TV Vertical Deflection Output Amplifier

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Transcription:

TELEFUNKEN Semiconductors TDA 73 TV Vertical Deflection Output Amplifier Technology: Bipolar Features Output peak current, I = 2. A Flyback current, peak to peak, I 3 = A Thermal protection, T j 0 C Case: 7 leads special plastic case Block diagram + V S 7 3 Power amplifier + Flyback generator Thermal protection Deflection coil 9 8723 Figure Block diagram Pin Configuration Pin Inverted input 2 Supply voltage 3 Flyback generator Ground Function Pin Function Output 6 Output stage supply 7 Non inverted input Rev. A: 6.2.99

TDA 73 TELEFUNKEN Semiconductors Absolute Maximum Ratings Parameters Symbol Value Unit Supply voltage Pin 2 V S 0 V Flyback peak voltage Pins and 6 V, 6 70 V Voltage at pin 3 V 3 V S V Input voltage Pins and 7 V, 7 V S V Output peak current: Pin I O A t = 2 ms, non repetitive f = 0/60 Hz, t < 0 s f = 0/60 Hz, t > 0 s 3 3. 2. DC current at pin 3, @ V < V 2 I 3 00 ma Flyback current peak to peak, Pin 3 I 3 A f= 0/60 Hz, t fly. ms Power dissipation, T case = 70 C P tot 20 W Storage temperature T stg 0 to + 0 C Junction temperature T j 0 to + 0 C Thermal Resistance Parameters Symbol Maximum Unit Junction case R thjc 3 K/W Electrical Characteristics V S = 3 V, T amb = 2 C, (see test circuits) Parameters Test Conditions / Pin Symbol Min Typ Max Unit Quiescent current I 3 = 0, I S = 0 Pin 2 I 2 20 ma I 3 = 0, I S = 0 Pin 6 I 6 30 figure 2 Input quiescent current V = V Pin I 0. A figure 3 Saturation voltage to GND (Pin ) Output voltage Saturation voltage to GND (Pin ) Saturation voltage to supply (Pin 6) Junction temperature for thermal shut down I 3 = 20 ma Pin 3 figure V S = 3 V, R r =39 k figure Pin I =.2 A Pin I =2.0 A figure 6 I =.2 A Pin I = 2.0 A figure 7 V 3-0.. V V 8 V V - 0.3 0.6 V -6.2 0.7...8 T j 0 C V V 2 Rev. A: 6.2.99

TELEFUNKEN Semiconductors TDA 73 I 2 I 6 0 k 7 V 7 9 872 I V 9 872 Figure 2 Figure 3 9 8726 9 8727 3 I 3 2 k V 3 V V 3 2 V R r.6 k Figure Figure 9 8728 9 8729 V 6 I 3 V V V I Figure 6 Figure 7 Rev. A: 6.2.99 3

TDA 73 TELEFUNKEN Semiconductors 0 23 6 7 I C ( A ) 9 907 0. 0 V CE ( V ) 00 Typical SOAR curves I C = I, V CE = V and I C = I, V CE = V 6 V Curve no. t p t p : T DC 2 0 ms : 2 3 0 ms : ms : 2 ms : 6 ms : 20 7 0.2 ms : 0 t p T 9 928 Rev. A: 6.2.99

TELEFUNKEN Semiconductors TDA 73 Dimensions in mm Package: 7 leads special plastic case We reserve the right to make changes without further notice to improve technical design. Parameters can vary in different applications. All operating parameters must be validated for each customer application by customer. Should Buyer use TEMIC products for any unintended or unauthorized application, Buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 33, D-702 Heilbronn, Germany Telephone: 9 (0)73 67 283, Fax Number: 9 (0)73 67 223 Rev. A: 6.2.99

TDA 73 TELEFUNKEN Semiconductors OZONE DEPLETING SUBSTANCES POLICY STATEMENT It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to. Meet all present and future national and international statutory requirements and 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. Of particular concern is the control or elimination of releases into the atmosphere of these substances which are known as ozone depleting substances (ODSs). The Montreal Protocol (987) and its London Amendments (990) will severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of any ODSs listed in the following documents that all refer to the same substances: () Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively (2) Class I and II ozone depleting substances in the Clean Air Act Amendments of 990 by the Environmental Protection Agency (EPA) in the USA and (3) Council Decision 88/0/EEC and 9/690/EEC Annex A, B and C (transitional substances) respectively. TEMIC can certify that our semiconductors are not manufactured with and do not contain ozone depleting substances. 6 Rev. A: 6.2.99