Typical Performance 1. 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system.

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Device Features OIP3 = 41.0 dbm @ 1900 MHz Gain = 15.5 db @ 1900 MHz Output P1 db = 25.5 dbm @ 1900 MHz 50 Ω Cascadable Lead-free/RoHS-compliant SOT-89 SMT package Product Description BeRex s BT09VG is a high performance and a high dynamic range amplifier in a low cost surface mount package(sot-89) with a RoHS -compliant, that incorporates reliable heterojunction-bipolar-transistor (HBT) devices fabricated with InGaP GaAs technology. This device is designed for use where high linearity is required and features high OIP3 and P1 with low consumption current (85mA) and requires a few external matching components such as a DC blocking capacitors on the In/Output pin, a bypass capacitor and a RF choke for the out port. All devices are 100% RF/DC tested. Applications Base station Infrastructure/RFID Commercial/Industrial/Military wireless system Application Circuits RF In DC Block RF Choke BT09VG DC Block Bypass Vcc RF Out Typical Performance 1 Parameter Frequency Unit 1 Device performance _ measured on a BeRex evaluation board at 25 C, 50 Ω system. 2 OIP3 _ measured with two tones at an output of 13 dbm per tone separated by 1 MHz. Absolute Maximum Ratings 900 1900 2450 3500 MHz Gain 21.5 15.5 13.5 10.8 db S11-16.0-30.0-14.0-15.0 db S22-24.0-19.0-19.0-14.0 db OIP3 2 39.0 41.0 41.0 42.0 dbm P1dB 24.5 25.5 27.0 25.0 dbm Noise Figure 3.7 4.0 4.7 5.4 db Min. Typical Max. Unit Bandwidth 5 4000 MHz I C @ (Vc = 5V) 140 160 180 ma V C 5.0 V R TH 50 C/W Parameter Rating Unit Operating Case Temperature -40 to +85 C Storage Temperature -55 to +155 C Junction Temperature +220 C Operating Voltage Supply Current Input RF Power +7.0 220 23 V ma dbm *Operation of this device above any of these parameters may result in permanent damage. *external matching circuit: refer to the page 5 to 14. 1

V-I Characteristics BeRex SOT89 Evaluation Board BeRex Evaluation Board *Dielectric constant _ 4.2 *RF pattern width 52mil *31mil thick FR4 PCB Typical Device Data S-parameters (Vc=5V, Ic=160mA, T=25 C) 2

S-Parameter (Vdevice = 5.0V, Icc = 160mA, T = 25 C, calibrated to device leads) Freq [MHz] S11 Mag S11 Ang S21 Mag S21 Ang 100 0.65-180.00 16.00 170.00 0.03 2.50 0.30-170.00 500 0.74 180.00 11.00 130.00 0.03 8.90 0.38-170.00 1000 0.79 170.00 7.00 98.00 0.03 14.00 0.42 180.00 1500 0.81 150.00 5.00 82.00 0.03 18.00 0.44 170.00 2000 0.83 140.00 3.90 69.00 0.04 19.00 0.46 170.00 2500 0.85 130.00 3.20 57.00 0.04 19.00 0.45 160.00 3000 0.88 120.00 2.80 46.00 0.04 18.00 0.45 150.00 3500 0.92 110.00 2.50 35.00 0.04 14.00 0.48 140.00 4000 0.96 98.00 2.20 23.00 0.05 11.00 0.51 140.00 S12 Mag S12 Ang S22 Mag S22 Ang 3

WCDMA 6FA 2140 55dBc WCDMA 6FA 2140 60dBc 4

ACLR Application Circuit: 900 MHz Schematic Diagram BOM Tolerance RFin C4 BT09VG L1 C7 C1 C2 C5 +5V C3 RFout C1 100pF ±5% C2 1000pF ±5% C3* 10uF ±20% C4 100pF ±5% C5 100pF ±5% C6 7pF ±5% C6 L2 Note: C7 10pF ±5% L1 39nH 5% L2 6.8nH 5% 10uF 1. PCB: 31mil thick FR4. 100pF 7pF BT013 BT09VG B B 39nH 10pF 1000 pf 100pF 100pF 6.8nH 2. Distance between the center of the shunt cap(c6) and the input pin of BT09VG _ 7.0mm. 3. Distance between the center of the series cap(c7) and the output pin of BT09VG _ 3.5mm. 4. Distance between the center of the shunt inductor(l2) and the output pin of BT09VG _ 5.5mm. 5

