Fixed Resistors CONTENTS

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2 Fixed Resistors CONTENTS Classifi cation Product Item Page Safety Precautions (Common precautions for Fixed Resistors) Surface Mount Resistors Power Type Resistors (eaded) Chip Resistors High Precision Current Sensing Small&High Power Anti-Sulfurated Resistor Network/Array Common specifi cations Fusing Resistors Thick Film Chip Resistors ER XG, G, G, 3G, 6G, 8G, 4,, Z, T 3 Precision Thick Film Chip Resistors ER XG, G, R, R, 3R, 6R, 3E, 6E, 8E, 4,, T 5 Metal Film (Thin Film) Chip Resistors, High Reliability Type Metal Film (Thin Film) Chip Resistors, High Sound Quality Type Thick Film Chip Resistors / ow Type ERA A, A, 3A, 6A, 8A 8 ERA H ER, 3, 6, B,3B,6B,8B,6C,8C ER B, 3B, 6D, 6B, 8B, 4B, 3R, 6R, 8R, 4R, R,Z, ER TR, 3, 6, 8, 4,, D, Current Sensing Resistors, Metal Plate Type ER MPG, MPK, MP3K, MP3M, MP4M, MP4P 7 Current Sensing Resistors, Metal Plate Type ER MS4S, MS4H, MS6S, MBS Current Sensing Resistors, Metal Plate Type ER MS, MT 5 High Power Chip Resistors / ide Terminal Type ER A, B, B, B3 7 High Precision Thick Film Chip Resistors ER PB3, PB6 3 Anti-Surge Thick Film Chip Resistors ER PA, P3, PA3, P6, P8, P4 3 Anti-Pulse Thick Film Chip Resistors ER T6, T8, T4 35 Anti-Sulfurated Thick Film Chip Resistors Anti-Sulfurated High Power Chip Resistors / ide Terminal Type Chip Resistor Array ER S, S3, S6, S8, S4, S, SD, ST ER U, U, U3, U6, U8, U4, U, UD, UT ER U6S, U6Q ER C 4 EXB 4V, 8V, 4V, 8V, N8V, HV, 34V, V4V, 38V, V8V, S8V Anti-Sulfurated Chip Resistor Array EXB U4, U8, UH, U34, U38 46 Chip Resistor Networks EXB D, E, A, Q 48 Chip Attenuator EXB 4AT, 4AT 5 Packaging Methods (Taping) 5 Recommended and Pattern 57 Recommended Soldering Conditions 59 Safety Precautions (Common precautions for Surface Mount Resistors) 6 Metal (Oxide) Film Resistors, Flame-Retardant ERG S, S, F, S, F, 3S, 3F, 5S, 5F ERX S, S, F, S, F, 3S, 3F, 5S, 5F Anti-Pulse Power Resistors ERG D, D, D, 3D 68 Metal Film Resistors / ow Value ERX,, 7 Metal Film Fusing Resistors ERQ Z, Z, Z, 4Z ERQ AB, AB, A, 4A Fixed Resistors Appendix All products in this catalog comply with the RoHS Directive. The RoHS Directive is the Directive (/65/EU) on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment and its revisions. Apr. 6

3 Safety Precautions (Common precautions for Fixed Resistors) hen using our products, no matter what sort of equipment they might be used for, be sure to make a written agreement on the specifications with us in advance. The design and specifications in this catalog are subject to change without prior notice. Do not use the products beyond the specifications described in this catalog. This catalog explains the quality and performance of the products as individual components. Before use, check and evaluate their operations when installed in your products. Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment where a defect in these products may cause the loss of human life or other significant dam age, such as damage to vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment. Systems equipped with a protection circuit and a protection device Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault () Precautions for use These products are designed and manufactured for general and standard use in general elec tron ic equipment (e.g. AV equipment, home electric appliances, office equipment, information and communication equipment) These products are not intended for use in the following special conditions. Before using the products, carefully check the effects on their quality and performance, and determine whether or not they can be used.. In liquid, such as water, oil, chemicals, or organic solvent. In direct sunlight, outdoors, or in dust 3. In salty air or air with a high concentration of corrosive gas, such as Cl, H S, NH 3, SO, or NO 4. Electric Static Discharge (ESD) Environment These components are sensitive to static electricity and can be damaged under static shock (ESD). Please take measures to avoid any of these environments. Smaller components are more sensitive to ESD environment. 5. Electromagnetic Environment Avoid any environment where strong electromagnetic waves exist. 6. In an environment where these products cause dew condensation 7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with resin or other materials These products generate oule heat when energized. Carefully position these products so that their heat will not affect the other components. Carefully position these products so that their temperatures will not exceed the category temperature range due to the effects of neighboring heat-generating components. Do not mount or place heat-generating components or inflammables, such as vinyl-coated wires, near these products. Note that non-cleaning solder, halogen-based highly active flux, or water-soluble flux may deteriorate the performance or reliability of the products. Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water residues. Otherwise, the insulation performance may be deteriorated. () Precautions for storage The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture of 5 C to 35 C and a relative humidity of 45 % to 85 %. Even within the above guarantee periods, do not store these products in the following conditions. Otherwise, their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping materials) may be deformed or deteriorated, resulting in mounting failures.. In salty air or in air with a high concentration of corrosive gas, such as Cl, H S, NH 3, SO, or NO. In direct sunlight <Package markings> Package markings include the product number, quantity, and country of origin. In principle, the country of origin should be indicated in English. Sep. 4

4 Thick Film Chip Resistors Thick Film Chip Resistors Type: ER XG, G, G, 3G, 6G, 8G, 4,, Z, T Features Small size and lightweight High reliability Metal glaze thick fi lm resistive element and three layers of electrodes Compatible with placement machines Taping packaging available Suitable for both refl ow and fl ow sol der ing Reference Standards IEC 65-8, IS C 5-8, EIA RC-34B AEC-Q qualifi ed (Exemption ERXG) RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers ERXGN, GN, GE, 3GE, 6GE, 8GE, 4,, Z, T Type, ±5 % E R 3 G E Y V Product Thick Film Chip Resistors Size, Power Rating Inch XGN GN GE 3GE 6GE 8GE 4 Z T Power R Marking Marking Value Marking on Y black side Nil No marking Tolerance Value Tolerance ±5 % umper The first two digits are significant figures of resistance and the third one denotes number of zeros following. Decimal Point is expressed by R as 4.7 = 4R7. umper is expressed by R. hen omitted, the rest of the P/N factors shall be moved up respectively. (Only XGN, GN, GE type) Y U C X Y V U Packaging Methods Packaging Pressed Carrier Taping 8P,, pcs. Embossed Carrier Taping 4P, 4, pcs. Pressed Carrier Taping mm pitch, 5, pcs. Punched Carrier Taping mm pitch,, pcs. Punched Carrier Taping mm pitch,, pcs. Punched Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 4, pcs. ERXGN ERGN ERGE ER3GE ER6GE ER8GE ER4 ER ERZ ERT 5 3 Mar. 5

5 Thick Film Chip Resistors Construction Protective coating Dimensions in mm (not to scale) a Alumina substrate Electrode (Inner) t b Thick film resistive element Electrode (Between) Electrode (Outer) (inch size) ERXG (5) ERG () ERG (4) ER3G (63) ER6G (85) ER8G (6) ER4 () ER (8) ERZ () ERT (5) Dimensions (mm) a b t Mass (eight) (g/ pcs.).4 ±.. ±.. ±.3. ±.3.3 ±..4.6 ±.3.3 ±.3. ±.5.5 ±.5.3 ±.3.5. ±.5.5 ±.5. ±..5 ±.5.35 ± ± ±..3 ±.5.45 ±.. ±..5 ±..4 ±..4 ±..6 ± ±..5 ±..6 ±. 3. ±..5 ±..5 ±..5 ±..6 ± ±. 3. ±..5 ±..5 ±..6 ± ±..5 ±..6 ±..6 ±..6 ± ±. 3. ±..65 ±..6 ±..6 ±. 45 Ratings [For Resistor] (inch size) ERXG (5) ERG () ERG (4) ER3G (63) ER6G (85) ER8G (6) ER4 () ER (8) ERZ () ERT (5) Power Rating at 7 C () imiting Element Voltage () (V) Maximum Overload Voltage () (V) Tolerance (%) Range (Ω) T.C.R. ( 6 / C) Category Temperature Range ( C) ±5 4.7 to M (E4) < Ω : to +6 Ω to Ω : ±3 Ω< : ± 55 to ±5 to M (E4) 55 to ±5 to M (E4) < Ω: to to ±5 to M (E4) 55 to ±5 to M (E4) 55 to ±5 to M (E4) Ω to MΩ: ± 55 to ±5 to M (E4) 55 to ±5 to M (E4) 55 to ±5 to M (E4) MΩ<: 4 to to ±5 to M (E4) 55 to +55 () Rated Continuous orking Voltage (RCV) shall be de ter mined from RCV= Power Rating Re sis tance Values, or imiting Element Voltage list ed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be de ter mined from SOTV=.5 (Only ERG=.) RCV or max. Over load Volt age list ed above which ev er less. [For umper] (inch size) ERXG (5) ERG () ERG (4) ER3G (63) ER6G (85) ER8G (6) ER4 () ER (8) ERZ () ERT (5) Rated Current (A) Maximum Over load Current (A).5 4 Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure below. 55 C C 4 XG, G 55 C 5 C Ambient Temperature ( C) Rated oad (%) G, 3G, 6G, 8G, 4,, Z, T 5 4 Mar. 5

6 Precision Thick Film Chip Resistors Precision Thick Film Chip Resistors Type: ER XG, G ER R, R, 3R, 6R ER 3E, 6E, 8E, 4,, T Features Small size and lightweight High reliability Metal glaze thick fi lm resistive element and three layers of electrodes Compatible with placement machines Taping packaging available Suitable for both refl ow and fl ow soldering ow Tolerance ERXG, G, R, 3E, 6E, 8E, 4,, T Type : ± % ERR, R, 3R, 6R Type : ±.5 % Reference Standards IEC 65-8, IS C 5-8, EIA RC-34B AEC-Q qualifi ed (Exemption ERXG, ERR) RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers ERR, R, 3R, 6R Type, ±.5 % E R 3 R B D V Product Thick Film Chip Resistors Size, Power Rating R R 3R 6R Inch Power R H B K E T.C.R. Marking T.C.R. ±5 6 / C (R, R) ±5 6 / C (3R, 6R) ± 6 / C (R) ± 6 / C (3R, 6R) Tolerance D Tolerance ±.5 % C X V Packaging Methods Packaging Pressed Carrier Taping mm pitch, 5, pcs. Punched Carrier Taping mm pitch,, pcs. Punched Carrier Taping 4 mm pitch, 5, pcs. ERR ERR ER3R ER6R Value The first three digits are significant figures of resistance and the last one denotes number of zeros following. Example: kω 6 5 Apr. 5

