STF14N80K5, STFI14N80K5

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Transcription:

STF14N80K5, STFI14N80K5 N-channel 800 V, 0.400 Ω typ., 12 A MDmesh K5 Power MOSFETs in TO-220FP and I²PAKFP packages Datasheet - production data Features Order code V DS R DS(on) max. I D STF14N80K5 STFI14N80K5 800 V 0.445 Ω 12 A TO-220FP I 2 PAKFP (TO-281) Figure 1: Internal schematic diagram D(2) Industry s lowest R DS(on) x area Industry s best figure of merit (FoM) Ultra-low gate charge 100% avalanche tested Zener-protected Applications Switching applications G(1) S(3) AM15572v1_no_tab Description These very high voltage N-channel Power MOSFET are designed using MDmesh K5 technology based on an innovative proprietary vertical structure. The result is a dramatic reduction in on-resistance and ultra-low gate charge for applications requiring superior power density and high efficiency. Table 1: Device summary Order code Marking Package Packing STF14N80K5 TO-220FP 14N80K5 Tube STFI14N80K5 I²PAKFP (TO-281) December 2015 DocID027725 Rev 2 1/16 This is information on a product in full production. www.st.com

Contents STF14N80K5, STFI14N80K5 Contents 1 Electrical ratings... 3 2 Electrical characteristics... 4 2.1 Electrical characteristics (curves)... 6 3 Test circuits... 9 4 Package information... 10 4.1 TO-220FP package information... 11 4.2 I2PAKFP (TO-281) package information... 13 5 Revision history... 15 2/16 DocID027725 Rev 2

STF14N80K5, STFI14N80K5 Electrical ratings 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit V GS Gate-source voltage ± 30 V I D (1) I D (1) I D (2) Drain current (continuous) at T C = 25 C 12 A Drain current (continuous) at T C = 100 C 7.4 A Drain current (pulsed) 48 A P TOT Total dissipation at T C = 25 C 30 W V ISO Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1 s; T C=25 C) dv/dt (3) Peak diode recovery voltage slope 4.5 dv/dt (4) MOSFET dv/dt ruggedness 50 T stg T J Storage temperature Operating junction temperature Notes: (1) Limited by maximum junction temperature. (2) Pulse width limited by safe operating area. (3) ISD 12 A, di/dt 100 A/μs; V DS peak < V (BR)DSS,V DD= 640 V (4) VDS 640 V 2500 V V/ns - 55 to 150 C Table 3: Thermal data Symbol Parameter Value Unit R thj-case Thermal resistance junction-case 4.2 C/W R thj-amb Thermal resistance junction-ambient 62.5 C/W Table 4: Avalanche characteristics Symbol Parameter Value Unit I AR Avalanche current, repetitive or not repetitive (pulse width limited by T jmax) 4 A E AS Single pulse avalanche energy (starting Tj = 25 C, I D = I AR, V DD = 50 V) 270 mj DocID027725 Rev 2 3/16

Electrical characteristics STF14N80K5, STFI14N80K5 2 Electrical characteristics T C = 25 C unless otherwise specified Table 5: On/off-state Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)DSS Drain-source breakdown voltage V GS = 0 V, I D = 1 ma 800 V I DSS Zero gate voltage drain current V GS = 0 V, V DS = 800 V 1 µa V GS = 0 V, V DS = 800 V T C = 125 C 50 µa I GSS Gate body leakage current V DS = 0 V, V GS = ±20 V ±10 µa V GS(th) Gate threshold voltage V DS = V GS, I D = 100 µa 3 4 5 V R DS(on) Static drain-source on-resistance V GS = 10 V, I D = 6 A 0.400 0.445 Ω Table 6: Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C iss Input capacitance - 620 - pf C oss Output capacitance V DS = 100 V, f = 1 MHz, V GS = 0 V - 60 - pf C rss Reverse transfer capacitance - 0.8 - pf C o(tr) (1) C o(er) (2) Equivalent capacitance time related V DS = 0 to 640 V, Equivalent capacitance energy V GS = 0 V related - 107 - pf - 39 - pf R g Intrinsic gate resistance f = 1 MHz, I D= 0 A - 6.5 - Ω Q g Total gate charge V DD = 640 V, I D = 12 A - 22 - nc Q gs Gate-source charge V GS= 10 V - 4.3 - nc Q gd Gate-drain charge (see Figure 16: "Test circuit for gate charge behavior" - 16.5 - nc Notes: (1) Time related is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% V DSS (2) Energy related is defined as a constant equivalent capacitance giving the same stored energy as Coss when V DS increases from 0 to 80% V DSS Table 7: Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit t d(on) Turn-on delay time V DD= 400 V, I D =6 A, R G = 4.7 Ω - 12.5 - ns t r Rise time V GS = 10 V - 8 - ns t d(off) Turn-off delay time see ( Figure 15: "Test circuit for resistive load switching times" and - 33 - ns t f Fall time Figure 20: "Switching time waveform") - 10 - ns 4/16 DocID027725 Rev 2

