600V Super-Junction Power MOSFET

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600V Super-Junction Power MOSFET FEATURES Very low FOM R DS(on) Q g 100% avalanche tested RoHS compliant APPLICATIONS Switch Mode Power Supply (SMPS) Uninterruptible Power Supply (UPS) Power Factor Correction (PFC) Device Marking and Package Information Device TPA60R240M TPB60R240M TPC60R240M TPP60R240M Package TO-220F TO-263 TO-262 TO-220 Marking 60R240M 60R240M 60R240M 60R240M Absolute Maximum Ratings T C = 25ºC, unless otherwise noted Parameter Symbol Value TO-263, TO-262, TO-220 TO-220F Unit Drain-Source Voltage (V GS = 0V) V DSS 600 V Continuous Drain Current I D 15 A Pulsed Drain Current (note1) I DM 45 A Gate-Source Voltage V GSS ±30 V Single Pulse Avalanche Energy (note2) E AS 284 mj Avalanche Current (note1) I AR 2.4 A Repetitive Avalanche Energy (note1) E AR 0.44 mj MOSFET dv/dt ruggedness, V DS = 0...480V dv/dt 50 V/ns Reverse diode dv/dt, V DS = 0 480V, I SD I D dv/dt 15 V/ns Power Dissipation (T C = 25ºC) P D 104 32 W Operating Junction and Storage Temperature Range T J, T stg -55~+150 ºC Thermal Resistance Parameter Symbol Value TO-263, TO-262, TO-220 TO-220F Unit Thermal Resistance, Junction-to-Case R thjc 1.2 3.9 Thermal Resistance, Junction-to-Ambient R thja 62 80 ºC/W V1.0 1

Specifications T J = 25ºC, unless otherwise noted Parameter Symbol Test Conditions Static Value Min. Typ. Max. Unit Drain-Source Breakdown Voltage V (BR)DSS V GS = 0V, I D = 250µA 600 -- -- V Zero Gate Voltage Drain Current I V DS = 600V, V GS = 0V, T J = 25ºC -- -- 1 DSS V DS = 600V, V GS = 0V, T J = 150ºC -- -- 50 μa Gate-Source Leakage I GSS V GS = ±30V -- -- ±100 na Gate-Source Threshold Voltage V GS(th) V DS = V GS, I D = 250µA 2.5 -- 4.5 V Drain-Source On-Resistance (Note3) R DS(on) V GS = 10V, I D = 7.5A -- 0.21 0.24 Ω Forward Transconductance (Note3) R G f = 1.0MHz open drain -- 12.5 -- S Dynamic Input Capacitance C iss V GS = 0V, -- 1306 -- Output Capacitance C oss V DS = 100V, -- 62 -- f = 1.0MHz Reverse Transfer Capacitance C rss -- 7 -- pf Total Gate Charge Q g V DD = 480V, I D = 15A, -- 27 -- Gate-Source Charge Q gs V GS = 10V -- 5.5 -- Gate-Drain Charge Q gd -- 10.5 -- nc Turn-on Delay Time t d(on) -- 23 -- Turn-on Rise Time t r V DD = 400V, I D = 15A, -- 65 -- Turn-off Delay Time t d(off) R G = 25Ω -- 105 -- ns Turn-off Fall Time t f -- 50 -- Drain-Source Body Diode Characteristics Continuous Body Diode Current I S -- -- 15 T C = 25ºC Pulsed Diode Forward Current I SM -- -- 45 A Body Diode Voltage V SD T J = 25ºC, I SD = 15A, V GS = 0V -- 0.9 1.2 V Reverse Recovery Time t rr V R = 400V, I F = I S, -- 410 -- ns Reverse Recovery Charge Q rr di F /dt = 100A/μs -- 4.1 -- μc Peak Reverse Recovery Current I rrm -- 20 -- A Notes 1. Repetitive Rating: Pulse Width limited by maximum junction temperature 2. I AS = 2.4A, V DD = 50V, R G = 25Ω, Starting T J = 25 C 3. Pulse Test: Pulse Width 300μs, Duty Cycle 1% V1.0 2

Typical Characteristics T J = 25ºC, unless otherwise noted 45 Figure 1. Output Characteristics 45 Figure 2. Transfer Characteristics I D, Drain Current (A) 30 15 20V 10V 8V 7V 6V 5.5V 5V 4.5V I D, Drain Current (A) 40 35 30 25 20 15 10 V DS = 20V T J = 25ºC T J = 150ºC 5 0 0 0 5 5 20 V DS, Drain-to-Source Voltage (V) 0 2 4 6 8 10 V DS, Drain-to-Source Voltage (V) 0.28 Figure 3. On-Resistance vs. Drain Current 10 4 Figure 4. Capacitance R DS(on), On-Resistance (Ω) 0.26 0.24 0.22 0.2 0.18 V GS = 10V T J = 25ºC 5 5 20 25 I D, Drain Current (A) Capacitance (pf) 10 3 10 2 V GS = 0 f = 1MHz C iss C oss C rss 0 25 50 75 100 125 150 V DS, Drain-to-Source Voltage (V) 12 Figure 5. Gate Charge 10 2 Figure 6. Body Diode Forward Voltage VGS, Gate-to-Source Voltage (V) 10 8 6 4 2 0 V DD = 120V V DD = 480V 0 5 5 20 25 30 I s, Source Current (A) 10-1 T J = 125ºC T J = 25ºC 0 0.5 1 1.5 2 Q g, Total Gate Charge (nc) V SD, Source-to-Drain Voltage (V) V1.0 3

