Hardware Interface Description

Transcription

1 MC75 Siemen Cellular Engine Verion: DocID: MC75_HD_V Hardware Interface Decription

2 MC75 Hardware Interface Decription Document Name: MC75 Hardware Interface Decription Verion: Date: June 02, 2005 DocId: Statu: MC75_HD_V General note Product i deemed accepted by Recipient and i provided without interface to Recipient product. The Product contitute pre-releae verion and code and may be changed ubtantially before commercial releae. The Product i provided on an a i bai only and may contain deficiencie or inadequacie. The Product i provided without warranty of any kind, expre or implied. To the maximum extent permitted by applicable law, Siemen further diclaim all warrantie, including without limitation any implied warrantie of merchantability, fitne for a particular purpoe and noninfringement of third-party right. The entire rik ariing out of the ue or performance of the Product and documentation remain with Recipient. Thi Product i not intended for ue in life upport appliance, device or ytem where a malfunction of the product can reaonably be expected to reult in peronal injury. Application incorporating the decribed product mut be deigned to be in accordance with the technical pecification provided in thee guideline. Failure to comply with any of the required procedure can reult in malfunction or eriou dicrepancie in reult. Furthermore, all afety intruction regarding the ue of mobile technical ytem, including GSM product, which alo apply to cellular phone mut be followed. Siemen AG cutomer uing or elling thi product for ue in any application do o at their own rik and agree to fully indemnify Siemen for any damage reulting from illegal ue or reale. To the maximum extent permitted by applicable law, in no event hall Siemen or it upplier be liable for any conequential, incidental, direct, indirect, punitive or other damage whatoever (including, without limitation, damage for lo of buine profit, buine interruption, lo of buine information or data, or other pecuniary lo) ariing out the ue of or inability to ue the Product, even if Siemen ha been advied of the poibility of uch damage. Subject to change without notice at any time. Copyright Tranmittal, reproduction, diemination and/or editing of thi document a well a utilization of it content and communication thereof to other without expre authorization are prohibited. Offender will be held liable for payment of damage. All right created by patent grant or regitration of a utility model or deign patent are reerved. Copyright Siemen AG 2005 MC75_HD_V Page 2 of

3 MC75 Hardware Interface Decription Content 0 Document Hitory Introduction Related Document Term and Abbreviation Type Approval Safety Precaution Product Concept Key Feature at a Glance MC75 Sytem Overview Circuit Concept Application Interface Operating Mode Power Supply Minimizing Power Loe Meauring the Supply Voltage V BATT Monitoring Power Supply by AT Command Power Up / Power Down Scenario Turn on MC Turn on MC75 Uing Ignition Line IGT Turn on MC75 Uing the VCHARGE Signal Reet MC75 via AT+CFUN Command Reet or Turn off MC75 in Cae of Emergency Turn off MC Turn off MC75 Uing AT Command Leakage Current in Power Down Mode Automatic Shutdown Temperature Dependent Shutdown Temperature Control during Emergency call Undervoltage Shutdown if Battery NTC i Preent Undervoltage Shutdown if no Battery NTC i Preent Overvoltage Shutdown Automatic EGPRS/GPRS Multilot Cla Change Charging Control Hardware Requirement Software Requirement Battery Pack Requirement Batterie Recommended for Ue with MC Charger Requirement Implemented Charging Technique Operating Mode during Charging Summary of State Tranition (Except SLEEP Mode) RTC Backup SIM Interface Serial Interface ASC Serial Interface ASC USB Interface Intalling the USB Modem Driver I 2 C Interface SD Memory Card Interface...55 MC75_HD_V Page 3 of

4 MC75 Hardware Interface Decription 3.14 Audio Interface Speech Proceing Microphone Circuit Single-ended Microphone Input Differential Microphone Input Line Input Configuration with OpAmp Loudpeaker Circuit Digital Audio Interface DAI Control Signal Synchronization Signal Uing the SYNC Pin to Control a Statu LED Behavior of the /RING0 Line (ASC0 Interface only) PWR_IND Signal Antenna Interface Antenna Intallation Antenna Pad Suitable Cable Type Antenna Connector Electrical, Reliability and Radio Characteritic Abolute Maximum Rating Operating Temperature Pin Aignment and Signal Decription Power Supply Rating Electrotatic Dicharge Reliability Characteritic Mechanic Mechanical Dimenion of MC Mounting MC75 to the Application Platform Board-to-Board Application Connector Sample Application Reference Approval Reference Equipment for Type Approval Compliance with FCC Rule and Regulation Appendix Lit of Part and Acceorie Fatener and Fixing for Electronic Equipment Fatener from German Supplier ETTINGER GmbH Data Sheet of Recommended Batterie MC75_HD_V Page 4 of

5 MC75 Hardware Interface Decription Table Table 1: Overview of operating mode...25 Table 2: Temperature dependent behavior...36 Table 3: Specification of battery pack uitable for ue with MC Table 4: Comparion Charge-only and Charge mode...42 Table 5: AT command available in Charge-only mode...43 Table 6: State tranition of MC75 (except SLEEP mode)...44 Table 7: Signal of the SIM interface (board-to-board connector)...46 Table 8: DCE-DTE wiring of ASC Table 9: DCE-DTE wiring of ASC Table 10: SD card interface...55 Table 11: Overview of DAI pin function...62 Table 12: Return lo in the active band...67 Table 13: Product pecification of U.FL-R-SMT connector...70 Table 14: Material and finih of U.FL-R-SMT connector and recommended plug...71 Table 15: Ordering information for Hiroe U.FL Serie...73 Table 16: Abolute maximum rating under non-operating condition...74 Table 17: Operating temperature...74 Table 18: Signal decription...76 Table 19: Power upply rating...81 Table 20: Current conumption during Tx burt for GSM 850MHz and GSM 900MHz...82 Table 21: Current conumption during Tx burt for GSM 1800MHz and GSM 1900MHz...83 Table 22: Meaured electrotatic value...84 Table 23: Summary of reliability tet condition...85 Table 24: Technical pecification of Molex board-to-board connector...89 Table 25: Lit of part and acceorie...96 Table 26: Molex ale contact (ubject to change)...97 Table 27: Hiroe ale contact (ubject to change)...97 Figure Figure 1: MC75 ytem overview...22 Figure 2: MC75 block diagram...23 Figure 3: Power upply limit during tranmit burt...28 Figure 4: Poition of the reference point BATT+ and GND...28 Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT...30 Figure 6: Power-on with IGT held low before witching on operating voltage at BATT Figure 7: Signal tate during turn-off procedure...34 Figure 8: Battery pack circuit diagram...40 Figure 9: RTC upply from capacitor...45 Figure 10: RTC upply from rechargeable battery...45 Figure 11: RTC upply from non-chargeable battery...45 Figure 12: Serial interface ASC Figure 13: Serial interface ASC Figure 14: USB circuit...50 Figure 15: I2C interface connected to VCC of application...53 Figure 16: I2C interface connected to VEXT line of MC Figure 17: SD card interface (example with power upply from module VEXT line)...56 Figure 18: Audio block diagram...57 Figure 19: Single ended microphone input...58 Figure 20: Differential microphone input...59 Figure 21: Line input configuration with OpAmp...60 MC75_HD_V Page 5 of

6 MC75 Hardware Interface Decription Figure 22: Differential loudpeaker configuration...61 Figure 23: Single ended loudpeaker configuration...61 Figure 24: PCM interface application...62 Figure 25: PCM timing...63 Figure 26: SYNC ignal during tranmit burt...64 Figure 27: LED Circuit (Example)...65 Figure 28: Incoming voice/fax/data call...66 Figure 29: URC tranmiion...66 Figure 30: Never ue antenna connector and antenna pad at the ame time...68 Figure 31: Retricted area around antenna pad...68 Figure 32: Mechanical dimenion of U.FL-R-SMT connector...70 Figure 33: U.FL-R-SMT connector with U.FL-LP-040 plug...71 Figure 34: U.FL-R-SMT connector with U.FL-LP-066 plug...71 Figure 35: Specification of U.FL-LP-(V)-040(01) plug...72 Figure 36: Pin aignment (component ide of MC75)...75 Figure 37: MC75 top view...86 Figure 38: Dimenion of MC Figure 39: Molex board-to-board connector on MC Figure 40: Mating board-to-board connector on application...91 Figure 41: MC75 ample application (draft)...93 Figure 42: Reference equipment for Type Approval...94 Figure 43: Lithium Ion battery from VARTA Figure 44: Lithium Polymer battery from VARTA MC75_HD_V Page 6 of

7 MC75 Hardware Interface Decription 0 Document Hitory Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter What i new New chapter: Digital Audio Interface DAI New chapter: Behavior of the /RING0 Line (ASC0 Interface only) New chapter: PWR_IND Signal 5.4 Added new table Current conumption during tranmit burt for frequency band GSM 180MHz and GSM 1900MHz. Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter 2.1, , What i new Modified decription of EMERG_RST line: EMERG_RST and additional activation of IGT will reet MC75. EMERG_RST without activation of IGT will witch MC75 off Updated recommended battery pecification Further detail on overvoltage hutdown. 5.2 Added remark on temperature tolerance. 5.4 Changed table Current conumption during tranmit burt. Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter Throughout manual What i new IGT line need to be driven low for at leat 400m 3.1 New chapter: Operating Mode Added remark on different operating mode Added remark on hutdown threhold in IDLE mode. 3.6 New chapter: Summary of State Tranition (Except SLEEP Mode) MC75_HD_V Page 7 of

8 MC75 Hardware Interface Decription Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter What i new 2.1 Added 7-bit addreing to lit of I 2 C feature New chapter to decribe requirement to control end of charging Added remark on how to witch the module off when in Charging-only mode and how to witch to other operating mode. No automatic hutdown in Charge-only mode. Updated lit of AT command Added 7-bit addreing and remark on AT^SSPI command Updated forward time of SYNC ignal during tranmit burt. 5.4 Updated Table 20. Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter What i new Added decription for undervoltage hutdown in IDLE and SLEEP mode Orderly hutdown in cae of overvoltage - added maximum voltage value. 5.4 Added table Power upply rating. 6.1 Updated Figure 38. Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter What i new 2.1 Corrected module weight Corrected current value in cae of undervoltage charging Removed AT^SMSO from lit of AT command upported in Charge-only mode. 3.8 Added pecification of peed parameter of SIM interface 3.14 Corrected figure Audio block diagram Deleted decription of the DAI. 4.1 Corrected figure Never ue antenna connector and antenna pad at the ame time. 4.2 Added note on oldering. 5.1 Added condition for abolute maximum rating. 5.4 New chapter: Power Supply Rating 8.1 Changed figure Reference equipment for type approval 8.2 Added further note. MC75_HD_V Page 8 of

9 MC75 Hardware Interface Decription Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter What i new Decribed effect of AT^SMSO during Charge-only mode Corrected everal parameter in figure More detailed decription of AT^SSYNC command. 8.2 Changed antenna gain and FCC identifier. Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter What i new / Added decription of how to meaure V BATT Orderly hutdown in cae of overvoltage (decription i preliminary) / Updated battery requirement. Added decription of VARTA batterie. Added data heet of VARTA batterie Added info about uber.y file Added filter in microphone circuit figure Added figure Differential loudpeaker configuration and Single ended loudpeaker configuration More detailed decription of how to connect the I 2 C interface. 5.1 Updated Table 16: Abolute maximum rating. 6.1 Updated Figure 38. Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter What i new --- Deleted ection about limitation of MC75 Preview Releae. Throughout manual Supply voltage range now 3.2V 4.3V (intead of 3.2V 4.2V) 2.1 / 5.3 Operating temperature pecified Added ection Leakage Current in Power Down Mode. 3.5 Added Lithium Polymer batterie. Updated recommended battery pecification. More detailed decription of trickle charging. 3.8 Ue CCGND a eparate ground line for the SIM interface Corrected decription and figure of USB interface. Decribed driver intallation / 5.3 USC4 pin marked a input. 5.3 Added pecification of USB interface. 5.4 Table 22: Added electrotatic value of USB and SD card interface. 6.1 Updated Figure 38. MC75_HD_V Page 9 of

10 MC75 Hardware Interface Decription Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter What i new Completely revied and updated all chapter and technical pecification. Added new chapter and appendix. Preceding document: "MC75 Hardware Interface Decription" Verion New document: "MC75 Hardware Interface Decription" Verion Chapter What i new 5 Changed decription of VEXT pin. Changed decription of pin 55 and renamed pin from EMERGOFF to EMERG_RST Corrected Figure 17: SD card interface. 7 Changed ample application. MC75_HD_V Page 10 of

11 MC75 Hardware Interface Decription 1 Introduction Thi document decribe the hardware of the Siemen MC75 module that connect to the cellular device application and the air interface. It help you quickly retrieve interface pecification, electrical and mechanical detail and information on the requirement to be conidered for integrating further component. 1.1 Related Document [1] MC75 AT Command Set [2] MC75 Releae Note [3] DSB75 Support Box - Evaluation Kit for Siemen Cellular Engine [4] Application 07: Rechargeable Lithium Batterie in GSM Application [5] Multiplexer Uer' Guide (not yet available) MC75_HD_V Page 11 of

12 MC75 Hardware Interface Decription 1.2 Term and Abbreviation Abbreviation ADC AGC ANSI ARFCN ARP ASC0 / ASC1 B B2B BER BTS CB or CBM CE CHAP CPU CS CSD CTS DAC DAI dbm0 DCE DCS 1800 DRX DSB DSP DSR DTE DTR DTX EDGE EFR EGSM EGPRS EIRP Decription Analog-to-Digital Converter Automatic Gain Control American National Standard Intitute Abolute Radio Frequency Channel Number Antenna Reference Point Aynchronou Controller. Abbreviation ued for firt and econd erial interface of MC75 Thermitor Contant Board-to-board connector Bit Error Rate Bae Tranceiver Station Cell Broadcat Meage Conformité Européene (European Conformity) Challenge Handhake Authentication Protocol Central Proceing Unit Coding Scheme Circuit Switched Data Clear to Send Digital-to-Analog Converter Digital Audio Interface Digital level, 3.14dBm0 correpond to full cale, ee ITU G.711, A-law Data Communication Equipment (typically modem, e.g. Siemen GSM engine) Digital Cellular Sytem, alo referred to a PCN Dicontinuou Reception Development Support Box Digital Signal Proceor Data Set Ready Data Terminal Equipment (typically computer, terminal, printer or, for example, GSM application) Data Terminal Ready Dicontinuou Tranmiion Enhanced Data Rate for Global Evolution Enhanced Full Rate Enhanced GSM Enhanced General Packet Radio Service Equivalent Iotropic Radiated Power MC75_HD_V Page 12 of

13 MC75 Hardware Interface Decription Abbreviation Decription EMC Electromagnetic Compatibility ERP Effective Radiated Power ESD Electrotatic Dicharge ETS European Telecommunication Standard FCC Federal Communication Commiion (U.S.) FDMA Frequency Diviion Multiple Acce FR Full Rate GMSK Gauian Minimum Shift Keying GPRS General Packet Radio Service GSM Global Standard for Mobile Communication HiZ High Impedance HR Half Rate I/O Input/Output IC Integrated Circuit IMEI International Mobile Equipment Identity ISO International Standard Organization ITU International Telecommunication Union kbp kbit per econd LED Light Emitting Diode Li-Ion / Li+ Lithium-Ion Li battery Rechargeable Lithium Ion or Lithium Polymer battery Mbp Mbit per econd MMI Man Machine Interface MO Mobile Originated MS Mobile Station (GSM engine), alo referred to a TE MSISDN Mobile Station International ISDN number MT Mobile Terminated NTC Negative Temperature Coefficient OEM Original Equipment Manufacturer PA Power Amplifier PAP Paword Authentication Protocol PBCCH Packet Switched Broadcat Control Channel PCB Printed Circuit Board PCL Power Control Level PCM Pule Code Modulation PCN Peronal Communication Network, alo referred to a DCS 1800 PCS Peronal Communication Sytem, alo referred to a GSM 1900 PDU Protocol Data Unit MC75_HD_V Page 13 of