Typical Performance 6

Performance Variation with Supply Voltage 7

Application Circuit: 1900MHz Schematic Diagram BOM Tolerance RFin C4 C8 C6 BT09VG L1 L2 C1 C7 C2 C5 +5V C3 RFout Note:1. PCB: 31mil thick FR4. C1 100pF ±5% C2 100pF ±5% C3* 10uF ±20% C4 100pF ±5% C5 100pF ±5% C6 2.7pF ±5% C7 1.5pF ±5% C8 4.7pF ±5% L1 39nH 5% L2 1nH 2% 10uF 1000 pf 2. Distance between the center of the series cap(c8) and the input pin of BT09VG _ 2.5mm. 100pF 2.7pF 4.7pF BT013 BT09VG B B 39nH 1nH 100pF 1.5pF 100pF 3. Distance between the center of the shunt cap(c6) and the input pin of BT09VG _ 4.0mm. 4. Distance between the center of the series inductor (L2) and the output pin of BT09VG _ 3.5mm. 5. Distance between the center of the shunt cap(c7) and the output pin of BT09VG _ 8.0mm. *Skipping C3 reduces device ruggedness. Typical Performance 8

9

Performance Variation with Supply Voltage 10

Application Circuit: 2450MHz Schematic Diagram BOM Tolerance RFin C4 C8 BT09VG L1 C1 C2 C5 +5V C3 RFout C1 100pF ±5% C2 1000pF ±5% C3* 10uF ±20% C4 56pF ±5% C5 56pF ±5% C6 1.5pF ±5% C6 C7 Note: C7 0.75pF ±5% C8 2.2pF ±5% L1 33nH 5% 10uF 1. PCB: 31mil thick FR4. 1000 pf 100pF 2. Distance between the center of the series cap(c8) and the input pin of BT09VG _ 2.5mm. 56pF 1.5pF 2.2pF BT013 BT09VG B B 33nH 0.75pF 56pF 3. Distance between the center of the shunt cap(c6) and the input pin of BT09VG _ 4.0mm. 4. Distance between the center of the shunt cap(c7) and the output pin of BT09VG _ 6.2mm. *Skipping C3 reduces device ruggedness. Typical Performance 11

12

Performance Variation with Supply Voltage 13

Application Circuit: 3500MHz Schematic Diagram BOM Tolerance RFin C4 C7 BT09VG L1 C1 C2 C5 +5V C3 RFout C1 100pF ±5% C2 1000pF ±5% C3 10uF ±20% C4 22pF ±5% C5 22pF ±5% C6 0.5pF ±5% C6 C7 0.5pF ±5% L1 33nH ±5% Note: 10uF 1. PCB: 31mil thick FR4. 1000 pf 100pF 2. Distance between the center of the series cap(c7) and the input pin of BT09VG _ 2.5mm. 22pF 0.5pF 0.5pF BT013 BT09VG B B 33nH 22pF 3. Distance between the center of the shunt cap(c6) and the input pin of BT09VG _ 8.5mm. Typical Performance 14

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Package Outline Dimension Suggested PCB Land Pattern and PAD Layout PCB Land Pattern PCB Mounting 0.40 1.30 0.40 Ø0.40 0.40 0.75 1.20 2.15 1.20 1.20 1.50 1.00 0.45 1.20 0.50 2.80 0.65 0.35 Note : All dimension are in millimeters PCB lay out _ on BeRex website 16

Package Marking Tape & Reel SOT89 Packaging information: Tape Width (mm): 12 Reel Size (inches): 7 YY = Year, WW = Working Week, XX = Wafer No. Device Cavity Pitch (mm): 8 Devices Per Reel: 1000 Lead plating finish 100% Tin Matte finish (All BeRex products undergoes a 1 hour, 150 degree C, Anneal bake to eliminate thin whisker growth concerns.) MSL / ESD Rating ESD Rating: Value: Test: Standard: Class 1B Passes <1000V Human Body Model (HBM) JEDEC Standard JESD22-A114B MSL Rating: Standard: Level 1 at +265 C convection reflow JEDEC Standard J-STD-020 NATO CAGE code: 2 N 9 6 F 17