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Transcription:

Datasheet N-channel 900 V, 3.6 Ω typ., 3 A SuperMESH Power MOSFETs in DPAK, TO-220 and TO-220FP packages TAB Features TAB 2 3 1 DPAK Order code V DS R DS(on) max. I D Package STD3NK90ZT4 DPAK STP3NK90Z 900 V 4.8 Ω 3 A TO-220 TO-220 G(1) 1 2 3 D(2, TAB) 1 2 3 TO-220FP STP3NK90ZFP Extremely high dv/dt capability 100% avalanche tested Gate charge minimized Very low intrinsic capacitance Zener-protected TO-220FP Applications S(3) AM01475V1 Switching applications Product status link Description These high-voltage devices are Zener-protected N-channel Power MOSFETs developed using the SuperMESH technology by STMicroelectronics, an optimization of the well-established PowerMESH. In addition to a significant reduction in on-resistance, these devices are designed to ensure a high level of dv/dt capability for the most demanding applications. STD3NK90ZT4 STP3NK90Z STP3NK90ZFP DS2980 - Rev 3 - August 2018 For further information contact your local STMicroelectronics sales office. www.st.com

Electrical ratings 1 Electrical ratings Table 1. Absolute maximum ratings Symbol Parameter DPAK, TO-220 Value TO-220FP Unit V DS Drain-source voltage 900 V V GS Gate-source voltage ± 30 V I D Drain current (continuous) at T C = 25 C 3 3 (1) A I D Drain current (continuous) at T C = 100 C 1.89 1.89 (1) A I (2) DM Drain current (pulsed) 12 12 (1) A P TOT Total dissipation at T C = 25 C 90 25 W ESD Gate-source human body model (R = 1,5 kω, C = 100 pf) 4 kv dv/dt (3) Peak diode recovery voltage slope 4.5 V/ns V ISO T j T stg Insulation withstand voltage (RMS) from all three leads to external heat sink (t = 1 s; T c = 25 C) Operating junction temperature range Storage temperature range 2.5 kv -55 to 150 C 1. Limited by maximum junction temperature. 2. Pulse width limited by safe operating area. 3. I SD 3 A, di/dt 200 A/μs, V DS(peak) V (BR)DSS, V DD = 80% V (BR)DSS. Table 2. Thermal data Symbol Parameter Value DPAK TO-220 TO-220FP Unit R thj-case Thermal resistance junction-case 1.38 5 R thj-amb Thermal resistance junction-ambient 62.5 C/W R thj-pcb (1) Thermal resistance junction-pcb 50 1. When mounted on 1inch² FR-4, 2 Oz copper board. Table 3. Avalanche characteristics Symbol Parameter Value Unit I (1) AR Avalanche current, repetitive or not-repetitive 3 A E (2) AS Single pulse avalanche energy 180 mj 1. Pulse width limited by T jmax. 2. Starting T j = 25 C, I D = I AR, V DD = 50 V. DS2980 - Rev 3 page 2/24

Electrical characteristics 2 Electrical characteristics (T CASE = 25 C unless otherwise specified) Table 4. On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)DSS I DSS I GSS Drain-source breakdown voltage Zero gate voltage drain current Gate body leakage current I D = 1 ma, V GS = 0 V 900 V V GS = 0 V, V DS = 900 V 1 µa V GS = 0 V, V DS = 900 V, T C = 125 C (1) 50 μa V DS = 0 V, V GS = ±20 V ±10 μa V GS(th) Gate threshold voltage V DS = V GS, I D = 50 µa 3 3.75 4.5 V R DS(on) Static drain-source on resistance V GS = 10 V, I D = 1.5 A 3.6 4.8 Ω 1. Defined by design, not subject to production test. Table 5. Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit C iss Input capacitance 590 C oss Output capacitance V DS = 25 V, f = 1 MHz, V GS = 0 V 63 - C rss Reverse transfer capacitance 13 - pf C oss eq. (1) Equivalent output capacitance V DS = 0 to 720 V, V GS = 0 V - 35 - pf Q g Total gate charge V DD = 720 V, I D = 3 A, V GS = 0 to 10 V 22.7 Q gs Gate-source charge (see Figure 16. Test circuit for gate charge - 4.2 Q gd Gate-drain charge behavior) 12 - nc 1. C oss eq. is defined as a constant equivalent capacitance giving the same charging time as C oss when V DS increases from 0 to 80% V DSS. Table 6. Switching times Symbol Parameter Test conditions Min. Typ. Max. Unit t d(on) t r t d(off) t f Turn-on delay time Rise time Turn-off delay time Fall time V DD = 450 V, I D = 1.5 A, R G = 4.7 Ω, V GS = 10 V - (see Figure 15. Test circuit for resistive load switching times and Figure 20. Switching time waveform) 18 7 45 18 - ns DS2980 - Rev 3 page 3/24

