Drain Efficiency (%) 1300 MHz 1400 MHz 15. Characteristic Symbol Min Typ Max Unit

Similar documents
Efficiency (%) 1215 MHz 15. Characteristic Symbol Min Typ Max Unit

Drain Efficiency (%) 10 a120501ea_g1-1. Characteristic Symbol Min Typ Max Unit. Return Loss IRL 10 7 db

Gain: 960 MHz Gain: 1030 MHz Gain: 1090 MHz Gain: 1150 MHz Gain: 1215 MHz Eff: 960 MHz Eff: 1030 MHz Eff: 1090 MHz Eff: 1150 MHz Eff: 1215 MHz

not recommended for new design

GTVA123501FA. Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 50 V, MHz. Description. Features. RF Characteristics

Drain Efficiency (%) b092707fh-gr1a. Characteristic Symbol Min Typ Max Unit

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

IMD Shoulder (dbc) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

PTFC270051M. High Power RF LDMOS Field Effect Transistor 5 W, 28 V, MHz. Description. Features. RF Characteristics, 2170 MHz

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

Preliminary GTVA126001EC/FC

PTFC270101M. High Power RF LDMOS Field Effect Transistor 10 W, 28 V, MHz. Description. Features. RF Characteristics

Efficiency (%) c261402fc_gr1. Adjacent Channel Power Ratio ACPR dbc All published data at T CASE = 25 C unless otherwise indicated

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR 7 7.

PTFB211503FL. Thermally-Enhanced High Power RF LDMOS FET 150 W, MHz. Description. Features. RF Characteristics

Efficiency (%) c241002fc-gr1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) gtra364002fc_g1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Characteristic Symbol Min Typ Max Unit. Intermodulation Distortion IMD 35 dbc All published data at T CASE = 25 C unless otherwise indicated

PTFB213004F. High Power RF LDMOS Field Effect Transistor 300 W, MHz. Description. Features. RF Characteristics

not recommended for new design Efficiency (%) Characteristic Symbol Min Typ Max Unit Intermodulation Distortion IMD dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Features. ficiency (%) Eff. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

Efficiency (%) g261701fa-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

ra097008nb-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

PTFB193404F. Thermally-Enhanced High Power RF LDMOS FET 340 W, 30 V, MHz. Description. Features. RF Characteristics

Drain Efficiency (%) c262157sh-gr1. Characteristic Symbol Min Typ Max Unit. Gain Gps db. Adjacent Channel Power Ratio ACPR 31.

Efficiency (%) ptra082808nf_g1. Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR

Drain Efficiency (%) c270101m-2.1-gr1c. Characteristic Symbol Min Typ Max Unit

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) c201202fc-v2-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

CCharacteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR 30 dbc. Output 0.01% CCDF OPAR 7 db

Advance PTNC210604MD. Wideband LDMOS Two-stage Integrated Power Amplifier 20 W + 40 W, 28 V, MHz. Description. Features

IMD D3 (dbc) Characteristic Symbol Min Typ Max Unit. Input Return Loss IRL 15 db

Efficiency (%) Characteristic Symbol Min Typ Max Units

rn Loss (db) -10 Retu Characteristic Symbol Min Typ Max Unit

= 25 C) Parameter 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units. Gain db. 32 dbm W

maintaining high gain and efficiency. Package Type: 3x4 DFN PN: CGHV1F025S Parameter 8.9 GHz 9.2 GHz 9.4 GHz 9.6 GHz Units = 37 dbm W

MQ1271VP LDMOS TRANSISTOR

Parameter 5.2 GHz 5.5 GHz 5.9 GHz Units. Small Signal Gain db. Output Power W. Efficiency

Innogration (Suzhou) Co., Ltd.

