SM5.0T3G Series Pb OBSOLETE/EOL DTE June/30/208 PCN/ECN# LFPCN4246 REPLCED BY SMJ Series Description The SM5.0T3G series is designed to protect voltage sensitive components from high voltage, high energy transients. They have excellent clamping capability, high surge capability, low zener impedance and fast response time. The SM5.0T3G series is supplied in the Littelfuse exclusive, cost-effective, highly reliable package and is ideally suited for use in communication systems, automotive, numerical controls, process controls, medical equipment, business machines, power supplies and many other industrial/consumer applications. Features orking Peak Reverse Voltage Range 5.0 V to 78 V Maximum Ratings and Thermal Characteristics Parameter Standard Zener Breakdown Voltage Range Symbol Value Unit PPK 400 6.7 V to 9.25 V Peak Power 400 @ ms Peak Power Dissipation (Note ) @ TL = 25 C, Pulse idth = ms ESD Rating of Class 3 (> 6 kv) per Human Body Model Response Time is Typically < ns DC Power Dissipation @ TL = 75 C Measured Zero Lead Length (Note 2) PD Derate bove 75 C Thermal Resistance from Junction to Lead R JL.0 20 m/ C 50 C/ Flat Handling Surface for ccurate Placement Package Design for Top Slide or Bottom Circuit Board Mounting Low Profile Package Bi-directional These are Pb Free Device DC Power Dissipation (Note 3) @ T = 25 C PD Derate bove 25 C Thermal Resistance from Junction to mbient R0J 0.5 4.0 m/ C 250 C/ Functional Diagram Cathode Forward Surge Current (Note 4) @ T = 25 C IFSM 40 Operating and Storage Temperature Range TJ, Tstg -65 to +50 C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. node dditional Information Uni-directional Datasheet Resources Samples. 0 X 000 µs, non repetitive. 2. square copper pad, FR 4 board. 3. FR 4 board, using Littelfuse minimum recommended footprint, as shown in 403D-02 case outline dimensions spec. 4. /2 sine wave (or equivalent square wave), P = 8.3 ms, duty cycle = 4 pulses per minute maximum.
I-V Curve Characteristics (T = 25 C unless otherwise noted, VF = 3.5 V Max. @ IF = 30 for all types) (Note 5) Symbol I IF V C V BR V RM IR V F IT IPP V Parameter IPP Maximum Reverse Peak Pulse Current VC Clamping Voltage @ IPP VRM orking Peak Reverse Voltage IR Maximum Reverse Leakage Current @ VRM VBR Breakdown Voltage @ IT IT Test Current IF Maximum Temperature Coefficient of VBR VF Forward Voltage @ IF 5. /2 sine wave or equivalent, P = 8.3 ms, non repetitive duty cycle. 5. /2 sine wave or equivalent, P = 8.3 ms non repetitive duty cycle
Electrical Characteristics Device* Device Marking V RM (Note 6) Breakdown Voltage V C @ I PP (Note 8) I R @ V RM V BR @ I T (V) (Note 7) @ I T V C I PP C Typ. (Note 9) Volts µ MIN NOM MX m Volts mps pf SM5.0T3G QE 5.0 400 6.4 6.7 7.0 0 9.2 43.5 2035 SM6.0T3G QG 6.0 400 6.67 7.02 7.37 0 0.3 38.8 730 SM6.5T3G QK 6.5 250 7.22 7.6 7.98 0.2 35.7 605 SM8.0T3G QR 8.0 25 8.89 9.36 9.83 3.6 29.4 035 SM8.5T3G QT 8.5 5.0 9.44 9.92 0.4 4.4 27.8 265 SM9.0T3G QV 9.0 2.5 0 0.55. 5.4 26.0 200 SM0T3G QX 0 2.5..7 2.3 7.0 23.5 090 SMT3G QZ 2.5 2.2 2.85 3.5 8.2 22.0 000 SM2T3G RE 2 2.5 3.3 4.0 4.7 9.9 20. 