Delphine series no-clean and halide free s o l d e r p a s t e INTERFLUX Electronics N.V.
Product manual
Key properties - Anti hidden pillow defect - Low voiding chemistry - High stability - High moisture resistance - Suitable for vapor phase soldering - Long profile capability - Halogen free - RO L0 (IPC-JSTD-004A) - Good cosmetics, clear minimal residue is a next generation lead-free from INTERFLUX Delphine lead-free series. After the implementation of lead-free processes it was clear that the chemistry in the lead-free era needed to be different from what was used up until then. Using the experience of the first generation lead-free products, market demands and analysis of market feedback, the Delphine carefully combines this acquired knowledge into a high performance product.
Performance overview ultra fine pitch capability volume consistency better than 3% difference in repeatability on combined 0,25mm (10mil) and 0,20mm (8mil) round apertures less than 2% difference after 6 hours of regular printing Printing printer abandon less than 2% difference after 2 hours temperature range excellent performance between 15 C and 29 C print speed range 20 mm/sec to 150 mm/sec voiding pass IPC-7095A class 1,2,3 requirements solder beading excellent performance Reflow solder balls pass preferred to IPC-J-STD-004 solder wetting pass preferred to IPC-J-STD-004 cold/ hot slump pass to IPC-J-STD-004 residue/ cosmetics excellent performance Ambient humidity resistance pass 4 hours at 26 C and 96% RH prior to reflow have no effect on reflow of mounted boards
Performance radar graph radar graph extensive field: 14 parameters total mean score: 84% alloy tested: Sn96,5 Ag3,0 Cu0,5 metal content tested: 89,5% squeegee release residue tackiness paste rolling residue spread print definition solder ball abandon void level tack solder spreading slump hot & cold solder wetting hidden pillow humidity resistance
Hidden pillow temperature: 22 C humidity: 55% R.H. method: Bga peel off after reflow hidden pillow on bga body side hidden pillow on board side The hidden pillow or head-in -pillow defect on a ball grid array (bga) type component as seen in a cross section. on bga body side on board side
Voiding reference: IPC-7095A result: pass for class 1,2,3 low voiding on voids on standard paste
Ultra fine pitch capability print speed: 70mm/sec temperature: 22 C humidity: 55% R.H. aperture: 0,25 mm (10mil) A difference of less than 3% volume deviation was measured. An abandon time of 1 hour for 0,25mm (10mil) apertures as test condition. Capable to show high repeatability of the volume of the printed deposit for 0,25mm (10mil) and 0,20mm (8mil) aperture sizes using type 3 size powder Repeatable 0201 component aperture printing using type 3 size powder Typical under screen cleaner wipe interval up to 10 prints at 0,5mm (20mil) pitch
Volume consistency Boards are printed using a 120µm thick stencil. Before and after each print boards are weighed on high precision scales. This process is repeated in time and the obtained values are set out in the graph below. print speed: 70mm/sec temperature: 22 C humidity: 55% R.H. During a 6 hour period of printing, a difference of less than 2% volume deviation was measured.
Printer abandon Boards are printed using a 120µm thick stencil. Before and after each print boards are weighed on high precision scales. This process is repeated after 2 hours of inactivity and values are set out in the graph below. print speed: 70mm/sec temperature: 22 C humidity: 55% R.H. After a 2 hour period of abandoning the printer and paste, a difference of less than 2% volume deviation was measured for the first print. The 2nd and 3rd print showed a deviation of less than 0,2% which is considered standard process deviation.
Temperature range Volume deviation variations of the printed paste amount at different temperatures. print speed: 70mm/sec temperature: variable 15-29 C humidity: 55% R.H. At 15 C a total deviation of less than 0,6% was measured, at 22 C the deviation was less than 0,8% and at 29 C the deviation was less than 1,5%.