MQ1270VP LDMOS TRANSISTOR

Innogration (Suzhou) Co., Ltd.

which offers high efficiency, high gain and wide bandwidth capabilities. The CGHV27030S GaN

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

MQ1470VP LDMOS TRANSISTOR

MR2003C LDMOS TRANSISTOR

PRELIMINARY. Cree s CGHV59070 is an internally matched gallium nitride (GaN) high electron mobility transistor

transistor is available in a flange and pill package. Package Types: & PN s: CGH40045F & CGH40045P

CMPA801B W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

MR2006C LDMOS TRANSISTOR

Innogration (Suzhou) Co., Ltd.

= 25 C) of Demonstration Amplifier. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units. 43 dbm

= 25 C), 50 V. Parameter 800 MHz 850 MHz 900 MHz 950 MHz 1000 MHz Units. Small Signal Gain db

Innogration (Suzhou) Co., Ltd.

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

CGH40006P. 6 W, RF Power GaN HEMT APPLICATIONS FEATURES

= 25 C) Note: Measured in CGHV96100F2-TB (838179) under 100 µs pulse width, 10% duty, Pin 42.0 dbm (16 W) Applications. Marine Radar.

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045P & CG2H40045F

= 25 C) Parameter 8.0 GHz 9.0 GHz 10.0 GHz 11.0 GHz Units Small Signal Gain db P OUT. = 25 dbm W Power P IN

CGH55030F2 / CGH55030P2

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045F & CG2H40045P

BLF6G10LS-135R. 1. Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features

= 25 C), CW. Parameter 1.7 GHz 1.8 GHz 1.9 GHz Units Small Signal Gain db P in. = 38 dbm

BLF6G10LS Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features

Part Number: ILD1011M160HV

= 25 C) Parameter 2.5 GHz 4.0 GHz 6.0 GHz Units Gain db W Power P OUT. = 43 dbm

= 25 C) Note: Measured at -30 dbc, 1.6 MHz from carrier, in the CGHV96050F1-AMP (838176) under OQPSK modulation, 1.6 Msps, PN23, Alpha Filter = 0.

PRELIMINARY. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

CGHV1J070D. 70 W, 18.0 GHz, GaN HEMT Die

CGHV1J025D. 25 W, 18.0 GHz, GaN HEMT Die

PRELIMINARY = 25 C) Parameter GHz 14.0 GHz 14.5 GHz Units Small Signal Gain db P SAT. = 26 dbm W P 3dB

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

CGH40120P. 120 W, RF Power GaN HEMT FEATURES APPLICATIONS

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

CMPA F. 30 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

CG2H W, DC - 6 GHz, RF Power GaN HEMT APPLICATIONS FEATURES

CGH55015F2 / CGH55015P2

maintaining high gain and efficiency. Parameter 5.5 GHz 6.0 GHz 6.5 GHz Units Small Signal Gain db = 28 dbm

60 W, DC MHz, 50 V, GaN HEMT for LTE and Pulse Radar Applications. = 25 C) of Demonstration Amplifier

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

BLA6H LDMOS avionics radar power transistor

RF LDMOS Wideband Integrated Power Amplifier MHVIC2115R2. Freescale Semiconductor, I. The Wideband IC Line SEMICONDUCTOR TECHNICAL DATA

PD RF power transistor The LdmoST plastic family. Features. Description

BLF6G10-135RN; BLF6G10LS-135RN

CGH35060F1 / CGH35060P1

= 25 C) Parameter 2.7 GHz 2.9 GHz 3.1 GHz 3.3 GHz 3.5 GHz Units Small Signal Gain db

= 25 C), 50 V. Parameter 0.96 GHz 1.1 GHz 1.25 GHz 1.4 GHz Units. Saturated Output Power W

MHz. The package options are ceramic/metal flange and pill package. Package Type: , PN: CGHV14250F, CGHV14250P

Characteristic Symbol Value Unit Thermal Resistance, Junction-to-Case R θjc 6 C/W

Watts W/ C Storage Temperature Range T stg 65 to +150 C Operating Junction Temperature T J 200 C. Test Conditions MRF9085SR3/MRF9085LSR3

RF LDMOS Wideband 2-Stage Power Amplifiers

CMPA F. 25 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Applications. Features

RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs

RF Power GaN Transistor

Transcription:

Thermally-Enhanced High Power RF LDMOS FET 700 W, 50 V, 1200 Description The PTVA127002EV LDMOS FET is designed for use in power amplifier applications in the 1200 to frequency band. Features include high gain and thermally-enhanced package with bolt-down flange. Manufactured with Wolfspeed's advanced LDMOS process, this device provides excellent thermal performance and superior reliability. PTVA127002EV Package H-36275-4 (dbm) V DD = 50 V, I DQ = 300 ma, T CASE = C, 300 µs pulse width, 12% duty cycle Output Power a127002ev_g1-1 Features Broadband input and output matching High gain and efficiency Integrated ESD protection Human Body Model Class 2 (per ANSI/ESDA/ JEDEC JS-001) Low thermal resistance Excellent ruggedness Pb-free and RoHS compliant Capable of withstanding a 10:1 load mismatch (all phase angles) at 700 W peak under RF pulse, 300 µs, 10% duty cycle. RF Characteristics Pulsed RF Performance (tested in Wolfspeed test fixture) V DD = 50 V, I DQ = 0 ma per side, = 700 W, ƒ 1 =, ƒ 2 =, ƒ 3 =, 300 µs pulse width, 12% duty cycle Characteristic Symbol Min Typ Max Unit G ps.5 db Drain h D 50 56 % Flatness DG 1.0 1.3 db Return Loss IRL 20 11 db All published data at T CASE = C unless otherwise indicated ESD: Electrostatic discharge sensitive device observe handling precautions!

2 RF Characteristics Typical RF Performance (not subject to production test, verified by design/characterization in Wolfspeed test fixture) V DD = 50 V, I DQ = 0 ma per side, Input signal (t r = 7 ns, t f = 5 ns), 300 µs pulse width, 12% duty cycle, class AB test Mode of Operation 300 µs, 12% Duty Cycle ƒ (MHz) IRL (db) (db) P 1dB P 3dB Max Eff (%) (W) (db) Eff (%) (W) P droop (pulse) @ P 1dB t r (ns) @P 1dB t f (ns) @P 1dB 1200 20.6 57 710.6 57 810 0.2 5 <2 1300.8 54 840 13.8 950 0.3 5 <2 00 20.7 54 730 13.7 53 820 0.2 5 <2 Typical RF Performance (tested on LTN/PTVA127002EV E5 Wolfspeed test fixture) V DD = 50 V, I DQ = 0 ma per side, Input signal (t r = 7 ns, t f = 5 ns), 32 ms pulse width, 50% duty cycle, class AB test Mode of Operation 32 ms, 50% Duty Cycle Compression ƒ (MHz) P IN (dbm) (db) IRL (db) I (A) Eff (%) (dbm) (W) P 1dB 1300 42.0.1 22.6 22.7 56.6 58.1 641 P 3dB 1300 44.4.1 19.0.2.8 58.5 703 DC Characteristics (single side) Characteristic Conditions Symbol Min Typ Max Unit Drain-Source Breakdown Voltage V GS = 0 V, I DS = 10 ma V (BR)DSS 105 V Drain Leakage Current V DS = 50 V, V GS = 0 V I DSS 1.0 µa V DS = 105 V, V GS = 0 V I DSS 10.0 µa On-State Resistance V GS = 10 V, V DS = 0.1 V R DS(on) 0.1 W Operating Gate Voltage V DS = 50 V, I DQ = 0 ma V GS 3 3. 4 V Gate Leakage Current V GS = 10 V, V DS = 0 V I GSS 1.0 µa Maximum Ratings Parameter Symbol Value Unit Drain-Source Voltage V DSS 105 V Gate-Source Voltage V GS 6 to +12 V Operating Voltage V DD 0 to + V Junction Temperature T J 2 C Storage Temperature Range T STG to +0 C Thermal Resistance (T CASE = 70 C, 700 W CW) R qjc ~0.36 C/W Ordering Information Type and Version Order Code Package Description Shipping PTVA127002EV V1 R0 PTVA127002EV-V1-R0 H-36275-4, bolt-down Tape & Reel, 50 pcs PTVA127002EV V1 R0 PTVA127002EV-V1-R0 H-36275-4, bolt-down Tape & Reel, 0 pcs

