MEMSIC MMC3120M Process Review For comments, questions, or more information about this report, or for any additional technical needs concerning semiconductor and electronics technology, please call Sales at Chipworks. 3685 Richmond Road, Suite 500, Ottawa, ON K2H 5B7, Canada Tel: 613.829.0414 Fax: 613.829.0515 www.chipworks.com
Process Review Table of Contents 1 Overview 1.1 List of Figures 1.2 List of Tables 1.3 Company Profile 1.4 Introduction 1.5 Sensor Devices Summary 1.6 ASIC Process Summary 2 Device Overview 2.1 MEMSIC 12787B Electronic Compass Board (ECB) 2.2 MEMSIC S62020M Dual-Axis Accelerometer 2.3 MEMSIC MMC3120M Package 2.4 MMC3120M ASIC 2.5 MMC3120M Magnetic Sensor Die 3 MMC3120M ASIC Die Process Overview 3.1 General Device Structure 3.2 Dielectrics 3.3 Metallization, Vias, and Contacts 3.4 Transistors and Polysilicon 3.5 Isolation 4 Magnetic Sensor Architectural Analysis 4.1 Overview 5 Magnetic Sensor Process Analysis 5.1 Bond Pad, Magnetizing Coil, and Interconnect Layer 5.2 Barber Pole Electrodes and AMR Strips 6 Critical Dimensions 7 References 8 Statement of Measurement Uncertainty and Scope Variation About Chipworks
Overview 1-1 1 Overview 1.1 List of Figures 2 Device Overview 2.1.1 ECB Photograph Top 2.1.2 ECB Photograph Bottom 2.1.3 MEMSIC S62020M Dual-Axis Accelerometer on ECB 2.1.4 MEMSIC C3120M on ECB 2.2.1 Top Package View of S62020M 2.2.2 Bottom Package View of S62020M 2.2.3 S62020M Die Photograph 2.2.4 S62020M Die Markings 2.3.1 Top Package View of MMC3120M 2.3.2 Bottom Package View of MMC3120M 2.3.3 Plan-View Package X-Ray of MMC3120M 2.3.4 Side-View Package X-Ray of MMC3120M 2.4.1 MMC3120M ASIC Die Photograph 2.4.2 MMC3120M ASIC Die Markings 2.4.3 Die Corner 2.4.4 Bond Pad 2.4.5 Bond Pad Pitch 2.4.6 Fuses 2.5.1 MMC3120M Magnetic Sensor Die Photograph 2.5.2 MMC3120M Magnetic Sensor Die Markings 2.5.3 Die Corner and Bond Pads 3 MMC3120M ASIC Die Process Overview 3.1.1 Annotated ASIC Die Photograph 3.1.2 General Structure 3.1.3 Die Edge Seal 3.2.1 Passivation and IMD 2 3.2.2 IMD 1 and PMD 3.3.1 ASIC Die Metallization Structure 3.3.2 Minimum Pitch Metal 2 3.3.3 Minimum Pitch Metal 1 3.3.4 Via 1s and Minimum Pitch Via 2s 3.3.5 Via 1s Minimum Pitch and Contact Plugs (Glass Etch) 3.3.6 Contact to Polycide 3.4.1 Minimum Gate Length MOS Transistors 3.4.2 Double Polysilicon Capacitors 3.4.3 Double Polysilicon Capacitor Electrodes Details 3.5.1 Poly Over Isolation 3.5.2 Minimum Width Isolation
Overview 1-2 4 Magnetic Sensor Architectural Analysis 4.1.1 Magnetic Sensor 4.1.2 Magnetizing Coil Details 4.1.3 AMR Strips Layout 4.1.4 Wheatstone Bridge Schematic 4.1.5 AMR Strips Details Lower Right Corner 4.1.6 Barber Poles Details Lower Right Corner 4.1.7 Barber Poles Details Upper Right Corner 5 Magnetic Sensor Process Analysis 5.1.1 Magnetic Sensor Die Thickness 5.1.2 Magnetic Sensor Dielectric Stack Edge and Bond Pad Left Side 5.1.3 Bond Pad Right Side and Magnetizing Coil Contact 5.1.4 Bond Pad Details 5.1.5 Magnetizing Coil (Metal 3) 5.1.6 Magnetizing Coil Contact 5.1.7 Magnetizing Coil Contact and Interconnect layer 5.2.1 General Structure of AMR Sensor 5.2.2 Metal 2 Interconnect to AMR Metal 1 Contact 5.2.3 Barber Pole Structure Pitch 5.2.4 Metal 2 and Metal 1 AMR Layers in the Middle of Barber Pole Electrode 5.2.5 Metal 1 AMR Layer TEM 5.2.6 Metal 1 AMR Layer STEM 5.2.7 M2 and M1 AMR Layers at Edge of Barber Pole Electrode TEM 5.2.8 M2 and M1 AMR Layers at Edge of Barber Pole Electrode Detail 5.2.9 Metal 2/Metal 1 Interface in Middle of Barber Pole Electrode TEM
Overview 1-3 1.2 List of Tables 1 Overview 1.4.1 Device Identification 1.5.1 ASIC Die Summary 1.5.2 AMR Sensor Die Summary 1.6.1 ASIC die Process Summary 2 Device Overview 2.3.1 Pin Description 2.5.1 Package and Die Dimensions 3 MMC3120M ASIC Die Process Overview 3.2.1 Dielectric Thicknesses 3.3.1 Metallization Vertical Dimensions 3.3.2 Metallization Horizontal Dimensions 3.3.3 Vias and Contacts Horizontal Dimensions 3.4.1 Peripheral Transistor and Capacitor Dimensions 4 Magnetic Sensor Architectural Analysis 4.1.1 Magnetic Sensor Planar Dimensions 5 Magnetic Sensor Process Analysis 5.2.1 Metallization Vertical Dimensions 5.2.2 Dielectric Vertical Dimensions 6 Critical Dimensions 6.0.1 Package and Die Dimensions 6.0.2 Dielectric Thicknesses 6.0.3 Metallization Vertical Dimensions 6.0.4 Metallization Horizontal Dimensions
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