150V N-Channel Trench MOSFET

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Transcription:

FEATURES Trench Power MOSFET Technology Low R DS(ON) Low Gate Charge Optimized For Fast-switching Applications TMP17N15A 15V N-Channel Trench MOSFET APPLICATIONS Synchronous Rectification in DC/DC and AC/DC Converters Isolated DC/DC Converters in Telecom and Industrial Device Marking and Package Information Device Package Marking TMP17N15A TO-22 17N15A Absolute Maximum Ratings T C = 25ºC, unless otherwise noted Parameter Symbol Value Unit Drain-Source Voltage (V GS = V) V DSS 15 V Continuous Drain Current T C = 25ºC T C = 1ºC 12.7 I D 17 A Pulsed Drain Current (note1) I DM 68 A Gate-Source Voltage V GSS ±2 V Single Pulse Avalanche Energy (note2) E AS 1.3 mj Avalanche Current I As 8.3 A Power Dissipation (note3) T C = 25ºC P D 78.9 W T C = 1ºC 39.5 W Operating Junction and Storage Temperature Range T J, T stg -55~+175 ºC Thermal Resistance Parameter Symbol Value Unit Thermal Resistance, Junction-to-Case R thjc 1.9 Thermal Resistance, Junction-to-Ambient R thja 6 ºC/W V1. 1

Specifications T J = 25ºC, unless otherwise noted Parameter Symbol Test Conditions Static Value Min. Typ. Max. Unit Drain-Source Breakdown Voltage V (BR)DSS V GS = V, I D = 25µA 15 -- -- V Zero Gate Voltage Drain Current I DSS V DS = 15V, V GS = V, T J = 25ºC -- -- 1 V DS = 15V, V GS = V, T J = 1ºC -- -- 1 μa Gate-Source Leakage I GSS V GS = ±2V -- -- ±1 na Gate-Source Threshold Voltage V GS(th) V DS = V GS, I D = 25µA 3 4 5 V Drain-Source On-Resistance R DS(on) V GS = 1V, I D = 8.5A -- 7 85 mω Forward Transconductance g fs V DS = 5V, I D = 8.5A -- 16.3 -- S Dynamic Input Capacitance C iss -- 144 -- V GS = V, Output Capacitance C oss V DS = 75V, f = 1.MHz -- 67 -- Reverse Transfer Capacitance C rss -- 26 -- Total Gate Charge Q g -- 25 -- Gate-Source Charge Q gs V DD = 75V, I D = 17A, V GS = 1V -- 9 -- Gate-Drain Charge Q gd -- 7 -- pf nc Turn-on Delay Time t d(on) -- 7 -- Turn-on Rise Time t r V DD = 75V, I D = 17A, -- 13 -- Turn-off Delay Time t d(off) Vgs=1V,R G = 2.5Ω -- 12 -- ns Turn-off Fall Time t f -- 8 -- Drain-Source Body Diode Characteristics Continuous Body Diode Current I S -- -- 17 T C = 25ºC Pulsed Diode Forward Current I SM -- -- 68 A Body Diode Voltage V SD T J = 25ºC, I SD = 8.5A, V GS = V -- -- 1.2 V Reverse Recovery Time t rr I F = 17A, -- 65 -- ns Reverse Recovery Charge Q rr di F /dt = 1A/μs -- 16 -- nc Notes 1. Repetitive Rating: Pulse width limited by maximum junction temperature 2. VDD = 5V, RG = 25Ω, Starting TJ = 25 C,L=.3mH 3. The power dissipation PD is based on TJ(MAX)=175 C, using junction-to-case thermal resistance. V1. 2

Typical Characteristics T J = 25ºC, unless otherwise noted V GS, Gate-to-Source Voltage (V) R DS(on), On-Resistance (mω) I D, Drain Current (A) 3 25 2 15 1 13 12 11 1 9 8 7 6 5 4 12 1 8 6 4 2 5 Figure 1. Output Characteristics 1V 7V 6.5V 6V 5.5V 1 2 3 4 5 V DS, Drain-to-Source Voltage (V) Figure 3. On-Resistance vs. Drain Current V GS = 1V T J = 25ºC 3 5 1 15 2 25 3 I D, Drain Current (A) Figure 5. Gate Charge V DD = 75V 5 1 15 2 25 3 Q g, Total Gate Charge (nc) I s, Source Current (A) Capacitance (pf) I D, Drain Current (A) 2 15 1 5 1 4 1 3 1 2 1 1 1 1 2 1 1 1 1-1 1-2 1-3 1-4 Figure 2. Transfer Characteristics V DS = 5V 2 3 4 5 6 7 8 V GS, Gate-to-Source Voltage (V) V GS = f = 1MHz T J = 125ºC Figure 4. Capacitance C iss C oss C rss 3 6 9 12 15 V DS, Drain-to-Source Voltage (V) Figure 6. Body Diode Forward Voltage T J = 125ºC T J = 25ºC T J = 25ºC.3.6.9 1.2 V SD, Source-to-Drain Voltage (V) V1. 3

Typical Characteristics T J = 25ºC, unless otherwise noted Figure 7. On-Resistance vs. Junction Temperature Figure 8. Threshold Voltage vs. Junction Temperature 3 2.5 V GS = 1V I D = 8.5A 1.5 I D = 25µA R DS(on), (Normalized) 2 1.5 1 V GS(th), (Variance) -.5-1.5-1.5-5 -25 25 5 75 1 125 15 T J, Junction Temperature (ºC) -2-5 -25 25 5 75 1 125 15 T J, Junction Temperature (ºC) Figure 9. Transient Thermal Impedance Figure 1. Safe operation area for 1 1 1 3 Z thjc, Thermal Impedance (Normalized) 1 1-1 1-2 D =.5 D =.2 D =.1 D =.5 D =.2 D =.1 Single Pulse 1-3 1-6 1-5 1-4 1-3 1-2 1-1 I D, Drain Current(A) 1 2 1 1 1 1-1 t p = 1us t p = 1us t p = 1ms t p = 1ms DC 1-1 1 1 1 1 2 1 3 T p, Pulse Width (s) V DS, Drain-Source Voltage(V) V1. 4

Figure A:Gate Charge Test Circuit and Waveform TMP17N15A Figure B:Resistive Switching Test Circuit and Waveform Figure C:Unclamped Inductive Switching Test Circuit and Waveform V1. 5

TO-22 V1. 6

Disclaimer All product specifications and data are subject to change without notice. TMP17N15A For documents and material available from this datasheet, Wuxi Unigroup does not warrant or assume any legal liability or responsibility for the accuracy, completeness of any product or technology disclosed hereunder. No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document or by any conduct of Wuxi Unigroup. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling Wuxi Unigroup products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Wuxi Unigroup for any damages arising or resulting from such use or sale. Wuxi Unigroup disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Wuxi Unigroup s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. Wuxi Unigroup Microelectronics CO., LTD. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all Wuxi Unigroup products (including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. Information (including circuit diagrams and circuit parameters) herein is for example only. It is not guaranteed for volume production. Wuxi Unigroup believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. V1. 7