7 Precision Thick Film Chip Resistors ERXG, G, R, 3E, 6E, 8E, 4,, T Type, ± % E R 8 E N F V Product Thick Film Chip Resistors XGN GN RK 3EK 6EN 8EN 4N N S TN Size, Power Rating Inch Power R Tolerance F Tolerance ± % Value The first three digits are significant figures of resistance and the last one denotes number of zeros following. Decimal point is expressed by "R". Example : kω Y C X V U Packaging Methods Packaging Pressed Carrier Taping mm pitch,, pcs. ERXGN Pressed Carrier Taping mm pitch, 5, pcs. ERGN Punched Carrier Taping mm pitch,, pcs. ERRK Punched Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 4, pcs. ER3EK ER6EN ER8EN ER4N ERN ERS ERTN Construction Dimensions in mm (not to scale) a Protective coating t Alumina substrate Thick film resistive element Electrode (Inner) Electrode (Between) Electrode (Outer) (inch size) ERXG (5) ERG, R () ERR (4) ER3R ER3EK (63) ER6R ER6EN (85) ER8EN (6) ER4N () ERN (8) ERS () ERTN (5) b Dimensions (mm) a b t Mass (eight) [g/ pcs.].4 ±.. ±.. ±.3. ±.3.3 ±..4.6 ±.3.3 ±.3. ±.5.5 ±.5.3 ±.3.5. ±.5.5 ±.5. ±..5 ±.5.35 ± ± ±..3 ±.5.45 ±.. ±..5 ±..4 ±..4 ±..6 ± ±..5 ±..6 ±. 3. ±..5 ±..5 ±..5 ±..6 ± ±. 3. ±..5 ±..5 ±..6 ± ±..5 ±..6 ±..6 ±..6 ± ±. 3. ±..65 ±..6 ±..6 ± Apr. 5

8 Precision Thick Film Chip Resistors Ratings <±.5 %> (inch size) Power Rating at 7 C () imiting Element Voltage () (V) Maximum Overload Voltage () (V) Tolerance (%) Range (Ω) T.C.R. ( 6 / C) Category Temperature Range ( C) ERRH () ±.5 k to M (E4, E96) ±5 55 to +5 ERRH (4) ERRK (4) ER3RB (63) ER3RE (63) ER6RB (85) ER6RE (85).63 5 ± ±.5. 5 ±.5. 5 ±.5. 5 ±.5. 5 ±.5 to k (E4, E96) to 97.6 k to M (E4, E96) to k (E4, E96) to 97.6 k to M (E4, E96) to k (E4, E96) to 97.6 k to M (E4, E96) ±5 55 to +5 ± 55 to +5 ±5 55 to +5 ± 55 to +5 ±5 55 to +5 ± 55 to +5 <± %> (inch size) ERXGN (5) ERGN () ERRK (4) ER3EK (63) ER6EN (85) ER8EN (6) ER4N () ERN (8) ERS () ERTN (5) Power Rating at 7 C () imiting Element Voltage () (V) Maximum Overload Voltage () (V) Tolerance (%) ± ±. 5 ± ±.5 5 ±.5 4 ±.5 4 ±.75 5 ±.75 5 ± 5 ± Range (Ω) to M (E4, E96) to M (3) (E4, E96) to M (3) (E4, E96) to M (E4, E96) to. M (E4, E96) to. M (E4, E96) to M (E4, E96) to M (E4, E96) to M (E4, E96) to M (E4, E96) T.C.R. ( 6 / C) < Ω : ±3 Ω < : ± Category Temperature Range ( C) 55 to +5 ± 55 to +5 ± 55 to +55 ± 55 to +55 ± 55 to +55 ± 55 to +55 ± 55 to +55 ± 55 to +55 ± 55 to +55 ± 55 to +55 () Rated Continuous orking Voltage (RCV) shall be de ter mined from RCV= Power Rating Re sis tance Values, or imiting Element Voltage list ed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=.5 (Only ERRK ±% =.) RCV or max. Over load Volt age list ed above whichever less. (3) Please contact us when you need a type with a resistance of less than Ω. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C C RK, 3E, 6E, 8E, 4,, T XG, G, R, RH, RK, 3R, 6R 5 C 55 C Ambient Temperature ( C) 6 7 Apr. 5

9 Metal Film (Thin Film) Chip Resistors, High Reliability Type Metal Film (Thin Film) Chip Resistors, High Reliability Type Type: ERA A, A, 3A, 6A, 8A Features High reliability... Stable at high temperature and humidity (85 C 85 %RH rated load, Category temperature range : 55 C to +55 C) High accuracy... Small resistance tolerance and Temperature Coeffi cient of High performance... ow current noise, excellent linearity Reference Standard... IEC 65-8, IS C 5-8, EIA RC-33B AEC-Q qualifi ed RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E4 Series E R A 3 A E B V Product Metal Film Chip Resistors Size, Power Rating A A 3A 6A 8A Inch Power Rating Temperature Coefficient T.C.R. R ± 6 / C P ±5 6 / C E ±5 6 / C H ±5 6 / C K ± 6 / C Tolerance B C D Tolerance ±.5 % ±. % ±.5 % ±.5 % C X V Packaging Methods Packaging Pressed Carrier Taping mm pitch, 5 pcs. Punched Carrier Taping mm pitch, pcs. Punched CarrierTaping 4 mm pitch, 5 pcs. ERAA ERAA ERA3A ERA6A ERA8A Value Consist of three figures for E4 series resistance value. The first two digits are significant figures of resistance and the third one denotes number of zeros following. (example) : k Ω E96 Series and other values E R A 3 A E B 5 V Product Metal Film Chip Resistors Size, Power Rating Inch A A 3A 6A 8A Power Rating Temperature Coefficient T.C.R. R ± 6 / C P ±5 6 / C E ±5 6 / C H ±5 6 / C K ± 6 / C Tolerance B C D Tolerance ±.5 % ±. % ±.5 % ±.5 % C X V Packaging Methods Packaging Pressed Carrier Taping mm pitch, 5 pcs. Punched Carrier Taping mm pitch, pcs. Punched CarrierTaping 4 mm pitch, 5 pcs. ERAA ERAA ERA3A ERA6A ERA8A Value Consist of four figures for E96 series resistance value. The first three digits are significant figures of resistance and the fourth one denotes number of zeros following. (example) 5 :.5k Ω note : Duplicated resistance values as E4 series part numbers shall follow E4 part numbers. (apply three digit resistance value) 8 Feb. 6

10 Metal Film (Thin Film) Chip Resistors, High Reliability Type Construction Protective coating Alumina substrate Electrode (Inner) Dimensions in mm (not to scale) a High reliability metal film Electrode (Between) Electrode (Outer) t b Dimensions (mm) Mass (eight) (inch size) a b t [g/ pcs.] ERAA ().6 ±.3.3 ±.3.5 ±.5.5 ±.5.3 ±.3.4 ERAA (4). ± ±..5 ±..35 ±.5.6 ERA3A (63).6 ±..8 ±..3 ±..3 ±..45 ±. ERA6A (85). ±..5 ±..4 ±.5.4 ±.5.5 ±. 4 ERA8A (6) 3. ± ±.5.5 ±.5.6 ±. 8 Ratings Power Rating at 85 C (inch size) () ERAA () ERAA (4) ERA3A (63) ERA6A (85) ERA8A (6) imiting Element Voltage () (V) Maximum Overload Voltage () (V) (detail) Tolerance (%) T.C.R. ( 6 / C) Range (3)(4) (Ω) ERAAEB ±. ERAAEC ±.5 ±5 to k (E4, E96) ERAARC ±.5 ERAARB ±. ± to k (E4, E96) ERAAR ±.5 k to k (E4, E96) ERAAKD ±.5 ± to 46.4 (E4, E96) ERAAED ±.5 ERAAEC ±.5 ±5 47 to k (E4, E96) ERAAEB ±. ERAAPC ±.5 ERAAPB ±. ±5 to 47k (E4, E96) ERAARC ±.5 ERAARB ±. ± to 47k (E4, E96) ERA3AHD ±.5 ±5 to 46.4 (E4, E96) ERA3AED ±.5 ERA3AEC ±.5 ±5 47 to 33k (E4, E96) ERA3AEB ±. ERA3APC ±.5 ERA3APB ±. ±5 47 to k (E4, E96) ERA3ARC ±.5 ERA3ARB ±. ± k to k (E4, E96) ERA3AR ±.5 ERA6AHD ±.5 ±5 to 46.4 (E4, E96) ERA6AED ±.5 ERA6AEC ±.5 ±5 47 to M (E4, E96) ERA6AEB ±. ERA6APC ±.5 ERA6APB ±. ±5 47 to k (E4, E96) ERA6ARC ±.5 ERA6ARB ±. ± k to k (E4, E96) ERA6AR ±.5 ERA8AHD ±.5 ±5 to 46.4 (E4, E96) ERA8AED ±.5 ERA8AEC ±.5 ±5 47 to M (E4, E96) ERA8AEB ±. ERA8APC ±.5 ERA8APB ±. ±5 47 to k (E4, E96) ERA8ARC ±.5 ERA8ARB ±. ± k to k (E4, E96) ERA8AR ±.5 Category Temperature Range ( C) 55 to +55 () Rated Continuous orking Voltage (RCV) shall be de ter mined from RCV= Rated Power Re sis tance Values, or imiting Element Voltage list ed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=.5 RCV or max. Over load Volt age list ed above which ev er less. (3) E9 series resistance values are also available. Please contact us for details. (4) Duplicated resistance values between E96, E9 and E4 series shall follow E4 Part Numbers. (apply three digit resistance value) 9 Feb. 6

11 Metal Film (Thin Film) Chip Resistors, High Reliability Type Power Derating Curve For resistors operated in ambient temperatures above 85 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C 85 C C Ambient Temperature ( C) Feb. 6