14 MC75 Hardware Interface Decription Abbreviation Decription PLL Phae Locked Loop PPP Point-to-point protocol PSK Phae Shift Keying PSU Power Supply Unit R&TTE Radio and Telecommunication Terminal Equipment RAM Random Acce Memory RF Radio Frequency RMS Root Mean Square (value) ROM Read-only Memory RTC Real Time Clock RTS Requet to Send Rx Receive Direction SAR Specific Aborption Rate SD Secure Digital SELV Safety Extra Low Voltage SIM Subcriber Identification Module SMS Short Meage Service SRAM Static Random Acce Memory TA Terminal adapter (e.g. GSM engine) TDMA Time Diviion Multiple Acce TE Terminal Equipment, alo referred to a DTE Tx Tranmit Direction UART Univeral aynchronou receiver-tranmitter URC Unolicited Reult Code USB Univeral Serial Bu USSD Untructured Supplementary Service Data VSWR Voltage Standing Wave Ratio Phonebook abbreviation FD SIM fixdialing phonebook LD SIM lat dialing phonebook (lit of number mot recently dialed) MC Mobile Equipment lit of unanwered MT call (mied call) ME Mobile Equipment phonebook ON Own number (MSISDN) tored on SIM or ME RC Mobile Equipment lit of received call SM SIM phonebook MC75_HD_V Page 14 of

15 MC75 Hardware Interface Decription 1.3 Type Approval MC75 i deigned to comply with the directive and tandard lited below. Pleae note that the product i till in a pre-releae tate and, therefore, type approval and teting procedure have not yet been completed. European directive 99/05/EC Directive of the European Parliament and of the council of 9 March 1999 on radio equipment and telecommunication terminal equipment and the mutual recognition of their conformity, in hort referred to a R&TTE Directive 1999/5/EC 89/336/EC 73/23/EC Directive on electromagnetic compatibility Directive on electrical equipment deigned for ue within certain voltage limit (Low Voltage Directive) Standard of North American Type Approval CFR Title 47 Code of Federal Regulation, Part 22 and Part 24 (Telecommunication, PCS) ; US Equipment Authorization FCC UL NAPRD.03 RSS133 (Iue2) Product Safety Certification (Safety requirement) Overview of PCS Type certification review board Mobile Equipment Type Certification and IMEI control PCS Type Certification Review board (PTCRB), Verion Canadian Standard Standard of European Type Approval 3GPP TS Digital cellular telecommunication ytem (Phae 2); Mobile Station (MS) conformance pecification ETSI EN GCF-CC V7.0.1 ( ) Candidate Harmonized European Standard (Telecommunication erie) Global Sytem for Mobile communication (GSM); Harmonized tandard for mobile tation in the GSM 900 and DCS 1800 band covering eential requirement under article 3.2 of the R&TTE directive (1999/5/EC) (GSM verion Releae 1998) Global Certification Forum - Certification Criteria V ETSI EN V1.2.1 Candidate Harmonized European Standard (Telecommunication erie) Electro Magnetic Compatibility and Radio pectrum Matter (ERM); Electro Magnetic Compatibility (EMC) tandard for radio equipment and ervice; Part 1: Common Technical Requirement ETSI EN V1.1.1 Candidate Harmonized European Standard (Telecommunication erie) Electro Magnetic Compatibility and Radio pectrum Matter (ERM); Electro Magnetic Compatibility (EMC) tandard for radio equipment and ervice; Part 7: Specific condition for mobile and portable radio and ancillary equipment of digital cellular radio telecommunication ytem (GSM and DCS) EN Safety of information technology equipment (2000) MC75_HD_V Page 15 of

16 MC75 Hardware Interface Decription Requirement of quality IEC Environmental teting DIN EN IP code Compliance with international rule and regulation Manufacturer of mobile or fixed device incorporating MC75 module are advied to have their completed product teted and approved for compliance with all applicable national and international regulation. A a quad-band GSM/GPRS engine deigned for ue on any GSM network in the world, MC75 i required to pa all approval relevant to operation on the European and North American market. For the North American market thi include the Rule and Regulation of the Federal Communication Commiion (FCC) and PTCRB, for the European market the R&TTE Directive and GCF Certification Criteria mut be fully atified. The FCC Equipment Authorization granted to the MC75 Siemen reference application i valid only for the equipment decribed in Section 8.1. SAR requirement pecific to portable mobile Mobile phone, PDA or other portable tranmitter and receiver incorporating a GSM module mut be in accordance with the guideline for human expoure to radio frequency energy. Thi require the Specific Aborption Rate (SAR) of portable MC75 baed application to be evaluated and approved for compliance with national and/or international regulation. Since the SAR value varie ignificantly with the individual product deign manufacturer are advied to ubmit their product for approval if deigned for portable ue. For European and US market the relevant directive are mentioned below. It i the reponibility of the manufacturer of the final product to verify whether or not further tandard, recommendation or directive are in force outide thee area. Product intended for ale on US market ES 59005/ANSI C95.1 Conideration for evaluation of human expoure to Electromagnetic Field (EMF) from Mobile Telecommunication Equipment (MTE) in the frequency range 30MHz - 6GHz Product intended for ale on European market EN Product tandard to demontrate the compliance of mobile phone with the baic retriction related to human expoure to electromagnetic field (300MHz - 3GHz) Note: Uage of MC75 in a fixed, mobile or portable application i not allowed without a new FCC certification. MC75_HD_V Page 16 of

17 MC75 Hardware Interface Decription 1.4 Safety Precaution The following afety precaution mut be oberved during all phae of the operation, uage, ervice or repair of any cellular terminal or mobile incorporating MC75. Manufacturer of the cellular terminal are advied to convey the following afety information to uer and operating peronnel and to incorporate thee guideline into all manual upplied with the product. Failure to comply with thee precaution violate afety tandard of deign, manufacture and intended ue of the product. Siemen AG aume no liability for cutomer failure to comply with thee precaution. When in a hopital or other health care facility, oberve the retriction on the ue of mobile. Switch the cellular terminal or mobile off, if intructed to do o by the guideline poted in enitive area. Medical equipment may be enitive to RF energy. The operation of cardiac pacemaker, other implanted medical equipment and hearing aid can be affected by interference from cellular terminal or mobile placed cloe to the device. If in doubt about potential danger, contact the phyician or the manufacturer of the device to verify that the equipment i properly hielded. Pacemaker patient are advied to keep their hand-held mobile away from the pacemaker, while it i on. Switch off the cellular terminal or mobile before boarding an aircraft. Make ure it cannot be witched on inadvertently. The operation of wirele appliance in an aircraft i forbidden to prevent interference with communication ytem. Failure to oberve thee intruction may lead to the upenion or denial of cellular ervice to the offender, legal action, or both. Do not operate the cellular terminal or mobile in the preence of flammable gae or fume. Switch off the cellular terminal when you are near petrol tation, fuel depot, chemical plant or where blating operation are in progre. Operation of any electrical equipment in potentially exploive atmophere can contitute a afety hazard. Your cellular terminal or mobile receive and tranmit radio frequency energy while witched on. Remember that interference can occur if it i ued cloe to TV et, radio, computer or inadequately hielded equipment. Follow any pecial regulation and alway witch off the cellular terminal or mobile wherever forbidden, or when you upect that it may caue interference or danger. Road afety come firt! Do not ue a hand-held cellular terminal or mobile when driving a vehicle, unle it i ecurely mounted in a holder for peakerphone operation. Before making a call with a hand-held terminal or mobile, park the vehicle. Speakerphone mut be intalled by qualified peronnel. Faulty intallation or operation can contitute a afety hazard. MC75_HD_V Page 17 of

18 MC75 Hardware Interface Decription SOS IMPORTANT! Cellular terminal or mobile operate uing radio ignal and cellular network. Becaue of thi, connection cannot be guaranteed at all time under all condition. Therefore, you hould never rely olely upon any wirele device for eential communication, for example emergency call. Remember, in order to make or receive call, the cellular terminal or mobile mut be witched on and in a ervice area with adequate cellular ignal trength. Some network do not allow for emergency call if certain network ervice or phone feature are in ue (e.g. lock function, fixed dialing etc.). You may need to deactivate thoe feature before you can make an emergency call. Some network require that a valid SIM card be properly inerted in the cellular terminal or mobile. MC75_HD_V Page 18 of

19 MC75 Hardware Interface Decription 2 Product Concept 2.1 Key Feature at a Glance Feature General Frequency band GSM cla Output power (according to Releae 99, V5) Implementation Quad band: GSM 850/900/1800/1900MHz Small MS Cla 4 (+33dBm ±2dB) for EGSM850 Cla 4 (+33dBm ±2dB) for EGSM900 Cla 1 (+30dBm ±2dB) for GSM1800 Cla 1 (+30dBm ±2dB) for GSM1900 Cla E2 (+27dBm ± 3dB) for GSM PSK Cla E2 (+27dBm ± 3dB) for GSM PSK Cla E2 (+26dBm +3 /-4dB) for GSM PSK Cla E2 (+26dBm +3 /-4dB) for GSM PSK The value tated above are maximum limit. According to Releae 99, Verion 5, the maximum output power in a multilot configuration may be lower. The nominal reduction of maximum output power varie with the number of uplink timelot ued and amount to 3.0dB for 2Tx, 4.8dB for 3Tx and 6.0dB for 4Tx. Power upply 3.2V to 4.3V Power conumption Operating temperature Phyical GSM / GPRS / EGPRS feature Data tranfer Sleep mode: max. TBD Power down mode: typically 50µA -30 C to +65 C ambient temperature Auto witch-off at +90 C board temperature (preliminary) Dimenion: 33.9mm x 44.6mm x max. 3.5mm Weight: approx. 7.5g GPRS Multilot Cla 12 Full PBCCH upport Mobile Station Cla B Coding Scheme 1 4 EGPRS Multilot Cla 10 Mobile Station Cla B Modulation and Coding Scheme MCS 1 9 MC75_HD_V Page 19 of

20 MC75 Hardware Interface Decription Feature Implementation CSD V.110, RLP, non-tranparent 2.4, 4.8, 9.6, 14.4kbp USSD PPP-tack for GPRS data tranfer SMS Point-to-point MT and MO Cell broadcat Text and PDU mode Storage: SIM card plu 25 SMS location in mobile equipment Tranmiion of SMS alternatively over CSD or GPRS. Preferred mode can be uer defined. Fax Group 3; Cla 1 Audio Speech codec: Half rate HR (ETS 06.20) Full rate FR (ETS 06.10) Enhanced full rate EFR (ETS 06.50/06.60/06.80) Adaptive Multi Rate AMR Speakerphone operation Echo cancellation, noie uppreion DTMF 7 ringing tone Software AT command AT-Haye GSM and 07.07, Siemen AT command for RIL compatibility (NDIS/RIL) Microoft TM compatibility RIL / NDIS for Pocket PC and Smartphone SIM Application Toolkit SAT Releae 99 TCP/IP tack IP addree IP verion 6 Firmware update Interface Acce by AT command Download over erial interface ASC0 Download over SIM interface Download over USB 2 erial interface ASC0 8-wire modem interface with tatu and control line, unbalanced, aynchronou 1.2kbp to 460kbp Autobauding TBD Support RTS0/CTS0 hardware handhake and oftware XON/XOFF flow control. Multiplex ability according to GSM Multiplexer Protocol. MC75_HD_V Page 20 of

21 MC75 Hardware Interface Decription Feature USB I 2 C SD card interface Implementation ASC1 4-wire, unbalanced aynchronou interface 1.2kbp to 460kbp Autobauding TBD Support RTS1/CTS1 hardware handhake and oftware XON/XOFF flow control Support a USB 2.0 Full Speed (12Mbit/) lave interface. I 2 C bu for 7-bit addreing and tranmiion rate up to 400kbp. Programmable with AT^SSPI command. Interface for SD memory card or multimedia card Audio 2 analog interface 1 digital interface (PCM) SIM interface Supported SIM card: 3V, 1.8V Antenna Module interface Power on/off, Reet 50Ohm. External antenna can be connected via antenna connector or olderable pad. 80-pin board-to-board connector Power on/off Switch-on by hardware pin IGT Switch-off by AT command (AT^SMSO) Automatic witch-off in cae of critical temperature and voltage condition. Reet Orderly hutdown and reet by AT command Emergency reet by hardware pin EMERG_RST and IGT. Special feature Charging Real time clock Phonebook Evaluation kit DSB75 Support management of rechargeable Lithium Ion and Lithium Polymer batterie Timer function via AT command SIM and phone DSB75 Evaluation Board deigned to tet and type approve Siemen cellular engine and provide a ample configuration for application engineering. MC75_HD_V Page 21 of

22 MC75 Hardware Interface Decription 2.2 MC75 Sytem Overview Antenna Interface MC75 Application Interface SD interface SD memory card USB I 2 C SIM Serial 1 (Modem) Serial 2 Digital Audio Analog Audio Charge Power Supply USB Hot I2C Slave SIM card UART Audio Codec Headphone or Headet Charging circuit Charger Uer Application Figure 1: MC75 ytem overview MC75_HD_V Page 22 of

23 Reet MC75 Hardware Interface Decription 2.3 Circuit Concept Figure 2 how a block diagram of the MC75 module and illutrate the major functional component: Baeband block: Digital baeband proceor with DSP Analog proceor with power upply unit (PSU) Flah / SRAM (tacked) Application interface (board-to-board connector) RF ection: RF tranceiver RF power amplifier RF front end Antenna connector SRAM Front End 3 D(0:15) A(0:24) RD; WR; CS; WAIT Flah RF Part RF Power Amplifier 26MHz 26MHz Digital Baeband Proceor with DSP ASC(0) ASC(1) I2C USB 8 SD Card Tranceiver NTC Meauring Network kHz Interface RF - Baeband RF Control Bu 4 I / Q RTC REFCHG TE M P2 BATTYPE CCIN CCRST CCIO CCCLK CCVCC 5 Analog Controller with PSU RESET 7 DAI SYNC 6 SIM Interface PWR_IND VEX T EM ERG_RS T 10 Audio analog IGT VDDLP CHARGEGATE VC HA RGE ISENSE Application Interface (80 pin) VSE NSE BATT_TEMP MC75 BATT+ GND Figure 2: MC75 block diagram MC75_HD_V Page 23 of

24 MC75 Hardware Interface Decription 3 Application Interface MC75 i equipped with an 80-pin board-to-board connector that connect to the external application. The hot interface incorporate everal ub-interface decribed in the following chapter: Power upply - ee Section 3.2 Charger interface Section 3.5 SIM interface - ee Section 3.8 Serial interface ASC0 - ee Section 3.9 Serial interface ASC1 - ee Section 3.10 Serial interface USB - ee Section Serial interface I²C - ee Section 3.12 SD card interface - ee Section 3.13 Two analog audio interface - ee Section 3.14 Digital audio interface (DAI) - ee Section 3.14 and Statu and control line: IGT, EMERG_RST, PWR_IND, SYNC - ee Table 18 MC75_HD_V Page 24 of

25 MC75 Hardware Interface Decription 3.1 Operating Mode The table below briefly ummarize the variou operating mode referred to in the following chapter. Table 1: Overview of operating mode Normal operation GSM / GPRS SLEEP Variou power ave mode et with AT+CFUN command. Software i active to minimum extent. If the module wa regitered to the GSM network in IDLE mode, it i regitered and paging with the BTS in SLEEP mode, too. Power aving can be choen at different level: The NON-CYCLIC SLEEP mode (AT+CFUN=0) diable the AT interface. The CYCLIC SLEEP mode AT+CFUN=7 and 9 alternatively activate and deactivate the AT interface to allow permanent acce to all AT command. GSM IDLE Software i active. Once regitered to the GSM network, paging with BTS i carried out. The module i ready to end and receive. GSM TALK Connection between two ubcriber i in progre. Power conumption depend on network coverage individual etting, uch a DTX off/on, FR/EFR/HR, hopping equence, antenna. GPRS IDLE EGPRS IDLE Module i ready for GPRS/EGPRS data tranfer, but no data i currently ent or received. Power conumption depend on network etting and GPRS/EGPRS configuration (e.g. multilot etting). GPRS DATA EGPRS DATA GPRS/EGPRS data tranfer in progre. Power conumption depend on network etting (e.g. power control level), uplink / downlink data rate, GPRS/EGPRS configuration (e.g. ued multilot etting) and reduction of maximum output power. POWER DOWN Normal hutdown after ending the AT^SMSO command. The Power Supply diconnect the upply voltage from the baeband part of the circuit. Only a voltage regulator i active for powering the RTC. Software i not active. Interface are not acceible. Operating voltage (connected to BATT+) remain applied. MC75_HD_V Page 25 of

