AD6C311-HSTR. Features. Description. Agency Approvals. Applications. Absolute Maximum Ratings. Schematic Diagram. Ordering Information.

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Transcription:

Description Features The AD6C311 is a bi-directional, single-pole, single-throw, normally open multipurpose solid state relay. It is designed to replace electromechanical relays in general purpose switching applications. The relay consists of an integrated circuit that drives two rugged source-to-source enhancement type DMOS transistors optically coupled to a light emitting diode. The AD6C311 comes standard in a miniature 6 pin DIP package making it ideal for high-density board applications. Low Input Control Current (2.5mA TYP) 200mA Maximum Continuous Load Current Low On Resistance (10 TYP) High Isolation Voltage (3.75kV RMS, 5kV RMS -H Option) Long Life / High Reliability RoHS / Pb-Free / REACH Compliant Applications Meter Reading Systems Multiplexers Data Acquisition Medical Equipment Battery Monitoring Home / Safety Security Systems Schematic Diagram Agency Approvals UL/C-UL: File # E201932 VDE: File # 40035191 (EN 60747-5-2) Absolute Maximum Ratings The values indicated are absolute stress ratings. Functional operation of the device is not implied at these or any conditions in excess of those defined in electrical characteristics section of this document. Exposure to absolute Maximum Ratings may cause permanent damage to the device and may adversely affect reliability. (+) Input 1 6 -/+ Load Storage Temperature..-55 to +125 C Operating Temperature -40 to +85 C Continuous Input Current..50mA Transient Input Current...500mA Reverse Input Control Voltage.. 6V Input Power Dissipation 40mW Output Power Dissipation..800mW Solder Temperature Wave (10sec)..260 C Solder Temperature IR Reflow (10sec)...260 C (-) Input 2 5 DC Connection Ordering Information Do Not Use 3 4 AD6C311 -/+ Load Part Number AD6C311 AD6C311-H AD6C311-S AD6C311-HS AD6C311-STR AD6C311-HSTR Description 6 pin DIP, (50/Tube) 5kV RMS Viso, 6 pin DIP, (50/Tube) 6 pin SMD, (50/Tube) 5kV RMS, 6 pin SMD, (50/Tube) 6 pin SMD, Tape and Reel (1000/Reel) 5kV RMS, 6 pin SMD, Tape and Reel (1000/Reel) NOTE: Suffixes listed above are not included in marking on device for part number identification Page 1 of 8

Electrical Characteristics, T A = 25 C (unless otherwise specified) Parameter Symbol Min. Typ. Max. Units Test Conditions Input Specifications LED Forward Voltage V F - 1.2 1.5 V I F = 10mA LED Reverse Voltage BV R 6 - - V I R = 10μA Turn-On Current I F - 2.5 5 ma I O = 200mA Turn-Off Current I FOFF - 1 - ma - Output Specifications Blocking Voltage V B 400 - - V I O =1A Continuous Load Current I O - - 200 ma I F =5mA On Resistance R ON - 6.5 10 Ω I F =5mA, I O =200mA Leakage Current I Oleak - 0.05 1 A I F =0mA, V O =400V Output Capacitance C OUT - 25 50 pf I F =0mA, f=1.0mhz Offset Voltage V OFFSET - - 0.2 mv I F =5mA Coupled Specifications Turn-On Time T ON - 1.5 5 ms I F =5mA, I O =200mA Turn-Off Time T OFF - 0.05 1 ms I F =0mA, I O =200mA Coupled Capacitance C COUPLED - 3 - pf Contact Transient Ratio - 2,000 7,000 0 V/S dv = 50V Isolation Specifications Isolation Voltage V ISO 3,750 - - V RMS RH 50%, t=1min -H Option V ISO 5,000 - - V RMS RH 50%, t=1min Input-Output Resistance R I-O - 10 12 - V I-O = 500V DC Page 2 of 8

AD6C311 Performance & Characteristics Plots, T A = 25 C (unless otherwise specified) Page 3 of 8

AD6C311 Solder Temperature Profile Recommendations (1) Infrared Reflow: Refer to the following figure as an example of an optimal temperature profile for single occurrence infrared reflow. Soldering process should not exceed temperature or time limits expressed herein. Surface temperature of device package should not exceed 250ºC: G F D B A E H C Process Step Description Figure 1 A Preheat Start Temperature (ºC) 150ºC B Preheat Finish Temperature (ºC) 180ºC C Preheat Time (s) 90-120s D Melting Temperature (ºC) 230ºC E Time above Melting Temperature (s) 30s F Peak Temperature, at Terminal (ºC) 260ºC G Dwell Time at Peak Temperature (s) 10s H Cool-down (ºC/s) <6ºC/s Parameter (2) Wave Solder: Maximum Temperature: 260ºC (at terminal) Maximum Time: 10s Pre-heating: 100-150ºC (30-90s) Single Occurrence (3) Hand Solder: Maximum Temperature: 350ºC (at tip of soldering iron) Maximum Time: 3s Single Occurrence Page 4 of 8

AD6C311 Package Dimensions 6 PIN DIP Package Note: All dimensions in inches [ ] with millimeters in parenthesis () Device Weight: 0.45g Page 5 of 8

AD6C311 Package Dimensions 6 PIN SMD Surface Mount Package (-S) Note: All dimensions in inches [ ] with millimeters in parenthesis () Device Weight: 0.45g Page 6 of 8

AD6C311 Package Dimensions 6 PIN SMD Tape & Reel (-STR) Note: All dimensions in millimeters Page 7 of 8

AD6C311 Package Marking AD6C311 YYWW Date Code Pin 1 DISCLAIMER Solid State Optronics (SSO) makes no warranties or representations with regards to the completeness and accuracy of this document. SSO reserves the right to make changes to product description, specifications at any time without further notices. SSO shall not assume any liability arising out of the application or use of any product or circuit described herein. Neither circuit patent licenses nor indemnity are expressed or implied. Except as specified in SSO s Standard Terms & Conditions, SSO disclaims liability for consequential or other damage, and we make no other warranty, expressed or implied, including merchantability and fitness for particular use. LIFE SUPPORT POLICY SSO does not authorize use of its devices in life support applications wherein failure or malfunction of a device may lead to personal injury or death. Users of SSO devices in life support applications assume all risks of such use and agree to indemnify SSO against any and all damages resulting from such use. Life support devices are defined as devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when used properly in accordance with instructions for use can be reasonably expected to result in significant injury to the user, or (d) a critical component of a life support device or system whose failure can be reasonably expected to cause failure of the life support device or system, or to affect its safety or effectiveness. Page 8 of 8