12 Metal Film (Thin Film) Chip Resistors, High Sound Quality Type Metal Film (Thin Film) Chip Resistors, High Sound Quality Type Type: ERA H Features High sound quality resistor... ow distortion and high-quality sound by selected material and optimized structure High accuracy... Small resistance tolerance and Temperature Coeffi cient of High performance... ow current noise, excellent linearity Reference Standard... IEC 65-8, IS C 5-8, EIA RC-33B RoHS compliant, Pb free, Halogen free Recommended Applications Audio amplifi er circuit, Smartphone (Hi-fi audio), portable audio player, portable DAC amplifi er As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E R A H E B X Product Metal Film Chip Resistors Size, Power Rating H Inch 4 Power Rating.63 Temperature Coefficient T.C.R. R ± 6 / C E ±5 6 / C H ±5 6 / C K ± 6 / C Tolerance B C D Tolerance ±. % ±.5 % ±.5 % X Packaging Methods Packaging Punched Carrier Taping mm pitch, pcs. Value Consist of four figures. The first three digits are significant figures of resistance and the fourth one denotes number of zeros following. (example) : k Ω ERAH Construction Protective coating Alumina substrate Electrode (Inner) Dimensions in mm (not to scale) a Electrode (Between) t b High sound quality metal film Electrode (Outer) (inch size) ERAH (4) Dimensions (mm) a b t Mass (eight) [g/ pcs.]. ± ±..5 ±..35 ± Feb. 6

13 Metal Film (Thin Film) Chip Resistors, High Sound Quality Type Ratings Power Rating at 7 C (inch size) () ERAH (4) imiting Element Voltage () (V) Maximum Overload Voltage () (V) (detail) Tolerance (%) T.C.R. ( 6 / C) Range (3) (Ω) ERAHKD ±.5 ± to 46.4 (E4, E96) ERAHHD ±.5 ±5 to 46.4 (E4, E96) ERAHEC ±.5 ±5 ERAHEB ±. 47 to k (E4, E96) ERAHRC ±.5 ± ERAHRB ±. Category Temperature Range ( C) 55 to +5 () Rated Continuous orking Voltage (RCV) shall be de ter mined from RCV= Rated Power Re sis tance Values, or imiting Element Voltage list ed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=.5 RCV or max. Over load Volt age list ed above which ev er less. (3) Other resistance except for E4 & E96 series values are also available. Please contact us for details. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C 7 C C Ambient Temperature ( C) Feb. 6

14 Thick Film Chip Resistors / ow Type Thick Film Chip Resistors / ow Type Type: ER, 3, 6 B, 3B, 6B, 8B, 6C, 8C ER B, 3B, 6D, 6B, 8B, 4B, 3R, 6R, 8R, 4R, R, Z, TR ER 3, 6, 8, 4,, D, Features Current Sensing resistor Small size and lightweight Realize both low-resistance & High-precision by original thick film resistive element & special electrode structure Suitable for both refl ow and fl ow sol der ing Realize High-power by double-sided resistive elements structure that aimed to suppress temperature rising : ER, 3, 6, B, 3B, 6B, 8B, 6C, 8C ow TCR : ±75 6 / C (ER6C, 8C) ow Value 5, 6, 7, 8, 9mΩ : ER6 5m Ω, m Ω : ER3 m Ω : ER m Ω to 5m Ω : ER8C m Ω to 3m Ω : ER6C m Ω to m Ω : ER6B, 8B m Ω to m Ω : ER3B, ER4, 4m Ω to m Ω : ERD, 47m Ω to m Ω : ERB, ER3, 6, 8 Reference Standards : IEC 65-8, IS C 5-8, EITA RC-44 AEC-Q qualifi ed RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers ER, 3, 6, B, 3B, 6B, 8B, 6C, 8C <High power (double-sided resistive elements structure) type> E R B G R 4 7 X Product Thick Film Chip Resistors 3 6 B 3B 6B 8B 6C 8C Inch Power Rating Value m Ω 5m Ω,m Ω 5, 6, 7, 8, 9m Ω 47m Ω to m Ω m Ω to m Ω m Ω to m Ω m Ω to m Ω m Ω to 3m Ω m Ω to 5m Ω Tolerance D F G Tolerance ±.5 % ± % ± % ± 5 % Please refer to the rating table for the resistance tolerance Value Shown by 4 digits or letters. (Ex.) R47 :.47 Ω=47m Ω Packaging Methods Packaging X V Pressed Carrier Taping mm pitch,, pcs. Punched Carrier Taping 4 mm pitch, 5, pcs. ER ERB ER3 ER6 ER3B ER6B ER8B ER6C ER8C 3 Feb. 6

15 Thick Film Chip Resistors / ow Type ERBS/BQ, 3BS/3BQ, 6BS/6BQ, 8BS/8BQ, 4BS/4BQ, 6D, 3R, 6R, 8R, 4R, R, Z, TR <High power type/standard type> E R 8 R Q F R V Product Thick Film Chip Resistors Size, Power Rating Type Inch Power R. B 3B 3R 6D 6B 6R 8B 8R 4B 4R R Z TR Value Res. Value S Q. Ω to. Ω. Ω to 9. Ω B :. Ω to. Ω Tolerance D F G Tolerance ±.5 % ± % ± % ± 5 % Please refer to the rating table for the resistance tolerance Value Shown by 3 digits or letters. (Ex.) R :. Ω Packaging Methods Packaging X V U Punched Carrier Taping mm pitch,, pcs. Punched Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 4, pcs. ERB ER3B/3R ER6D/6B/6R ER8B/8R ER4B/4R ERR ERZ ERTR ER3, 6, 8, 4,, D, <ow TCR type> E R 4 K 5 M U Product Thick Film Chip Resistors Size, Power Rating Type Inch Power R D Res. Value Std. K m Ω, m Ω, 33m Ω, 39m Ω, 47m Ω, 5m Ω, m Ω U m Ω to m Ω 3, 6, 8 : 47m Ω to m Ω D, : 4m Ω to m Ω Tolerance F Tolerance ± % ± 5 % Value Shown by 3 digits or letters. (Ex.) 5M:5m Ω, C:m Ω V U Packaging Methods Packaging Punched Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 3, pcs. ER3 ER6 ER8 ER4 ER ERD ER Ratings <High power (double-sided resistive elements structure) type> Power Rating () Category at 7 C Tolerance Range T.C.R. (inch size) () (%) (Ω) ( 6 Temperature Range / C) ( C) ER (4). ±, ±, ±5 m to 5 55 to +5 5m to 7 55 to +5 ER3 (63).5 ±, ±, ±5 m to 3 55 to +5 ER6 (85).5 ±, ±, ±5 5, 6, 7, 8, 9m to 3 55 to +55 ERB (4).5 ±, ±, ±5 47m to m (E4) ±3 55 to +55 ER3B (63).33 ±, ±, ±5 m to m (E4) ER6B (85).5 ±, ±, ±5 m to m (E4) () Please contact us when resistors of irregular series are needed. R < 39m Ω : ±5 R > 39m Ω : ±5 R < 5m Ω : ±3 R > 5m Ω : ± 55 to to +55 ER8B (6) ±, ±, ±5 m to m (E4) m Ω < R < m Ω : ± m Ω < R < 47m Ω : ±5 47m Ω < R < m Ω : ± 55 to +55 ER6C (85).5 ±.5, ±, ±, ±5 m to 3m (E4) ±75 55 to +5 ER8C (6) ±, ±, ±5 m to 5m (E4) ±75 55 to +55 (m to 33m Ω) 55 to +5 (36m to 5m Ω) 4 Feb. 6

16 Thick Film Chip Resistors / ow Type Ratings <High power type> Power Rating () T.C.R. at 7 C Tolerance Range (inch size) ( () (%) (Ω) 6 / C) ERBS (4). to. (E4) ±3.66 ±, ±, ±5 ERBQ (4). to. (E4) ±5 ER3BS (63). to. (E4) ±3.5 ±, ±, ±5. to.9 (E4) ER3BQ (63). to 9. (E4) ± ER6DS (85) ±.5, ±,. to. (E4, E96) ±5.5 ER6DQ (85) ±, ±5. to 9. (E4, E96) ± ER6BS (85). to. (E4) ±5.33 ±, ±, ±5. to.9 (E4) ER6BQ (85). to 9. (E4) ± ER8BS (6). to. (E4) ±5.5 ±, ±, ±5. to.9 (E4) ER8BQ (6). to 9. (E4) ± ER4BS (). to. (E4) ±.5 ±, ±, ±5. to.9 (E4) ER4BQ (). to 9. (E4) ± () Please contact us when resistors of irregular series are needed. Category Temperature Range ( C) 55 to to to to to to +5 <Standard type> (inch size) ER3RS (63) ER3RQ (63) ER6RS (85) ER6RQ (85) ER8RS (6) ER8RQ (6) ER4RS () ER4RQ () ERRS (8) ERRQ (8) ERZS () ERZQ () ERTRS (5) ERTRQ (5) Power Rating at 7 C () Tolerance (%). ±, ±, ±5.5 ±, ±, ±5.5 ±, ±, ±5.5 ±, ±, ±5.5 ±, ±, ±5.5 ±, ±, ±5 ±, ±, ±5 Range (Ω). to. (E4). to.9 (E4) T.C.R. ( 6 / C) ±3. to 9. (E4) ±. to. (E4) ±5. to.9 (E4). to 9. (E4) ±. to. (E4) ±5. to.9 (E4). to 9. (E4) ±. to. (E4) ±. to.9 (E4). to 9. (E4) ±. to. (E4) ±. to.9 (E4). to 9. (E4) ±. to. (E4) ±. to.9 (E4). to 9. (E4) ±. to. (E4) ±. to.9 (E4). to 9. (E4) ± Category Temperature Range ( C) 55 to to to to to to to +5 <ow TCR type> (inch size) Power Rating at 7 C () Tolerance (%) () Range (Ω) T.C.R. ( 6 / C) Category Temperature Range ( C) ER3 (63). ±, ±5 47m to m ± 55 to +5 ER6 (85).5 ±, ±5 47m to m ± 55 to +5 ER8 (6).33 ±, ±5 47m to m ± 55 to +5 ER4 ().33 ±, ±5 m to m 55 to +5 ER (8).5 ±, ±5 m to m R < 47m Ω : ±3 55 to +5 ERD ().5 ±, ±5 4m to m R > 47m Ω : ± 55 to +5 ER (5) ±, ±5 4m to m 55 to +5 () Standard R.V. : m Ω, m Ω, 33m Ω, 39m Ω, 47m Ω, 5m Ω, m Ω, Custom R.V. : Each m Ω within upper range. 5 Feb. 6