26 MC75 Hardware Interface Decription Airplane mode Airplane mode hut down the radio part of the module, caue the module to log off from the GSM/GPRS network and diable all AT command whoe execution require a radio connection. Airplane mode can be controlled by uing the AT command AT^SCFG and AT+CALA: With AT^SCFG=MEopMode/Airplane/OnStart the module can be configured to enter the Airplane mode each time when witched on or reet. The parameter AT^SCFG=MEopMode/Airplane can be ued to witch back and forth between Normal mode and Airplane mode any time during operation. Setting an alarm time with AT+CALA followed by AT^SMSO wake the module up into Airplane mode at the cheduled time. Charge-only mode Limited operation for battery powered application. Enable charging while module i detached from GSM network. Limited number of AT command i acceible. Charge-only mode applie when the charger i connected if the module wa powered down with AT^SMSO. Charge mode during normal operation Normal operation (SLEEP, IDLE, TALK, GPRS IDLE, GPRS/EGPRS DATA) and charging running in parallel. Charge mode change to Charge-only mode when the module i powered down before charging ha been completed. See Table 6 for the variou option proceeding from one mode to another. MC75_HD_V Page 26 of

27 MC75 Hardware Interface Decription 3.2 Power Supply MC75 need to be connected to a power upply at the B2B connector (5 pin each BATT+ and GND). The power upply of MC75 ha to be a ingle voltage ource at BATT+. It mut be able to provide the peak current during the uplink tranmiion. All the key function for upplying power to the device are handled by the power management ection of the analog controller. Thi IC provide the following feature: Stabilize the upply voltage for the GSM baeband uing low drop linear voltage regulator. Switche the module' power voltage for the power up and down procedure. Deliver, acro the VEXT pin, a regulated voltage for an external application. Thi voltage i not available in Power-down mode. SIM witch to provide SIM power upply Minimizing Power Loe When deigning the power upply for your application pleae pay pecific attention to power loe. Enure that the input voltage V BATT+ never drop below 3.2V on the MC75 board, not even in a tranmit burt where current conumption can rie to typical peak of 2A. It hould be noted that MC75 witche off when exceeding thee limit. Any voltage drop that may occur in a tranmit burt hould not exceed 400mV. The meaurement network monitor outburt and inburt value. The drop i the difference of both value. The maximum drop (Dmax) ince the lat tart of the module will be aved. In IDLE and SLEEP mode, the module witche off if the minimum battery voltage (V batt min) i reached. Example: V I min = 3.2V Dmax = 0.35V V batt min = V I min + Dmax V batt min = 3.2V V = 3.55V The bet approach to reducing voltage drop i to ue a board-to-board connection a recommended, and a low impedance power ource. The reitance of the power upply line on the hot board and of a battery pack hould alo be conidered. Note: If the application deign require an adapter cable between both board-to-board connector, ue a flex cable a hort a poible in order to minimize power loe. MC75_HD_V Page 27 of

28 MC75 Hardware Interface Decription Example: If the length of the flex cable reache the maximum length of 100mm, thi connection may caue, for example, a reitance of 30mΩ in the BATT+ line and 30mΩ in the GND line. A a reult, a 2A tranmit burt would add up to a total voltage drop of 120mV. Plu, if a battery pack i involved, further loe may occur due to the reitance acro the battery line and the internal reitance of the battery including it protection circuit. Tranmit burt 2A Tranmit burt 2A BATT+ min. 3.2V Drop Ripple Figure 3: Power upply limit during tranmit burt Meauring the Supply Voltage V BATT+ The reference point for meauring the upply voltage V BATT+ on the module are BATT+ and GND, both acceible at a capacitor located cloe to the board-to-board connector of the module. Reference point BATT+ Reference point GND Figure 4: Poition of the reference point BATT+ and GND Monitoring Power Supply by AT Command To monitor the upply voltage you can alo ue the AT^SBV command which return the value related to the reference point BATT+ and GND. The module continuouly meaure the voltage at interval depending on the operating mode of the RF interface. The duration of meauring range from 0.5 in TALK/DATA mode to 50 when MC75 i in IDLE mode or Limited Service (deregitered). The diplayed voltage (in mv) i averaged over the lat meauring period before the AT^SBV command wa executed. MC75_HD_V Page 28 of

29 MC75 Hardware Interface Decription 3.3 Power Up / Power Down Scenario In general, be ure not to turn on MC75 while it i beyond the afety limit of voltage and temperature tated in Chapter 5. MC75 would immediately witch off after having tarted and detected thee inappropriate condition. In extreme cae thi can caue permanent damage to the module Turn on MC75 MC75 can be tarted in a variety of way a decribed in the following ection: Hardware driven tart-up by IGT line: tart Normal mode or Airplane mode (ee Section ) Software controlled reet by AT+CFUN command: tart Normal or Airplane mode (ee Section ) Hardware driven tart-up by VCHARGE line: tart charging algorithm and Charge-only mode (ee Section ) Wake-up from Power-down mode by uing RTC interrupt: tart Airplane mode The option whether to tart into Normal mode or Airplane mode depend on the etting made with the AT^SCFG command or AT+CALA. With AT+CALA, followed by AT^SMSO the module can be configured to retart into Airplane mode at a cheduled alarm time. Switching back and forth between Normal mode and Airplane mode i poible any time during operation by uing the AT^SCFG command. After tartup or mode change the following URC indicate the module ready tate: SYSSTART indicate that the module ha entered Normal mode. ^SYSSTART AIRPLANE MODE indicate that the module ha entered Airplane mode. ^SYSSTART CHARGE ONLY MODE indicate that the module ha entered the Charge-only mode. Detailed explanation on AT^SCFG, AT+CFUN, AT+CALA and Airplane mode can be found in [1] Turn on MC75 Uing Ignition Line IGT When the MC75 module i in Power-down mode, it can be tarted to Normal mode or Airplane mode by driving the IGT (ignition) line to ground. Thi mut be accomplihed with an open drain/collector driver to avoid current flowing into thi pin. The module will tart up when both of the following two condition are met: The upply voltage applied at BATT+ mut be in the operating range. The IGT line need to be driven low for at leat 400m. Conidering different trategie of hot application deign the figure below how two approache to meet thi requirement: The example in Figure 5 aume that IGT i activated after BATT+ ha already been applied. The example in Figure 6 aume that IGT i held low before BATT+ i witched on. In either cae, to power on the module, enure that low tate of IGT take at leat 400m from the moment the voltage at BATT+ i available. MC75_HD_V Page 29 of

30 MC75 Hardware Interface Decription If configured to a fix baud rate (AT+IPR 0), the module will end the URC ^SYSSTART or ^SYSSTART AIRPLANE MODE to notify that it i ready to operate. If autobauding i enabled (AT+IPR=0) there will be no notification. BATT+ IGT t = 400m min HiZ PWR_IND EMERG_RST 120m VEXT TXD0/TXD1/RTS0/RST1/DTR0 (driven by the application) CTS0/CTS1/DSR0/DCD0 Serial interface ASC0 and ASC1 Undefined ca. 500 m Active Figure 5: Power-on with operating voltage at BATT+ applied before activating IGT MC75_HD_V Page 30 of

31 MC75 Hardware Interface Decription BATT+ t = 400m min HiZ IGT PWR_IND EMERG_RST 120m VEXT TXD0/TXD1/RTS0/RST1/DTR0 (driven by the application) CTS0/CTS1/DSR0/DCD0 Serial interface ASC0 and ASC1 Undefined ca. 500 m Active Figure 6: Power-on with IGT held low before witching on operating voltage at BATT Turn on MC75 Uing the VCHARGE Signal A detailed in Section 3.5.7, the charging adapter can be connected regardle of the module operating mode. If the charger i connected to the charger input of the external charging circuit and the module VCHARGE pin while MC75 i off, and the battery voltage i above the undervoltage lockout threhold, proceor controlled fat charging tart (ee Section 3.5.6). MC75 enter a retricted mode, referred to a Charge-only mode where only the charging algorithm will be launched. During the Charge-only mode MC75 i neither logged on to the GSM network nor are the erial interface fully acceible. To witch to normal operation and log on to the GSM network, the IGT line need to be activated a decribed in Section MC75_HD_V Page 31 of

32 MC75 Hardware Interface Decription Reet MC75 via AT+CFUN Command To reet and retart the MC75 module ue the command AT+CFUN. You can enter AT+CFUN=,1 or AT+CFUN=x,1, where x may be in the range from 0 to 9. See [1] for detail. If configured to a fix baud rate (AT+IPR 0), the module will end the URC ^SYSSTART or ^SYSSTART AIRPLANE MODE to notify that it i ready to operate. If autobauding i enabled (AT+IPR=0) there will be no notification. To regiter to the network SIM PIN authentication i neceary after retart Reet or Turn off MC75 in Cae of Emergency Caution: Ue the EMERG_RST pin only when, due to eriou problem, the oftware i not reponding for more than 5 econd. Pulling the EMERG_RST pin caue the lo of all information tored in the volatile memory. Therefore, thi procedure i intended only for ue in cae of emergency, e.g. if MC75 doe not repond, if reet or hutdown via AT command fail. The EMERG_RST ignal i available on the application interface. To control the EMERG_RST line it i recommended to ue an open drain / collector driver. The EMERG_RST line can be ued to witch off or to reet the module. In any cae the EMERG_RST line mut be pulled to ground for 10m. Then, after releaing the EMERG_RST line additional activation of IGT for 400 m will reet the module. If IGT i not activated for 400 m the module witche off. In thi cae, it can be retarted any time a decribed in ection After hardware driven retart, notification via ^SYSSTART or ^SYSSTART AIRPLANE URC i the ame a in cae of retart by IGT or AT command. To regiter to the network SIM PIN authentication i neceary after retart. MC75_HD_V Page 32 of

33 MC75 Hardware Interface Decription Turn off MC75 MC75 can be turned off a follow: Normal hutdown: Software controlled by AT^SMSO command Automatic hutdown: Take effect if board or battery temperature i out of range or if undervoltage or overvoltage condition occur Turn off MC75 Uing AT Command The bet and afet approach to powering down MC75 i to iue the AT^SMSO command. Thi procedure let MC75 log off from the network and allow the oftware to enter into a ecure tate and afe data before diconnecting the power upply. The mode i referred to a Power-down mode. In thi mode, only the RTC tay active. Before witching off the device end the following repone: ^SMSO: MS OFF OK ^SHUTDOWN After ending AT^SMSO do not enter any other AT command. There are two way to verify when the module turn off: Wait for the URC ^SHUTDOWN. It indicate that data have been tored non-volatile and the module turn off in le than 1 econd. Alo, you can monitor the PWR_IND pin. High tate of PWR_IND definitely indicate that the module i witched off. Be ure not to diconnect the upply voltage V BATT+ before the URC ^SHUTDOWN ha been iued and the PWR_IND ignal ha gone high. Otherwie you run the rik of loing data. Signal tate during turn-off are hown in Figure 7. While MC75 i in Power-down mode the application interface i witched off and mut not be fed from any other ource. Therefore, your application mut be deigned to avoid any current flow into any digital pin of the application interface, epecially of the erial interface. No pecial care i required for the USB interface which i protected from revere current. MC75_HD_V Page 33 of

34 MC75 Hardware Interface Decription PWR_IND VEXT See note 1 CTS0/CTS1/DSR0/DTR0 TXD0/TXD1/RTS0/RTS1/DTR0 (driven by the application) Serial interface ASC0 and ASC1 Active Undefined Figure 7: Signal tate during turn-off procedure Note 1: Depending on capacitance load from hot application Leakage Current in Power Down Mode The leakage current in Power Down mode varie depending on the following condition: If the upply voltage at BATT+ wa diconnected and then applied again without tarting up the MC75 module, the leakage current range between 90µA and 100µA. If the MC75 module i tarted and afterward powered down with AT^SMSO, then the leakage current i only 50µA. Therefore, in order to minimize the leakage current take care to tart up the module at leat once before it i powered down. MC75_HD_V Page 34 of

35 MC75 Hardware Interface Decription Automatic Shutdown Automatic hutdown take effect if the MC75 board i exceeding the critical limit of overtemperature or undertemperature the battery i exceeding the critical limit of overtemperature or undertemperature undervoltage or overvoltage i detected See Charge-only mode decribed in ection for exception. The automatic hutdown procedure i equivalent to the Power-down initiated with the AT^SMSO command, i.e. MC75 log off from the network and the oftware enter a ecure tate avoiding lo of data. Alert meage tranmitted before the device witche off are implemented a Unolicited Reult Code (URC). The preentation of thee URC can be enabled or diabled with the two AT command AT^SBC and AT^SCTM. The URC preentation mode varie with the condition, pleae ee Chapter to for detail. For further intruction on AT command refer to [1] Temperature Dependent Shutdown The board temperature i contantly monitored by an internal NTC reitor located on the PCB. The NTC that detect the battery temperature mut be part of the battery pack circuit a decribed in The value detected by either NTC reitor are meaured directly on the board or the battery and therefore, are not fully identical with the ambient temperature. Each time the board or battery temperature goe out of range or back to normal, MC75 intantly diplay an alert (if enabled). URC indicating the level "1" or "-1" allow the uer to take appropriate precaution, uch a protecting the module from expoure to extreme condition. The preentation of the URC depend on the etting elected with the AT^SCTM write command: AT^SCTM=1: Preentation of URC i alway enabled. AT^SCTM=0 (default): Preentation of URC i enabled for 15 econd time after tart-up of MC75. After 15 econd operation, the preentation will be diabled, i.e. no alert meage can be generated. URC indicating the level "2" or "-2" are intantly followed by an orderly hutdown. The preentation of thee URC i alway enabled, i.e. they will be output even though the factory etting AT^SCTM=0 wa never changed. The maximum temperature rating are tated in Table 17. Refer to Table 2 for the aociated URC. All tatement are baed on tet condition according to IEC (till air). MC75_HD_V Page 35 of

36 MC75 Hardware Interface Decription Table 2: Temperature dependent behavior Sending temperature alert (15 after MC75 tart-up, otherwie only if URC preentation enabled) ^SCTM_A: 1 ^SCTM_B: 1 ^SCTM_A: -1 ^SCTM_B: -1 ^SCTM_A: 0 ^SCTM_B: 0 Caution: T amb of battery cloe to overtemperature limit. Caution: T amb of board cloe to overtemperature limit. Caution: T amb of battery cloe to undertemperature limit. Caution: T amb of board cloe to undertemperature limit. Battery back to uncritical temperature range. Board back to uncritical temperature range. Automatic hutdown (URC appear no matter whether or not preentation wa enabled) ^SCTM_A: 2 ^SCTM_B: 2 ^SCTM_A: -2 ^SCTM_B: -2 Alert: T amb of battery equal or beyond overtemperature limit. MC75 witche off. Alert: T amb of board equal or beyond overtemperature limit. MC75 witche off. Alert: T amb of battery equal or below undertemperature limit. MC75 witche off. Alert: T amb of board equal or below undertemperature limit. MC75 witche off Temperature Control during Emergency call If the temperature limit i exceeded while an emergency call i in progre the engine continue to meaure the temperature, but deactivate the hutdown functionality. If the temperature i till out of range when the call end, the module witche off immediately (without another alert meage) Undervoltage Shutdown if Battery NTC i Preent In application where the module charging technique i ued and an NTC i connected to the BATT_TEMP terminal, the oftware contantly monitor the applied voltage. If the meaured battery voltage i no more ufficient to et up a call the following URC will be preented: ^SBC: Undervoltage. The meage will be reported, for example, when the uer attempt to make a call while the voltage i cloe to the hutdown threhold of 3.2V and further power lo i caued during the tranmit burt. In IDLE mode, the hutdown threhold i the um of the module minimum upply voltage (3.2V) and the value of the maximum voltage drop reulting from earlier call. Thi mean that in IDLE mode the actual hutdown threhold may be higher than 3.2V. Therefore, to properly calculate the actual hutdown threhold application manufacturer are advied to meaure the maximum voltage drop that may occur during tranmit burt. To remind the uer that the battery need to be charged oon, the URC appear everal time before the module witche off. To enable or diable the URC ue the AT^SBC command. The URC will be enabled when you enter the write command and pecify the current conumption of your hot application. Step by tep intruction are provided in [1]. MC75_HD_V Page 36 of

