FT10MHLR FT10MVLR. 650 nm DC-10 MBd RedLink Fiber Optic Transmitter Datasheet DESCRIPTION FEATURES APPLICATIONS AVAILABLE OPTIONS

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Transcription:

FT10MHLR FT10MVLR 650 nm DC-10 MBd RedLink Fiber Optic Transmitter Datasheet DESCRIPTION The Firecomms DC to 10 MBd low current RedLink transmitter is a highly reliable Resonant Cavity Light Emitting Diode (RCLED) which operates as a visible optical source generating red 650 nm light at data rates from burst mode DC to a maximum of 10 MBd of continuous digital data. The RCLED is encapsulated in a lensed clear molded plastic package for optimum coupling to Plastic Optic Fiber (POF). It operates over the industrial temperature range of -40 ⁰C to +85 ⁰C. The 10 MBd transmitter produces higher optical power for the same input current relative to the standard Firecomms 10 MBd device (FT10MHNR). This allows a lower overall current consumption when used in an existing link design. The transmitter is assembled in a gray nonconducting plastic housing requiring low operating current supporting both horizontal and vertical plug options. The use of the eye-safe, visible light simplifies link set-up and testing. AVAILABLE OPTIONS FEATURES Visible RCLED at red wavelength (660 nm) Optimized for data transmission from DC to 10 MBd with low current consumption Ideal for use with Step Index (SI) Plastic Optic Fiber (POF) Industrial temperature range -40 ⁰C to +85 ⁰C RoHS compliant Flame retardant (UL 94 V-0) connector housings Low pulse width distortion Compatible with Versatile Link cables and connectors APPLICATIONS Table APPLICATIONS Table 1 ORDERING INFORMATION / PART NUMBERS 10 MBd Horizontal Package Non-Inverting, TTL FT10MHLR Application Standard Automation and Industrial Control, Low- Speed Serial Communications, Voltage Isolation Serial RS3, RS485, CAN Bus, Modbus, Profibus, Sercos 10 MBd Vertical Package Non-Inverting, TTL FT10MVLR Distance 50 meters Step Index (SI) POF [1] Speed DC to 10 MBd Note: 1. Depending on the installation conditions and assuming a Firecomms 10 MBd receiver 1

SPECIFICATIONS Table 3 TRANSMITTER PIN DESCRIPTION 5, Gnd Pin Name Symbol 1 RCLED ANODE TD + RCLED CATHODE TD - 3 Not Connected N.C. / Gnd 4 Not Connected N.C. / Gnd 4, N.C. 3, N.C., TD - 1, TD + 5 Retaining Pin Gnd 8 Retaining Pin Gnd 8, Gnd FIGURE 1 Transmitter pin-out, top view Table 4 REGULATORY COMPLIANCE Parameter Symbol Standard Level Electrostatic Discharge, Human Body Model (contact ESD) HBM Mil-STD-883 Level (4 kv) Radiated Emissions Immunity Vm -1 IEC 61000-4-3 15 Vm -1 UL Certification UL 60950-1 Files No. E367 Storage Compliance MSL J-STD-00 a (4-week floor life) Restriction of Hazardous Substances Directive RoHS Directive 011/65/EU Certified compliant RECOMMENDED APPLICATION CIRCUIT 5 Value Tolerance R1 kω 5% R 100 Ω 1% C1 0.1 µf 0% C 10 µf 0% C C1 R R1 Vcc (5 V) 4 3 1/ SN75451 1 DATA 8 FIGURE Recommended transmitter application circuit. See note 6 Table 6