17 Thick Film Chip Resistors / ow Type Construction Protective coating Alumina substrate Thick film resistive element Electrode (Inner) Electrode (Between) Electrode (Outer) Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure below. Rated oad (%) 55 C C 4 55 C 5 C Ambient Temperature ( C) Dimensions in mm (not to scale) Dimensions (mm) Mass(eight) (inch size) a b t [g/ pcs.] ER (4). ± ±..5 ±..4 ±.5.8 ERB (4). ± ±..4 ±..35 ±.5.8 ERBS (4) ERBQ. ± ±..7 ±..35 ± t b a ER3 (63).6 (5m Ω).8 ±.5.5 ±..5 ±..55 ± 3 ER3 (m Ω) (63).6 ±.5.8 ±.5.4 ±..4 ±..55 ± 3 ER3B ER3R ER3B (63).6 ± ±..3 ±.5.45 ±. ER3 ER6 (85). ±..5 ±..63 ±..63 ±..7 ±. 6 ER6B (85). ±..5 ±..55 ±..55 ±..65 ±. 6 ER6C.6 ( to 3m Ω).6 ±..5 ±..3 ±..65 ±. ER6C.45 (5 to 3m Ω).45 ±. 6 ER6D (85). ±..5 ±..4 ±..55 ±.5.6 ±. 5 ER6R ER6B (85). ±..5 ±..4 ±..4 ±..6 ±. 5 ER6 ER8B (6) 3. ±..6 ±.. ±.. ±..65 ±. 3 ER8C ( to 6m Ω) 3. ±..6 ±.. ±.. ±..65 ±. 3 ER8C (8 to 5m Ω) 3. ±..6 ±..6 ±..6 ±..65 ±. 3 ER8R ER8B (6) ±..5 ±..6 ±. ER8 ER4R ER4B () 3. ±..5 ±..5 ±..5 ±..6 ±. 6 ER4 ERR (8) ER 4.5 ±. 3. ±..5 ±..5 ±..6 ±. 7 ERZ () ERD 5. ±..5 ±..6 ±..6 ±..6 ±. 7 ERTR (5) ER 6.4 ±. 3. ±..65 ±..6 ±..6 ± ±. 3. ±..65 ±..3 ±.. ± Feb. 6

18 Current Sensing Resistors, Metal Plate Type Current Sensing Resistors, Metal Plate Type Type: ER MP, MP3, MP4 Features Ideal for current sensing solution Small case size with high power Metal plate bonding technology. Excellent long term stability Outer Resin with high heat dissipation. ide temperature range ( 65 C to +7 C) AEC-Q qualifi ed RoHS compliant ISO9, ISO/TS6949 certifi ed As for Packaging Methods, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E R M P 4 P F M U Product Type Power Rating Tolerance Value Packaging Methods Metal Plate Tolerance Packaging Chip Resistors F ± % Embossed Carrier Taping 4 mm pitch, 3, pcs. P P3 P4 Inch size 6 5 K M P Q Rating.5 3 Shown by 3 digits or letters.decimal point is expressed by M as M=m Ω M=m Ω U Embossed Carrier Taping 4 mm pitch,, pcs. ERMP ERMP3 ERMP4 Ratings (inch size) Power Rating at 7 C () Range (mω) ERMPK (6).5 to 5 ERMPM (6) to 33 ERMP3K ().5 to 5 ERMP3M () to 33 ERMP3P () to ERMP4M (5) to 5 ERMP4P (5) to 33 ERMP4Q (5) 3 to 5 Tolerance (%) T.C.R. ( 6 / C) Category Temperature Range ( C) F : ± ±75 65 to +7 F : ± ±75 65 to +7 F : ± ±75 65 to +7 Regular resistance : m Ω, m Ω, 3m Ω, 5m Ω, m Ω, 5m Ω, m Ω, m Ω, 5m Ω, 3m Ω, 33m Ω, 5m Ω Please contact us when resistors of irregular series are needed. Please contact us when T.C.R. assurance within ±5-6 / C is needed. Power Derating Curve If the ambient temperature of the resistor is more than ambient temperature upper limit value of the rated table, please reduce the rated power according to the Power Derating Curve shown in the figure on the right. Rated Power (%) 8 65 C 7 C C Ambient Temperature ( C) May. 6 7

19 Current Sensing Resistors, Metal Plate Type Construction Resistive Element (Metal Plate) Insulator Surfase Treatment (Ni/Sn) Protective Resin Electrode (Metal) Dimensions in mm (not to scale), Recommended and Pattern t b A c and Pattern a (inch size) ERMP (6) ERMP3 () ERMP4 (5) Value (Ω) Dimension (mm) Recommended and Pattern (mm) Mass (eight) (g/ pcs.) A t a b c m.4± ±.5 m 3.±.5.6±.5.64±.5 3m to 5m ±.5 6m to 5m.5±.5 m 5.±.5.5±.5.47±.5.9± m to 6m.64±.5 7m to 5m.5± m.±.5.9±.5 m to 4m ±.5 3.±.5 5m, 6m.±.5.64±.5 7m to 5m.76± Typical Temperature dependence of electrical resistance Change of (%) Temperature ( C) ong-term stability oad ife 7 C, Rated power Thermal Shock 55 C/55 C Change of (%) ERMPKF5MU ERMP4PF5MU ERMP3MF5MU Test Time (hrs) Change of (%) ERMPKF5MU ERMP4PF5MU ERMP3MF5MU Test Time (hrs) May. 6 8

20 Current Sensing Resistors, Metal Plate Type Maximum pulse energy respectively pulse power for continuous operation Referance Data Condition : Room Temperature, OFF : s, cycle, ave form : Square Change of =± % ERMP type Pulse Energy (). ERMP m Ω ERMP 5m Ω ERMP m Ω.. Power (). ERMP 33m Ω ERMP 5m Ω Pulse width (s). ERMP3 type Pulse Energy (). ERMP3 m Ω ERMP3 5m Ω ERMP3 m Ω ERMP3 5m Ω ERMP3 33m Ω.. Power () Pulse width (s). ERMP4 type Pulse Energy (). ERMP4 m Ω ERMP4 m Ω ERMP4 5m Ω ERMP4 5m Ω ERMP4 33m Ω.. Power () Pulse width (s). May. 6 9

21 Current Sensing Resistors, Metal Plate Type Performance (AEC-Q) Test Item Test Condition Specification Typical value Thermal Shock 55 C/55 C, cycles ± %. % Overload 3 Rated Power, 5 sec ±.5 %. % Solderability 45 C, 3 sec > 95% coverage > 95% coverage to Solvents MI-STD- method 5,.a,.d No damage No damage ow Temperature Storage and Operation 65 C, 4 h ±.5 %.3 % to Soldering Heat MI-STD- method (6 C, s) ±.5 %. % Moisture MI-STD- method 6 ±.5 %. % Shock MI-STD- method 3-A ±.5 %. % Vibration, High Frequency to (Hz) ±.5 %.5 % ife 7 C, Rated Power, h ± %.3 % Storage ife at Elevated Temperature 7 C, h ± %.3 % High Temperature Characteristics 4 C, h ±.5 %.5 % Frequency Characteristics Inductance < 5 nh < nh Sense terminal-ayout Sense terminal and May. 6

22 Current Sensing Resistors, Metal Plate Type Current Sensing Resistors, Metal Plate Type Type: ER MS4, MS6, MB Features Ideal for current sensing solution Small case size with high power Metal plate bonding technology. Excellent long term stability Outer Resin with high heat dissipation. ide temperature range (-65 C to +7 C) AEC-Q qualifi ed RoHS compliant ISO9, ISO/TS6949 certifi ed As for Packaging Methods, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E R M S 4 S F M U Product Type Tolerance Value Packaging Methods Metal Plate Tolerance Packaging Chip Resistors F ± % S4S S4H S6S BS Inch size Electrode type Standard Narrow Standard Standard Shown by 3 digits or letters.decimal point is expressed by M as.m Ω=M,.5m Ω=M5,.m Ω= U Embossed Carrier Taping 4 mm pitch,, pcs. Embossed Carrier Taping 8 mm pitch,, pcs. Embossed Carrier Taping 4 mm pitch,, pcs. ERMS4 ERMS6 ERMB Ratings (inch size) ERMS4S (5) ERMS4H (5) ERMS6S (56) ERMBS () Power Rating at 7 C () Range (mω) Tolerance (%) T.C.R. ( 6 / C) Category Temperature Range ( C) Terminal temp. upper limit ( C) 3,, 3, 4 F : ± ±75 65 to , 6 F : ± ±75 65 to , 8, 9, F : ± ±75 65 to ,, F : ± ±75 65 to +7 3,, 3, 4, 5 F : ± ±75 65 to +7 3 Please contact us when resistors of irregular series are needed. Power Derating Curve If the terminal temperature of the resistor is more than terminal temperature upper limit value of the rated table, please reduce the rated power according to the Power Derating Curve shown in the figure on the right. <Supplemented> In the case of the temperature measurement of the terminal portion of the resistor, Please perform under the following conditions. ) Tarminal temperature measurement, please apply the temperature of the higher of either the left or right electrode upper surface of the resistor. ) Please measure the temperature of the resistor in the land pattern printed of circuit board and plan to use by real conditions. Rated oad (%) C C 3 C ERMS4H (7 to m Ω) Terminal Temperature ( C) 7 C 3 un. 6

23 Current Sensing Resistors, Metal Plate Type Construction Protective Film Surface Treatment (Ni/Sn) Electrode (Metal) Resistive Element (Metal Plate) Dimensions in mm (not to scale), Recommended and Pattern ERMS4S/ERMS4H ERMS6S ERMBS t t t A A A b b b c a c a c a and Pattern (inch size) ERMS4S (5) ERMS4H (5) ERMS6S (56) ERMBS () Dimension (mm) Recommended and Pattern (mm) Mass (eight) (g/ pcs.) A t a b c 6.4±.5 3.±.5.±.5.± ±.5 3.±.5.5±.5.± ±.5 6.8±.5.±.5.± ±.5 5.± ± Typical Temperature dependence of electrical resistance Change of (%) Temperature ( C) ong-term stability Change of (%) ERMS4SFMU 4 C Storage est Time (hrs) 3 un. 6