925 SM3T3G RG 3 2.5 4.4 5.5 5.9 2.5 8.6 860 SM4T3G RH 4 2.5 5.6 6.4 7.2 23.2 7.2 800 SM5T3G RM 5 2.5 6.7 7.6 8.5 24.4 6.4 758 SM6T3G RP 6 2.5 7.8 8.75 9.7 26.0 5.4 75 SM7T3G RR 7 2.5 8.9 9.9 20.9 27.6 4.5 680 SM8T3G RT 8 2.5 20 2.05 22. 29.2 3.7 645 SM20T3G RV 20 2.5 22.2 23.35 24.5 32.4 2.3 585 SM22T3G RX 22 2.5 24.4 25.65 26.9 35.5.3 540 SM24T3G RZ 24 2.5 26.7 28. 29.5 38.9 0.3 500 SM26T3G SE 26 2.5 28.9 30.4 3.9 42. 9.5 460 SM28T3G SG 28 2.5 3. 32.75 34.4 45.4 8.8 430 SM30T3G SK 30 2.5 33.3 35.05 36.8 48.4 8.3 405 SM33T3G SM 33 2.5 36.7 38.65 40.6 53.3 7.5 375 SM36T3G SP 36 2.5 40 42. 44.2 58. 6.9 345 SM40T3G SR 40 2.5 44.4 46.75 49. 64.5 6.2 35 SM43T3G ST 43 2.5 47.8 50.3 52.8 69.4 5.8 295 SM45T3G SV 45 2.5 50 52.65 55.3 72.2 5.5 280 SM48T3G SX 48 2.5 53.3 56. 58.9 77.4 5.2 265 SM54T3G TE 54 2.5 60 63.5 66.3 87. 4.6 240 SM58T3G TG 58 2.5 64.4 67.8 7.5 93.6 4.3 225 SM70T3G TP 70 2.5 77.8 8.9 86.0 3 3.5 90 6. transient suppressor is normally selected according to the working peak reverse voltage (V RM ), which should be equal to or greater than the DC or continuous peak operating voltage level. 7. V BR measured at pulse test current I T at an ambient temperature of 25 C. 8. Surge current waveform per Figure 2 and derate per Figure 3. 9. Bias voltage = 0 V, F =.0 MHz, T J = 25 C. Please see SM0CT3 to SM75CT3 for Bidirectional devices.
Ratings and Characteristic Curves Figure. Pulse Rating Curve Figure 2. Pulse aveform Ppk, PEK POER (k) 00 NONREPETITIVE PULSE VEFORM SHON IN FIGURE 2. T = 25 C 0 0. 0 4 0.00 0. 0.0 tp, PULSE IDTH (ms) 0 Figure 3 - Pulse Derating Curve Figure 4. Typical Junction Capacitance vs. Bias Voltage C, CPCITNCE (pf) 0,000 TJ = 25 C F = MHz SM5.0T3G,000 SM0T3G SM36T3G 00 SM64T3G 0 0 BIS VOLTGE (VOLTS) PD, MXIMUM POER DISSIPTION (TTS) Figure 5. Steady State Power Derating 6 5 4 @ TL = 75 C PD =.5 3 2 @ T = 25 C PD = 0.5 0 0 25 50 00 75 T, TEMPERTURE ( C) 25 50 00
Dimensions Soldering Footrpint HE 4.000 0.57 E bd D 2.000 0.079 POLRITY INDICTOR OPTIONL S NEEDED (SEE STYLES) c L 2.000 0.079 SCLE 8: Dim Inches mm inches Millimeters Min Nom Max Min Nom Max 0.078 0.083 0.087.97 2.0 2.20 0.002 0.004 0.008 0.05 0.0 0.20 b 0.050 0.057 0.064.27.45.63 c 0.006 0.0 0.06 0.5 0.28 0.4 D 0.090 0.03 0.5 2.29 2.60 2.92 E 0.60 0.70 0.80 4.06 4.32 4.57 HE 0.90 0.205 0.220 4.83 5.2 5.59 L 0.030 0.045 0.060 0.76.4.52 NOTES: ORDERING INFORMTION Device Package Shipping SM (Pb Free) SMxxT3G 5,000 / Tape & Reel Flow/ave Soldering (Solder Dipping) Peak Temperature : 260OC Dipping Time : 0 seconds. DIMENSIONING ND TOLERNCING PER NSI Y4.5M, 982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION b SHLL BE MESURED ITHIN DIMENSION L. Physical Specifications STYLE : PIN. CTHODE (POLRITY BND) 2. NODE Case Void-free, transfer-molded, thermosetting plastic Polarity Cathode indicated by molded polarity notch Mounting Position ny Finish ll external surfaces are corrosion resistant and leads are readily solderable Part Marking System xx Y xx = Y= = Device Code (Refer to page 3) ssembly Location Year = ork eek Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at: www.littelfuse.com/disclaimer-electronics.