Recommended Dressing per Application
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2 Recommended Dressing per Application General: Substrate matrices and quality requirements may vary and be different from customer to customer. The ADT recommended dressing procedures are general / generic recommendations based on years of experience in the market place. They are a good starting point for each application. Final optimization of the dressing procedure should be performed at the customer site in a production mode
3 Recommended Dressing per Application Application - Plastic BGA Most BGA type applications require no specific dressing. Customers are starting to dice on production wafers, some at top production feed rate and some by an override process. Blade Used For tape mounting Metal Sintered ADT Matrices 95, 29, 62, 02 For tapeless mounting Metal Sintered ADT Matrix 42 Override recommendation: Override media Production BGA substrate Recommended override parameters:- Spindle speed Production speed 30-40Krpm Feed rate Start at 10mm/sec going up by 5mm/sec increments, making 5x cuts at each feed rate, going up to production speed. Cut depth Use production depth Index Use substrate index Note Perform height only after the dressing / override process is completed
4 - QFN H.E. Lead / Tin (Matte) (Pb / Sn) Blade used Resin E- & -T-series Dressing media Silicon Carbide 320 mesh Dressing media geometry 90 x 25 x 3mm Dressing media P/N coating Dressing parameters Process 2 3 Spindle speed (Krpm) Feed rate mm/sec Cut depth (mm) Cut length (Meters) Index 10 / 10x cuts 20 / 5x cuts 40 / 5x cuts 60 / 5x cuts 80 / 5x cuts 10 / 10x cuts 20 / 5x cuts 40 / 5x cuts 60 / 5x cuts 80 / 5x cuts Production Production ~ ~ x blade Thick. 2x blade Thick. Note Perform height only after the dressing process is completed
5 - QFN H.E. Nickel Palladium ( (Ni / Pd) ) coating Blade used Resin E- & -T- series Dressing media Silicon Carbide 320 mesh Dressing media geometry 90 x 25 x 3mm Dressing media P/N Dressing parameters Process 2 3 Spindle speed (Krpm) Feed rate mm/sec Cut depth (mm) Cut length (Meters) Index 10 / 10x cuts 20 / 5x cuts 40 / 5x cuts 60 / 5x cuts 10 / 10x cuts 20 / 5x cuts 40 / 5x cuts 60 / 5x cuts 80 / 5x cuts 80 / 5x cuts Production Production ~ ~ x blade Thick. 2x blade Thick. Note Perform height only after the dressing process is completed
6 Power QFN Blade used Resin E- series Dressing media Silicon Carbide 320 mesh Dressing media geometry 90 x 25 x 5mm Dressing media P/N Dressing parameters Spindle speed (Krpm) Feed rate mm/sec Cut depth (mm) Cut length (Meters) Index Process 3 (Krpm) / 10x cuts 20 / 10x cuts 40 / 10x cuts Production ~ x blade Thick. Note Perform height only after the dressing process is completed
7 PCB (LED Packages) Blade used Nickel Serrated, 2 2 O.D. x T, V & Z matrices x 10, 13, & 17mic. Grit x thick Dressing media Green Silicon Car. 600mesh Dressing media geometry - 90 x 25 x 2mm or 3mm Dressing media P/N or -003 Dressing parameters:- Spindle speed Process 25-35Krpm Feed rate 10mm/sec 3x cuts, 20mm/sec 3x cuts, 40mm/sec 3x cuts 60mm/sec 3x cuts, 80mm/sec 3x cuts, 100mm/sec 3cuts Cut depth - Production + 0.2mm Cut length ~0.5meter Index 2x blade Thick. Note Perform height only after the dressing process is complete
8 Ceramic BGA Blade used - Resin, 2 2 or 4 4 O.D. X Matrices K or R x 45 75mic diamond grit x thick Dressing media Green Silicon Car. 600mesh Dressing media geometry - 90 x 25 x 2mm or 3mm Dressing media P/N or -003 Dressing parameters:- 2 O.D. 4 O.D. Spindle speed 25 30Krpm 8 12Krpm Feed rate 2mm/sec 2x cuts, 4mm/sec 2x cuts, 6mm/sec 2x cuts 8mm/sec 2x cuts, 10mm/sec 2x cuts Cut depth - Production + 0.2mm Cut length 250mm Index Blade thickness x 2 Note Perform height only after the dressing process is completed
9 Glass Applications general: The market faces many glass applications with different thickness and material variations. The following are general dressing recommendations. For special glass coatings or surface finishes consult the factory. Glass up to 1mm thick can be diced with both resin & metal Sintered blades. Glass over 1mm we recommend to use resin type blades.