3 Typical RF Performance (data taken in production test fixture) V DD = 50 V, I DQ = 300 ma, T CASE = C, 300 µs pulse width, 12% duty cycle V DD = 50 V, I DQ = 300 ma, T CASE = C, 300 µs pulse width, 12% duty cycle (dbm) Output Power a127002ev_g1-1 (db) 13 12 a127002ev_g1-2 Pulsed RF Performance V DD = 50 V, I DQ = 300 ma, = 700 W, 300 µs pulse width, 12% duty cycle Pulsed RF Performance V DD = 50 V, I DQ = 300 ma, = 700 W, 300 µs pulse width, 12% duty cycle 70-10 0.4 (db) 60 IRL (db) - -20 - IRL Power Droop 0.3 0.2 0.1 Power Droop (db) 50 a127002ev_g1-3 10 1200 10 1300 10 00 10-30 a127002ev_g1-4 0.0 10 1200 10 1300 10 00 10

4 Typical RF Performance (cont.) V DD = 50 V, I DQ = 300 ma, T CASE = C, 2 ms pulse width, 10% duty cycle V DD = 50 V, I DQ = 300 ma, T CASE = C, 2 ms pulse width, 10% duty cycle (dbm) Output Power a127002ev_g2-1 (db) 13 a127002ev_g2-2 P (dbm) Pulsed RF Performance V DD = 50 V, I DQ = 300 ma, = 700W, 2 ms pulse width, 10% duty cycle Pulsed RF Performance V DD = 50 V, I DQ = 300 ma, = 700 W, 2 ms pulse width,10% duty cycle 70-10 Power Droop 0.4 (db) 60 IRL (db) - -20 - IRL 0.3 0.2 0.1 Power Droop (db) a127002ev_g2-3 50 10 1200 10 1300 10 00 10-30 a127002ev_g2-4 0.0 10 1200 10 1300 10 00 10

5 Typical RF Performance (cont.) V DD = 50 V, I DQ = 300 ma, T CASE = C, ms pulse width, 20% duty cycle V DD = 50 V, I DQ = 300 ma, T CASE = C, ms pulse width, 20% duty cycle (dbm) Output Power (db) a127002ev_g3-1 12 13 a127002ev_g3-2 Pulsed RF Performance V DD = 50 V, I DQ = 300 ma, = 700 W, ms pulse width, 20% duty cycle Pulsed RFPerformance V DD = 50 V, I DQ = 300 ma, = 700 W, ms pulse width, 20% duty cycle 70-10 0.5 (db) 60 IRL (db) - -20 - IRL Power Droop 0.4 0.3 0.2 Power Droop (db) 50 10 1200 10 1300 10 00 10-30 0.1 a127002ev_g3-3 a127002ev_g3-4 10 1200 10 1300 10 00 10