Typical Characteristics T J = 25ºC, unless otherwise noted 3.0 Figure 7. On-Resistance vs. Junction Temperature 1.3 Figure 8. Breakdown voltage vs. Junction Temperature RDS(on), (Normalized) 2.5 2.0 1.5 1.0 0.5 V GS = 10V I D = 7.5A V BR(DSS), (Normalized) 1.2 1.1 1.0 0.9 I D = 250µA 0.0-50 -25 0 25 50 75 100 125 150 0.8-50 -25 0 25 50 75 100 125 150 T J, Junction Temperature (ºC) T J, Junction Temperature (ºC) Z thjc, Thermal Impedance (ºC/W) Figure 9. Transient Thermal Impedance TO-263/TO-262/TO-220 10-1 10-2 D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 Single Pulse Z thjc, Thermal Impedance (ºCW) 10-1 Figure 10. Transient Thermal Impedance TO-220F D = 0.5 D = 0.2 D = 0.1 D = 0.05 D = 0.02 D = 0.01 Single Pulse 10-5 10-4 10-3 10-2 10-1 10-5 10-4 10-3 10-2 10-1 10-2 T p, Pulse Width (s) T p, Pulse Width (s) 10 2 Figure 11. Safe operation area for TO-263/TO-262/TO-220 10 2 Figure 12. Safe operation area for TO-220F I D, Drain Current(A) 10-1 10-2 t p = 1us t p = 10us t p = 100us t p = 1ms t p = 10ms DC 10 2 10 3 V DS, Drain-Source Voltage(V) I D, Drain Current(A) 10-1 10-2 10-1 t p = 1us t p = 10us t p = 100us t p = 1ms t p = 10ms DC 10 2 10 3 V DS, Drain-Source Voltage(V) V1.0 4

Figure A:Gate Charge Test Circuit and Waveform Figure B:Resistive Switching Test Circuit and Waveform Figure C:Unclamped Inductive Switching Test Circuit and Waveform V1.0 5

TO-220F E 9.96 10.16 10.36 e 2.54BSC A 4.50 4.70 4.90 A1 2.34 2.54 2.74 A2 0.30 0.45 0.60 A4 2.56 2.76 2.96 c 0.40 0.50 0.65 c1 1.20 1.30 1.35 D 15.57 15.87 16.17 L 12.68 12.98 13.28 L1 2.88 3.03 3.18 ΦP 3.03 3.18 3.38 ΦP3 3.15 3.45 3.65 F3 3.15 3.30 3.45 G3 1.25 1.35 1.55 b1 1.18 1.28 1.43 H1 6.70REF b2 0.70 0.80 0.95 V1.0 6

TO-263 A 4.37 4.57 4.77 A1 1.22 1.27 1.42 E 9.86 10.16 10.36 E5 7.06 - - A2 2.49 2.69 2.89 e 2.54BSC A3 0.00 0.13 0.25 b 0.70 0.81 0.96 b1 1.17 1.27 1.47 c 0.30 0.38 0.53 H 14.70 15.5.50 H2 1.07 1.27 1.47 L 2.00 2.30 2.60 L1 1.40 1.55 1.70 D1 8.50 8.70 8.90 L4 0.25BSC D4 6.60 - - θ 0 5 9 V1.0 7

TO-262 A 4.37 4.57 4.77 A1 1.22 1.27 1.42 E 9.86 10.16 10.36 E4 7.06 - - A2 2.49 2.69 2.89 e 2.54BSC b 0.70 0.81 0.96 b2 1.17 1.27 1.42 c 0.28 0.38 0.53 D 23.20 23.7 24.02 D1 8.50 8.70 8.90 G 1.25 1.35 1.50 H2 - - 1.50 L 13.33 13.73 14.13 L1 3.50 3.75 4.00 L3 1.28 1.43 1.58 D2 6.00 - - V1.0 8

TO-220 A 4.37 4.57 4.77 E3 7.00 - - A1 1.25 1.30 1.45 b 2.20 2.40 2.60 e e1 2.54BSC 5.08BSC b2 1.17 1.27 1.47 c 0.45 0.50 0.60 D 15.5.60 16.10 D1 8.80 9.10 9.40 D2 5.50 - - H1 6.25 6.50 6.85 L 12.75 13.50 13.80 L1-3.10 3.40 ΦP 3.40 3.60 3.80 Q 2.60 2.80 3.00 E 9.70 10.00 10.30 V1.0 9

Disclaimer All product specifications and data are subject to change without notice. For documents and material available from this datasheet, Wuxi Unigroup does not warrant or assume any legal liability or responsibility for the accuracy, completeness of any product or technology disclosed hereunder. No license, express or implied, by estoppels or otherwise, to any intellectual property rights is granted by this document or by any conduct of Wuxi Unigroup. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling Wuxi Unigroup products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Wuxi Unigroup for any damages arising or resulting from such use or sale. Wuxi Unigroup disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Wuxi Unigroup s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products. Wuxi Unigroup Microelectronics CO., LTD. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with some probability. It is possible that these probabilistic failures could give rise to accidents or events that could endanger human lives that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits and error prevention circuits for safe design, redundant design, and structural design. In the event that any or all Wuxi Unigroup products (including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from the authorities concerned in accordance with the above law. Information (including circuit diagrams and circuit parameters) herein is for example only. It is not guaranteed for volume production. Wuxi Unigroup believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringements of intellectual property rights or other rights of third parties. V1.0 10