37 MC75 Hardware Interface Decription Undervoltage Shutdown if no Battery NTC i Preent The undervoltage protection i alo effective in application, where no NTC connect to the BATT_TEMP terminal. Thu, you can take advantage of thi feature even though the application handle the charging proce or MC75 i fed by a fixed upply voltage. All you need to do i executing the write command AT^SBC=<current> which automatically enable the preentation of URC. You do not need to pecify <current>. Whenever the upply voltage fall below the value of 3.2V the URC ^SBC: Undervoltage appear everal time before the module witche off Overvoltage Shutdown The overvoltage hutdown threhold i 100mV above the maximum upply voltage V BATT+ pecified in Table 19. When the upply voltage approache the overvoltage hutdown threhold the module will end the following URC ^SBC: Overvoltage warning Thi alert i ent once. When the overvoltage hutdown threhold i exceeded the module will end the URC ^SBC: Overvoltage hutdown before it hut down cleanly. Keep in mind that everal MC75 component are directly linked to BATT+ and, therefore, the upply voltage remain applied at major part of MC75, even if the module i witched off. Epecially the power amplifier i very enitive to high voltage and might even be detroyed. MC75_HD_V Page 37 of

38 MC75 Hardware Interface Decription 3.4 Automatic EGPRS/GPRS Multilot Cla Change Temperature control i alo effective for operation in EGPRS Multilot Cla 10, GPRS Multilot Cla 10 and GPRS Multilot Cla 12. If the board temperature increae to the limit pecified for retricted operation 1) while data are tranmitted over EGPRS or GPRS, the module automatically revert: from EGPRS Multilot Cla 10 (2Tx lot) to EGPRS Multilot Cla 8 (1Tx), from GPRS Multilot Cla 12 (4Tx lot) to GPRS Multilot Cla 8 (1Tx) from GPRS Multilot Cla 10 (2Tx lot) to GPRS Multilot Cla 8 (1Tx) Thi reduce the power conumption and, conequently, caue the board temperature to decreae. Once the temperature drop to a value of 5 degree below the limit of retricted operation, MC75 return to the higher Multilot Cla. If the temperature tay at the critical level or even continue to rie, MC75 will not witch back to the higher cla. After a tranition from EGPRS Multilot Cla 10 to EGPRS Multilot Cla 8 a poible witchback to EGPRS Multilot Cla 10 i blocked for one minute. The ame applie when a tranition occur from GPRS Multilot Cla 12 or 10 to GPRS Multilot Cla 8. Pleae note that there i not one ingle caue of witching over to a lower Multilot Cla. Rather it i the reult of an interaction of everal factor, uch a the board temperature that depend largely on the ambient temperature, the operating mode and the tranmit power. Furthermore, take into account that there i a delay until the network proceed to a lower or, accordingly, higher Multilot Cla. The delay time i network dependent. In extreme cae, if it take too much time for the network and the temperature cannot drop due to thi delay, the module may even witch off a decribed in Section ) See Table 17 for temperature limit known a retricted operation. MC75_HD_V Page 38 of

39 MC75 Hardware Interface Decription 3.5 Charging Control MC75 integrate a charging management for rechargeable Lithium Ion and Lithium Polymer batterie. You can kip thi chapter if charging i not your concern, or if you are not uing the implemented charging algorithm. The following ection contain an overview of charging and battery pecification. Pleae refer to [4] for greater detail, epecially regarding requirement for batterie and charger, appropriate charging circuit, recommended batterie and an analyi of operational iue typical of battery powered GSM/GPRS application Hardware Requirement MC75 ha no on-board charging circuit. To benefit from the implemented charging management you are required to intall a charging circuit within your application according to the Figure Software Requirement Ue the command AT^SBC, parameter <current>, to enter the current conumption of the hot application. Thi information enable the MC75 module to correctly determine the end of charging and terminate charging automatically when the battery i fully charged. If the <current> value i inaccurate and the application draw a current higher than the final charge current, either charging will not be terminated or the battery fail to reach it maximum voltage. Therefore, the termination condition i defined a: final charge current (50mA) plu current conumption of the external application. If ued the current flowing over the VEXT pin of the application interface (typically 2.9V) mut be added, too. The parameter <current> i volatile, meaning that the factory default (0mA) i retored each time the module i powered down or reet. Therefore, for better control of charging, it i recommended to enter the value every time the module i tarted. See [1] for detail on AT^SBC Battery Pack Requirement The charging algorithm ha been optimized for rechargeable Lithium batterie that meet the characteritic lited below and in Table 3. It i recommended that the battery pack you want to integrate into your MC75 application i compliant with thee pecification. Thi enure reliable operation, proper charging and, particularly, allow you to monitor the battery capacity uing the AT^SBC command. Failure to comply with thee pecification might caue AT^SBC to deliver incorrect battery capacity value. Li-Ion or Lithium Polymer battery pack pecified for a maximum charging voltage of 4.2V and a recommended capacity of 1000 to 1200mAh. Since charging and dicharging largely depend on the battery temperature, the battery pack hould include an NTC reitor. If the NTC i not inide the battery it mut be in thermal contact with the battery. The NTC reitor mut be connected between BATT_TEMP and GND. The B value of the NTC hould be in the range: 10kΩ 25 C, B 25/85 = 3423K to B =3435K ± 3% (alternatively acceptable: 10kΩ 25 C, B 25/50 = 3370K +3%). Pleae MC75_HD_V Page 39 of

40 MC75 Hardware Interface Decription note that the NTC i indipenable for proper charging, i.e. the charging proce will not tart if no NTC i preent. Enure that the pack incorporate a protection circuit capable of detecting overvoltage (protection againt overcharging), undervoltage (protection againt deep dicharging) and overcurrent. Due to the dicharge current profile typical of GSM application, the circuit mut be inenitive to puled current. On the MC75 module, a built-in meauring circuit contantly monitor the upply voltage. In the event of undervoltage, it caue MC75 to power down. Undervoltage threhold are pecific to the battery pack and mut be evaluated for the intended model. When you evaluate undervoltage threhold, conider both the current conumption of MC75 and of the application circuit. The internal reitance of the battery and the protection hould be a low a poible. It i recommended not to exceed 150mΩ, even in extreme condition at low temperature. The battery cell mut be inenitive to rupture, fire and gaing under extreme condition of temperature and charging (voltage, current). The battery pack mut be protected from revere pole connection. For example, the caing hould be deigned to prevent the uer from mounting the battery in revere orientation. It i recommended that the battery pack be approved to atify the requirement of CE conformity. Figure 8 how the circuit diagram of a typical battery pack deign that include the protection element decribed above. to BATT+ to BATT_TEMP ϑ to GND NTC Protection Circuit Figure 8: Battery pack circuit diagram Table 3: Specification of battery pack uitable for ue with MC Battery cell Polyfue Battery type Rechargeable Lithium Ion or Lithium Polymer battery Nominal voltage 3.6V / 3.7V Capacity Recommended: 1000mAh to 1200mAh Minimum: 500mAh NTC 10kΩ ± 25 C approx. 45 C approx. 0 C B value range: B (25/85)=3423K to B =3435K ± 3% Overcharge detection voltage ± 0.025V Overdicharge detection voltage 2.5 ± 0.05V Overcurrent detection 3 ± 0.5A Overcurrent detection delay time 4 ~ 16m Short detection delay time 50µ Internal reitance <130mΩ Note: A maximum internal reitance of 150mΩ hould not be exceeded even after 500 cycle and under extreme condition. MC75_HD_V Page 40 of

41 MC75 Hardware Interface Decription Batterie Recommended for Ue with MC75 When you chooe a battery for your MC75 application you can take advantage of one of the following two batterie offered by VARTA Microbattery GmbH. Both batterie meet all requirement lited above. They have been thoroughly teted by Siemen, proved to be uited for MC75, and are CE approved. LIP A1B PCM.STB, type Lithium Ion Thi battery i lited in the tandard product range of VARTA. It i incorporated in a hrink leeve and ha been choen for integration into the reference etup ubmitted for Type Approval of Siemen GSM module. LPP CA PCM.NTC.LT50, type Lithium Polymer Thi battery ha been epecially deigned by VARTA for ue with Siemen GSM module. It ha the ame propertie a the above Li-Ion battery, except that it i type Polymer, i maller and come without caing. Specification, contruction drawing and ale contact for both VARTA batterie can be found in Section Charger Requirement For uing the implemented charging algorithm and the reference charging circuit recommended in [4] and in Figure 41, the charger ha to meet the following requirement: Output voltage: 5.2Volt ±0.2V (tabilized voltage) Output current: 500mA Charger with a higher output current are acceptable, but pleae conider that only 500mA will be applied when a 0.3Ohm hunt reitor i connected between VSENSE and ISENSE. See [4] for further detail Implemented Charging Technique If all requirement lited above are met (appropriate external charging circuit of application, battery pack, charger, AT^SBC etting) then charging i enabled in variou tage depending on the battery condition: Trickle charging: Trickle charge current flow over the VCHARGE line. Trickle charging i done when a charger i preent (connected to VCHARGE) and the battery i deeply dicharged or ha undervoltage. If deeply dicharged (Deep Dicharge Lockout at V BATT+ = 0 2.5V) the battery i charged with 5mA, in cae of undervoltage (Undervoltage Lockout at V BATT+ = V) it i charged with 30mA Software controlled charging: Controlled over the CHARGEGATE. Temperature condition: 0 C to 45 C Software controlled charging i done when the charger i preent (connected to VCHARGE) and the battery voltage i at leat above the undervoltage threhold. Software controlled charging pae the following tage: - Power ramp: Depending on the dicharge level of the battery (i.e. the meaured battery voltage V BATT+ ) the oftware adjut the maximum charge current for charging the MC75_HD_V Page 41 of

42 MC75 Hardware Interface Decription battery. The duration of power ramp charging i very hort (le than 30 econd). - Fat charging: Battery i charged with contant current (approx. 500mA) until the battery voltage reache 4.2V (approx. 80% of the battery capacity). - Top-up charging: The battery i charged with contant voltage of 4.2V at tepwie reducing charge current until full battery capacity i reached. The duration of oftware controlled charging depend on the battery capacity and the level of dicharge Operating Mode during Charging Of coure, the battery can be charged regardle of the engine' operating mode. When the GSM module i in Normal mode (SLEEP, IDLE, TALK, GPRS IDLE or GPRS DATA mode), it remain operational while charging i in progre (provided that ufficient voltage i applied). The charging proce during the Normal mode i referred to a Charge mode. If the charger i connected to the charger input of the external charging circuit and the module VCHARGE pin while MC75 i in Power-down mode, MC75 goe into Charge-only mode. While the charger remain connected it i not poible to witch the module off by uing the AT^SMSO command or the automatic hutdown mechanim. Intead the following applie: If the module i in Normal mode and the charger i connected (Charge mode) the AT^SMSO command caue the module to hut down hortly and then tart into the Charge-only mode. In Charge-only mode the AT^SMSO command i not uable. In Charge-only mode the module neither witche off when the battery or the module exceed the critical limit of overtemperature or undertemperature. In thee cae you can only witch the module off by diconnecting the charger. To proceed from Charge-only mode to another operating mode you have the following option: To witch from Charge-only mode to Normal mode drive the ignition line (IGT) to ground for 1 econd. To witch from Charge-only mode to Airplane mode enter the command AT^SCFG=MEopMode/Airplane,on. If AT^SCFG=MEopMode/Airplane/OnStart,on i et, driving the ignition line (IGT) activate the Airplane mode. Table 4: Comparion Charge-only and Charge mode How to activate mode Decription of mode Charge mode Connect charger to charger input of hot application charging circuit and module VCHARGE pin while MC75 i operating, e.g. in IDLE or TALK mode in SLEEP mode Battery can be charged while GSM module remain operational and regitered to the GSM network. In IDLE and TALK mode, the erial interface are acceible. All AT command can be ued to full extent. NOTE: If the module operate at maximum power level (PCL5) and GPRS Cla 12 at the ame time the current conumption i higher than the current upplied by the charger. MC75_HD_V Page 42 of

43 MC75 Hardware Interface Decription How to activate mode Decription of mode Charge-only mode Connect charger to charger input of hot application charging circuit and module VCHARGE pin while MC75 i in Power-down mode in Normal mode: Connect charger to the VCHARGE pin, then enter AT^SMSO. NOTE: While trickle charging i in progre, be ure that the hot application i witched off. If the application i fed from the trickle charge current the module might be prevented from proceeding to oftware controlled charging ince the current would not be ufficient. Battery can be charged while GSM engine i deregitered from GSM network. Charging run moothly due to contant current conumption. The AT interface i acceible and allow to ue the command lited below. Table 5: AT command available in Charge-only mode AT command AT+CALA AT+CCLK AT^SBC AT^SBV AT^SCTM AT^SCFG Ue Set alarm time, configure Airplane mode. Set date and time of RTC. Query tatu of charger connection. Enable / diable ^SBC URC. Monitor upply voltage. Query temperature range, enable/diable URC to report critical temperature range Enable/diable parameter MEopMode/Airplane or MEopMode/Airplane/OnStart MC75_HD_V Page 43 of

44 MC75 Hardware Interface Decription 3.6 Summary of State Tranition (Except SLEEP Mode) Table 6: State tranition of MC75 (except SLEEP mode) The table how how to proceed from one mode to another (grey column = preent mode, white column = intended mode) Further mode POWER DOWN Normal mode **) Charge-only mode *) Airplane mode Preent mode POWER DOWN mode --- If AT^SCFG=MeOpMode/ Airplane/OnStart,off: IGT >400 m at low level Connect charger to VCHARGE If AT^SCFG=MeOpMode/ Airplane/OnStart,on: IGT >400 m at low level Regardle of AT^SCFG configuration: cheduled wake-up et with AT+CALA. Normal mode **) AT^SMSO --- AT^SMSO if charger i connected AT^SCFG=MeOpMode/ Airplane,on. If AT^SCFG=MeOpMode/ Airplane/OnStart,on: AT+CFUN=x,1 or EMERG_RST + IGT >400 m. Charge-only mode *) Diconnect charger If AT^SCFG=MeOpMode/ Airplane/OnStart,off: IGT >1 at low level --- AT^SCFG=MeOpMode/ Airplane,on. If AT^SCFG=MeOpMode/ Airplane/OnStart,on: IGT >1 at low level Airplane mode AT^SMSO AT^SCFG=MeOpMode/ Airplane,off *) See ection for detail on the charging mode AT^SMSO if charger i connected **) Normal mode cover TALK, DATA, GPRS, EGPRS, IDLE and SLEEP mode --- MC75_HD_V Page 44 of

45 MC75 Hardware Interface Decription 3.7 RTC Backup The internal Real Time Clock of MC75 i upplied from a eparate voltage regulator in the analog controller which i alo active when MC75 i in POWER DOWN tatu. An alarm function i provided that allow to wake up MC75 to Airplane mode without logging on to the GSM network. In addition, you can ue the VDDLP pin on the board-to-board connector to backup the RTC from an external capacitor or a battery (rechargeable or non-chargeable). The capacitor i charged by the BATT+ line of MC75. If the voltage upply at BATT+ i diconnected the RTC can be powered by the capacitor. The ize of the capacitor determine the duration of buffering when no voltage i applied to MC75, i.e. the larger the capacitor the longer MC75 will ave the date and time. A erial 1kΩ reitor placed on the board next to VDDLP limit the charge current of an empty capacitor or battery. The following figure how variou ample configuration. Pleae refer to Table 18 for the parameter required. BATT+ Baeband proceor RTC PSU 1k B2B VDDLP + Figure 9: RTC upply from capacitor BATT+ Baeband proceor RTC PSU 1k B2B VDDLP + Figure 10: RTC upply from rechargeable battery BATT+ Baeband proceor RTC PSU 1k B2B VDDLP + + Figure 11: RTC upply from non-chargeable battery MC75_HD_V Page 45 of

