TQQ7399 DC 2700 MHz Through Line

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Applications General Purpose Wireless RF Bypass Paths Microwave Radio Test & Measurement Scientific Instruments Product Features 6 Pin 3 x 3 mm leadless SMT Package Functional Block Diagram DC 2700 MHz 50 Ohm Port Impedance Typical Insertion Loss, 0.15 db at 2140 MHz Typical Return Loss, 25 db at 2140 MHz Surface Mountable General Description The is a passive low-loss through line that operates from 0 to 2700 MHz. At 2140 MHz, input and output return loss is typical 25 db and typical insertion loss is 0.15 db. The product is housed in an industry standard Pb-free / RoHS-compliant surface-mount leadless package. Typical Performance Parameter Typical Value Units Frequency 100 2140 2700 MHz Insertion Loss 0.15 0.15 0.15 db Input / Output Return Loss 25 25 25 db Pin Configuration Top View Pin # Label 2, 5 RF I/O 1, 3, 4, 6 NC Ordering Information Part No. Description TR7* Through Line *Standard T/R size = 2500 pieces on a 7 reel. Datasheet December 02, 2017-1 of 5 - Disclaimer: Subject to change without notice

Gain (db) S11 (db) S22 (db) Absolute Maximum Ratings Parameter Rating Storage Temperature 50 to +150 C RF Input Power, CW +20 dbm Operation of this device outside the parameter ranges given above may cause permanent damage. Recommended Operating Conditions Parameter Min Typ Max Units TCASE 40 +105 C Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Antenna Transmit Test conditions unless otherwise specified: Temp. = +25 C Parameter Conditions Min Typ Max Units Operational Frequency Range 0 2700 MHz Test Frequency 2140 MHz Port Impedance 0 to 2700 MHz 50 Ohms Insertion Loss 0.15 0.2 db Return Loss 0 to 2700 MHz 25 db Performance Plots: 0.0 Gain vs. Frequency 0 Input Return Loss vs. Frequency 0 Output Return Loss vs. Frequency -0.2-0.4-0.6-0.8-10 -20-30 -10-20 -30-1.0-40 -40 Pin Description & Layout Pin No. Symbol Description 2, 5 RF I/O RF through path (bi-directional) 1, 3, 4, 6 NC No electrical connection. Provide grounded land pads for PCB mounting integrity. Datasheet December 02, 2017-2 of 5 - Disclaimer: Subject to change without notice

Package Marking and Dimensions 2x 2x Terminal 1 Indentifier Package Marking Product Identifier: Q7399 Date Code: YYWW Assembly Code: axxxx Q7399 YYWW XXXX A B 2.150 0.100 1.075 0.100 0.700 1.100 1.100 (1X) 1.400x X 0.600y A B Terminal 1 (5X) 0.650x X 0.600y A B A 1.020 TOP VIEW BOTTOM VIEW SIDE VIEW Notes: 1. All dimensions are in millimeters. Angles are in degrees. 2. Dimension and tolerance formats conform to ASME Y14.4M-1994. 3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012. PCB Mounting Pattern PIN1 (1X) 1.68 x 0.60 PIN1 (1X) 1.68 x 0.60 3.35 REF 3.35 REF 0.84 1.21 0.84 1.21 0.05 typ 0.05 typ (5X) 0.93 x 0.60 (5X) 0.93 x 0.60 1.10 2.80 REF 2.80 REF 1.10 0.18 0.18 Top view recommended land pattern metallization. Notes: 1. All dimensions LAND are in PATTERN millimeters. Angles are in degrees. 2. Use 1 oz. copper minimum LAND PATTERN for top and bottom layer metal. Top view recommended land pattern stencil aperture. LAND PATTERN MASK D000000 D000000 00:00 LAND PATTERN MASK TriQuint Reach Further - Reach faster 03.00mm X 03.00mm, Reach 4 LAYER Further - Reach faster A3H RLP RLPmsk TriQuint 03.00mm X 03.00mm, 4 LAYER D000000 D000000 00:00 A3H RLP RLPmsk Datasheet December 02, 2017-3 of 5 - Disclaimer: Subject to change without notice

Manufacturing Environments COMPONENT HANDLING All necessary special handling techniques shall be adopted in order to avoid contamination of metallization / terminations. Examples include use of finger cots, plastic tweezers, etc. PART PLACEMENT A placement force of up to 500 grams is applied (using a 2.00 mm or a 0.080 inch diameter rod) to the center of the part while remaining in its tape carrier. COMPONENT SOLDERABILITY Convection or Infrared Reflow Part will comply with convection or infrared reflow soldering processes consistent with IPC/JEDEC J-STD-020. Qorvo s actual reflow profile for qualification is provided below: Reflow Parameters IPC / JEDEC J-STD-020 Qorvo Actual Average ramp-up rate (217 C to Peak) 3 C /second max. 0.57 C / second Preheat Time (150 C to 200 C) 60 180 seconds 150 seconds Time above 217 C 60 150 seconds 126 seconds Peak Temperature 260 +0 / 5 C 259 C Time within 5 C of actual Peak Temperature 20 40 seconds 30 seconds Ramp-down Rate 6 C / second max. 0.875 C / second Time 25 C to Peak Temperature 8 minutes max. 7 minutes max. Tape and Reel Information Datasheet December 02, 2017-4 of 5 - Disclaimer: Subject to change without notice

Product Compliance Information MSL Rating MSL Rating: Level 3 Test: 260 C convection reflow Standard: JEDEC Standard IPC/JEDEC J-STD-020 Solderability Compatible with both lead-free (260 C max. reflow temperature) and tin/lead (245 C max. reflow temperature) soldering processes. Contact plating: Electroless Nickel Immersion Gold RoHs Compliance This part is compliant with EU 2002/95/EC RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment). This product also has the following attributes: Lead Free Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br402) Free PFOS Free SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Web: www.qorvo.com Tel: 1-844-890-8163 Email: customer.support@qorvo.com For technical questions and application information: Email: appsuport@qorvo.com Important Notice The information contained herein is believed to be reliable. Qorvo makes no warranties regarding the information contained herein. Qorvo assumes no responsibility or liability whatsoever for any of the information contained herein. Qorvo assumes no responsibility or liability whatsoever for the use of the information contained herein. The information contained herein is provided "AS IS, WHERE IS" and with all faults, and the entire risk associated with such information is entirely with the user. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Datasheet December 02, 2017-5 of 5 - Disclaimer: Subject to change without notice