SPECIFICATIONS Table 5 ABSOLUTE MAXIMUM RATINGS These are the absolute maximum ratings at or beyond which the part can be expected to be damaged Notes: 1. 60 C for 10 seconds, one time only, at least. mm away from lead root. When peak forward current exceeds 30 ma, the duty cycle must maintain a pulse width (PW) less than 1 µs and average forward current less than or equal to 30 ma. [30 ma IFPK 45 ma IFAVG 30 ma AND PW 1 µs] Parameter Symbol Minimum Maximum Unit Storage Temperature T stg -40 +85 C Operating Temperature T op -40 +85 C Soldering Temperature [1] T sld +60 [1] C TX Reverse Input Voltage V R 3 V TX Peak Forward Input Current [] I FPK 45 ma Average Forward Input Current [] I FAVG 30 ma Transmitter Input, V in 50% tpropdly-lh tpropdly-hl Optical Output, P o 80% 50% 0% tr tf FIGURE 3 Transmitter Propagation Delay and rise/fall time definitions as per application circuit of Figure 3

SPECIFICATIONS Table 6 TRANSMITTER ELECTRICAL AND OPTICAL CHARACTERISTICS Test Conditions: 1. Test data was validated over the full temperature range of -40 C to +85 C, and over the full drive current range. Optical power for POF is measured when coupled into 0.5 m of a 1 mm diameter 0.5 NA POF and a large area detector 3. As measured in the given application circuit (inverting) as shown in Figure with 50 cm of 0.5 NA POF 4. Emission Wavelength (centroid) λc = ƩiPi. λi/ ƩiPi. (Ref: EIA/TIA std. FOTP-17/6.1, 1991) 5. Spectral Width Root Mean Squared (RMS) λrms = (Ʃi Pi(λc λi) / ƩiPi) 1/.(Ref: EIA/TIA std. FOTP-17/6.3, 1991) 6. Pins 5 and 8 are used for mounting and retaining purposes only. Connect to ground. Parameter Symbol Min Typical Max Unit Test Condition -3 + +4 dbm 1 mm POF I FDC = 30 ma -9-3 -1 dbm 1 mm POF I FDC = 10 ma Output Power P -11-5 -3 dbm 1 mm POF I FDC = 5 ma -14-8 -6 dbm 1 mm POF I FDC = 3 ma -0-15 -1 dbm 00 µm PCS I FDC = 30 ma Emission Wavelength (centroid) [4] λ c 640 660 680 nm I FDC = 30 ma Spectral Width (RMS) [5] λ RMS 11 0 nm I FDC = 30 ma Forward Voltage V F 1.4 1.95.4 V I FDC = 30 ma Forward Voltage Temperature Coefficient Δ V F/ΔT -3.5 mv/ o C I FDC = 30 ma Reverse Input Breakdown Voltage V BR 0 V I FDC = -1 µa Diode Capacitance C o 11 pf V = 0 V Data Rate DC 10 MBd Optical Rise Time (0%- 80 %) t r 5 7 ns I FAVG = 15 ma [3] Optical Fall Time (80%- 0 %) t f 7 9 ns I FAVG = 15 ma [3] Propagation Delay Low-to-High (Electrical-to-Optical) Propagation Delay High-to-Low (Electrical-to-Optical) PropDly_ LtoH (EL/OP) PropDly_ HtoL (EL/OP) 18 8 ns I FAVG = 15 ma [3] 16 4 36 ns I FAVG = 15 ma [3] Pulse Width Distortion PWD - 8 ns I FAVG = 15 ma [3] 4

VF-Forward Voltage (V).3..1.0 1.9 1.8 1.7 1.6 1.5 1.4 1 10 100 IF- Transmitter Drive Current (ma) -40 C +5 C +85 C FIGURE 4 Typical forward voltage (VF) vs. drive current (IF,DC). PT POF Coupled Power (dbm) 0 - -4-6 -8-10 -1-14 -16 1 10 100 I F,DC -Transmitter Drive Current (ma) - 40 C + 5 C + 85 C FIGURE 5 Typical normalized optical power vs. drive current. 5

