74LVC1G07 SINGLE BUFFER/DRIVER WITH OPEN DRAIN OUTPUT. Description. Pin Assignments NEW PRODUCT. Features. Applications

Transcription

1 Description The is a single inverter gate with an open drain output. The device is designed for operation with a power supply range of 1.65V to 5.5V. The input is tolerant to 5.5V allowing this device to be used in a mixed voltage environment. The device is fully specified for partial power down applications using I OFF. The I OFF circuitry disables the output preventing damaging current backflow when the device is powered down. The open-drain output can be connected to other open drain outputs to implement activelow wired-or or active-high wired-nd functions. The maximum sink current is 32 m. Features Wide Supply Voltage Range from 1.65 to 5.5V 24m Sink Current at 3.3V CMOS low power consumption I OFF Supports Partial-Power-Down Mode Operation Inputs accept up to 5.5V ESD Protection Tested per JESD 22 o Exceeds 200-V Machine Model (115-) o Exceeds 2000-V Human Body Model (114-) o Exceeds 1000-V Charged Device Model (C101C) Latch-Up Exceeds 100m per JESD 78, Class II Range of Package Options Direct Interface with TTL Levels ll packages ssembled with Green Molding Compound (no Br, Sb) Lead Free Finish/ RoHS Compliant (Note 1) Pin ssignments NC 1 2 GND 3 (Top View) 5 4 SOT25 / SOT353 (Top View) NC 1 6 (Top View) NC GND SOT553 Top View (Top View) NC NC 2 5 NC GND 3 4 GND 3 4 X2-DFN X2-DFN pplications Voltage Level Shifting General Purpose Logic Power Down Signal Isolation Wide array of products such as: o PCs, networking, notebooks, netbooks, PDs o Tablet Computers, E-readers o Computer peripherals, hard drives, CD/DVD ROM o TV, DVD, DVR, set top box o Cell Phones, Personal Navigation / GPS o MP3 players,cameras, Video Recorders Notes: 1. EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant. No purposely added lead. Halogen and ntimony free. Please visit our website at 1 of 12

2 Pin Descriptions Logic Diagram Pin Name Description NC No Connection Data Input 2 4 GND Ground Data Output Supply Voltage Function Table Inputs Output H Z L L bsolute Maximum Ratings (Note 2) Symbol Description Rating Unit ESD HBM Human Body Model ESD Protection 2 KV ESD CDM Charged Device Model ESD Protection 1 KV ESD MM Machine Model ESD Protection 200 V Supply Voltage Range -0.5 to 6.5 V V I Input Voltage Range -0.5 to 6.5 V V O Voltage applied to output in high impedance or I OFF state -0.5 to 6.5 V V O Voltage applied to output in high or low state -0.3 to +0.5 V I IK Input Clamp Current V I <0-50 m I OK Output Clamp Current -50 m I O Continuous output current 50 m I CC, I GND Continuous current through Vcc or GND ±100 m T J Operating Junction Temperature -40 to 150 C T STG Storage Temperature -65 to 150 C Notes: 2. Stresses beyond the absolute maximum may result in immediate failure or reduced reliability. These are stress values and device operation should be within recommend values. 2 of 12

3 Recommended Operating Conditions (Note 3) Symbol Parameter Min Max Unit V IH V IL Operating Voltage High-level Input Voltage Low-level input voltage Operating V Data retention only 1.5 V = 1.65V to 1.95V 0.65 X = 2.3V to 2.7V 1.7 = 3V to 3.6V 2 = 4.5V to 5.5V = 1.65V to 1.95V 0.7 X 0.35 X = 2.3V to 2.7V 0.7 = 3V to 3.6V 0.8 = 4.5V to 5.5V 0.3 X V I Input Voltage V V O Output Voltage 0 V I OL Δt/ΔV T Low-level output current Input transition rise or fall rate Operating free-air temperature = 1.65V 4 = 2.3V 8 = 3V = 4.5V 32 = 1.8V ± 0.15V, 2.5V ± 0.2V 20 = 3.3V ± 0.3V 10 = 5V ± 0.5V V V m ns/v ºC Notes: 3. Unused inputs should be held at or Ground. 3 of 12

4 Electrical Characteristics (ll typical values are at = 3.3V, T = 25 C) Symbol Parameter Test Conditions -40ºC to 85ºC -40ºC to 125ºC Min Typ. Max Min Max Unit I OL = 100μ 1.65V to 5.5V I OL = 4m 1.65V V OL Low Level I OL = 8m 2.3V Output V I Voltage OL = 16m V I OL = 24m I OL = 32m 4.5V I I Input Current V I = 5.5 V or GND 0 to 5.5V ± 0.1 ±5 ± 100 μ Power Down I OFF Leakage Current V I or V O = 5.5V 0V ±10 ±200 μ I CC ΔI CC C i Supply Current dditional Supply Current Input Capacitance V I = 5.5V or GND I O =0 Input at 0.6V 5.5V μ 3V to 5.5V μ V i = or GND 3.3V 5 pf 4 of 12

5 Package Characteristics (ll typical values are at = 3.3V, T = 25 C) Notes: Symbol Parameter Test Conditions Min Typ. Max Unit θ J θ JC Thermal Resistance Junction-to-mbient Thermal Resistance Junction-to-Case SOT SOT SOT553 (Note 4) 231 X2-DFN X2-DFN SOT25 SOT SOT553 (Note 4) 105 X2-DFN X2-DFN Test condition for SOT25, SOT353, SOT553, X2-DFN and X2-DFN1010-6: Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. Switching Characteristics 52 o C/W o C/W Figure 1 Typical Values at T = 25ºC and nominal voltages 1.8V, 2.5V, 2.7V, 3.3V, and 5.0V. Parameter From To T = -40ºC to 85ºC T = -40ºC to 125ºC V Input Output CC Min Typ Max Min Max 1.8V ± 0.15V V ± 0.2V t pd or B 2.7V V ± 0.3V V ± 0.5V Unit ns Operating Characteristics T = 25ºC C pd Parameter Power dissipation capacitance Test Conditions = 1.8V = 2.5V = 3.3V = 5V Typ. Typ. Typ. Typ. f = 10 MHz pf Unit 5 of 12