10 Glass using resinoid blades Blade used Resin Matrices QUP, QKP & QIP x 2, 2, 3 3 & 4 4 O.D 15-45mic. diamond grit x thick Dressing media Green Silicon Car. 600mesh 320 for grits over 30mic Dressing media geometry - 90 x 25 x 2mm or 3mm or 5mm Dressing media P/N or -003 or or for over 30mic grit Glass thickness range Dressing parameters:- Spindle Dia. Spindle speed Krpm Feed rate mm/sec, cut / F.R Cut depth - Index Up to 0.5mm 0.5 to 1mm 1 2mm 2 4mm , 4, 6 x 2 cuts 2, 4,6 x 2 cuts 2, 4, 6, x 2 cuts s 1, 2, 3, 4, 5, 2 cuts Pro. Sub.+0.2mm Pro. Sub.+0.2mm Pro. Sub.+0.2mm Pro. Sub.+0.2mm S Blade thick. x 2 Blade thick. x 2 Blade thick. x 2 Blade thick. x 2 Note Perform height only after the dressing process is completed
11 Glass using metal sintered blades Blade used Sintered matrices M55, -M96 x 2 2 O.D. 10, 13, 17, 25, 30mic. diamond grit x thick Dressing media Green Silicon Car. 600mesh Dressing media geometry - 90 x 25 x 2mm or 3mm or 5mm Dressing media P/N or -003 or 005 Dressing parameters:- Spindle Dia. Spindle speed Krpm Feed rate mm/sec, cut / F.R Cut depth - Index Glass thickness range Up to 0.5mm 0.5 to 1mm ,3,4,5, 6 x 2 cuts 2, 4, 5, 6 x 2 cuts Pro. Sub.+0.2mm Pro. Sub.+0.2mm Blade thick. x 2 Blade thick. x 2 Note Perform height only after the dressing process is completed
12 Hard Alumina Blade used Resin Matrices KUP, RUP x 2, 2, & 4 4 O.D 45-88mic. diamond grit x thick Dressing media Green Silicon Car. 320mesh Dressing media geometry - 90 x 25 x 2mm or 3mm or 5mm Dressing media P/N or -003 or 005 Dressing parameters:- Spindle Dia. Spindle speed Krpm Feed rate mm/sec, cut / F.R Cut depth - Index Glass thickness range Up to 0.5mm 0.5 to 1mm 1 2mm 2 4mm , 4, 6, 8 x 2 cuts 2, 4,6, 8 x 2 cuts 2, 4, 6, 8 x 2 cuts 2, 4, 6, 8 x 2 cuts Pro. Sub.+0.2mm Pro. Sub.+0.2mm Pro. Sub.+0.2mm Pro. Sub.+0.2mm S Blade thick. x 2 Blade thick. x 2 Blade thick. x 2 Blade thick. x 2 Note Perform height only after the dressing process is completed
13 Quartz ( Application Quartz (SAW filters others) Blade used Resinoid 2 2 Matrices KUP, QUP x 30-45mic. grit x thick Dressing media Green Silicon Car. 600mesh Dressing media geometry - 90 x 25 x 2mm or 3mm Dressing media P/N or -003 Dressing parameters:- Spindle Dia. Spindle speed Krpm Feed rate mm/sec, X cuts / F.R Cut depth - Index Quartz thickness range mm 0.5 to 1mm , 2, 3, 4, 5, x 2 cuts 1, 2, 4, 5, x 2 cuts Pro. Sub.+0.2mm Pro. Sub.+0.2mm Blade thick. x 2 Blade thick. x 2 Note Perform height only after the dressing process is completed
14 LiNb03 & LiTa03 Blade used - Nickel 2 2 O.D. x & 4-8mic. 4 Grit x thick - Resinoid 2 2 Matrices QUP, QKP & KUP x 15 & 20mic. grit x thick Dressing media For Nickel Silicon carbide (Dark) 600 mesh For Resinoid - Green Silicon Car. 600mesh Dressing media geometry - Ni x 75 x 1mm, Resin - 90 x 25 x 2mm or 3mm Dressing media P/N Ni , 001, Resin or -003 Dressing parameters:- Substrate thickness Spindle Dia. Spindle speed Krpm Feed rate mm/sec, cut / F.R Cut depth - Index Nickel Resinoid 0.2-1mm 0.2-2mm Krpm 25-30Krpm 2 x 10 cuts, 5x5 cuts & 8 x 1cut 2 x 2 cuts, 4 x 2 cuts, 8 x 2cuts Pr.+ 0.2mm Production + 0.2mm Blade thick. x 2 Blade thick. x 2 Note Perform height only after the dressing process is completed
15 LTCC Blade used Sintered 2 2 O.D. Matrices M94 & M50 x 15-35mic. Grit x thick Resinoid 2 2 Matrices QUP, QKP & KUP x 35-53mic. 53mic. grit x thick Dressing media For Sintered Green Silicon carbide 600 mesh - For Resinoid - Green Silicon Car. 320 mesh Dressing media geometry - 90 x 25 x 2mm or 3mm Dressing media P/N Sintered or -003, Resin or -003 Dressing parameters:- Substrate thickness Spindle Dia. Spindle speed Krpm Feed rate mm/sec, cut / F.R Cut depth - Index M. Sintered Resinoid 0.2-2mm 0.5-2mm x10cuts, 4x5cuts & 6x 5cuts 5 x 5 cuts, 8 x5 cuts & 5 x 1cut Pro. Sub.+0.2mm Pr.+ 0.2mm Blade thick. x 2 Blade thick. x 2 Note Perform height only after the dressing process is completed
