APPROVAL SHEET. Issued Date Dept. R&D R&D QM. Name JungHwan, Park Namjun, Kim Juwon, Park

Transcription

1 APPROVAL SHEET ITEM Model Name SAW FILTER Issued Date Revision No 2 Dept. Prepared by Confirmed by Approved by Customer Name Sign. Dept. R&D R&D QM Inc. Name JungHwan, Park Namjun, Kim Juwon, Park Sign. Approval NEW RENEW Other Approved Date Inc. 112 Seonggeo-Street, Seonggeo-eup, Seobuk-gu, Cheonan-si, Chungcheongnam-do, South Korea / Tel : / Fax : /

2 Revision No Date Rev No Page Contents All First issued X axis subject added ,4,7,10 Error correcting Page 2 / 15

3 Table of Contents 1. Product Specification 1.1 Model Name 1.2 Scope 1.3 Application 1.4 Maximum Rating 1.5 Electrical Specification 1.6 Frequency Response 1.7 Product Dimension 1.8 Test Fixture 1.9 Marking 1.10 RoHS Information 1.11 Reflow & Solder Recommendation 2. Reliability Test 2.1 Test Flow 2.2 Test Items & Sample Size 2.3 Test Methods for Electrical Characteristics 3. Parts List 3.1 Parts List 4. Packing 4.1 Carrier Tape Dimension 4.2 Top Cover Tape Adhesion 4.3 Reel Dimension 4.4 Packaging Test Results Important Notes 15 Page 3 / 15

4 1. Product Specification 1.1 Model Name : [SF: / 0869: Center Frequency(MHz) / 08: Serial number / C24: Package type(csp 1411)] 1.2 Scope : This specification is applied to the Surface Acoustic Wave filter 1.3 Application : RF SAW filter for Wireless, MHz 1.4 Maximum Ratings ( Ta = 25 ) Parameters Description Maximum DC Voltage Maximum Input Power Rating 0 V 10 dbm Operating Temperature Range -40 ~ +85 Storage Temperature Range -40 ~ Electrical Specification Item Test Condition Min C Max Unit Center Frequency (Fo) MHz Max.Insertion Loss ~ MHz db Amplitude Ripple ~ MHz dbp-p VSWR ~ MHz Source Impedance Unbalanced (1) Load Impedance Unbalanced (1) Attenuation 10.0 ~ MHz db Attenuation ~ MHz db Attenuation ~ MHz db Attenuation ~ MHz db Attenuation ~ MHz db Attenuation ~ MHz db Notes : (1) No Matching Network (Ref. Testing Environment Circuit as shown below). Page 4 / 15

5 1.6 Frequency Response Frequency Response VSWR Page 5 / 15

6 SMITH CHART 1.7 Product Dimension(Unit : mm) Pin Description B, C, E Ground A D Input Output Page 6 / 15

7 1.8 Test Fixture Source & Load Impedance: 50 Standard PCB Foot Print(mm) 1.9 Marking S j 3 X Marking Descriptions: S : j : Band Class 3 : Series Number X : Date Code(Year+Month) 1.10 RoHS Information SAW FILTER C24-type (CSP-Mold Type : 1.4*1.1*0.65) Hazardous Materials that MUST be declared Lead Pb Test Method IEC 62321:2013,ICP Detection Limit (ppm) n.d. = not detected Amount (ppm) 1000 n.d Mercury - Hg 1000 n.d. Cadmium - Cd 100 n.d. Hexavalent Chromium Cr (VI) 1000 n.d. IEC 62321:2008, UV-VIS Polybrominated biphenyls PBBs IEC 62321:2008, GC-MS 1000 n.d. Polybrominated diphenyl ethers - PBDE 1000 n.d. Does this part meet the requirements for a lead free solder process? (Y/N) Yes Compiled by: SGS Korea Date :27. Jan Page 7 / 15

8 1.11 Reflow & Solder Recommendation Reflow Profile (Temperature measured from Reflow-effected Product Surface) Time Page 8 / 15

9 2. Reliability Test 2.1 Test Flow Visual Inspection, Dimension Check, Characteristic Inspection (Initial) Vibration Test Drop Test Thermal Shock Static Humidity Solder Reflow High Temperature Exposure Low Temperature Exposure Visual Inspection, Dimension Check, Characteristic Inspection (Final) 2.2 Test item and sample size NO Test items Criterion N Terms 1 Visual Inspection No Burr, scratch, etc. All 2 Dimension Check Specification All 3 Vibration Test Electrical Specification Drop Test 5 5 Static Humidity 15 6 Solder Reflow 15 C = 0 7 Thermal Shock 15 8 High Temp. Exposure 15 9 Low Temp. Exposure 15 Total 180 Page 9 / 15