STF14N80K5, STFI14N80K5 Table 8: Source-drain diode Electrical characteristics Symbol Parameter Test conditions Min. Typ. Max. Unit I SD Source-drain current - 12 A I SDM (1) V SD (2) Source-drain current (pulsed) - 48 A Forward on voltage I SD = 12 A, V GS = 0 V - 1.5 V t rr Reverse recovery time I SD = 12 A, di/dt = 100-365 ns Q rr Reverse recovery charge A/µs,V DD = 60 V (see Figure 17: "Test circuit - 4.77 µc I RRM Reverse recovery current for inductive load switching and diode recovery times") - 26 A t rr Reverse recovery time I SD = 12 A, di/dt = 100 A/µs - 485 ns Q rr Reverse recovery charge V DD = 60 V, T j = 150 C (see Figure 17: "Test circuit - 5.85 µc I RRM Reverse recovery current for inductive load switching and diode recovery times") - 24 A Notes: (1) Pulse width limited by safe operating area (2) Pulsed: pulse duration = 300 µs, duty cycle 1.5% Table 9: Gate-source Zener diode Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)GSO Gate-source breakdown voltage I GS= ± 1mA, I D= 0 A 30 - - V The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device. The Zener voltage facilitates efficient and cost-effective device integrity protection,thus eliminating the need for additional external componentry. DocID027725 Rev 2 5/16

Electrical characteristics 2.2 Electrical characteristics (curves) Figure 2: Safe operating area STF14N80K5, STFI14N80K5 Figure 3: Thermal impedance Figure 4: Output characteristics Figure 5: Transfer characteristics Figure 6: Gate charge vs gate-source voltage Figure 7: Static drain-source on-resistance 6/16 DocID027725 Rev 2

STF14N80K5, STFI14N80K5 Figure 8: Capacitance variations Electrical characteristics Figure 9: Normalized gate threshold voltage vs temperature Figure 10: Normalized on-resistance vs temperature Figure 11: Normalized V (BR)DSS vs temperature Figure 12: Maximum avalanche energy vs starting T J Figure 13: Source-drain diode forward characteristics DocID027725 Rev 2 7/16

Electrical characteristics Figure 14: Output capacitance stored energy STF14N80K5, STFI14N80K5 8/16 DocID027725 Rev 2

STF14N80K5, STFI14N80K5 Test circuits 3 Test circuits Figure 15: Test circuit for resistive load switching times Figure 16: Test circuit for gate charge behavior Figure 17: Test circuit for inductive load switching and diode recovery times Figure 18: Unclamped inductive load test circuit Figure 19: Unclamped inductive waveform Figure 20: Switching time waveform DocID027725 Rev 2 9/16

Package information STF14N80K5, STFI14N80K5 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 10/16 DocID027725 Rev 2

STF14N80K5, STFI14N80K5 4.1 TO-220FP package information Figure 21: TO-220FP package outline Package information DocID027725 Rev 2 11/16

Package information Dim. STF14N80K5, STFI14N80K5 Table 10: TO-220FP package mechanical data mm Min. Typ. Max. A 4.4 4.6 B 2.5 2.7 D 2.5 2.75 E 0.45 0.7 F 0.75 1 F1 1.15 1.70 F2 1.15 1.70 G 4.95 5.2 G1 2.4 2.7 H 10 10.4 L2 16 L3 28.6 30.6 L4 9.8 10.6 L5 2.9 3.6 L6 15.9 16.4 L7 9 9.3 Dia 3 3.2 12/16 DocID027725 Rev 2

STF14N80K5, STFI14N80K5 4.2 I 2 PAKFP (TO-281) package information Figure 22: I²PAKFP (TO-281) package outline Package information 8291506 Re v. C DocID027725 Rev 2 13/16

Package information Dim. STF14N80K5, STFI14N80K5 Table 11: I²PAKFP (TO-281) mechanical data mm Min. Typ. Max. A 4.40 4.60 B 2.50 2.70 D 2.50 2.75 D1 0.65 0.85 E 0.45 0.70 F 0.75 1.00 F1 1.20 G 4.95 5.20 H 10.00 10.40 L1 21.00 23.00 L2 13.20 14.10 L3 10.55 10.85 L4 2.70 3.20 L5 0.85 1.25 L6 7.50 7.60 7.70 14/16 DocID027725 Rev 2

STF14N80K5, STFI14N80K5 Revision history 5 Revision history Table 12: Document revision history Date Revision Changes 06-Oct-2015 1 First release. 02-Dec-2015 2 Modified: Table 2: "Absolute maximum ratings", Table 3: "Thermal data", Table 4: "Avalanche characteristics", Table 6: "Dynamic", Table 7: "Switching times" and Table 8: "Source-drain diode". Added: Section 3.1: "Electrical characteristics (curves)" Minor text changes DocID027725 Rev 2 15/16

STF14N80K5, STFI14N80K5 IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2015 STMicroelectronics All rights reserved 16/16 DocID027725 Rev 2