24 Current Sensing Resistors, Metal Plate Type Maximum pulse energy respectively pulse power for continuous operation Referance Data Condition : Room Temperature, OFF : s, cycle, ave form : Square Change of =± % ERMS4 type Pulse Energy (). ERMS4S m Ω ERMS4H 5m Ω ERMS4H m Ω.. Power () Pulse width (s). ERMS6 type ERMS6S.5m Ω ERMS6S m Ω Pulse Energy () ERMS6S 3m Ω.. Power () Pulse width (s) ERMB type Pulse Energy (). ERMBS m Ω ERMBS 3m Ω ERMBS 5m Ω.. Power () Pulse width (s). 3 3 un. 6

25 Current Sensing Resistors, Metal Plate Type Performance (AEC-Q) ERMS4, ERMS6 type Test Item Test Condition Specification Typical value Thermal Shock 55 C/55 C, cycles ± %. % Overload 3 Rated Power, 5 sec ±.5 %. % Solderability 45 C, 3 sec > 95% coverage > 95% coverage to Solvents MI-STD- method 5,.a,.d No damage No damage ow Temperature Storage and Operation 65 C, 4 h ±.5 %.3 % to Soldering Heat MI-STD- method (6 C, s) ±.5 %. % Moisture MI-STD- method 6 ±.5 %. % Shock MI-STD- method 3-A ±.5 %. % Vibration, High Frequency to (Hz) ±.5 %.5 % ife 7 C, Rated Power, h ± %.3 % Storage ife at Elevated Temperature 7 C, h ± %.3 % High Temperature Characteristics 4 C, h ±.5 %.5 % Frequency Characteristics Inductance < 5 nh < nh ERMB type Test Item Test Condition Specification Typical value Thermal Shock 55 C/55 C, cycles ± %.3 % Overload.5 Rated Power, 5 sec ± %.3 % Solderability 45 C, 3 sec > 95% coverage > 95% coverage to Solvents MI-STD- method 5,.a,.d No damage No damage ow Temperature Storage and Operation 65 C, 4 h ±.5 %.3 % to Soldering Heat MI-STD- method (6 C, s) ±.5 %. % Moisture MI-STD- method 6 ±.5 %. % Shock MI-STD- method 3-A ±.5 %. % Vibration, High Frequency to (Hz) ±.5 %.5 % ife 7 C, Rated Power, h ± %.3 % Storage ife at Elevated Temperature 7 C, h ± %.3 % High Temperature Characteristics 4 C, h ±.5 %.5 % Frequency Characteristics Inductance < 5 nh < nh ( C) Temperature Rise ERMS4HF5MU ERMS6SFMU ERMBSF3MU () Temperature Rise ( C) Power () Temperature Rise ( C) Power () <Condition> Base material : FR-4 (t.6mm) Copper Thickness : 7 µm, Two layer Resistor Soldering PB Sense terminal-ayout and Sense terminal 3 4 un. 6

26 Current Sensing Resistors, Metal Plate Type Current Sensing Resistors, Metal Plate Type Type: ERM Features ow resistance values and high precision ( mω to mω) Stable resistance not infl uenced by measurement position High heat emission ow profi le, strong body Inductance less than. nh for the metal plate structure RoHS compliant As for Packaging Methods, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E R M S F 3 M U Product Thick Film Chip Resistors Size, Power Rating M Inch 5 Power R. S T Type General type ide terminal type Tolerance F Tolerance ± % ± 5 % Packaging Methods Packaging Embossed Carrier Taping U 4 mm pitch, 3, pcs. Value Shown by 3 digits or letters. Decimal point is expressed by M as 3 mω=3m, mω=m Ratings (inch size) ERMS (5) ERMT (5) Power Rating at 7 C () Standard (mω) Tolerance (%) Please contact the factory for other values and the range T.C.R. ( -6 / C) 3, 4 ±35 5, 6,, 5, ± F: ±, : ±5,.5 35±, 3, 4 ±5 Category Temperature Range ( C) 55 to +7 Circuit board of use You should use the aluminum substrate when the added watt age exceeds.5. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) C 55 C 7 C Ambient Temperature ( C) 8 5 Oct. 4

27 Current Sensing Resistors, Metal Plate Type Construction Dimensions in mm (not to scale) a T Terminal; Plated Metal Protective coating; Resin Resistive Body; Alloy Plate Type (inch size) S Type ERMS (5) T Type ERMT (5) Dimensions (mm) T a Mass (eight) [g/ pcs.] 6.4 ±.5 3. ±.5.8 ±.3. ± ±.4. ±.3 9 Recommended and Pattern An example of a land pattern a b iring pattern (copper trace) and pattern c Solder resist Dimensions (mm) a b c ERMS ERMT Oct. 4

28 High Power Chip Resistors / ide Terminal Type High Power Chip Resistors / ide Terminal Type Type: ER A, B, B, B3 Features High solder-joint reliability by wide terminal con struc tion Excellent heat dissipation characteristics by wide terminal construction AEC-Q qualifi ed RoHS compliant Recommended Applications Automotive electronic circuits including ECUs (Electrical control unit), anti-lock breaking systems and air-bag systems Current sensing for power supply circuits in a variety of equipment As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E R A A U Product Thick Film Chip Resistors A B B B3 Size, Power Rating Inch Power R..33, ( R < Ω ).75, ( R < Ω ).33,.5 ( R < Ω ) Value Region A B C D Ω < R. Ω < R < Ω. Ω < R <. Ω.5 Ω < R <. Ω Tolerance F G ± % ± % ± 5 % Value Shown by 3 digits or letters. Only when it is impossible, shown by 4 digits or letters. (Ex.) :. kω R :. Ω = mω 4R7 : 4.7 Ω R5 :.5 Ω = 5 mω V Packaging Methods Packaging U Punched Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 4, pcs. ERB ERB3 ERB ERA Ratings (inch size) ERA (5) ERB () ERB (6) ERB3 (58) Power Rating at 7 C ().75 (R < Ω) imiting Element Voltage () (V) Maximum Overload Voltage () (V) 4 Tolerance (%) Range (Ω) 5 m to 9 m : mω step ( ) T.C.R. ( 6 / C) ± m to k (E4) R < mω : ± mω < R : ± (±%) ±, ±5 m to k (E4) ± (±%, ±5%) R < mω : ±35 mω < R < 47 mω : ± 47 mω 4 ±, ±, ±5 m to k (E4) < R < mω : ±5 (±%) (R < Ω) ± (±%, ±5%) mω < R : ± (±%) ± (±%, ±5%) ±, ± m to M (E4) R < mω : to +3 mω < R < 47 mω : to (R < Ω) ±5 5 m to M m to M : E4 5 ±, ±, ±5 m to (E4) 47 mω < R < mω : to +5 mω < R < mω : to +5 (±%) to + (±%, ±5%) mω < R : ± (±%) ± (±%, ±5%) R < 47 mω : to mω < R < Ω : to + Ω < R : ± (±%) ± (±%, ±5%) Category Temperature Range ( C) 55 to to to to +55 () Rated Continuous orking Voltage (RCV) shall be de ter mined from RCV= Power Rating Re sis tance Values, or imiting Element Voltage list ed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=.5 RCV or max. Over load Volt age list ed above which ev er less. 6 7 Apr. 5

29 High Power Chip Resistors / ide Terminal Type Construction (Example : ERA type) Protective coating Thick film resistive element Electrode (Inner) Electrode (Outer) Alumina substrate Electrode (Between) Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure below. Rated oad (%) C 7 C 55 C Ambient Temperature ( C) Dimensions in mm (not to scale) ERA type ERB type fd P A A B B B T ( R< mω ) ( mω < R < MΩ ) T T b b a a R l b b a a B C Di men sions (mm) Di men sions (mm) Mass (eight) [ pcs.] : 4 g T A B 3.±. 6.4±..55±..7±..45±. A B P D C.7±..5±.5.7± min. Mass (eight) [ pcs.] : g Di men sions (mm) T a b 5 mω<r< mω.65±.5.3±..3±. mω<r< mω.6±.5 3.±..55±.5.5±. mω<r< MΩ.5±. ERB type T l 3 b b T a a b b ERB3 type a a Di men sions (mm) Mass (eight) [ pcs.] : 7 g T a b.5±. 5.±..55±..5±..9±. Di men sions (mm) Mass (eight) [ pcs.] : 4.8 g T a b.5±..±.5.5±..5±..4±. 6 8 Apr. 5

30 High Power Chip Resistors / ide Terminal Type Circuit Configuration ERA type ERB type ERB3 type R R R R R R R R R R ERB type < ess than mω > < ow resistance zone > < High resistance zone > R R R R R R R 6 9 Apr. 5

31 High Precision Thick Film Chip Resistors High Precision Thick Film Chip Resistors Type: ER PB3, PB6 Features Achieve the resistance tolerance ±. % with high reliability metal glaze thick fi lm resistor Guarantee the temperature coeffi cient of ±5 6 / C in high resistance range up to M Ω Suitable for both refl ow and fl ow soldering High power. : 63 inch / 68 mm size (ERPB3).5 : 85 inch / mm size (ERPB6) Reference Standards IEC 65-8, IS C 5-8, EIA RC-34B AEC-Q qualifi ed RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E R P B 6 B V Product Thick Film Chip Resistors Size, Power Rating PB3 PB6 Inch Power R...5 Tolerance B D Tolerance ±. % ±.5 % Value The first three digits are significant figures of resistance and the last one denotes number of zeros following. Example : 5 5 Ω : 3 k Ω Packaging Methods Packaging Punched Carrier Taping V 4 mm pitch, 5, pcs. ERPB3 ERPB6 Construction Dimensions in mm (not to scale) Protective coating Electrode (Inner) a Alumina substrate Electrode (Between) t b Thick fi lm resistive element Electrode (Outer) (inch size) ERPB3 (63) ERPB6 (85) Dimensions (mm) a b t Mass (eight) [g/ pcs.].6 ± ±..45 ±..5.. ±..5 ±..5 ±..4 ±..6 ±. 4 3 Feb. 6

32 High Precision Thick Film Chip Resistors Ratings (inch size) Power Rating (3) at 7 C () imiting Element Voltage () (V) Maximum Overload Voltage () (V) Tolerance (%) Range (Ω) T.C.R. ( 6 / C) Category Temperature Range ( C) ERPB3 (63). 5 ±. ±.5 to k (E4, E96) ±5 55 to +55 ERPB6 (85).5 5 ±. ±.5 to M (E4, E96) ±5 55 to +55 () Rated Continuous orking Voltage (RCV) shall be de ter mined from RCV= Power Rating Re sis tance Values, or imiting Element Voltage list ed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=.5 RCV or max. Over load Volt age list ed above which ev er less. (3) Use it on the condition that the case temperature is below 55 C. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the fi gure on the right. Rated oad (%) 55 C 7 C C Ambient Temperature ( C) 3 Feb. 6