46 MC75 Hardware Interface Decription 3.8 SIM Interface The baeband proceor ha an integrated SIM interface compatible with the ISO 7816 IC Card tandard. Thi i wired to the hot interface (board-to-board connector) in order to be connected to an external SIM card holder. Six pin on the board-to-board connector are reerved for the SIM interface. The SIM interface upport 3V and 1.8V SIM card. Pleae refer to Table 18 for electrical pecification of the SIM interface line depending on whether a 3V or 1.8V SIM card i ued. The CCIN pin erve to detect whether a tray (with SIM card) i preent in the card holder. Uing the CCIN pin i mandatory for compliance with the GSM recommendation if the mechanical deign of the hot application allow the uer to remove the SIM card during operation. To take advantage of thi feature, an appropriate SIM card detect witch i required on the card holder. For example, thi i true for the model upplied by Molex, which ha been teted to operate with MC75 and i part of the Siemen reference equipment ubmitted for type approval. See Chapter 8 for Molex ordering number. Table 7: Signal of the SIM interface (board-to-board connector) Signal CCGND CCCLK CCVCC CCIO CCRST CCIN Decription Separate ground connection for SIM card to improve EMC. Be ure to ue thi ground line for the SIM interface rather than any other ground pin or plane on the module. A deign example for grounding the SIM interface i hown in Figure 41. Chipcard clock, variou clock rate can be et in the baeband proceor. SIM upply voltage. Serial data line, input and output. Chipcard reet, provided by baeband proceor. Input on the baeband proceor for detecting a SIM card tray in the holder. If the SIM i removed during operation the SIM interface i hut down immediately to prevent detruction of the SIM. The CCIN pin i active low. The CCIN pin i mandatory for application that allow the uer to remove the SIM card during operation. The CCIN pin i olely intended for ue with a SIM card. It mut not be ued for any other purpoe. Failure to comply with thi requirement may invalidate the type approval of MC75. The total cable length between the board-to-board connector pin on MC75 and the pin of the external SIM card holder mut not exceed 100mm in order to meet the pecification of 3GPP TS and to atify the requirement of EMC compliance. To avoid poible cro-talk from the CCCLK ignal to the CCIO ignal be careful that both line are not placed cloely next to each other. A ueful approach i uing the CCGND line to hield the CCIO line from the CCCLK line. Note: No guarantee can be given, nor any liability accepted, if lo of data i encountered after removing the SIM card during operation. Alo, no guarantee can be given for properly initializing any SIM card that the uer inert after having removed a SIM card during operation. In thi cae, the application mut retart MC75. MC75_HD_V Page 46 of

47 MC75 Hardware Interface Decription 3.9 Serial Interface ASC0 MC75 offer an 8-wire unbalanced, aynchronou modem interface ASC0 conforming to ITU-T V.24 protocol DCE ignalling. The electrical characteritic do not comply with ITU-T V.28. The ignificant level are 0V (for low data bit or active tate) and 2.9V (for high data bit or inactive tate). For electrical characteritic pleae refer to Table 18. MC75 i deigned for ue a a DCE. Baed on the convention for DCE-DTE connection it communicate with the cutomer application (DTE) uing the following ignal: Port application end data to the module TXD0 ignal line Port application receive data from the module RXD0 ignal line GSM module (DCE) Application (DTE) TXD0 RXD0 RTS0 CTS0 DTR0 DSR0 DCD0 RING0 TXD RXD RTS CTS DTR DSR DCD RING Figure 12: Serial interface ASC0 Feature Include the data line TXD0 and RXD0, the tatu line RTS0 and CTS0 and, in addition, the modem control line DTR0, DSR0, DCD0 and RING0. ASC0 i primarily deigned for controlling voice call, tranferring CSD, fax and GPRS data and for controlling the GSM engine with AT command. Full Multiplex capability allow the interface to be partitioned into three virtual channel, yet with CSD and fax ervice only available on the firt logical channel. Pleae note that when the ASC0 interface run in Multiplex mode, ASC1 cannot be ued. For more detail on Multiplex mode ee [5]. The DTR0 ignal will only be polled once per econd from the internal firmware of MC75. The RING0 ignal erve to indicate incoming call and other type of URC (Unolicited Reult Code). It can alo be ued to end pule to the hot application, for example to wake up the application from power aving tate. See [1] for detail on how to configure the RING0 line by AT^SCFG. By default, configured for 8 data bit, no parity and 1 top bit. The etting can be changed uing the AT command AT+ICF and, if required, AT^STPB. For detail ee [1]. ASC0 can be operated at bit rate from 300bp to bp. Autobauding upport the following bit rate: TBD. Autobauding i not compatible with multiplex mode. Support RTS0/CTS0 hardware flow control and XON/XOFF oftware flow control. MC75_HD_V Page 47 of

48 MC75 Hardware Interface Decription Table 8: DCE-DTE wiring of ASC0 V.24 circuit DCE DTE Pin function Signal direction Pin function Signal direction 103 TXD0 Input TXD Output 104 RXD0 Output RXD Input 105 RTS0 Input RTS Output 106 CTS0 Output CTS Input 108/2 DTR0 Input DTR Output 107 DSR0 Output DSR Input 109 DCD0 Output DCD Input 125 RING0 Output /RING Input MC75_HD_V Page 48 of

49 MC75 Hardware Interface Decription 3.10 Serial Interface ASC1 MC75 offer a 4-wire unbalanced, aynchronou modem interface ASC1 conforming to ITU- T V.24 protocol DCE ignalling. The electrical characteritic do not comply with ITU-T V.28. The ignificant level are 0V (for low data bit or active tate) and 2.9V (for high data bit or inactive tate). For electrical characteritic pleae refer to Table 18. MC75 i deigned for ue a a DCE. Baed on the convention for DCE-DTE connection it communicate with the cutomer application (DTE) uing the following ignal: Port application end data to module TXD1 ignal line Port application receive data from the module RXD1 ignal line GSM module (DCE) Application (DTE) TXD1 RXD1 RTS1 CTS1 TXD RXD RTS CTS Figure 13: Serial interface ASC1 Feature Include only the data line TXD1 and RXD1 plu RTS1 and CTS1 for hardware handhake. On ASC1 no RING line i available. The indication of URC on the econd interface depend on the etting made with the AT^SCFG command. For detail refer to [1]. Configured for 8 data bit, no parity and 1 or 2 top bit. ASC1 can be operated at bit rate from 300bp to bp. Autobauding TBD. Support RTS1/CTS1 hardware flow control and XON/XOFF oftware flow control. Table 9: DCE-DTE wiring of ASC1 V.24 circuit DCE DTE Pin function Signal direction Pin function Signal direction 103 TXD1 Input TXD Output 104 RXD1 Output RXD Input 105 RTS1 Input RTS Output 106 CTS1 Output CTS Input MC75_HD_V Page 49 of

50 MC75 Hardware Interface Decription 3.11 USB Interface MC75 upport a USB 2.0 Full Speed (12Mbit/) device interface. It i primarily intended for ue a command and data interface and for downloading firmware. The USB I/O-pin are capable of driving the ignal at min 3.0V. They are 5V I/O compliant. To properly connect the module USB interface to the hot a USB 2.0 compatible connector i required. Furthermore, the USB modem driver delivered with MC75 mut be intalled a decribed below. The USB hot i reponible for upplying, acro the VUSB_IN line, power to the module USB interface, but not to other MC75 interface. Thi i becaue MC75 i deigned a a elfpowered device compliant with the Univeral Serial Bu Specification Reviion MCU USB Tranceiver 3V lin. Regulator PSU 5V 1.5kOhm 22Ohm 22Ohm VUSB_IN USB_DP USB_DN 80 pole board-to-board connector VBUS GND D+ D- Hot Baeband controller GSM module Figure 14: USB circuit 1 The pecification i ready for download on MC75_HD_V Page 50 of

51 MC75 Hardware Interface Decription Intalling the USB Modem Driver Thi ection aume you are familiar with intalling and configuring a modem under Window 2000 and Window XP. A both operating ytem ue multiple method to acce modem etting thi ection provide only a brief ummary of the mot important tep. Take care that the ubmodem.inf file delivered with MC75 i at hand. Connect the USB cable to the MC75 hot application (for example the evaluation board DSB75) and the PC. Window detect MC75 a a new USB modem, open the Found New Hardware Wizard and report that it i earching for the Siemen AG WM USB Modem driver. Follow the intruction on the creen and pecify the path where the ubmodem.inf file i located. Window will copy the required oftware to your computer and configure the modem by aigning a free COM port. If you are already uing more than one COM port then the next free one will be allocated. Click Finih to complete the intallation. Note for Window 2000 only: During the intallation procedure you will be prompted for the uber.y driver. Make ure the file i preent before you tart intalling the above inf file. The uber.y file i not delivered a a ingle file, but mut be extracted from a Window 2000 cabinet file. Thi i either the file driver.cab located in the I386 folder of the original Window 2000 CD or a later cabinet file inide the Service Pack. SP4 for example include the p4.cab file which can be found in it I386 folder. The uber.y driver from the Service Pack ha priority over one provided with the tandard Window 2000 intall CD. It i neceary to retart Window 2000 to make the change take effect. MC75_HD_V Page 51 of

52 MC75 Hardware Interface Decription You can find the Siemen AG WM USB Modem lited under Control Panel Phone and Modem Option Modem. Troublehooting for intallation problem If Window fail to aign the next free COM port to MC75 and, for example, allocate a COM port already ued by another modem you can manually elect a free port a follow: Open the Window Device Manager, elect the intalled Siemen AG WM USB Modem, click Propertie, elect the Advanced tab and click Advanced Port etting. From the litbox COM Port Number chooe a free port. To make the change take effect diconnect and reconnect the USB cable. If not yet ucceful, alo retart Window. MC75_HD_V Page 52 of

53 MC75 Hardware Interface Decription 3.12 I 2 C Interface I 2 C i a erial, 8-bit oriented data tranfer bu for bit rate up to 400kbp in Fat mode. It conit of two line, the erial data line I2CDAT and the erial clock line I2CCLK. The MC75 module act a a ingle mater device, e.g. the clock I2CCLK i driven by module. I2CDAT i a bi-directional line. Each device connected to the bu i oftware addreable by a unique 7-bit addre, and imple mater/lave relationhip exit at all time. The module operate a matertranmitter or a mater-receiver. The cutomer application tranmit or receive data only on requet of the module. To configure and activate the I 2 C interface ue the AT^SSPI command decribed in [1]. To configure and activate the I 2 C bu ue the AT^SSPI command. Detailed information on the AT^SSPI command a well explanation on the protocol and yntax required for data tranmiion can be found in [1]. The I 2 C interface can be powered from an external upply or via the VEXT line of MC75. If connected to the VEXT line the I 2 C interface will be properly hut down when the module enter the Power-down mode. If you prefer to connect the I 2 C interface to an external power upply, take care that VCC of the application i in the range of V VEXT and that the interface i hut down when the PWR_IND ignal goe high. See figure below a well a Section 7 and Figure 41. In the application I2CDAT and I2CCLK line need to be connected to a poitive upply voltage via a pull-up reitor. For electrical characteritic pleae refer to Table 18. GSM module Application VCC w VEXT R p R p I2CDAT I2CCLK GND I2CDAT I2CCLK GND Figure 15: I 2 C interface connected to VCC of application MC75_HD_V Page 53 of

54 MC75 Hardware Interface Decription GSM module Application VEXT R p R p I2CDAT I2CCLK GND I2CDAT I2CCLK GND Figure 16: I 2 C interface connected to VEXT line of MC75 Note: Good care hould be taken when creating the PCB layout of the hot application: The trace of I2CCLK and I2CDAT hould be equal in length and a hort a poible. MC75_HD_V Page 54 of

55 MC75 Hardware Interface Decription 3.13 SD Memory Card Interface The SD card interface i compliant with the SD Memory Card Specification / Part 1 Phyical Layer Specification, Verion The interface upport the following feature: Data rate up to 3250kByte/. The read/write data rate depend on the clock rate. SD card inertion detection (at SD_D3-line) or via SD_DET line a option (CD witch in SD card holder required) Write protect detection via SD_WP line i optional (WP witch in SD card holder required) Maximum capacity of SD card compliant with the above SD Memory Card Specification i 4GByte. The SD memory card interface can be powered from an external upply or via the VEXT line of MC75. If connected to the VEXT line the SD memory card interface will be properly hut down when the module enter the Power-down mode. If you prefer to connect the SD card interface to an external power upply, take care that the interface i hut down when the PWR_IND ignal goe high. See alo Section 7 and Figure 41. Note: No guarantee can be given, nor any liability accepted, if lo of data i encountered after removing the SD memory card during operation. Table 10: SD card interface Signal I/O Decription Remark SD_D0 I/O 4 bit data bu --- SD_D1 I/O --- SD_D2 I/O --- SD_D3 I/O SD_CMD O Command / Repone Card detect at power on: 0 or open = Card removed 1 or 50k pull-up = Card inerted Note: Thi i no removal detection during card operation! SD_CLK O Clock 25.4kHz 13MHz Clock rie and fall time: max. 10n SD_WP I Write protect detection 0= unlocked 1= locked (External pull-up reitor required) SD_DET I Card detection (optional) 0= card inerted 1= card removed Power upply from external ource or from VEXT line Required power upply: min. 2.7V, max. 3.6V. Note: Good care hould be taken when creating the PCB layout of the hot application: The trace of SD_CLK, SD_CMD, and SD_D(0..3) hould be equal in length and a hort a poible. MC75_HD_V Page 55 of

56 MC75 Hardware Interface Decription SD_WP Baeband controller SD_DET SD_D1 SD_D0 SD_CLK VEXT SD_CMD SD_D3 SD_D2 80 pole board-to-board connector 47k Card detect unlock lock DAT1 DAT0 GND 1) CLK VDD GND 50k CMD CD/DAT3 DAT2 SD card Write protect lide Analog controller SD card holder GSM module 1) Internal witch i cloed after power-up and open during regular data tranfer. Ued for card detection. Figure 17: SD card interface (example with power upply from module VEXT line) MC75_HD_V Page 56 of

57 MC75 Hardware Interface Decription 3.14 Audio Interface MC75 comprie three audio interface available on the board-to-board connector: Two analog audio interface, both with balanced or ingle-ended input/output. Serial digital audio interface (DAI) deigned for PCM (Pule Code Modulation). Thi mean you can connect up to three different audio device, although only one interface can be operated at a time. Uing the AT^SAIC command you can eaily witch back and forth. MICP1 MICN1 MICP2 MUX MUX MUX A D MICN2 EPP1 VMIC EPN1 EPP2 EPN2 Analog witch D A DSP Air Interface AGND USC0 USC1 USC2 USC3 USC4 USC5 USC6 Digital Audio Interface Figure 18: Audio block diagram To uit different type of acceorie the audio interface can be configured for different audio mode via the AT^SNFS command. The electrical characteritic of the voiceband part vary with the audio mode. For example, ending and receiving amplification, idetone path, noie uppreion etc. depend on the elected mode and can be altered with AT command (except for mode 1). Both analog audio interface can be ued to connect headet with microphone or peakerphone. Headet can be operated in audio mode 3, peakerphone in audio mode 2. Audio mode 5 can be ued for a peech coder without ignal pre or pot proceing. When hipped from factory, all audio parameter of MC75 are et to interface 1 and audio mode 1. Thi i the default configuration optimized for the Votronic HH-SI-30.3/V1.1/0 handet and ued for type approving the Siemen reference configuration. Audio mode 1 ha fix parameter which cannot be modified. To adjut the etting of the Votronic handet imply change to another audio mode. MC75_HD_V Page 57 of

58 MC75 Hardware Interface Decription Speech Proceing The peech ample from the ADC or DAI are handled by the DSP of the baeband controller to calculate e.g. amplification, idetone, echo cancellation or noie uppreion depending on the configuration of the active audio mode. Thee proceed ample are paed to the peech encoder. Received ample from the peech decoder are paed to the DAC or DAI after pot proceing (frequency repone correction, adding idetone etc.). Full rate, half rate, enhanced full rate, adaptive multi rate (AMR), peech and channel encoding including voice activity detection (VAD) and dicontinuou tranmiion (DTX) and digital GMSK modulation are alo performed on the GSM baeband proceor Microphone Circuit MC75 ha two identical analog microphone input. There i no on-board microphone upply circuit, except for the internal voltage upply VMIC and the dedicated audio ground line AGND. Both line are well uited to feed a balanced audio application or a ingle-ended audio application. The AGND line on the MC75 board i epecially provided to achieve bet grounding condition for your audio application. A there i le current flowing than through other GND line of the module or the application, thi olution will avoid hum and buzz problem Single-ended Microphone Input Figure 19 a well a Figure 41 how an example of how to integrate a ingle-ended microphone input. R VMIC VMIC R A = typ. 2k R B = typ. 5k R VMIC = typ. 470Ohm R A R A MICPx C k = typ. 100nF C F = typ. 22µF V Bia C F MICNx GSM module V MIC = typ. 2.5V V bia = 1.0V 1.6V, typ. 1.5V R B C K AGND Figure 19: Single ended microphone input R A ha to be choen o that the DC voltage acro the microphone fall into the bia voltage range of 1.0V to 1.6V and the microphone feeding current meet it pecification. The MICNx input i automatically elf biaed to the MICPx DC level. It i AC coupled via C K to a reitive divider which i ued to optimize upply noie cancellation by the differential microphone amplifier in the module. MC75_HD_V Page 58 of