6 Broadband Circuit Impedance Freq [MHz] Z Source W Z Load W R jx R jx Z Source D Z Load 1200 0.84 1.27 0.90 0.97 1300 0.97 1.06 0.72 0.47 G 00 1. 1.12 0.63 0.03 S Load Pull Performance (single side) Load Pull at Max Point µs pulse width, 10% duty cycle, class AB, V DD = 50 V, 0 ma Freq [MHz] Zl P IN P G [db] PAE Eff [%] 1200 1.91 j2.04 41.40 56.40 436.52.00 53.80 1.30 j2.03 1300 2.72 j3.13 42.24 56.54 0.82.30 54.48 1. j1.94 00 4.83 j1.46 41.66 56.31 427.56. 53.27 1.03 j1.94 Z OUT Load Pull at Max G T Point µs pulse width, 10% duty cycle, class AB, V DD = 50 V, 0 ma Freq [MHz] Zl P IN P G [db] PAE Eff [%] 1200 1.91 j2.04 38.10 54.72 296.48.62 57.89 3.03 j3.11 1300 2.72 j3.13 38.84 54.83 304.09.99 62.54 3.22 j1.63 00 4.83 j1.46 37.21 53.42 219.79.21 57. 2.30 j0.09 Z OUT Load Pull at Max Point µs pulse width, 10% duty cycle, class AB, V DD = 50 V, 0 ma Freq [MHz] Zl P IN P G [db] PAE Eff [%] 1200 1.91 j2.04 39.60.80 380.19.20 60.71 2.22 j2.43 1300 2.72 j3.13 39.44.23 333.43.79 63.71 2.81 j1.90 00 4.83 j1.46 39.39.19 330.37.80 62.26 2.40 j1. Z OUT Z Optimum µs pulse width, 10% duty cycle, class AB, V DD = 50 V, 0 ma Freq [MHz] Zl P IN P G [db] PAE Eff [%] 1200 1.91 j2.04 39..58 361.41.40 60.50 2.41 j2.50 1300 2.72 j3.13 39.50.30 338.84.80 62.60 2.73 j1.51 00 4.83 j1.46 40.00.60 363.08.60 60.70 1.86 j1.37 Z OUT

pt v a12 700 2ev _ C D_ 06-19 - 20 PTVA127002EV 7 Reference Circuit, 1200 C208 RO3010,.0 (62) R801 R804 C803 C801 S3 + S2 R101 R102 C102 C802 R802 R803 S1 C207 R201 C201 C206 RO3010,.0 (62) VDD C103 C104 C101 R104 C205 C204 C203 C111 RF_IN C105 C113 C112 C209 RF_OUT C202 PTVA127002EV_IN C106 C110 R105 C109 R103 C107 C805 R106 C108 R807 C806 S4 R808 C804 R806 C211 R202 C212 VDD R805 S6 + S5 C210 PTVA127002EV_OUT Reference circuit assembly diagram (not to scale)

8 Reference Circuit (cont.) Reference Circuit Assembly DUT Test Fixture Part No. PCB PTVA27002EV V1 LTN/PTVA127002EV V1 Rogers 3010, 0.6mm [0.0 ] thick, 2 oz. copper, ε r = 10.2, ƒ = 1930 1990 MHz Find Gerber files for this test fixture on the Wolfspeed Web site at www.wolfspeed.com/rf Components Information Component Description Suggested Manufacturer P/N Input C101, C102, C108, Capacitor, 39 pf ATC ATC100B390KW500XB C109 C103, C110 Capacitor, 10 μf TDK Corporation C5750X5R1H106K230KA C104, C107 Capacitor, 1 μf TDK Corporation C32X7R2A105M230KA C105, C112, C113 Capacitor, 56 pf ATC ATC100B560JW500XB C106 Capacitor, 3.9 pf ATC ATC800A3R9CW0 C111 Capacitor, 6.2 pf ATC ATC100A6R2CW0XB C801, C802, C803, Capacitor, 1000 pf Panasonic Electronic Components ECJ-1VB1H102K C804, C805, C806 R101, R105 Resistor, 1000 Ω Panasonic Electronic Components ERJ-8GEYJ102V R102, R106 Resistor, 5.6 Ω Panasonic Electronic Components ERJ-8GEYJ5R6V R103, R104, R804, Resistor, 10 Ω Panasonic Electronic Components ERJ-8GEYJ100V R808 R801, R805 Resistor, 2000 Ω Panasonic Electronic Components ERJ-8GEYJ202V R802, R807 Resistor, 1300 Ω Panasonic Electronic Components ERJ-3GEYJ132V R803, R806 Resistor, 1200 Ω Panasonic Electronic Components ERJ-3GEYJ122V S1, S4 Transistor Infineon Technologies BCP56 S2, S5 Voltage Regulator National Semiconductor LM7805 S3, S6 Potentiometer, 2k Ω Bourns Inc. 3224W-1-202E Output C201, C210 Capacitor, 1 μf TDK Corporation C32X7R2A105M230KA C202 Capacitor, 2.2 μf ATC ATC100B2R2CW500 C203 Capacitor, 100 μf Cornell Dubilier Electronics (CDE) SK101M100ST C204 Capacitor, 22 μf Cornell Dubilier Electronics (CDE) SEK220M100ST C205 Capacitor, 10 μf Cornell Dubilier Electronics (CDE) SEK100M100ST C206, C212 Capacitor, 10 μf TDK Corporation C5750X5R1H106K230KA C207, C211 Capacitor, 39 pf ATC ATC100B390KW500 C208 Capacitor, 6800 μf Panasonic Electronic Components ECO-S2AP682EA C209 Capacitor, 56 pf ATC ATC100B560JW500 R201, R202 Resistor, 5.6 Ω Panasonic Electronic Components ERJ-8RQJ5R6V