33 Anti-Surge Thick Film Chip Resistors Anti-Surge Thick Film Chip Re sis tors Type: ER PA, P3, PA3, P6, P8, P4 Features ESD surge characteristics superior to standard metal fi lm resistors High reliability Metal glaze thick fi lm resistive element and three layers of electrodes Suitable for both refl ow and fl ow soldering High power. : 4 inch / 5 mm size (ERPA), 63 inch / 68 mm size (ERP3).5 : 63 inch / 68 mm size (ERPA3).5 : 85 inch / mm size (ERP6), inch / 35 mm size (ERP4).66 : 6 inch / 36 mm size (ERP8) Reference Standards IEC 65-8, IS C 5-8, EIA RC-34B AEC-Q qualifi ed RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E R P 6 D V Product Thick Film Chip Resistors Size, Power Rating PA P3 PA3 P6 P8 P4 Inch Power R Tolerance D F Tolerance ±.5 % ± % ± 5 % Value The first two or three digits are significant figures of resistance and the third or 4th one denotes number of zeros following. Three digit type (±5 %), four digit type (± %, ±.5 %) Example:.k Ω, k Ω V U Packaging Methods Packaging Punched Carrier Taping X mm pitch,, pcs. Punched Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 5, pcs. ERPA ERP3 ERPA3 ERP6 ERP8 ERP4 Construction Dimensions in mm (not to scale) a Protective coating Electrode (Inner) Alumina substrate t Thick fi lm resistive element Electrode (Between) Electrode (Outer) (inch size) ERPA (4) ERP3 (63) ERPA3 (63) ERP6 (85) ERP8 (6) ERP4 () b Dimensions (mm) a b t Mass (eight) [g/ pcs.]. ±.5.5 ±.5. ±.5.5 ±.5.35 ± ± ±.5.45 ± ± ±..45 ±..5.. ±..5 ±..5 ±..4 ±..6 ± ±..5 ±..6 ±. 3. ±..5 ±..35 ±..5 ±..6 ±. 6 3 Feb. 6

34 Anti-Surge Thick Film Chip Resistors Ratings (inch size) ERPA (4) ERP3 (63) ERPA3 (63) ERP6 (85) ERP8 (6) ERP4 () Power Rating (3) at 7 C () imiting Element Voltage () (V) Maximum Overload Voltage () (V) Tolerance (%) Range (Ω) T.C.R. ( 6 / C) ±.5, ± to M (E4, E96) ± ±5 to M (E4) ± ±.5 to M (E4, E96) ±5 ± to M (E4, E96) ± ±5 to M (E4) R < Ω : 5 to +4 Ω < R : ± ±.5, ± to M (E4, E96) ± ±5 to.5m (E4) ± ±.5, ± to M (E4, E96) R < 33 Ω : ±3 33 Ω < R : ± R < Ω : to +6 ±5 to 3.3M (E4) Ω < R < 33 Ω : ±3 33 Ω < R : ± ±.5, ± to M (E4, E96) ± ±5 to M (E4) R < Ω : to +6 Ω < R : ± ±.5, ± to M (E4, E96) ± ±5 to M (E4) R < Ω : to +6 Ω < R : ± Category Temperature Range ( C) 55 to to to to to to +55 () Rated Continuous orking Voltage (RCV) shall be de ter mined from RCV= Power Rating Re sis tance Values, or imiting Element Voltage list ed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=.5 RCV or max. Over load Volt age list ed above which ev er less. (3) Use it on the condition that the case temperature is below 55 C. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the fi gure on the right. hen the temperature of ERP4 is 55 C or less, the derating start temperature can be changed to 5 C. (See the dotted line) Rated oad (%) 55 C C ER PA, P3, PA3, P4 5 C ER P6, P8 55 C Ambient Temperature ( C) 33 Feb. 6

35 Anti-Surge Thick Film Chip Resistors ESD Characteristic R= Ω(<.5k Ω)/5 Ω(>.5k Ω) E C=5p F Sample 4 inch size : E=±k V 63, 85, 6, inch size : E=±3k V Anti-Surge Thick Film Chip Resistors(ERP Type) Thick Film Chip Resistors(ER Type) Change Ratio of Value 5% % -5% -% -5% -% -5% -3% ERPA (4 inch /5 mm size) ERPA ERG Ω Ω k Ω k Ω k Ω M Ω Change Ratio of Value 5% % -5% -% -5% -% -5% -3% ERP3, PA3 (63 inch /68 mm size) ERPA3 ERP3 ER3G Ω Ω k Ω k Ω k Ω M Ω Change Ratio of Value 5% % -5% -% -5% -% -5% -3% ERP6 (85 inch / mm size) ERP6 ER6G Ω Ω k Ω k Ω k Ω M Ω Change Ratio of Value 5% % -5% -% -5% -% -5% -3% ERP8 (6 inch / 36 mm size) ERP8 ER8G Ω Ω k Ω k Ω k Ω M Ω Change Ratio of Value 5% % -5% -% -5% -% -5% -3% ERP4 ( inch / 35 mm size) ERP4 ER4 Ω Ω k Ω k Ω k Ω M Ω 34 Feb. 6

36 Anti-Pulse Thick Film Chip Resistors Anti-Pulse Thick Film Chip Re sis tors Type: ER T6, T8, T4 ER T4 Features Anti-Pulse characteristics High pulse characteristics achieved by the optimized trimming specifi cations (ERT6, T8, T4) Further high pulse characteristics achieved by trimming-less specifi cations (ERT4) High reliability Metal glaze thick fi lm resistive element and three layers of electrodes Suitable for both refl ow and fl ow soldering High power.5 : 85 inch / mm size (ERT6).33 : 6 inch / 36 mm size (ERT8).5 : inch / 35 mm size (ERT4, ERT4) Reference Standards IEC 65-8, IS C 5-8, EIA RC-34B AEC-Q qualifi ed RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers ERT6, T8, T4 Type E R T 6 V Product Thick Film Chip Resistors T6 T8 T4 Size, Power Rating Inch 85 6 Power R Tolerance Tolerance ± 5 % V U Packaging Methods Packaging Punched Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 5, pcs. ERT6 ERT8 ERT4 Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. Example:. kω ERT4 Type E R T 4 M U Product Thick Film Chip Resistors T4 Size, Power Rating Inch Power R..5 Product specifications Specifications Trimming-less Tolerance K M Tolerance ± % ± % U Packaging Methods Packaging Embossed Carrier Taping 4 mm pitch, 5, pcs. ERT4 Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. Example:. kω Please contact us for (mm) and 36 (mm) size trimming-less types Nov. 5

37 Anti-Pulse Thick Film Chip Resistors Construction Dimensions in mm (not to scale) Protective coating Alumina substrate Electrode (Inner) a t Electrode (Between) b (inch size) ERT6 (85) Dimensions (mm) a b t Mass (eight) [g/ pcs.]. ±..5 ±..5 ±..4 ±..6 ±. 4 Thick fi lm resistive element Electrode (Outer) ERT8 (6) ERT4 ERT4 () ±..5 ±..6 ±. 3. ±..5 ±..35 ±..5 ±..6 ±. 6 Ratings (inch size) ERT6 (85) Power Rating at 7 C () imiting Element Voltage () (V) Maximum Overload Voltage () (V) Tolerance (%).5 5 ±5 Range (Ω) to M (E4) T.C.R. ( 6 / C) ess than Ω : to +6 ess than 33 Ω : ±3 More than 33 Ω : ± Category Temperature Range ( C) 55 to +55 ERT8 (6).33 4 ±5 to M (E4) ess than Ω : to +6 More than Ω : ± 55 to +55 ERT4 ().5 4 ±5 to M (E4) ess than Ω : to +6 More than Ω : ± 55 to +55 ERT4 ().5 4 ± ± to M (E) ess than Ω : to +6 More than Ω : ± 55 to +55 () Rated Continuous orking Voltage (RCV) shall be de ter mined from RCV= Power Rating Re sis tance Values, or imiting Element Voltage list ed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be de termined from SOTV=.5 RCV or max. Over load Volt age list ed above which ev er less. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C 7 C C Ambient Temperature ( C) 6 36 Nov. 5

38 Anti-Pulse Thick Film Chip Resistors imiting Power Curve In rush pulse Characteristic Pp imiting Power Pulse duration : t Period time : s Test cycle : cycles Spec : value = within ±5% : Anti-Pulse Thick Film Chip Resistors (ERT4 Type) : Anti-Pulse Thick Film Chip Resistors (ERT Type) : Thick Film Chip Resistors (ER Type) ERT6 (85 inch/ mm size) ERT8 (6 inch/36 mm size) ERT4,ERT4 ( inch/35 mm size) imiting Power : Pp () Pulse duration t (msec) imiting Power : Pp () Pulse duration t (msec) imiting Power : Pp () Pulse duration t (msec) Please contact us for (mm) and 36 (mm) size trimming-less types Nov. 5

39 Anti-Sulfurated Thick Film Chip Resistors Anti-Sulfurated Thick Film Chip Resistors Type: ER S, S3, S6, S8, S4, S, SD, ST (Au-based inner electrode type) Type: ER U, U, U3, U6, U8, U4, U, UD, UT, U6S, U6Q (Ag-Pd-based inner electrode type) Features High resistance to sulfurization achieved by adopting an Au-based inner electrode (ERS type) and Ag-Pd-based inner electrode (ERU type) High reliability Metal glaze thick fi lm resistive element and three layers of electrodes Suitable for both refl ow and fl ow soldering ow type ERU6S, U6Q :. Ω to. Ω Reference Standard IEC 65-8, IS C 5-8, EIA RC-34B AEC-Q qualifi ed (Exemption ERU) RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers ERS, S, U, U Type E R S 6 F V Product Thick Film Chip Resistors Inch U S U 4 S3 U3 63 S6 U6 85 S8 U8 6 Size, Power Rating Power R. Inch.5 S4 U4. S U 8. SD UD.5 ST UT 5.5 Power R Tolerance F Tolerance ± % ± 5 % umper Value The first two or three digits are significant figures of resistance and the third or 4th one denotes number of zeros following. umper is expressed by R. Three digit type (±5%), four digit type (±%) Example:. kω, kω Packaging Methods Packaging C Pressed Carrier Taping mm pitch, 5, pcs. ERU X Punched Carrier Taping mm pitch,, pcs. ERS, ERU V U Punched Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 5, pcs. Embossed Carrier Taping 4 mm pitch, 4, pcs. ERS3, ERU3 ERS6, ERU6 ERS8, ERU8 ERS4, ERU4 ERS, ERU ERSD, ERUD ERST, ERUT ERU6S, U6Q Type E R U 6 S R V U6 Product Thick Film Chip Resistors Size, Power Rating Inch 85 Power R..5 Value Res. Value S Q. Ω to. Ω. Ω to Ω Tolerance F G Tolerance ± % ± % ±5 % Value Shown by 3 digits or letters. (Example) R :. Ω= mω R :. Ω= mω V Packaging Methods Packaging Punched Carrier Taping 4 mm pitch, 5, pcs. ERU6S ERU6Q 8 38 Apr. 5