59 MC75 Hardware Interface Decription The VMIC voltage hould be filtered if gain larger than 20dB are ued. The filter can be attached a a imple firt order RC-network (R VMIC and C F ). Thi circuit i well uited if the ditance between microphone and module i kept hort. Due to good grounding the microphone can be eaily ESD protected a it houing uually connect to the negative terminal Differential Microphone Input Figure 20 how a differential olution for connecting an electret microphone. R A R VMIC VMIC MICPx R A = typ. 1k R VMIC = 470Ohm C K = typ. 100nF C F = typ. 22µF V MIC = typ. 2.5V C F GSM module V bia = 1.0V 1.6V, typ. 1.5V MICNx V Bia R A C K AGND Figure 20: Differential microphone input The reulting DC voltage between MICPx and AGND hould be in the range of 1.0V to 1.6V to bia the input amplifier. MICNx i automatically elf biaed to the MICPx DC level. The reulting AC differential voltage i then amplified in the GSM module. The VMIC voltage hould be filtered if gain larger than 20dB are ued. The filter can be attached a a imple firt order RC-network (R VMIC and C F ). The advantage of thi circuit i that it can be ued if the application involve longer line between microphone and module. MC75_HD_V Page 59 of

60 MC75 Hardware Interface Decription Line Input Configuration with OpAmp Figure 21 how an example of how to connect an opamp into the microphone circuit. VMIC R A = typ. 47k R VMIC = 470Ohm ~ C K C K R A R A R VMIC MICPx MICNx GSM module C k = typ. 100nF C F = typ. 22µF V MIC = typ. 2.5V V bia = typ. ½ V MIC = 1.25V V Bia C F AGND Figure 21: Line input configuration with OpAmp The AC ource (e.g. an opamp) and it reference potential have to be AC coupled to the MICPx rep. MICNx input terminal. The voltage divider between VMIC and AGND i neceary to bia the input amplifier. MICNx i automatically elf biaed to the MICPx DC level. The VMIC voltage hould be filtered if gain larger than 20dB are ued. The filter can be attached a a imple firt order RC-network (R VMIC and C F ). If a high input level and a lower gain are applied the filter i not neceary. If deired, MICNx via C K can alo be connected to the invere output of the AC ource intead of connecting it to the reference potential for differential line input. MC75_HD_V Page 60 of

61 MC75 Hardware Interface Decription Loudpeaker Circuit The GSM module comprie two analog peaker output: EP1 and EP2. Output EP1 i able to drive a load of 8Ohm while the output EP2 can drive a load of 32Ohm. Each interface can be connected in differential and in ingle ended configuration. See example in Figure 22 and Figure 23. Loudpeaker impedance EPP1/EPN1 Z L = typ. 8Ohm EPPx EPP2/EPN2 Z L = typ. 32Ohm GSM module EPNx AGND Figure 22: Differential loudpeaker configuration GSM module EPPx Loudpeaker impedance EPP1/EPN1 Z L = typ. 8Ohm C k = 220µF EPP2/EPN2 Z L = typ. 32Ohm C k = 47µF EPNx + AGND C k Figure 23: Single ended loudpeaker configuration MC75_HD_V Page 61 of

62 MC75 Hardware Interface Decription Digital Audio Interface DAI The DAI can be ued to connect audio device capable of PCM (Pule Code Modulation), for example a codec. Table 11: Overview of DAI pin function Signal name on B2B connector Function for PCM Interface DAI0 TXDAI O DAI1 RXDAI I DAI2 FS (Frame ync) O DAI3 BITCLK O DAI4 nc I DAI5 nc I DAI6 nc I Input/Output To clock input and output PCM ample the PCM interface deliver a bit clock (BITCLK) which i ynchronou to the GSM ytem clock. The frequency of the bit clock i 128±1kHz. The frame ync ignal (FS) ha a frequency of 8kHz and i high for one BITCLK period. The PCM interface i mater for the bit clock and the frame ync ignal. PCM interface of the GSM module BITCLK FS TXDAI RXDAI Codec bitclk frame ync RX_data TX_data Figure 24: PCM interface application MC75_HD_V Page 62 of

63 MC75 Hardware Interface Decription The timing of a PCM hort frame i hown in Figure 25. In PCM mode, 16-bit data are tranferred in both direction at the ame time. The duration of a frame ync pule i one BITCLK period, tarting at the riing edge of BITCLK. TXDAI data i hifted out at the next riing edge of BITCLK. The mot ignificant bit i tranferred firt. Data tranmitted from RXDAI of the internal application i ampled at the falling edge of BITCLK. 125µ BITCLK FS TXDAI 1 LSB MSB LSB MSB 14 RXDAI 1 LSB MSB LSB MSB 14 Figure 25: PCM timing MC75_HD_V Page 63 of

64 MC75 Hardware Interface Decription 3.15 Control Signal Synchronization Signal The ynchronization ignal erve to indicate growing power conumption during the tranmit burt. The ignal i generated by the SYNC pin. Pleae note that thi pin can adopt three different operating mode which you can elect by uing the AT^SSYNC command: the mode AT^SSYNC=0 decribed below, and the two LED mode AT^SSYNC=1 or AT^SSYNC=2 decribed in [1] and Section The firt function (factory default AT^SSYNC=0) i recommended if you want your application to ue the ynchronization ignal for better power upply control. Your platform deign mut be uch that the incoming ignal accommodate ufficient power upply to the MC75 module if required. Thi can be achieved by lowering the current drawn from other component intalled in your application. The timing of the ynchronization ignal i hown below. High level of the SYNC pin indicate increaed power conumption during tranmiion. 1 Tx 577 µ every m 2 Tx 1154 µ every m Tranmit burt SYNC ignal *) t = 180µ Figure 26: SYNC ignal during tranmit burt *) The duration of the SYNC ignal i alway equal, no matter whether the traffic or the acce burt are active. MC75_HD_V Page 64 of

65 MC75 Hardware Interface Decription Uing the SYNC Pin to Control a Statu LED A an alternative to generating the ynchronization ignal, the SYNC pin can be configured to drive a tatu LED that indicate different operating mode of the MC75 module. To take advantage of thi function the LED mode mut be activated with the AT^SSYNC command and the LED mut be connected to the hot application. The connected LED can be operated in two different diplay mode (AT^SSYNC=1 or AT^SSYNC=2). For detail pleae refer to [1]. Epecially in the development and tet phae of an application, ytem integrator are advied to ue the LED mode of the SYNC pin in order to evaluate their product deign and identify the ource of error. To operate the LED a buffer, e.g. a tranitor or gate, mut be included in your application. A ample circuit i hown in Figure 27. Power conumption in the LED mode i the ame a for the ynchronization ignal mode. For detail ee Table 18, SYNC pin. Figure 27: LED Circuit (Example) MC75_HD_V Page 65 of

66 MC75 Hardware Interface Decription Behavior of the /RING0 Line (ASC0 Interface only) The /RING0 line i available on the firt erial interface ASC0 (ee alo Chapter 3.9). The ignal erve to indicate incoming call and other type of URC (Unolicited Reult Code). Although not mandatory for ue in a hot application, it i trongly uggeted that you connect the /RING0 line to an interrupt line of your application. In thi cae, the application can be deigned to receive an interrupt when a falling edge on /RING0 occur. Thi olution i mot effective, particularly, for waking up an application from power aving. Note that if the /RING0 line i not wired, the application would be required to permanently poll the data and tatu line of the erial interface at the expene of a higher current conumption. Therefore, utilizing the /RING0 line provide an option to ignificantly reduce the overall current conumption of your application. The behavior of the /RING0 line varie with the type of event: When a voice/fax/data call come in the /RING0 line goe low for 1 and high for another 4. Every 5 econd the ring tring i generated and ent over the /RXD0 line. If there i a call in progre and call waiting i activated for a connected handet or handfree device, the /RING0 line witche to ground in order to generate acoutic ignal that indicate the waiting call. /RING Ring Ring Ring tring tring tring Figure 28: Incoming voice/fax/data call All other type of Unolicited Reult Code (URC) alo caue the /RING0 line to go low, however for 1 econd only. /RING0 Figure 29: URC tranmiion 1 URC PWR_IND Signal PWR_IND notifie the on/off tate of the module. High tate of PWR_IND indicate that the module i witched off. The tate of PWR_IND immediately change to low when IGT i pulled low. For tate detection an external pull-up reitor i required. MC75_HD_V Page 66 of

67 MC75 Hardware Interface Decription 4 Antenna Interface The RF interface ha an impedance of 50Ω. MC75 i capable of utaining a total mimatch at the antenna connector or pad without any damage, even when tranmitting at maximum RF power. The external antenna mut be matched properly to achieve bet performance regarding radiated power, DC-power conumption, modulation accuracy and harmonic uppreion. Antenna matching network are not included on the MC75 PCB and hould be placed in the hot application. Regarding the return lo MC75 provide the following value in the active band: Table 12: Return lo in the active band State of module Return lo of module Recommended return lo of application Receive > 8dB > 12dB Tranmit not applicable > 12dB The connection of the antenna or other equipment mut be decoupled from DC voltage. Thi i neceary becaue the antenna connector i DC coupled to ground via an inductor for ESD protection. 4.1 Antenna Intallation To uit the phyical deign of individual application MC75 offer two alternative approache to connecting the antenna: Recommended approach: U.FL-R-SMT antenna connector from Hiroe aembled on the component ide of the PCB (top view on MC75). See Section 4.3 for detail. Antenna pad and grounding plane placed on the bottom ide. See Section 4.2. The U.FL-R-SMT connector ha been choen a antenna reference point (ARP) for the Siemen reference equipment ubmitted to type approve MC75. All RF data pecified throughout thi manual are related to the ARP. For compliance with the tet reult of the Siemen type approval you are advied to give priority to the connector, rather than uing the antenna pad. IMPORTANT: Both olution can only be applied alternatively. Thi mean, whenever an antenna i plugged to the Hiroe connector, the pad mut not be ued. Vice vera, if the antenna i connected to the pad, then the Hiroe connector mut be left empty. MC75_HD_V Page 67 of

68 MC75 Hardware Interface Decription Antenna connected to Hiroe connector: Antenna connected to pad: Module PAD U.FL Antenna or meaurement equipment Module PAD U.FL 50Ohm 50Ohm 50Ohm Z Z Antenna 50Ohm Figure 30: Never ue antenna connector and antenna pad at the ame time No matter which option you chooe, enure that the antenna pad doe not come into contact with the holding device or any other component of the hot application. It need to be urrounded by a retricted area filled with air, which mut alo be reerved 0.8mm in height. U.FL antenna connector PCB RF ection Antenna pad Retricted area Figure 31: Retricted area around antenna pad MC75_HD_V Page 68 of

69 MC75 Hardware Interface Decription 4.2 Antenna Pad The antenna can be oldered to the pad, or attached via contact pring. For proper grounding connect the antenna to the ground plane on the bottom of MC75 which mut be connected to the ground plane of the application. When you decide to ue the antenna pad take into account that the pad ha not been intended a antenna reference point (ARP) for the Siemen MC75 type approval. The antenna pad i provided only a an alternative option which can be ued, for example, if the recommended Hiroe connection doe not fit into your antenna deign. Alo, conider that according to the GSM recommendation TS and TS a 50Ω connector i mandatory for type approval meaurement. Thi require GSM device with an integral antenna to be temporarily equipped with a uitable connector or a low lo RF cable with adapter. Note on oldering: To prevent damage to the module and to obtain long-term older joint propertie you are advied to maintain the tandard of good engineering practice for oldering. Be ure to older the antenna core to the pad and the hielding of the coax cable to the ground plane of the module next to the antenna pad. The direction of the cable i not relevant from the electrical point of view. MC75 material propertie: MC75 PCB: FR4 Antenna pad: Gold plated pad Suitable Cable Type For direct older attachment, we ugget to ue the following cable type: RG316/U 50Ohm coaxial cable 1671A 50Ohm coaxial cable Suitable cable are offered, for example, by IMS Connector Sytem. For further detail and other cable type pleae contact MC75_HD_V Page 69 of

70 MC75 Hardware Interface Decription 4.3 Antenna Connector MC75 ue an ultra-miniature SMT antenna connector upplied from Hiroe Ltd. The product name i: U.FL-R-SMT The poition of the antenna connector on the MC75 board can be een in Figure 38. Figure 32: Mechanical dimenion of U.FL-R-SMT connector Table 13: Product pecification of U.FL-R-SMT connector Item Specification Condition Rating Nominal impedance Rated frequency Mechanical characteritic Female contact holding force Repetitive operation Vibration Shock Environmental characteritic Humidity reitance Temperature cycle 50Ω DC to 3GHz Operating temp:-40 C to + 90 C Operating humidity: max. 90% 0.15N min Meaured with a pin gauge Contact reitance: Center 25mΩ Outide 15mΩ No momentary diconnection of 1µ; No damage, crack and looene of part No momentary diconnection of 1µ. No damage, crack and looene of part. No damage, crack and looene of part. Inulation reitance: 100MΩ min. at high humidity 500MΩ min. when dry No damage, crack and looene of part. Contact reitance: Center 25mΩ Outide 15mΩ 30 cycle of inertion and diengagement Frequency of 10 to 100Hz, ingle amplitude of 1.5mm, acceleration of 59m/ 2, for 5 cycle in the direction of each of the 3 axe Acceleration of 735m/ 2, 11m duration for 6 cycle in the direction of each of the 3 axe Expoure to 40 C, humidity of 95% for a total of 96 hour Temperature: +40 C 5 to 35 C +90 C 5 to 35 C Time: 30min within 5min 30min within 5min Salt pray tet No exceive corroion 48 hour continuou expoure to 5% alt water MC75_HD_V Page 70 of

71 MC75 Hardware Interface Decription Table 14: Material and finih of U.FL-R-SMT connector and recommended plug Part Material Finih Shell Phophor bronze Silver plating Male center contact Bra Gold plating Female center contact Phophor bronze Gold plating Inulator Plug: PBT Receptacle: LCP Black Beige Mating plug and cable can be choen from the Hiroe U.FL Serie. Example are hown below and lited in Table 15. For latet product information pleae contact your Hiroe dealer or viit the Hiroe home page, for example Figure 33: U.FL-R-SMT connector with U.FL-LP-040 plug Figure 34: U.FL-R-SMT connector with U.FL-LP-066 plug MC75_HD_V Page 71 of

72 MC75 Hardware Interface Decription In addition to the connector illutrated above, the U.FL-LP-(V)-040(01) verion i offered a an extremely pace aving olution. Thi plug i intended for ue with extra fine cable (up to 0.81mm) and minimize the mating height to 2mm. See Figure 35 which how the Hiroe dataheet. Figure 35: Specification of U.FL-LP-(V)-040(01) plug MC75_HD_V Page 72 of

73 MC75 Hardware Interface Decription Table 15: Ordering information for Hiroe U.FL Serie Item Part number HRS number Connector on MC75 U.FL-R-SMT CL Right-angle plug hell for 0.81mm cable Right-angle plug for 0.81mm cable Right-angle plug for 1.13mm cable Right-angle plug for 1.32mm cable U.FL-LP-040 U.FL-LP(V)-040 (01) U.FL-LP-068 U.FL-LP-066 CL CL CL CL Extraction jig E.FL-LP-N CL MC75_HD_V Page 73 of

74 MC75 Hardware Interface Decription 5 Electrical, Reliability and Radio Characteritic 5.1 Abolute Maximum Rating The abolute maximum rating tated in Table 16 are tre rating under non-operating condition. Stree beyond any of thee limit will caue permanent damage to MC75. Table 16: Abolute maximum rating under non-operating condition Parameter Min Max Unit Supply voltage BATT V Voltage at digital pin V Voltage at analog pin V Voltage at VCHARGE pin V Voltage at CHARGEGATE pin V VUSB_IN V VSENSE 5.5 V ISENSE 5.5 V 5.2 Operating Temperature Tet condition were pecified in accordance with IEC (till air). The value tated below are in compliance with GSM recommendation TS Table 17: Operating temperature Parameter Min Typ Max Unit Ambient temperature (according to GSM 11.10) *) C Automatic hutdown MC75 board temperature Battery temperature Ambient temperature for charging (oftware controlled fat charging) *) +60 C C Due to temperature meaurement uncertainty, a tolerance on thee witching off threhold may occur. The poible deviation i in a range of: ± 3 C at the overtemperature limit ± 5 C at the undertemperature limit *) On MC75 the automatic overtemperature hutdown threhold i et to 90 C board temperature. Thi prevent permanent damage to component on the board. Conider the ratio of output power, upply voltage and operating temperature: to achieve T amb max = 65 C in GPRS Cla 8 (GSM900/ GSM850) with 2W RF power the upply voltage mut not be higher than 4.2V. MC75_HD_V Page 74 of