6 Parameter Measurement Information TEST t PLZ (see Notes D and E) t PZL (see Notes D and F) Condition Vload Vload Inputs V I t r /t f V M V LOD C L R L V 1.8V±0.15V 2ns /2 2 X 30pF 1KΩ 0.15V 2.5V±0.2V 2ns /2 2 X 30pF 500Ω 0.15V 2.7V 2.7V 2.5ns 1.5V 6V 50pF 500Ω 0.3V 3.3V±0.3V 3V 2.5ns 1.5V 6V 50pF 500Ω 0.3V 5V±0.5V 2.5ns /2 2 X 50pF 500Ω 0.3V Voltage Waveform Pulse Duration Voltage Waveform Propagation Delay Times Figure 1. Load Circuit and Voltage Waveforms Notes:. Includes test lead and test apparatus capacitance. B. ll pulses are supplied at pulse repetition rate 10 MHz C. The inputs are measured one at a time with one transition per measurement. D. For the open drain device t PLZ and t PZL are the same as t PD E. t PZL is measured at V M. F. t PLZ is measured at V OL +V 6 of 12

7 Ordering Information 74LVC1G 07 XXX -7 Logic Device Function Package Packing 74 : Logic Prefix LVC : 1.65 to 5.5V Family 1G : One Gate 07 : 3 Buffer/Driver with Open Drain W5 : SOT25 SE : SOT353 Z : SOT553 FW4 : X2-DFN FZ4 : X2-DFN : Tape & Reel Device Package Packaging 7 Tape and Reel Code (Note 6) Quantity Part Number Suffix W5-7 W5 SOT /Tape & Reel -7 SE-7 SE SOT /Tape & Reel -7 Z-7 Z SOT /Tape & Reel -7 FW4-7 FW4 X2-DFN /Tape & Reel -7 FZ4-7 FZ4 X2-DFN /Tape & Reel -7 Notes: 5. Pad layout as shown on Diodes Inc. suggested pad layout document P02001, which can be found on our website at 6. The taping orientation is located on our website at Marking Information (1) SOT25, SOT353 and SOT Part Number Package Identification Code W5 SOT25 UN SE SOT353 UN Z SOT553 UN (3) X2-DFN and X2-DFN (Top View) XX WX XX : Identification Code : ear 0~9 W : Week : ~Z : 1~26 week; a~z : 27~52 week; z represents 52 and 53 week X : ~Z : Internal Code Part Number Package Identification Code FW4 X2-DFN UN FZ4 X2-DFN UN 7 of 12

8 Package Outline Dimensions (ll Dimensions in mm) (1) Package Type: SOT25 H K J D (2) Package Type: SOT353 B C N L M SOT25 Dim Min Max Typ B C D 0.95 H J K L M N α 0 8 ll Dimensions in mm K J H D F B C L M SOT353 Dim Min Max B C D 0.65 Typ F H J K L M α 0 8 ll Dimensions in mm (3) Package Type: SOT553 E1 E1/2 R0.1 MX. TP. e F D e1 E/2 E b (5x) a c L (5x) SOT553 Dim Min Max Typ b c D E E e 0.50 BSC e BSC F L a ll Dimensions in mm 7 TP. 8 of 12

9 Package Outline Dimensions (cont.) (4) Package Type X2-DFN X2-DFN Dim Min Max Typ (Pin #1 ID) b1 E L(6x) e D K b b D E e 0.35 L K 0.15 Z ll Dimensions in mm Z(4x) b(6x) (5) Package Type: X2-DFN Seating Plane X2-DFN Dim Min Max Typ D b (Pin #1 ID) e D E e 0.50 E L(6x) L Z 0.10 Z Z1(4x) ll Dimensions in mm Z(4x) b(6x) 9 of 12

10 Suggested Pad Layout (1) Package Type: SOT25 C2 C2 Dimensions Value (in mm) Z 3.20 G 1.60 Z G C1 X (2) Package Type: SOT353 X C2 C2 C C Z G C1 Dimensions Value (in mm) Z 2.5 G 1.3 X C1 1.9 C X (3) Package Type: SOT553 C2 C2 Z G C1 Dimensions Value (in mm) Z 2.2 G 1.2 X C1 1.7 C2 0.5 X 10 of 12

11 Suggested Pad Layout (cont.) (4) Package Type X2-DFN X1 C (6x) Value Dimensions (in mm) C G(4x) 1 X(6x) G X X (5) Package Type: X2-DFN X1 C (6x) Value Dimensions (in mm) C G X X G(4x) X(6x) 11 of 12

12 IMPORTNT NOTICE DIODES INCORPORTED MKES NO WRRNT OF N KIND, EXPRESS OR IMPLIED, WITH REGRDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WRRNTIES OF MERCHNTBILIT ND FITNESS FOR PRTICULR PURPOSE (ND THEIR EQUIVLENTS UNDER THE LWS OF N JURISDICTION). Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. ny Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages. Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application. Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks. LIFE SUPPORT Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. s used herein:. Life support devices or systems are devices or systems which: 1. are intended to implant into the body, or 2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems. Copyright 2012, Diodes Incorporated 12 of 12