Problem/Procedure Description Creating a multilayer PCB with boardmaster 5 Requirements LPKF Milling machine Fiducial recognition camera Boardmaster 5.0 software USB 2.0 port Multi-Press S or Multi-Press II Mini-Contac galvanic plating system One (1) piece of Prepreg material One (1) piece of double sided base material Two (2) pieces of single sided laminate Problem/Procedure Solution 1. Open Boardmaster a. Double click on the boardmaster icon. b. When prompted, enter the tool status 2. Load the multi-layer phase file a. Go to the file menu, select new and click on the 4-layer.phs file. 3. Load the tool list a. Go to the configuration menu, select tool library, then click on Mill/Drill. b. Press the load button Page 1 of 6
c. Select the tool list required for your machine. i. 100K motors load FR-4 100.tls ii. 60K motors load FR-4 60.tls iii. 30K motors load FR-4 30.tls 4. Import the multi-layer LMD file a. Press the import icon, or go to the file menu, select import and then LMD b. Select the desired LMD file to be imported. c. Press OK. 5. Place the LMD file in the middle of the working area. a. Right click on the project, or go to the edit menu and click on placement. b. Adjust the Y axis origin point to zero (0). Page 2 of 6
6. Place PCB core onto the milling machine (Layers 2 and 3) 7. Load required tools into the toolbar. a. If using the 95sII, H100, S62 or S100, press the tool dialogue icon. b. For the S62 and S100, when prompted, move the machine to the pause position. c. On the right side of the tool positions window, the required tools to create the PCB board are listed. d. On the left side of the tool positions window, verify that the tools listed match up with the tools from the right side. They do not have to match line by line. Note: If using an S62 or S100 and the board requires more than 10 tools, load the milling tools first, then fill what you can for the drills. When you go to run the drilling phase, load the rest of the drills. Note: If using a 95sII or H100 milling machine, press the tool box up button to activate the tool positions screen. After loading the required tools, press the tool box down button. e. Place a check in the stop at tool exchange check box in the lower right corner. Note: The software will create an interrupt before each milling tool is used to test for cutting depth). Note: If using a H100 milling machine, disregard the stop at tool exchange check box, as the machine automatically sets the tool depth during the tool change sequence. f. Press OK. Page 3 of 6
8. Drill Fiducials b. Then click on All +, then start. 9. Mill layer 3 b. Press the All + icon and then press start. c. For each milling tool, do a scratch test to verify tool depth is correct. d. When prompted to adjust the tool depth, select yes. e. After the tool is adjusted to the correct depth, press start. Note: This will also route out the alignment holes for the multi-press plates. 10. Flip the PCB board 11. Read fiducials (layer 2) Note: The machine will put the tool that is in the collet away. The machine will then scan for the fiducials, utilizing the fiducial recognition camera. If the camera does not recognize the fiducial hole, a manual window will appear and you will have to manually align the camera to the hole. Press OK. c. If the fiducials are loaded correctly, you will see white cross hairs on top of the fiducial holes. If not, repeat this process. 12. Mill layer 2 c. For each milling tool, do a scratch test to verify tool depth is correct. 13. Remove multi-layer core from the milling machine. 14. Place single sided laminate onto the milling machine. 15. Prepare top and bottom laminates. Note: This will route the alignment holes for the multi-press. c. Repeat for the top laminate, using the prepare top phase. Page 4 of 6
16. Press the layers together with the multi-press. a. Cut the prepreg material so that it is just larger than the PCB design. b. Place the prepreg between the core and the two single sided laminates. c. Place the PCB stack onto the multi-press plates. i. See multi-press manual for layer stacking procedures. d. Place the multi-press plates into the multi-press system. i. See multi-press manual for operational procedures. Note: The press time is 2 hours, plus a recommended cooling period of 24 hours. 17. Remove pressed PCB board from multi-press. 18. Place the PCB board onto the milling machine with the top layer (layer 1) facing up. 19. Read fiducials for the top layer (layer 1). b. Use the steps as described in step twelve (12). 20. Complete the marking drills phase. Note: The machine will use the universal cutter 0.2mm marking tool to center punch your drill holes. This is to minimize reflection for the drill as it enters the material, thus reducing the possibility of top to bottom layer registration problems. c. Conduct a scratch test to ensure that the universal cutter is set to the correct depth. 21. Complete the Drill plated phase. b. Press the All + icon then start. Note: If using the S62 or S100 and require more than 10 tools to complete the PCB board, repeat step 8 for the drills. 22. Remove PCB from the milling machine. 23. Place PCB board into the Mini Contac galvanic plating system to plate the inside of the drilled holes. a. See Mini-Contac manual for operational procedures. Note: The galvanic plating process takes approximately 2 hours. 24. Place the plated PCB board onto the milling machine with the bottom layer facing up. 25. Read the fiducials on the bottom layer (layer 4). a. Repeat process as described in step 20. 26. Mill Bottom layer a. In the phase select drop down menu, select the phase. b. Press the All + icon, then start. c. For each milling tool, conduct a scratch test to verify that the milling depth is set correctly. Note: If using the S62 or S100, you may need to load the milling tools back into the toolbar, as stated in step 8. 27. Flip PCB board. 28. Read the fiducials on the top layer (layer 1) a. Use the described process from step 20. 29. Mill top layer. a. In the phase select drop down menu, select the phase. b. Press the All + icon, then start. c. For each milling tool, conduct a scratch test to verify that the milling depth is set correctly. 30. If using the promask (solder mask) or prolegend (silkscreen) systems, remove the PCB board and complete the promask and/or prolegend system. a. After completion, place PCB on the milling machine and complete the read top (layer 1) phase, as described in step 20. Page 5 of 6
31. Complete the drill un-plated phase. a. If you have any unplated holes, select the phase in the phase select drop down menu. Note: If necessary, load the drills into the tool bar as described in step 8. 32. Route out the PCB from the base material. a. In the phase select drop down menu, select the phase. b. Press the All + icon, and then start. 33. Remove the PCB board from the milling machine. 34. Snip the break out tabs. 35. Board complete. References Boardmaster Operations Manual Multi-Press Operations Manual Mini Contac Operations Manual How to set milling depth document LPKF Technical Support Created on 10/16/2008 6:22:00 PM Created by Christopher Ware E-MAIL: Support@lpkfusa.com PHONE: 503-454-4229 Page 6 of 6