Print speed range Volume variations at different print speeds of the printed paste amount print speed: variable temperature: 24 C humidity: 53% R.H. mean deviations measured: 10mm/sec: less than 0,2% 20mm/sec: less than 0,4% 35mm/sec: less than 0,4% 50mm/sec: less than 0,2% 70mm/sec: less than 0,2%
Solder paste tack Tack force over an 8 hour period of time method: J-STD-005 and IPC-TM-650 2.4.44 temperature: 25 C ± 2 C humidity: 50% R.H. ± 10% tack in g mean deviations measured: less than 3% over 8 hour (480min)
Solder beading print speed: 70 mm/sec temperature: 22 C humidity: 53% R.H. Solder beading resistance: good
Solder balling temperature: 22 C humidity: 55% R.H. method: J-STD-005 IPC-TM-650 2.4.34 result: pass as preferred 15 min result: pass as preferred 4 hours
Solder wetting temperature: 22 C humidity: 55% R.H. method: J-STD-005 IPC-TM-650 2.4.45 wetting on oxidized Cu 105% spread of the printed SAC305 paste wetting and spreading on NiAu the grey circle is original print deposit area wetting and spreading on Chem Sn the grey circle is original print deposit area
Cold/ hot slump temperature: 22 C humidity: 55% R.H. method: J-STD-005 IPC-TM-650 2.4.45 Pre slump pattern A-21 Hot slump: pass pattern A-20 Cold slump: pass pattern A-21 Hot slump: pass pattern A-21
Residue/ cosmetics typical residue amount after reflow: <5%
Humidity resistance temperature: 26 C humidity: 96% RH time: 3 and 4 hours a suffering from humidity 3 hours at 26 C - 96% RH prior to reflow resulting in displaced components and flux spatter humidity resistance 4 hours at 26 C - 96% RH prior to reflow
Application data Printing data squeegee material: stainless steel preferred printing speed: 20-100 mm/sec squeegee pressure: ±0,25 kg per cm squeegee blade length temperature range: 15-25 C humidity: 40-75 % R.H. stencil life: > 8 hours abandon time: 2 hours @ 22 C 55% R.H. Mounting data tack time: > 8 hours Reflow data consult product T.D. for details profile type: straight ramp to peak or soak profile heating type: convection, vapor phase, laser, atmosphere: air or nitrogen (N 2 ) recommended linear and soak profile for SnAgCu alloy m.p. 217 C
Reliability data Electrical properties (summary) Surface Insulation Resistance pass 8,98x1008 Ω TM-650 2.6.33 (IPC 168h @ 85 C-85%R.H.) Electrical properties (details) boards (group E) Control boards (group F) Board 1 Board1 Pattern T1 6,23x1008 Ω Ti 3,96x1012 Ω T3 9,86x1008 Ω T1 3,01x1009 Ω T3 2,72x1009 Ω Board 2 Board2 Pattern T1 7,54x1008 Ω Ti 2,28x1012 Ω T3 1,18x1009 Ω T1 2,70x1009 Ω T3 2,16x1009 Ω Board 3 Pattern T1 4,82x1008 Ω T3 5,32x1008 Ω Ti pattern initial measurements T1 pattern measurements after 24 hours T3 pattern measurements after 168 hours
Other data Cleaning Stencil manual cleaning: Misprint: Interflux ISC 8020 and IPA/ D.I. pre-saturated wipes Interflux ISC 8020 and IPA/ D.I. pre-saturated wipes Storing Unopened paste jars: Opened paste jars: keep at 3-7 C at room temperature Do not mix used and new paste as this may change paste properties INTERFLUX Electronics N.V. Eddastraat 51 9042 Gent INTERFLUX Singapore Ltd. www.interflux.com.sg Belgium INTERFLUX China www.interflux.com.cn www.interflux.com INTERFLUX Danmark Aps www.interflux.dk INTERFLUX Eesti Ltd www.interflux.ee Represented by: INTERFLUX France www.interfluxfrance.com INTERFLUX Electronikai Kft Hungary www.interflux.com INTERFLUX Electronics Italia www.interflux.com INTERFLUX Poland www.interflux.pl INTERFLUX Skandinavia AB www.interflux.se INTERFLUX Skandinavia Norge As www.interflux.no