Electrical characteristics Table 7. Source drain diode Symbol Parameter Test conditions Min. Typ. Max. Unit I SD I SDM (1) Source-drain current Source-drain current (pulsed) - 3 12 A V (2) SD Forward on voltage I SD = 3 A, V GS = 0 V - 1.6 V t rr Reverse recovery time I SD = 3 A, di/dt = 100 A/µs 510 ns Q rr Reverse recovery charge V DD = 40 V, T J = 150 C - 2.2 μc I RRM Reverse recovery current (see Figure 17. Test circuit for inductive load switching and diode recovery times) 8.7 A 1. Pulse width limited by safe operating area. 2. Pulsed: pulse duration = 300 μs, duty cycle 1.5%. Table 8. Gate-source Zener diode Symbol Parameter Test conditions Min. Typ. Max. Unit V (BR)GSO Gate-source breakdown voltage I GS = ±1 ma, I D = 0 A 30 - - V The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device. The Zener voltage facilitates efficient and cost-effective device integrity protection, thus eliminating the need for additional external componentry. DS2980 - Rev 3 page 4/24

Electrical characteristics curves 2.1 Electrical characteristics curves Figure 1. Safe operating area for DPAK, TO-220 Figure 2. Thermal impedance for DPAK, TO-220 Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP K δ=0.5 δ=0.2 0.05 0.1 GC20940_ZTH 10-1 0.02 0.01 Single pulse 10-2 10-3 10-4 10-3 10-1 10 0 10-2 tp(s) Figure 5. Output characterisics Figure 6. Transfer characteristics DS2980 - Rev 3 page 5/24

Electrical characteristics curves Figure 7. Static drain-source on resistance Figure 8. Gate charge vs gate-source voltage Figure 9. Capacitance variations Figure 10. Normalized gate threshold voltage vs temperature Figure 11. Normalized on resistance vs temperature Figure 12. Source-drain diode forward characteristics DS2980 - Rev 3 page 6/24

Electrical characteristics curves Figure 13. Maximum avalanche energy vs temperature Figure 14. Normalized V (BR)DSS vs temperature DS2980 - Rev 3 page 7/24

Test circuits 3 Test circuits Figure 15. Test circuit for resistive load switching times Figure 16. Test circuit for gate charge behavior VDD VD RL + 2200 μf 3.3 μf VDD VGS 12 V IG= CONST 47 kω 100 Ω 100 nf D.U.T. 1 kω VGS pulse width RG D.U.T. pulse width 2200 μf + 2.7 kω 47 kω VG 1 kω AM01468v1 AM01469v1 Figure 17. Test circuit for inductive load switching and diode recovery times Figure 18. Unclamped inductive load test circuit G 25 Ω A D D.U.T. S B A fast diode B A B G 100 µh 3.3 1000 D µf + µf VDD D.U.T. VD ID L + 2200 µf 3.3 µf VDD + _ RG S Vi pulse width D.U.T. AM01471v1 AM01470v1 Figure 19. Unclamped inductive waveform Figure 20. Switching time waveform V(BR)DSS t on t off VD t d(on) t r t d(off) t f 90% 90% IDM ID 0 10% V DS 10% VDD VDD V GS 90% AM01472v1 0 10% AM01473v1 DS2980 - Rev 3 page 8/24

Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. DS2980 - Rev 3 page 9/24

DPAK (TO-252) type A2 package information 4.1 DPAK (TO-252) type A2 package information Figure 21. DPAK (TO-252) type A2 package outline 0068772_type-A2_rev25 DS2980 - Rev 3 page 10/24

DPAK (TO-252) type A2 package information Table 9. DPAK (TO-252) type A2 mechanical data Dim. mm Min. Typ. Max. A 2.20 2.40 A1 0.90 1.10 A2 0.03 0.23 b 0.64 0.90 b4 5.20 5.40 c 0.45 0.60 c2 0.48 0.60 D 6.00 6.20 D1 4.95 5.10 5.25 E 6.40 6.60 E1 5.10 5.20 5.30 e 2.159 2.286 2.413 e1 4.445 4.572 4.699 H 9.35 10.10 L 1.00 1.50 L1 2.60 2.80 3.00 L2 0.65 0.80 0.95 L4 0.60 1.00 R 0.20 V2 0 8 DS2980 - Rev 3 page 11/24

DPAK (TO-252) type C2 package information 4.2 DPAK (TO-252) type C2 package information Figure 22. DPAK (TO-252) type C2 package outline 0068772_C2_25 DS2980 - Rev 3 page 12/24