16 HTCC Blade used Sintered 2 O.D. Matrices M94 & M50 x 35-50mic. 50mic. Grit x thick Dressing media Green Silicon Carbide 320 mesh Dressing media geometry 90 x 25 x 2 or 3mm Dressing media P/N or Dressing parameters Process Spindle speed 20-30Krpm Feed rate mm/sec Cut depth (mm) Production + 0.2mm Cut length (Meters) 0.6 meter Index Blade thickness x 2 5, 10, 15, 20, 25, 30 x 4 cuts per F.R. Note Perform height only after the dressing process is completed
17 Silicon wafers Blade used Nickel (Annular) 2 2 O.D. x 2-4, 2 3-6, 3 4-6mic. 4 x thick Dressing media Silicon Carbide (Dark) 600 mesh Dressing media geometry 75 x 75 x 1mm Dressing media P/N Dressing parameters:- Spindle speed Feed rate inch/sec Cut depth - Cut length Index Step # 1 Step # 2 Step # 3 Step # Krpm 35-45Krpm 35-45Krpm 35-45Krpm Production Production x 75=750mm 10 x 75=750mm 10 x 75=750mm On blank Sil. wafer Start at.1,, cont. at.2 steps up to pro. speed depending on cut quality * Blade Thick. X 2 Blade Thick. X 2 Blade Thick. X 2 Blade Thick. X 2 Cut depth = production depth Note Perform height only after the dressing process is completed
18 Silicon on Glass Blade used Resin 2 O.D. x matrices QUP & QKP x 25-35mic. Grit x thick Dressing media Silicon Carbide 600 mesh Dressing media geometry 90 x 25 x 3 or 5mm Dressing media P/N or -005 Dressing parameters Process Spindle speed (Krpm) Feed rate mm/sec x 2 cuts, 2 x 2 cuts (Krpm) 25 3 x 2 cuts, 5 x 2 cuts Cut depth (mm) Cut length Index Production + 0.2mm 100mm Blade Thickness x 2 Note Perform height only after the dressing process is completed
19 Tic Magnetic head General: This process involves thin blades with fine diamond grits. The quality criteria's are challenging and require unique dressing processes which are in house developed and are confidential for each customer. The dressing process involves O.D. grinding on cylindrical grinders and than preliminary dressing on the dicing saws Using fine silicon carbide or Al. Oxide dressing medias and an override process on Tic. Blank material to confirm cut quality. The following recommended dressing procedures were developed and used successfully in ADT during blade optimization for some key magnetic head customers.
20 Tic Magnetic head Parting process Blade used Nickel 4.3 O.D. x & 4-6mic. 4 Grit x special matrix x mm thick Dressing media Silicon Carbide 600 mesh Dressing media geometry 90 x 25 x 3mm Dressing media P/N Dressing parameters Process Spindle speed (Krpm) Feed rate mm/sec x Cut depth (mm) (Krpm) 9 2 x 5 cuts x c. depth 2 x 2 cuts x c. depth Cut length Index 175mm Blade Thickness x 3
21 Tic Magnetic head Process: Row Slicing Dressing Silicon carbide 600 mesh - Spindle 9Krpm - 5x cuts at cut depth of 0.050mm - 2x cuts at cut depth of 0.550mm - Feed rate 2mm/sec Blade used Nickel 4.3 O.D. x 48, 4 10, 13mic. Grit x special matrix x mm thick Dressing media Silicon Carbide 600 mesh Dressing media geometry 90 x 25 x 3mm Dressing media P/N Dressing parameters Process Spindle speed (Krpm) 8-9 Feed rate mm/sec 2 x 6 cuts x c. depth x Cut depth (mm) 2 x 2 cuts x c. depth Cut length Index 200mm Blade Thickness x 3
22 Green ceramic Green ceramic or unfired ceramic requires a different dicing mechanism of using nickel electroformed blades or Tungsten carbide saw blades. Both with nickel blades and with T. carbide saw blades no dressing is required. No real diamond exposing is needed on nickel blades and on T. carbide blades any dressing will actually damage the blade buy y loosing the sharpness of the teeth. So directly dicing production substrate can be performed
23 PZT (Ultrasound Sensors) Blade used Nickel 2 O.D. x & 4-8mic. 4 Grit x Low Dia.% x mm thick Dressing media Silicon Carbide 600 mesh up to 3000 mesh Dressing media geometry 90 x 25 x 3mm 75 x 75 x 1mm and others Most PZT customers developed their own dressing process which is Usually confidential. The bellow are generic guide lines for a new n user. Dressing parameters Process Spindle speed (Krpm) 20 (Krpm) Feed rate on Sil C. mm/sec 2 x 5 cuts x c. depth x Cut depth (mm) 2 x 2 cuts x prod. c. depth On Sil. or PZT Start at production F.R. (1-3mm/sec) x cut depth of 0.10mm. Change cut depth by steps of 0.050mm every 5 cuts till reaching production depth To be optimized Cut length To be optimized Index Blade Thick. x 3
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