10 2.3 Test Methods for Electrical Characteristics No Test Item Condition of Test Requirements 1 Vibration 2 Drop Test 3 Static Humidity 4 Solder Reflow 5 Thermal Shock Total peak amplitude = 1.5 mm Vibration frequency : 10~55 Hz Sweep period : 1.0 minute Vibration directions : 3 mutually perpendicular Duration : 2 hr/direc. Random free drops : 10 times height = 1.0 meter into concrete floor.(no load) Temperature : +30 ±2 Relative humidity : 60% Duration : 96 hours Temp / Duration : 275 / 10sec Total time : 6min.(IR-reflow) Heat cycle conditions -40 (30min) 85 (30min) *cycle time 100 times After the test, Specimen would be kept at room temperature for 2 hours. And then the measured values shall meet Item High Temperature Exposure Low Temperature Exposure Temperature : +85±5 Duration : 240 hours Temperature : -40±5 Duration : 240 hours 3. Parts List 3.1 Material List No Part name Materials remarks 1 Wafer 39 LT 4 Inch 2 Wire Au-Bump Gold 3 Base LTCC CSP 1.4x1.1 4 Cap Thin Film Mold Type Page 10 / 15

11 4. Packing 4.1 Carrier Tape Dimension Po E F Bo W Ko P1 Ao (Unit : mm) A B K0 W E F P0 P Top Cover Tape Adhesion Pull of angle : 0 ~ 15 degree Speed : 300 mm/min Force : 0.1 ~ 1.0N Direction of pull off Top cover tape 0~15 Carrier tape Page 11 / 15

12 4.3 Reel Dimension (Unit : mm) A N H W1 W Packaging Tray and Tape Type : N.A Page 12 / 15

13 4.4.2 Packaging Box 1) Inner Box ; in which EECO puts 5 reel which contains filters. 2) Outer Box ; in which EECO puts 4 inner boxers, that is 20 reel. Total filters/outer box Page 13 / 15

14 5. Test Results C u s t o m e r 1 Inspected Confirmed Approved / / / Part No Quantity 1. Electrical Characteristics ( S - 4, n = ) NO 2 3 Test Items Amplitude Ripple SPEC max 1.0 db RF SAW AQL C = ~ MHz VSWR ~ MHz Attenuation 10.0 ~ MHz max 2.0 min 42 db Insp. INSPECTION SHEET Insp. Date Model Name Test Condition Tested Datas S A W N I C S Inspected 8 9 / / / MARKING LOT No Confirmed 10 Approved Results ~ MHz min 42dB ~ MHz min 13dB ~ MHz min 24dB ~ MHz min 42dB ~ MHz min 40 db Insertion Loss 9 max 3.0dB ~ MHz 2. Dimension ( S - 4, n = ) NO Test Items SPEC Insp Results 1 Length 1.4±0.13 mm (Width) 2 Length 1.1±0.13 mm (Length) Length max (Height) 3. Appearance Accept, Reject Final Result Accept, Reject ( G - 1, n = ) Accept, Reject Accept, Reject Etc. MQ (1) Inc. Page 14 / 15

15 6. Important Notes 6.1 This device should not be used in any type of fluid such as water, oil, organic solvent, etc. 6.2 Cleaning agent isopropyl alcohol and ethyl alcohol can be used. 6.3 As rapid temperature change for cleaning after reflow soldering might be a cause of degradation or destruction, clean this component after confirming that temperature of this component goes down to room temperature. 6.4 As ultrasonic vibration might be a cause of degradation or destruction, do not use ultrasonic cleaning. 6.5 This device follows JEDEC standards for moisture classifications. The following this device is classified as Moisture Sensitive Level 3 This device is moisture sensitive and need to be handled within proper MSL 3 guidelines to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. 6.6 This is an Electrostatic Sensitive Device. Please avoid static voltage during operation and storage. 6.7 Sudden change of temperature shall be avoided, deterioration of the characteristics can occur. 6.8 If any malfunction due to designing or manufacturing which is out of specification occurs within one year after the products have been delivered, the maker should exchange the defective products. Page 15 / 15