H-36275-4_po_01_10-22-2012 PTVA127002EV 9 Package Outline Specifications Package H-36275-4 13.72 [.540] 2X R1.59 [R.062] 2X X 1.19 [ X.047] LC 2x 2.03 [.080] REF D1 D2 3.23±0.51 [.127±.020] C L S 9.4 [.360] 10. [.400].612±0.500 [.4±.020] 8X R0.51 +0.13-0.51 [ R.020+.005 -.020 ] LC G1.56 [1.400] CL G2 4X 11.68 [.460] 2.13 [.084] SPH 1.63 [.064] 31.242±0.280 [1.230±.011] 4.58 +0. -0.13.0 +.010 -.005 ] [ LC CL L C 41. [1.620] Diagram Notes unless otherwise specified: 1. Interpret dimensions and tolerances per ASME Y.5M-1994. 2. Primary dimensions are mm. Alternate dimensions are inches. 3. All tolerances ± 0.127 [.005] unless specified otherwise. 4. Pins: D1, D2 drains; G1, G2 gates; S source. 5. Lead thickness: 0.127 ±0.051 mm [0.005 ±0.002 inch]. 6. Gold plating thickness: 1. ± 0.38 micron [ ± microinch].

10 Revision History Revision Date Data Sheet Type Page Subjects (major changes since last revision) 01 2013-10-01 Advance All Data Sheet reflects advance specification for product development 02 20-03-04 Preliminary All Data Sheet reflects preliminary specification 02.1 20-09-30 Preliminary 2 Added LTN/PTVA127002EV E5 test fixture 03 20-11-11 Production All Data Sheet reflects released product specifications Includes Reference Circuit 03.1 20-06- Production 8 Corrected frequency range 03.2 20-04-19 Production 1, 3 Added ESD rating, updated ordering information 03.3 20-02-06 Production 2 Updated operating voltage and junction temperature 04 20-06-19 Production All Converted to Wolfspeed Data Sheet For more information, please contact: 4600 Silicon Drive Durham, North Carolina, USA 27703 www.wolfspeed.com/rf Sales Contact RFSales@wolfspeed.com RF Product Marketing Contact RFMarketing@wolfspeed.com 919.407.78 Notes Disclaimer Specifications are subject to change without notice. Cree, Inc. believes the information contained within this data sheet to be accurate and reliable. However, no responsibility is assumed by Cree for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Cree. Cree makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Typical parameters are the average values expected by Cree in large quantities and are provided for information purposes only. These values can and do vary in different applications and actual performance can vary over time. All operating parameters should be validated by customer s technical experts for each application. Cree products are not designed, intended or authorized for use as components in applications intended for surgical implant into the body or to support or sustain life, in applications in which the failure of the Cree product could result in personal injury or death or in applications for planning, construction, maintenance or direct operation of a nuclear facility. Copyright 20 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Wolfspeed and the Wolfspeed logo are trademarks of Cree, Inc. www.wolfspeed.com