75 MC75 Hardware Interface Decription 5.3 Pin Aignment and Signal Decription The Molex board-to-board connector on MC75 i an 80-pin double-row receptacle. The name and the poition of the pin can be een from Figure 1 which how the top view of MC75. 1 GND GND 80 2 nc Do not ue 79 3 nc PWR_IND 78 4 GND Do not ue 77 5 Do not ue Do not ue 76 6 SD_WP Do not ue 75 7 Do not ue SD_D SD_DETECT SD_D SD_CMD SD_D SD_CLK SD_D I2CCLK I2CDAT VUSB_IN USB_DP DAI5 USB_DN ISENSE VSENSE DAI6 VMIC CCCLK EPN CCVCC EPP CCIO EPP CCRST EPN CCIN MICN CCGND MICP DAI4 MICP DAI3 MICN DAI2 AGND DAI1 IGT DAI0 EMERG_RST BATT_TEMP DCD SYNC CTS RXD1 CTS RXD0 RTS TXD1 DTR TXD0 RTS VDDLP DSR VCHARGE RING CHARGEGATE VEXT GND BATT GND BATT GND BATT GND BATT GND BATT+ 41 Figure 36: Pin aignment (component ide of MC75) MC75_HD_V Page 75 of

76 MC75 Hardware Interface Decription Pleae note that the reference voltage lited in Table 18 are the value meaured directly on the MC75 module. They do not apply to the acceorie connected. Table 18: Signal decription Function Signal name IO Signal form and level Comment Power upply BATT+ I V I max = 4.3V V I typ = 3.8V V I min = 3.2V during Tx burt on board I 2A, during Tx burt n Tx = n x 577µ peak current every 4.616m Five pin of BATT+ and GND mut be connected in parallel for upply purpoe becaue higher peak current may occur. Minimum voltage mut not fall below 3.2V including drop, ripple, pike. Power upply Charge Interface External upply voltage GND Ground Application Ground VCHARGE BATT_TEMP ISENSE VSENSE CHARGEGATE VEXT I I I I O O V I min = * V BATT+ V I max = 5.45V Connect NTC with R NTC 25 C to ground. See Section for B value of NTC. V I max = 4.65V V I max to V BATT+ = +0.3V at normal condition V I max = 4.5V V O max = 5.5V I O max = 1mA Normal mode: V O min = 2.75V V O typ = 2.93V V O max = 3.05V I O max = -50mA Thi line ignalize to the proceor that the charger i connected. If unued keep pin open. Battery temperature meaurement via NTC reitance. NTC hould be intalled inide or near battery pack to enable proper charging and deliver temperature value. If unued keep pin open. ISENSE i required for meauring the charge current. For thi purpoe, a hunt reitor for current meaurement need to be connected between ISENSE and VSENSE. If unued connect pin to VSENSE. VSENSE mut be directly connected to BATT+ at battery connector or external power upply. Control line to the gate of charge FET If unued keep pin open. VEXT may be ued for application circuit, for example to upply power for an SD card. If unued keep pin open. Not available in Power-down mode. The external digital logic mut not caue any pike or glitche on voltage VEXT. MC75_HD_V Page 76 of

77 MC75 Hardware Interface Decription Function Signal name IO Signal form and level Comment Power indicator PWR_IND O V IH max = 10V V OL max = 0.4V at Imax = 2mA PWR_IND (Power Indicator) notifie the module on/off tate. PWR_IND i an open collector that need to be connected to an external pullup reitor. Low tate of the open collector indicate that the module i on. Vice vera, high level notifie the Powerdown mode. Therefore, the pin may be ued to enable external voltage regulator which upply an external logic for communication with the module, e.g. level converter. Ignition IGT I R I 30kΩ, C I 10nF V IL max = 0.8V at Imax = -150µA V OH max = 4.5V (V BATT+ ) ON ~~~ ~~~ Active Low 400m Thi ignal witche the mobile on. Thi line mut be driven low by an open drain or open collector driver. Emergency reet Synchronization EMERG_RST I R I 5kΩ V IL max = 0.2V at Imax = -0.5mA V OH min = 1.75V V OH max = 3.05V SYNC O Signal ~~~ ~~~ Pull down 10m V OL max = 0.3V at I = 0.1mA V OH min = 2.3V at I = -0.1mA V OH max = 0.05V n Tx = n x 577µ impule each 4.616m, with µ forward time. RTC backup VDDLP I/O R I 1kΩ V O max = 4.5V V BATT+ = 4.3V: V O = 3.2V at I O = -500µA V BATT+ = 0V: V I = 2.7V 4.5V at I max = 15µA Reet or turn-off in cae of emergency: Pull down and releae EMERG_RST. Then, activating IGT for 400m will reet MC75. If IGT i not activated for 400m, MC75 witche off. Data tored in the volatile memory will be lot. For orderly oftware controlled reet rather ue the AT+CFUN command (e.g. AT+CFUN=,1). Thi line mut be driven by open drain or open collector. If unued keep pin open. There are two alternative option for uing the SYNC pin: a) Indicating increaed current conumption during uplink tranmiion burt. Note that the timing of the ignal i different during handover. b) Driving a tatu LED to indicate different operating mode of MC75. The LED mut be intalled in the hot application. If unued keep pin open. If unued keep pin open. MC75_HD_V Page 77 of

78 MC75 Hardware Interface Decription Function Signal name IO Signal form and level Comment SIM interface pecified for ue with 3V SIM card SIM interface pecified for ue with 1.8V SIM card ASC0 Serial interface CCIN I R I 100kΩ V IL max = 0.6V at I = -25µA V IH min = 2.1V at I = -10µA V O max= 3.05V CCRST O R O 47Ω V OL max = 0.25V at I = +1mA V OH min = 2.5V at I = -0.5mA V OH max = 2.95V CCIO I/O R I 4.7kΩ V IL max = 0.75V V IL min = -0.3V V IH min = 2.1V V IH max = CCVCCmin + 0.3V = 3.05V R O 100Ω V OL max = 0.3V at I = +1mA V OH min = 2.5V at I = -0.5mA V OH max = 2.95V CCCLK O R O 100Ω V OL max = 0.3V at I = +1mA V OH min = 2.5V at I = -0.5mA V OH max = 2.95V CCVCC O V O min = 2.75V V O typ = 2.85V V O max = 2.95V I O max = -20mA CCGND Ground CCIN I R I 100kΩ V IL max = 0.6V at I = -25µA V IH min = 2.1V at I = -10µA V O max= 3.05V CCRST O R O 47Ω V OL max = 0.25V at I = +1mA V OH min = 1.45V at I = -0.5mA V OH max = 1.90V CCIO I/O R I 4.7kΩ V IL max = 0.45V V IH min = 1.35V V IH max = CCVCCmin + 0.3V = 2.00V R O 100Ω V OL max = 0.3V at I = +1mA V OH min = 1.45V at I = -0.5mA V OH max = 1.90V CCCLK O R O 100Ω V OL max = 0.3V at I = +1mA V OH min = 1.45V at I = -0.5mA V OH max = 1.90V CCVCC O V O min = 1.70V, V O typ = 1.80V V O max = 1.90V I O max = -20mA CCGND RXD0 TXD0 CTS0 RTS0 DTR0 DCD0 DSR0 RING0 O I O I I O O O Ground V OL max = 0.2V at I = 2mA V OH min = 2.55V at I = -0.5mA V OH max = 3.05V V IL max = 0.8V V IH min = 2.0V V IH max = VEXTmin + 0.3V = 3.05V CCIN = Low, SIM card holder cloed Maximum cable length or copper track 100mm to SIM card holder. All ignal of SIM interface are protected againt ESD with a pecial diode array. Uage of CCGND i mandatory. CCIN = Low, SIM card holder cloed Maximum cable length or copper track 100mm to SIM card holder. All ignal of SIM interface are protected againt ESD with a pecial diode array. Uage of CCGND i mandatory. Serial interface for AT command or data tream. If line are unued keep pin open. MC75_HD_V Page 78 of

79 MC75 Hardware Interface Decription Function Signal name IO Signal form and level Comment ASC1 RXD1 O V OL max = 0.2V at I = 2mA Serial TXD1 I V OH min = 2.55V at I = -0.5mA interface V OH max = 3.05V CTS1 O RTS1 I V IL max = 0.8V V IH min = 2.0V V IH max = VEXTmin + 0.3V = 3.05V Serial interface for AT command or data tream. If line are unued keep pin open. I 2 C interface USB I2CCLK O V OL max = 0.2V at I = 2mA V OH min = 2.55V at I = -0.5mA V OH max = 3.05V I2CDAT I/O V OL max = 0.2V at I = 2mA V IL max = 0.8V V IH min = 2.0V V IH max = VEXTmin + 0.3V = 3.05V VUSB_IN I V IN min = 4.0V V IN max = 5.25V USB_DN USB_DP I/O I/O Differential Output Croover voltage Range V CRS min = 1.5V, V CRS max = 2.0V I2CDAT i configured a Open Drain and need a pullup reitor in the hot application. According to the I2C Bu Specification Verion 2.1 for the fat mode a rie time of max. 300n i permitted. There i alo a maximum V OL =0.4V at 3mA pecified. The value of the pull-up depend on the capacitive load of the whole ytem (I2C Slave + line). The maximum ink current of I2CDAT and I2CCLK i 4mA. If line are unued keep pin open. If line are unued keep pin open. Driver Output Reitance Z DRV typ = 32Ohm SD card interface SD_D0 SD_D1 SD_D2 SD_D3 SD_CLK SD_WP I/O O I V OL max = 0.2V at I = 2mA V OH min = 2.55V at I = -0.5mA V OH max = 3.05V V IL max = 0.8V V IH min = 2.0V V IH max = VEXTmin + 0.3V = 3.05V SD card interface can be connected to VEXT of MC75 or to external power upply. Rie and fall time of SD_CLK ignal: max. 10n. If line are unued keep pin open. SD_CMD O SD_DETECT I Digital Audio interface DAI0 DAI1 DAI2 O I O V OL max = 0.2V at I = 2mA V OH min = 2.55V at I = -0.5mA V OH max = 3.05V See Table 11 for detail. If unued keep pin open. DAI3 DAI4 DAI5 O I I V IL max = 0.8V V IH min = 2.0V V IH max = VEXTmin + 0.3V = 3.05V DAI6 I MC75_HD_V Page 79 of

80 MC75 Hardware Interface Decription Function Signal name IO Signal form and level Comment Analog VMIC O V O min = 2.4V Microphone upply for Audio V O typ = 2.5V cutomer feeding circuit interface V O max = 2.6V I max = 2mA EPP2 O Vpp (differential) typical The audio output can directly EPN2 O 3.4Vpp differential maximal operate a 32-Ohmloudpeaker. Audio mode TBD If unued keep pin open. Meaurement condition TBD Minimum differential rep. ingle ended load 27Ohm EPP1 O Vpp (differential) typical The audio output can directly EPN1 O 6.0Vp-p differential maximal operate an 8-Ohmloudpeaker. Audio mode TBD If unued keep pin open. Meaurement condition TBD Minimum differential rep. ingle ended load 7.5Ohm MICP1 I Full Scale Input Voltage 1.578Vpp Balanced or ingle ended MICN1 I 0dBm0 Input Voltage Vpp microphone or line input with external feeding circuit (uing MICP2 I At MICNx, apply external bia from 1.0V to VMIC and AGND). MICN2 I 1.6V. If unued keep pin open. Audio mode TBD Meaurement condition TBD AGND Analog Ground GND level for external audio circuit MC75_HD_V Page 80 of

81 MC75 Hardware Interface Decription 5.4 Power Supply Rating Table 19: Power upply rating Parameter Decription Condition Min Typ Max Unit BATT+ Supply voltage Voltage drop during tranmit burt Voltage ripple Directly meaured at reference point BATT+ and GND, ee chapter Voltage mut tay within the min/max value, including voltage drop, ripple, pike. Normal condition, power control level for P out max Normal condition, power control level for P out f>200khz V 400 mv I VDDLP OFF State RTC BATT+ = 0V 25 µa upply current POWER DOWN mode 1) µa I BATT+ Average tandby upply current 2) 50 2 mv mv SLEEP DRX = ma SLEEP DRX = ma SLEEP DRX = ma IDLE DRX = 2 28 ma 1) 2) Meaured after module INIT (witch ON the module and following witch OFF); applied voltage on BATT+ (w/o INIT) how increaed POWER DOWN upply current. Additional condition: SLEEP mode meaurement tarted 3 minute after witch ON the module Averaging time: SLEEP mode - 3 minute; IDLE mode minute Communication teter etting: no neighbor cell, no cell reelection etc. USB interface diabled MC75_HD_V Page 81 of

82 MC75 Hardware Interface Decription Table 20: Current conumption during Tx burt for GSM 850MHz and GSM 900MHz Mode GSM call GPRS Cla 8 Timelot configuration Maximum poible power (RF power nominal) Radio output power reduction with AT^SCFG, parameter <ropr> Current characteritic GPRS Cla10 GPRS Cla 12 EGPRS Cla 8 EGPRS Cla 10 1Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx 4Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx 2W (33dBm) 2W (33dBm) 2W (33dBm) 1W (30dBm) 1W (30dBm) 0.5W (27dBm) 0.5W (27dBm) 0.5W (27dBm) 0.25W (24dBm) <ropr> = <ropr> = <ropr> = 1 <ropr> = 2 or 3 <ropr> = 1 <ropr> = 2 or 3 <ropr> = <ropr> = 1 <ropr> = 2 or 3 Burt 50Ω antenna (typ.) 2.0A 2.0A 2.0A 1.5A 1.5A 1.3A 1.6A peak 1.4A plateau 1.6A peak 1.4A plateau 1.3A peak 1.1A plateau Burt total mimatch Average 50Ω antenna (typ.) Average total mimatch 3.2A 3.2A 3.2A 2.3A 2.3A 1.9A 2.0A peak 1.6A plateau 2.0A peak 1.6A plateau 1.5A peak 1.3A plateau 335mA 385mA 610mA 485mA 810mA 710mA 405mA 525mA 450mA 485mA 535mA 910mA 685mA 1210mA 1010mA 430mA 575mA 500mA AT parameter are given in bracket <...> and marked italic. MC75_HD_V Page 82 of

83 MC75 Hardware Interface Decription Table 21: Current conumption during Tx burt for GSM 1800MHz and GSM 1900MHz Mode GSM call GPRS Cla 8 Timelot configuration Maximum poible power (RF power nominal) Radio output power reduction with AT^SCFG, parameter <ropr> Current characteritic GPRS Cla10 GPRS Cla 12 EGPRS Cla 8 EGPRS Cla 10 1Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx 4Tx / 1Rx 1Tx / 4Rx 2Tx / 3Rx 1W (30dBm) 1W (30dBm) 1W (30dBm) 0.5W (27dBm) 0.5W (27dBm) 0.25W (24dBm) 0.25W (24dBm) 0.25W (24dBm) 0.125W (21dBm) <ropr> = <ropr> = <ropr> = 1 <ropr> = 2 or 3 <ropr> = 1 <ropr> = 2 or 3 <ropr> = <ropr> = 1 <ropr> = 2 or 3 Burt 50Ω antenna (typ.) 1.6A 1.6A 1.6A 1.4A 1.4A 1.2A 1.4A peak 1.2A plateau 1.4A peak 1.2A plateau 1.25A peak 1.1A plateau Burt total mimatch Average 50Ω antenna (typ.) Average total mimatch 2.1A 2.1A 2.1A 1.75A 1.75A 1.5A 1.9A peak 1.6A plateau 1.9A peak 1.6A plateau 1.6A peak 1.3A plateau 285mA 335mA 510mA 460mA 760mA 660mA 380mA 475mA 450mA 350mA 400mA 635mA 550mA 940mA 810mA 430mA 575mA 500mA AT parameter are given in bracket <...> and marked italic. MC75_HD_V Page 83 of