40 Anti-Sulfurated Thick Film Chip Resistors Construction Protective coating Alumina substrate Thick fi lm resistive element Electrode (Inner) Au-based : ERS type Ag-Pd-based: ERU type Electrode (Between) Electrode (Outer) Dimensions in mm (not to scale) t b a Dimensions (mm) Mass (eight) (inch size) a b t [g/ pcs.] ERU ().6 ±.3.3 ±.3. ±.5.5 ±.5.3 ±.3.5 ERS (4) ERU. ±.5.5 ±.5. ±..5 ±..35 ±.5.8 ERS3 (63) ERU3.6 ± ±..3 ±.5.45 ±. ERS6 (85) ERU6. ±..5 ±..4 ±..4 ±..6 ±. 4 ERU6 (85). ±..5 ±..45 ±..45 ±..55 ±. 6 ERS8 (6) ERU ±..5 ±..6 ±. ERS4 () ERU4 3. ±..5 ±..5 ±..5 ±..6 ±. 6 ERS (8) ERU 4.5 ±. 3. ±..5 ±..5 ±..6 ±. 7 ERSD () ERUD 5. ±..5 ±..6 ±..6 ±..6 ±. 7 ERST (5) ERUT 6.4 ±. 3. ±..65 ±..6 ±..6 ±. 45 Ratings (inch size) PowerRating at 7 C () imiting Element Voltage () (V) Maximum Overload Voltage () (V) ERU () ERS ERU (4) ERS3 ERU3 (63) ERS6 ERU6 (85) ERS8 ERU8 (6) ERS4 ERU4 () ERS ERU (8) ERSD ERUD () ERST ERUT (5) Tolerance (%) Range (Ω) ± to M (E4, E96) ±5 to M (E4) ± to M (E4, E96) ±5 to 3.3 M (E4) ± to M (E4, E96) ±5 to M (E4) ± to M (E4, E96) ±5 to M (E4) ± to M (E4, E96) ±5 to M (E4) ± to M (E4, E96) ±5 to M (E4) ± to M (E4, E96) ±5 to M (E4) ± to M (E4, E96) ±5 to M (E4) ± to M (E4, E96) ±5 to M (E4) T.C.R. ( -6 / C ) < Ω: to +6 Ω to MΩ: ±(±5%) ±(±%) ERU, ERS, ERU : ± MΩ<: 4 to +5 Category Temperature Range ( C) -55 to to to to to to to to to +55 () Rated Continuous orking Voltage (RCV) shall be determined from RCV= Power Rating Values, or imiting Element Voltage listed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=.5 RCV or max. Overload Voltage listed above whichever less. [ow type] (inch size) ERU6S (85) ERU6Q (85) PowerRating at 7 C () Tolerance (%).5 ±, ±, ±5 Range (Ω). to. (E4). to (E4) T.C.R. ( -6 / C ) Category Temperature Range ( C) ±5-55 to Apr. 5

41 Anti-Sulfurated Thick Film Chip Resistors [For umper] (inch size) Rated Current (A) ERU ().5 ERS ERU (4) ERS3 ERU3 (63) ERS6 ERU6 (85) ERS8 ERU8 (6) ERS4 ERU4 () ERS ERU (8) ERSD ERUD () ERST ERUT (5) Maximum Overload Current (A) 4 Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure below. Rated oad (%) 55 C C 4 ERU 5 C 55 C Ambient Temperature ( C) 8 4 Apr. 5

42 Anti-Sulfurated High Power Chip Resistors / ide Terminal Type Anti-Sulfurated High Power Chip Resistors / ide Terminal Type Type: ER C Features High resistance to sulfurization achieved by adopting Anti-Sulfurated electrode structure and material High solder-joint reliability by wide terminal con struc tion Excellent heat dissipation characteristics by wide terminal construction AEC-Q qualifi ed RoHS compliant Recommended Applications Motor control circuit of the industrial equipment Automotive electronic circuits including ECUs (Electrical control unit), anti-lock breaking systems and air-bag systems Current sensing for power supply circuits in a variety of equipment As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E R C C F R U Product Thick Film Chip Resistors Size, Power Rating C Inch Power R. Value Region B C mω < R < Ω mω < R < mω Tolerance F ± % ± 5 % Packaging Methods Packaging U Embossed Carrier Taping 4 mm pitch, 5, pcs. ERC Value Shown by 3 digits or letters. Only when it is impossible, shown by 4 digits or letters. (ex.) R :. Ω = mω R5 :.5 Ω = 5 mω Construction Dimensions in mm (not to scale) Protective coating Alumina substrate Electrode (Inner) Ag-Pd-based : ERCB type Covered Electrode : ERCC type l 3 a a T b Electrode (Between) b Thick fi lm resistive element Electrode (Outer) (inch size) ERCB () ERCC () Di men sions (mm) T a b Mass (eight) [g/ pcs.].35±..5±. 5.±..55±..9±. 7.6±. 4 4 Sep. 4

43 Anti-Sulfurated High Power Chip Resistors / ide Terminal Type Circuit Configuration Type ERC R R R Ratings (inch size) ERC () Power Rating at 7 C () () Tolerance (%) ± ±5 Range (Ω) m to (E4) T.C.R. ( -6 / C ) mω < R < mω : ±35 mω < R < 47 mω : ± 47 mω < R < mω : ±5 mω < R < Ω : ± mω < R < mω : ±35 mω < R < Ω : ± Category Temperature Range ( C) 55 to +55 () Use it on the condition that the case temperature is below 55 C. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C 7 C C Ambient Temperature ( C) 4 4 Sep. 4

44 Chip Resistor Array Chip Resistor Array Type: EXB 4V, 8V, 4V, 8V, N8V, HV, 34V, V4V, 38V, V8V, S8V Features High density resistors in.8 mm.6 mm size / 3 inch size : EXB4V 4 resistors in.4 mm.6 mm size / 5 inch size : EXB8V resistors in. mm. mm size / 44 inch size : EXB4V 4 resistors in. mm. mm size / 84 inch size : EXB8V, EXBN8V 8 resistors in 3.8 mm.6 mm size / 56 inch size : EXBHV resistors in.6 mm.6 mm size / 66 inch size : EXB34V, EXBV4V 4 resistors in 3. mm.6 mm size / 6 inch size : EXB38V, EXBV8V 4 resistors in 5. mm. mm size / 9 inch size : EXBS8V Improvement of placement effi ciency Placement effi ciency of Chip Resistor Array is two, four or eight times of the fl at type chip resistor Reference Standard IEC 65-9, IS C 5-9, EIA RC-9 AEC-Q qualifi ed (EXB, EXB3) RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E X B V 8 V 4 7 V Product Thick Film Chip Resistor Networks Size and construction No. of Terminal Schematics Value Packaging Methods Inch Terminal type 4 4 Terminal V Isolated The first two digits are Tolerance Packaging Convex/ Array 8 8 Terminal type significant figures of ±5 % Embossed Carrier Taping Flat Terminal H 6 Terminal resistance value and Nil EXBS8V umper 4 mm pitch,,5 pcs. 4 Array Convex the third one denotes 3 63 Array Terminal the number of zeros Punched Carrier Taping EXB4V, 8V, X N 4 Array following. umper is mm pitch,, pcs. 4V, 8V, N8V Concave expressed by R Punched Carrier Taping EXBHV, 34V, V 63 Array Terminal V 4 mm pitch, 5, pcs. 38V, V4V, V8V S 85 Array Example :. kω Construction (Example : Concave Terminal) Schematics Isolated type 4V, 4V, 34V, V4V resistors 4 3 8V, 8V, N8V, 38V, V8V, S8V 4 resistors Protective coating 3 4 Alumina substrate Electrode (Outer) Thick film resistive element Electrode (Between) Electrode (Inner) HV 8 resistors Apr. 5

45 Chip Resistor Array Ratings Item Specifi cations Range Ω to MΩ : E4 series Tolerance : ±5 % 4V,4V,V4V,34V 4 terminal Number of Terminals 8V,8V,N8V,38V,V8V,S8V 8 terminal HV 6 terminal 4V,4V,V4V,34V element imiting Element Voltage () Maximum Overload Voltage () Item 4V,8V HV 4V,8V,N8V,38V,34V,V4V,V8V S8V 4V,8V HV 4V,8V,N8V,38V,34V,V4V,V8V S8V Specifi cations.5 V 5 V 5 V V 5 V 5 V V V Number of Resistors 8V,8V,N8V,38V,V8V,S8V 4 element T.C.R. ± -6 / C HV 4V,N8V 8V 8 element.3 /element.3 /element (. /package) Power Rating at 7 C 4V,8V,V4V,34V,V8V,38V.63 /element S8V HV. /element.63 /element (.5 /package) umper Array Category Temperature Range 55 C to 5 C 4V,8V Rated Current HV,4V,8V,N8V,38V,34V,V4V,V8V Maximum Overload Current S8V 4V,8V HV,4V,8V,N8V,38V,34V,V4V,V8V S8V.5 A A A A A 4 A () Rated Continuous orking Voltage (RCV) shall be de ter mined from RCV= Power Rating Value, or imiting Element Voltage listed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=.5 RCV or max. Overload Voltage list ed above whichever less. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C 7 C C Ambient Temperature ( C) 4 44 Apr. 5