DPAK (TO-252) type C2 package information Table 10. DPAK (TO-252) type C2 mechanical data Dim. mm Min. Typ. Max. A 2.20 2.30 2.38 A1 0.90 1.01 1.10 A2 0.00 0.10 b 0.72 0.85 b4 5.13 5.33 5.46 c 0.47 0.60 c2 0.47 0.60 D 6.00 6.10 6.20 D1 5.10 5.60 E 6.50 6.60 6.70 E1 5.20 5.50 e 2.186 2.286 2.386 H 9.80 10.10 10.40 L 1.40 1.50 1.70 L1 2.90 REF L2 0.90 1.25 L3 0.51 BSC L4 0.60 0.80 1.00 L6 1.80 BSC θ1 5 7 9 θ2 5 7 9 V2 0 8 DS2980 - Rev 3 page 13/24

DPAK (TO-252) type C2 package information Figure 23. DPAK (TO-252) recommended footprint (dimensions are in mm) FP_0068772_25 DS2980 - Rev 3 page 14/24

DPAK (TO-252) packing information 4.3 DPAK (TO-252) packing information Figure 24. DPAK (TO-252) tape outline 10 pitches cumulative tolerance on tape +/- 0.2 mm T Top cover tape P0 D P2 E B1 K0 B0 F W For machine ref. only including draft and radii concentric around B0 A0 P1 D1 User direction of feed R User direction of feed Bending radius AM08852v1 DS2980 - Rev 3 page 15/24

DPAK (TO-252) packing information Figure 25. DPAK (TO-252) reel outline B 40mm min. access hole at slot location T D C A N Full radius Tape slot in core for tape start 2.5mm min.width G measured at hub AM06038v1 Table 11. DPAK (TO-252) tape and reel mechanical data Tape Reel Dim. mm mm Dim. Min. Max. Min. Max. A0 6.8 7 A 330 B0 10.4 10.6 B 1.5 B1 12.1 C 12.8 13.2 D 1.5 1.6 D 20.2 D1 1.5 G 16.4 18.4 E 1.65 1.85 N 50 F 7.4 7.6 T 22.4 K0 2.55 2.75 P0 3.9 4.1 Base qty. 2500 P1 7.9 8.1 Bulk qty. 2500 P2 1.9 2.1 R 40 T 0.25 0.35 W 15.7 16.3 DS2980 - Rev 3 page 16/24

TO-220 type A package information 4.4 TO-220 type A package information Figure 26. TO-220 type A package outline 0015988_typeA_Rev_21 DS2980 - Rev 3 page 17/24

TO-220 type A package information Table 12. TO-220 type A package mechanical data Dim. mm Min. Typ. Max. A 4.40 4.60 b 0.61 0.88 b1 1.14 1.55 c 0.48 0.70 D 15.25 15.75 D1 1.27 E 10.00 10.40 e 2.40 2.70 e1 4.95 5.15 F 1.23 1.32 H1 6.20 6.60 J1 2.40 2.72 L 13.00 14.00 L1 3.50 3.93 L20 16.40 L30 28.90 øp 3.75 3.85 Q 2.65 2.95 DS2980 - Rev 3 page 18/24

TO-220FP package information 4.5 TO-220FP package information Figure 27. TO-220FP package outline 7012510_Rev_12_B DS2980 - Rev 3 page 19/24

TO-220FP package information Table 13. TO-220FP package mechanical data Dim. mm Min. Typ. Max. A 4.4 4.6 B 2.5 2.7 D 2.5 2.75 E 0.45 0.7 F 0.75 1 F1 1.15 1.70 F2 1.15 1.70 G 4.95 5.2 G1 2.4 2.7 H 10 10.4 L2 16 L3 28.6 30.6 L4 9.8 10.6 L5 2.9 3.6 L6 15.9 16.4 L7 9 9.3 Dia 3 3.2 DS2980 - Rev 3 page 20/24

Ordering information 5 Ordering information Table 14. Order codes Order code Marking Package Packing STD3NK90ZT4 D3NK90Z DPAK Tape and reel STP3NK90Z P3NK90Z TO-220 STP3NK90ZFP P3NK90ZFP TO-220FP Tube DS2980 - Rev 3 page 21/24

Revision history Table 15. Document revision history Date Version Changes 24-Oct-2006 1 First release. 29-Jan-2013 2 20-Aug-2018 3 The part number STD3NK90Z-1 has been moved to a separate datasheet Minor text changes Updated: Section 4: Package mechanical data Removed maturity status indication from cover page. The document status is production data. Updated title in cover page, Section 1 Electrical ratings, Section 2 Electrical characteristics and Section 4 Package information. Minor text changes. DS2980 - Rev 3 page 22/24

Contents Contents 1 Electrical ratings...2 2 Electrical characteristics...3 2.1 Electrical characteristics curves...5 3 Test circuits...8 4 Package information...9 4.1 DPAK (TO-252) type A2 package information... 9 4.2 DPAK (TO-252) type C2 package information... 11 4.3 DPAK (TO-252) packing information... 14 4.4 TO-220 type A package information...16 4.5 TO-220FP package information...18 5 Ordering information...21 Revision history...22 DS2980 - Rev 3 page 23/24

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2018 STMicroelectronics All rights reserved DS2980 - Rev 3 page 24/24