84 MC75 Hardware Interface Decription 5.5 Electrotatic Dicharge The GSM engine i not protected againt Electrotatic Dicharge (ESD) in general. Conequently, it i ubject to ESD handling precaution that typically apply to ESD enitive component. Proper ESD handling and packaging procedure mut be applied throughout the proceing, handling and operation of any application that incorporate a MC75 module. Special ESD protection provided on MC75: Antenna interface: one park dicharge line (park gap) SIM interface: clamp diode for protection againt overvoltage. The remaining port of MC75 are not acceible to the uer of the final product (ince they are intalled within the device) and therefore, are only protected according to the Human Body Model requirement. MC75 ha been teted according to the EN tandard. The meaured value can be gathered from the following table. Table 22: Meaured electrotatic value Specification / Requirement Contact dicharge Air dicharge ETSI EN ESD at SIM port ± 4kV ± 8kV ESD at antenna port ± 4kV ± 8kV Human Body Model (Tet condition: 1.5kΩ, 100pF) ESD at USB interface ± 1kV ± 1kV ESD at SD card interface ± 1kV ± 1kV ESD at all other interface ± 1kV ± 1kV Note: Pleae note that the value may vary with the individual application deign. For example, it matter whether or not the application platform i grounded over external device like a computer or other equipment, uch a the Siemen reference application decribed in Chapter 8. MC75_HD_V Page 84 of

85 MC75 Hardware Interface Decription 5.6 Reliability Characteritic The tet condition tated below are an extract of the complete tet pecification. Table 23: Summary of reliability tet condition Type of tet Condition Standard Vibration Shock half-inu Dry heat Temperature change (hock) Damp heat cyclic Cold (contant expoure) Frequency range: 10-20Hz; acceleration: 3.1mm amplitude Frequency range: Hz; acceleration: 5g Duration: 2h per axi = 10 cycle; 3 axe Acceleration: 500g Shock duration: 1mec 1 hock per axi 6 poition (± x, y and z) Temperature: +70 ±2 C Tet duration: 16h Humidity in the tet chamber: < 50% Low temperature: -40 C ±2 C High temperature: +85 C ±2 C Changeover time: < 30 (dual chamber ytem) Tet duration: 1h Number of repetition: 100 High temperature: +55 C ±2 C Low temperature: +25 C ±2 C Humidity: 93% ±3% Number of repetition: 6 Tet duration: 12h + 12h Temperature: -40 ±2 C Tet duration: 16h DIN IEC DIN IEC EN Bb ETS DIN IEC Na ETS DIN IEC Db ETS DIN IEC MC75_HD_V Page 85 of

86 MC75 Hardware Interface Decription 6 Mechanic 6.1 Mechanical Dimenion of MC75 Figure 37 how the top view of MC75 and provide an overview of the board' mechanical dimenion. For further detail ee Figure 38. Pin 1 Pin 80 Figure 37: MC75 top view MC75_HD_V Page 86 of

87 MC75 Hardware Interface Decription All dimenion in mm Figure 38: Dimenion of MC75 MC75_HD_V Page 87 of

88 MC75 Hardware Interface Decription 6.2 Mounting MC75 to the Application Platform There are many way to properly intall MC75 in the hot device. An efficient approach i to mount the MC75 PCB to a frame, plate, rack or chai. Fatener can be M2 crew plu uitable waher, circuit board pacer, or cutomized crew, clamp, or bracket. In addition, the board-to-board connection can alo be utilized to achieve better upport. To help you find appropriate pacer a lit of elected crew and ditance leeve for 3mm tacking height can be found in Section 9.2. When uing the two mall hole take care that the crew are inerted with the crew head on the bottom of the MC75 PCB. Screw for the large hole can be inerted from top or bottom. For proper grounding it i trongly recommended to ue large ground plane on the bottom of board in addition to the five GND pin of the board-to-board connector. The ground plane may alo be ued to attach cooling element, e.g. a heat ink or thermally conductive tape. To prevent mechanical damage, be careful not to force, bend or twit the module. Be ure it i poitioned flat againt the hot device. All the information you need to intall an antenna i ummarized in Chapter 4. Note that the antenna pad on the bottom of the MC75 PCB mut not be influenced by any other PCB, component or by the houing of the hot device. It need to be urrounded by a retricted pace a decribed in Section 4.1. MC75_HD_V Page 88 of

89 MC75 Hardware Interface Decription 6.3 Board-to-Board Application Connector Thi ection provide the pecification of the 80-pin board-to-board connector ued to connect MC75 to the external application. Connector mounted on the MC75 module: Type: SlimStack Receptacle 80 pin, 0.50mm pitch, for tacking height from 3.0 to 4.0mm, ee Figure 39 for detail. Supplier: Molex Table 24: Technical pecification of Molex board-to-board connector Parameter Specification (80-pin B2B connector) Electrical Number of Contact 80 Contact pacing 0.5mm (.020") Voltage 50V Rated current 0.5A max per contact Contact reitance 50mΩ max per contact Inulation reitance > 100MΩ Dielectric Withtanding Voltage 500V AC (for 1 minute) Phyical Inulator material (houing) White gla-filled LCP platic, flammability UL 94V 0 Contact material Plating: Gold over nickel Inertion force 1 t < 74.4N Inertion force 30 th < 65.6N Withdrawal force 1 t > 10.8N Maximum connection cycle 30 (@ 70mΩ max per contact) Mating connector type for the cutomer' application offered by Molex: SlimStack Plug, 3mm tacking height, ee Figure 40 for detail SlimStack Plug, 4mm tacking height MC75_HD_V Page 89 of

90 MC75 Hardware Interface Decription Figure 39: Molex board-to-board connector on MC75 MC75_HD_V Page 90 of

91 MC75 Hardware Interface Decription Figure 40: Mating board-to-board connector on application MC75_HD_V Page 91 of

92 MC75 Hardware Interface Decription 7 Sample Application Figure 41 how a typical example of how to integrate a MC75 module into the GSM part of a mobile application. Uage of the variou hot interface depend on the deired feature of the application. Audio interface 1 demontrate the balanced connection of microphone and earpiece. Thi olution i particularly well uited for internal tranducer. Audio interface 2 ue an unbalanced microphone and earpiece connection typically found in headet application. The charging circuit i optimized for the charging tage (trickle charging and oftware controlled charging) a well a the battery and charger pecification decribed in Section 3.5. The PWR_IND line i an open collector that need an external pull-up reitor which connect to the voltage upply VCC µc of the microcontroller. Low tate of the open collector pull the PWR_IND ignal low and indicate that the MC75 module i active, high level notifie the Power-down mode. If the module i in Power-down mode avoid current flowing from any other ource into the module circuit, for example revere current from high tate external control line. Therefore, the controlling application mut be deigned to prevent revere flow. Thi i not neceary for the USB interface. The SD memory card interface can be powered from an external upply or via the VEXT line of MC75. Figure 41 ue the VEXT line. The advantage of thi olution i that when the module enter the Power-down mode, the SD memory card interface i hut down a well. If you prefer to connect an SD card to an external power upply, take care that the interface i hut down when the PWR_IND ignal goe high in Power-down mode. The ame applie to the I 2 C interface in thi cae it i recommended to connect it external pull-up reitor (Rp) from VEXT. The EMC meaure are bet practice recommendation. In fact, an adequate EMC trategy for an individual application i very much determined by the overall layout and, epecially, the poition of component. For example, mounting the internal acoutic tranducer directly on the PCB eliminate the need to ue the ferrite bead hown in the ample chematic. However, when connecting cable to the module interface it i trongly recommended to add appropriate ferrite bead for reducing RF radiation. Diclaimer No warranty, either tated or implied, i provided on the ample chematic diagram hown in Figure 41 and the information detailed in thi ection. A functionality and compliance with national regulation depend to a great amount on the ued electronic component and the individual application layout manufacturer are required to enure adequate deign and operating afeguard for their product uing MC75 module. MC75_HD_V Page 92 of

93 MC75 Hardware Interface Decription MC75 Application (Draft) *) VCC µc SIM 47k 47k 100k Serial Interface ASC0 Serial Interface ASC1 200nF *) I2C SD memory*) card USB (Slave) 1nF 2 x R P IGT BC847 BC847 All SIM component hall be cloe to card holder. *) 27pF EMERG_RST PWR_IND VEXT (2.9V) SYNC CCIN CCVCC CCRST CCIO CCCLK CCGND VCHARGE MC75 0R (not mounted) BATT+ BATTEMP VSENSE ISENSE CHARGEGATE GND VMIC (2.5V) MICP1 MICN1 MICP2 MICN2 EPN1 EPP1 EPP2 EPN2 AGND 470R Rechargeable Lithium battery 100nF 100µF NTC 1k 1k 100nF Figure 41: MC75 ample application (draft) >8R 0.3R 2.2k >32R SI3441DV 5.6k 2.2k 2.7k 7 22µF CRS04 ESD protection Digital Audio V ch ar ge 5.2V + 0.2V Charger *) depend on final pecification MC75_HD_V Page 93 of

94 MC75 Hardware Interface Decription 8 Reference Approval 8.1 Reference Equipment for Type Approval The Siemen reference etup ubmitted to type approve MC75 conit of the following component: Siemen MC75 cellular engine Development Support Box DSB75 SIM card reader integrated on DSB75 U.FL-R-SMT antenna connector and U.FL-LP antenna cable Handet type Votronic HH-SI-30.3/V1.1/0 Li-Ion battery PC a MMI Antenna or 50 Ω cable to ytem imulator PC RS-232 DSB75 Antenna Flex cable 100mm GSM module SIM Power upply Li-Ion battery Handet Figure 42: Reference equipment for Type Approval MC75_HD_V Page 94 of

95 MC75 Hardware Interface Decription 8.2 Compliance with FCC Rule and Regulation The FCC Equipment Authorization Certification for the MC75 reference application decribed in Section 8.1 i lited under the FCC identifier QIPMC75 IC: 267W-MC75 granted to Siemen AG. The MC75 reference application regitered under the above identifier i certified to be in accordance with the following Rule and Regulation of the Federal Communication Commiion (FCC). Power lited i ERP for Part 22 and EIRP for Part 24 Thi device contain GSM, GPRS Cla12 and EGPRS Cla 10 function in the 900 and 1800MHz Band which are not operational in U.S. Territorie. Thi device i to be ued only for mobile and fixed application. The antenna() ued for thi tranmitter mut be intalled to provide a eparation ditance of at leat 20cm from all peron and mut not be co-located or operating in conjunction with any other antenna or tranmitter. Uer and intaller mut be provided with antenna intallation intruction and tranmitter operating condition for atifying RF expoure compliance. Antenna ued for thi OEM module mut not exceed 8.4dBi gain (GSM 1900) and 2.9dBi (GSM 850) for mobile and fixed operating configuration. Thi device i approved a a module to be intalled in other device. The FCC label of the module mut be viible from the outide. If not, the hot device i required to bear a econd label tating, Contain FCC ID QIPMC75. IMPORTANT: Manufacturer of mobile or fixed device incorporating MC75 module are advied to clarify any regulatory quetion, have their completed product teted, have product approved for FCC compliance, and include intruction according to above mentioned RF expoure tatement in end product uer manual. Pleae note that change or modification not exprely approved by the party reponible for compliance could void the uer authority to operate the equipment. MC75_HD_V Page 95 of

96 MC75 Hardware Interface Decription 9 Appendix 9.1 Lit of Part and Acceorie Table 25: Lit of part and acceorie Decription Supplier Ordering information MC75 Siemen Siemen ordering number: L36880-N8810-A100 Siemen Car Kit Portable Siemen Siemen ordering number: L36880-N3015-A117 DSB75 Support Box Siemen Siemen ordering number: L36880-N8811-A100 Votronic Handet VOTRONIC Votronic HH-SI-30.3/V1.1/0 VOTRONIC Entwicklung- und Produktiongeellchaft für elektroniche Geräte mbh Saarbrücker Str St. Ingbert Germany Phone: +49-(0) / Fax: +49-(0) / contact@votronic.com SIM card holder incl. puh button ejector and lide-in tray Molex Ordering number: Sale contact are lited in Table 26. Board-to-board connector Molex Sale contact are lited in Table 26. U.FL-R-SMT antenna connector Hiroe See Section 4.3 for detail on U.FL-R-SMT connector, mating plug and cable. Sale contact are lited in Table 27. MC75_HD_V Page 96 of

97 MC75 Hardware Interface Decription Table 26: Molex ale contact (ubject to change) Molex For further information pleae click: Molex Deutchland GmbH Felix-Wankel-Str Heilbronn-Biberach Germany Phone: Fax: mxgermany@molex.com American Headquarter Lile, Illinoi U.S.A. Phone: MOLEX Fax: Molex China Ditributor Beijing, Room 1319, Tower B, COFCO Plaza No. 8, Jian Guo Men Nei Street, Beijing P.R. China Phone: Phone: Phone: Fax: Molex Singapore Pte. Ltd. Jurong, Singapore Phone: Fax: Molex Japan Co. Ltd. Yamato, Kanagawa, Japan Phone: Fax: Table 27: Hiroe ale contact (ubject to change) Hiroe Ltd. For further information pleae click: Hiroe Electric (U.S.A.) Inc 2688 Wethill Court Simi Valley, CA U.S.A. Phone: Fax: Hiroe Electric GmbH Zeppelintrae Otfildern Kemnat 4 Germany Phone: Fax info@hiroe.de Hiroe Electric UK, Ltd Crownhill Buine Centre 22 Vincent Avenue, Crownhill Milton Keyne, MK8 OAB Great Britain Phone: Fax: Hiroe Electric Co., Ltd. 5-23, Oaki 5 Chome, Shinagawa-Ku Tokyo 141 Japan Phone: Fax: Hiroe Electric Co., Ltd. European Branche Firt cla Building 4F Beechavenue PV Schiphol-Rijk Netherland Phone: Fax: MC75_HD_V Page 97 of

98 MC75 Hardware Interface Decription 9.2 Fatener and Fixing for Electronic Equipment Thi ection provide a lit of upplier and manufacturer offering fatener and fixing for electronic equipment and PCB mounting. The content of thi ection i deigned to offer baic guidance to variou mounting olution with no warranty on the accuracy and ufficiency of the information upplied. Pleae note that the lit remain preliminary although it i going to be updated in later verion of thi document Fatener from German Supplier ETTINGER GmbH Sale contact: ETTINGER GmbH Phone: Fax: The following table contain only article number and baic parameter of the lited component. For further detail and ordering information pleae contact Ettinger GmbH. Pleae note that ome of the lited crew, pacer and nut are delivered with the DSB75 Support Board. See comment below. Article number: Spacer - Aluminum / Wall thickne = 0.8mm Length Material For internal diameter Internal diameter External diameter 3.0mm AlMgSi-0,5 M2= d = 2.4mm 4.0mm Vogt AG No. x MC75_HD_V Page 98 of

99 MC75 Hardware Interface Decription Article number: Length Inulating Spacer for M2 Self-gripping *) 3.0mm Material Polyamide 6.6 Surface Internal diameter External diameter Flammability rating Black 2.2mm 4.0mm UL94-HB *) 2 pacer are delivered with DSB75 Support Board Article number: Threaded Stud M2.5 - M2 Type E / External thread at both end Length Material Thread 1 / Length Thread 2 / Length 3.0mm Stainle teel X12CrMoS17 M2.5 / 6.0mm M2 / 8.0mm Width acro flat 5 Rece Type ye External / External MC75_HD_V Page 99 of

100 MC75 Hardware Interface Decription Article number: Screw M2 *) DIN 84 - ISO 1207 Length 8.0mm Material Steel 4.8 Surface Thread Head diameter Head height Type Zinced A2K M2 D = 3.8mm 1.30mm Slotted cheee head crew *) 2 crew are delivered with DSB75 Support Board Article number: Length Screw M2 DIN 84 - ISO mm Material Steel 4.8 Surface Thread Head diameter Head height Type Zinced A2K M2 D = 3.8mm 1.30mm Slotted cheee head crew MC75_HD_V Page 100 of

101 MC75 Hardware Interface Decription Article number: Hexagon Nut *) DIN ISO 4032 Material Steel 4.8 Surface Thread Zinced A2K M2 Wrench ize / Ø 4 Thickne / L Type 1.6mm Nut DIN/UNC, DIN934 *) 2 nut are delivered with DSB75 Support Board 9.3 Data Sheet of Recommended Batterie The following two data heet have been provided by VARTA Microbattery GmbH. Click here for ale contact and further information: MC75_HD_V Page 101 of