AuthenTec AES1710 Secure Slide Fingerprint Sensor Package Analysis For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor technology, please call Sales at Chipworks. 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com
Package Analysis Table of Contents 1.1 List of Figures 1.2 List of Tables 1.3 Introduction 1.4 Device Summary 1.5 Package Summary 2.1 Package and Die 3.1 Package Cross Section Overview 3.2 Package Cross Section Analysis 4 Materials Analysis 4.1 SEM-EDS Analysis of Board Interconnect and Land Platings 4.2 SEM-EDS Analysis of Selected Packaging Materials 5 References 6 Statement of Measurement Uncertainty and Scope Variation Report Evaluation
Overview 1-1 1.1 List of Figures 2.1.1 AES1710 Fingerprint Sensor on PCB Perspective View 2.1.2 Package Photograph Top 2.1.3 Package Photograph Bottom 2.1.4 Plan View Package X-Ray 2.1.5 Side View Package X-Ray AES1710 on PCB 2.1.6 TMS791 Die Photograph 2.1.7 Die Markings 2.1.8 Die Corner 2.1.9 Minimum Pitch Bond Pads 3.1.1 Planes of Cross-Sectioning 3.1.2 Package Cross Section Overview (Section A) 3.2.1 Package Edge (Section A) 3.2.2 Edge of Package Window (Section A) 3.2.3 Package Edge (Section B) 3.2.4 Reinforcement Frame Coating 3.2.5 Through Hole Via 3.2.6 Solder Ball 3.2.7 Solder Ball Land Plating SEM 3.2.8 Solder Ball Land Plating Optical 3.2.9 Stitch Bond Land 3.2.10 Stitch Bond Land Plating SEM 3.2.11 Stitch Bond Land Plating Optical 3.2.12 Die Cross Section Overview 3.2.13 Die Bottom Interconnection 3.2.14 Bond Pad Overview 3.2.15 Detailed View of Die Bond Pad 3.2.16 Reinforcement Frame Interconnection (Section C) 4 Materials Analysis 4.1.1 SEM-EDS Spectrum of Cu Board Interconnect 4.1.2 SEM-EDS Spectrum of Ni Solder Ball Land Plating 4.1.3 SEM-EDS Spectrum of AuNi Solder Ball Land Plating 4.1.4 SEM-EDS Spectrum of Sn Solder Ball 4.1.5 SEM-EDS Spectrum of Au Stitch Bond Outer Land Plating 4.1.6 SEM-EDS Spectrum of Ni Stitch Bond Inner Land Plating 4.2.1 SEM-EDS Spectrum of Sensor Area Coating 4.2.2 SEM-EDS Spectrum of Ag Epoxy Die Attach 4.2.3 SEM-EDS Spectrum of Ag Epoxy Reinforcement Frame Attach 4.2.4 SEM-EDS Spectrum of Reinforcement Frame Body 4.2.5 SEM-EDS Spectrum of Reinforcement Frame Inner Coating 4.2.6 SEM-EDS Spectrum of Reinforcement Frame Outer Coating
Overview 1-2 1.2 List of Tables 1.3.1 Samples Analyzed 1.4.1 Device Summary 1.5.1 Package Summary 2.1.1 Package and Die Dimensions 3.2.1 Package Materials and Observed Critical Dimensions
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