MECHANICAL DATA, HORIZONTAL.54 (3x) 4. 3.56 min. 3.81 max. 0.64 0.5 (4X) 0.64 (x) Front View Side View Rear View 0.5 (4x).54 (3x) 1.7 1.7 Ø1.01 (6x) Pin 1 Indicator Date Code Dust Cap 1.90 min. 10.16.83 4 3 1 8 5 Product Number 5.08 1.35 18.9.9 PCB Hole Details Top View Top View FIGURE 6 Mechanical dimensions of the horizontal connectors and PCB footprint, which is a top view General dimensional tolerance is ± 0. mm 6.9 16. Part Name: RedLink Tx Lot No: RD016040006 Part Number: FT10MHLR Date Code: 16A Quantity: 40 515 FIGURE 7 Packing tube for Firecomms Horizontal RedLink Transmitters 6

MECHANICAL DATA, VERTICAL Product Number Date Code 18.90 Ø1.01 (6x).54 (3x) 0.5 (4x) Pin 1 Indicator 4..79 min. 3.30 max. 0.64 0.5 (4X) Ø0.64 (x) Front View Side View Rear View 1.57 4.4 5.08 10.16.0 Dust Cap 5 8 1.74 1 3 4.9 18.8.54 (3x) 1.7 Top View PCB Hole Details Top View FIGURE 8 Mechanical dimensions of the vertical transmitter connectors and PCB footprint, which is a top view General dimensional tolerance is ± 0. mm 30.6 0.7 Part Name: RedLink Tx Lot No: RD016040006 Part Number: FT10MVLR Date Code: 163E Quantity: 40 515 FIGURE 9 Packing tube for Firecomms Vertical RedLink Transmitters 7

PART HANDLING The Firecomms DC-10 MBd 650 nm RedLink transmitter devices are color coded gray. They are autoinsertable. They are tested for handling in static-controlled assembly processes (HBM). Cleaning, degreasing and post solder washing should be carried out using standard solutions compatible with both plastics and the environment. For example, recommended solutions for degreasing are alcohols (methyl, isopropyl and isobutyl). Acetone, ethyl acetate, phenol or similar solution based products are not permitted. In the soldering process, non-halogenated water soluble fluxes are recommended. These products are not suitable for use in reflow solder processes (infrared/vapor-phase reflow). The dust plug should remain in place during soldering, washing and drying processes to avoid contamination of the active optical area of each part. The Moisture Sensitivity Level (MSL) classification of this device is a according to JEDEC J-STD-00. The shelf life of an unopened MBB (Moisture Barrier Bag) is 4 months at < 40 C and < 90 % R.H. Once the Moisture Barrier Bag is opened the devices can be either a) Stored in normal factory conditions < 30 C and < 60 % R.H. for a maximum of 67 hours (4 Weeks) prior to soldering. b) Stored at < 10 % R.H. (Dry Cabinet). 8

PACKING INFORMATION Components are packed in PVC anti-static tubes in moisture barrier bags. Bags should be opened only in static-controlled locations, and standard procedures should be followed for handling moisture sensitive components. Table 7 PACKING INFORMATION Horizontal Vertical Components per Tube 40 40 Tube Length 515 mm 515 mm Tube Height 16. mm 1.0 mm Tube Depth 6.9 mm 30.8 mm Tubes per Bag 5 5 Bags per Inner Carton 1 1 Inner Carton Length 630 mm 630 mm Inner Carton Width 70 mm 70 mm Inner Carton Height 105 mm 105 mm Weight per Inner Carton, Complete 0.77 kg 0.9 kg Components per Inner Carton 00 00 Inner Cartons per Outer Carton 10 10 Outer Carton Length 650 mm 650 mm Outer Carton Width 35 mm 35 mm Outer Carton Height 376 mm 376 mm Weight per Outer Carton, Complete 8.13 kg 9.60 kg Components per Outer Carton,000,000 For the most recent revision or further information please visit www.firecomms.com or contact the company directly at the following address, Firecomms Ltd, 00 Airport Business Park, Cork, IRELAND. Copyright 004-018 Firecomms. All rights reserved. Firecomms refers to Firecomms Limited and/or its subsidiaries. Firecomms assumes no responsibility for inaccuracies or omissions in the information contained in this document. Specifications are subject to change without notice. No patent rights are granted to any of the circuits described herein. 9