46 Chip Resistor Array Dimensions in mm (not to scale) () Convex Terminal type A EXB4V, 4V, 34V A A EXB8V, 38V P T P T A EXBV4V A A EXBN8V, V8V, S8V B G B G B G B G P T P T A A EXB8V B G G B B G B B G G B B G G A A EXBHV P T (inch size) Dimensions (mm) Mass (eight) [g/ pcs.] T A A B P G EXB4V ( ).8 ±..6 ±..35 ±..35 ±..5 ±. (.5).5 ±..5 EXB4V (4 ). ±.. ±..35 ±..4 ±..8 ±. (.65).5 ±.. EXB8V (4 4). ±.. ±..35 ±..45 ±..35 ±.. ±. (.5).5 ±.. EXBHV (4 8) 3.8 ±..6 ±..45 ±..35 ±..35 ±..3 ±. (.5).3 ±. 9. EXB34V (63 ).6 ±..6 ±.5.5 ±..65 ±.5.3 ±. (.8).3 ±. 3.5 EXB38V (63 4) 3. ±..6 ±.5.5 ±..65 ±.5.45 ±.5.3 ±. (.8).35 ±. 7. () Concave Terminal type ( ) Reference (inch size) Dimensions (mm) Mass (eight) [g/ pcs.] T A A B P G EXBN8V (4 4). ±.. ±..45 ±..3 ±..3 ±.. ±.5 (.5).3 ±.5 3. EXBV4V (63 ) ±..6 ±..3 ±.5 (.8).45 ±.5 5. EXBV8V (63 4) ±..6 ±..6 ±..3 ±.5 (.8).45 ±.5 EXBS8V (85 4) ±..8 ±.5.8 ±.5.5 ±.5 (.7).55 ±.5 3 (3) Flat Terminal type ( ) Reference (inch size) P B T G Dimensions (mm) Mass (eight) [g/ pcs.] T A A B P G EXB8V ( 4).4±..6±..35±..±..±..±. (.4).±.. ( ) Reference 4 45 Apr. 5

47 Anti-Sulfurated Chip Resistor Array Anti-Sulfurated Chip Resistor Array Type: EXB U4, U8, UH, U34, U38 Features High resistance to sulfurization achieved by adopting an Ag-Pd-based inner electrode High density resistors in. mm. mm size / 44 inch size : EXBU4 4 resistors in. mm. mm size / 84 inch size : EXBU8 8 resistors in 3.8 mm.6 mm size / 56 inch size : EXBUH resistors in.6 mm.6 mm size / 66 inch size : EXBU34 4 resistors in 3. mm.6 mm size / 6 inch size : EXBU38 Improvement of placement effi ciency Placement effi ciency of Chip Resistor Array is two, four or eight times of the fl at type chip resistor Reference Standard IEC 65-9, IS C 5-9, EIA RC-9 AEC-Q qualifi ed RoHS compliant As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E X B U X Product Thick Film Chip Resistor Networks Size, Construction Inch U 4 Array U3 63 Array Anti-Sulfuarted Convex Terminal No. of Terminal 4 4 Terminal 8 8 Terminal H 6 Terminal Value The first two digits are significant figures of resistance value and the third one denotes the number of zeros following. umper is expressed by R Example :. kω Tolerance ±5 % umper X V Packaging Methods Packaging Punched Carrier Taping mm pitch,, pcs. Punched Carrier Taping 4 mm pitch, 5, pcs. EXBU4, U8 EXBUH, U34, U38 Construction Schematics Isolated type EXBU4, U34 resistors EXBU8, U38 4 resistors Protective coating 3 4 Alumina substrate EXBUH 8 resistors Thick film resistive element Electrode (Inner) Electrode (Between) Electrode (Outer) Apr. 5

48 Anti-Sulfurated Chip Resistor Array Dimensions in mm (not to scale) A EXBU4, U34 A A EXBU8, U38 B B G G B B G G P T P T A A EXBUH G B B G P T (inch size) Ratings Dimensions (mm) Mass (eight) [g/ pcs.] T A A B P G EXBU4 (4 ). ±.. ±..35 ±..4 ±..8 ±. (.65).5 ±.. EXBU8 (4 4). ±.. ±..35 ±..45 ±..35 ±.. ±. (.5).5 ±.. EXBUH (4 8) 3.8 ±..6 ±..45 ±..35 ±..35 ±..3 ±. (.5).3 ±. 9. EXBU34 (63 ).6 ±..6 ±.5.5 ±..65 ±.5.3 ±. (.8).3 ±. 3.5 EXBU38 (63 4) 3. ±..6 ±.5.5 ±..65 ±.5.45 ±.5.3 ±. (.8).35 ±. 7. ( ) Reference Item Specifi cations Item Specifi cations Range Ω to MΩ E4 series Tolerance : ±5 % Number of Terminals Number of Resistors Power Rating at 7 C U4, U34 4 terminal U8, U38 8 terminal UH 6 element U4, U34 element U8, U38 4 element UH 8 element U4, U8, U34, U38.63 /element UH.63 /element (.5 /package) imiting Element UH 5 V Voltage () U4, U8, U34, U38 5 V Max. Overload UH 5 V Voltage () U4, U8, U34, U38 V () Rated Continuous orking Voltage (RCV) shall be de ter mined from RCV= Power Rating Value, or imiting Element Voltage listed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=.5 RCV or max. Overload Voltage list ed above whichever less. T.C.R. ± -6 / C Category Temperature Range 55 C to 5 C umper Array Rated U4, U8, UH, U34, U38 A Current Max. Overload U4, U8, UH, U34, U38 A Current Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C 7 C C Ambient Temperature ( C) 4 47 Apr. 5

49 Chip Resistor Networks Chip Resistor Networks Type: EXBD EXBE EXBA EXBQ Features High density placing for digital signal circuits Bussed 8 or 5 resistors for pull up/down circuits EXBD: 3. mm.6 mm.55 mm,.635 mm pitch EXBE: 4. mm. mm.55 mm,.8 mm pitch EXBA: 6.4 mm 3. mm.55 mm,.7 mm pitch EXBQ: 3.8 mm.6 mm.45 mm,.5 mm pitch Available direct placing on the bus line by means of half pitch spacing without through-holes on PB ( High density placing is shown below) High speed mounting using conventional placing machine Reference Standard IEC 65-9, IS C 5-9, EIA RC-3 RoHS compliant [High density placing] Pull up resistors V CC EXBEC Direct placement on the bus line EXBAP V CC V CC IC IC No through hole IC IC IC IC Through holes.4 mm pitch.635 mm pitch As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E X B E C 3 Product Thick Film Resistor Network D E A Q Dimension of Chip Resistor Network Inch Dimensions 3. mm.6 mm 4. mm. mm 6.4 mm 3. mm 3.8 mm.6 mm Number of Terminals (EXBD,E,A) 6(EXBQ) Circuit Configuration Common Terminal Position C P P E Center common circuit (EXBD, EXBE) Diagonal common circuit (Terminal 5 and Terminal ) (EXBA) One side common circuit (Terminal 6) (EXBQ) Diagonal common circuit (Terminal and Terminal 6) (EXBA) Value The first two digits are significant figures of resistance value and the third one denotes the number of zeros following. Tolerance ±5 % Suffix for Special Requirements 48 Sep. 4

50 Chip Resistor Networks Construction (Example : EXBD) Protective coating Protective coating Electrode (Inner) Alumina substrate Thick film Electrode (Outer) resistive element Electrode (Between) Electrode (Inner) Thick film resistive element Alumina substrate Dimensions in mm (not to scale) EXBD EXBE EXBA EXBQ.±..4±.5.4±.5.33±.5 f.±..±..635±. 3.±.5.3±..5±..±..±..5±..35±.5.35±.5.6±.5.55±..5±. f ±..3±..5±..35±..5±. I3.8±. 4.±..4±..5±..5±..35±..4±..4±..±..55±..7±. f I3.7±. 6.4±..5±..5±..5±..3±..3±. 3.±. EXBAP I3.55±. EXBAE I ±. 3.8±..±. 47.5± ±.5.3±.5.6±..45±. Mass (eight)[ pcs.] : g Mass (eight)[ pcs.] : 6 g Mass (eight)[ pcs.] : 4 g Mass (eight)[ pcs.] : 9 g Circuit Configuration EXBD, EXBE EXBA EXBQ EXBAP EXBAE Ratings Item Specifi cations Series EXBD EXBE EXBA EXBQ Range 47 Ω to MΩ (E) Ω to 47 kω (E6 series) Tolerance ±5% Number of Terminals terminals 6 terminals Number of Resistors 8 element 5 element Power Rating at 7 C.5 /element.63 /element.5 /element imiting Element Voltage () 5V 5 V 5V Maximum Overload Voltage () 5 V V 5 V T. C. R. ± 6 / C Category Temperature Range 55 C to +5 C () Rated Continuous orking Voltage (RCV) shall be determined from RCV= Power Rating Value, or imiting Element Voltage listed above, whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be determinedfrom SOTV=.5 RCV or Maximum Overload Voltage list ed above which ev er less. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C 7 C C Ambient Temperature ( C) 49 Sep. 4

51 Chip Attenuator Chip Attenuator Type: EXB 4AT EXB 4AT Features Unbalanced π type attenuator circuit in one chip EXB4AT (.8 mm.6 mm), EXB4AT (. mm. mm) Reduced mounting area : EXB4AT : About 6 % smaller than the area of an attenuator circuit consisting of three 63 chip resistors, almost equal to the area of three 4 chip resistors EXB4AT : About 5 % smaller than the area of an attenuator circuit consisting of three 5 chip resistors, almost equal to the area of three 63 chip resistors Mounting cost reduction : (Only chip placed as compared to 3) Attenuation : db to db RoHS compliant Recommended Applications Attenuation / level control / impedance matching of high frequency (communication signalling equipment cellular phones(gsm, CDMA, PDC, etc.), PHS, PDAs) As for Packaging Methods, and Pattern, Soldering Conditions and Safety Precautions, Please see Data Files Explanation of Part Numbers E X B 4 A T 3 A R 3 X Product Attenuation Value Tolerance R3 ±.3 db Thick Film Resistor Network 4AT Dimensions and Circuit Configuration.8 mm.6 mm (inch size : 3) π type attenuator One-digit number /one letter shows attenuation value (ex.) db, A db R5 ±.5 db X Packaging Punched Carrier Taping mm pitch,, pcs. 4AT. mm. mm (inch size : 44) π type attenuator Characteristics Impedance A 5 Ω Attenuation (db) Attenuation-Frequency Characteristics (EXB4AT, EXB4AT) db db 3dB 4dB 5dB 6dB db 3 k k M M M G 3 G Frequency (Hz) Circuit Configuration Unbalanced π type 4 3 R R R 5 Sep. 4

52 Chip Attenuator Construction EXB4AT EXB4AT Protective coating Protective coating Thick film resistive element Electrode (Inner) Electrode (Between) Dimensions in mm (not to scale) EXB4AT Alumina substrate Electrode (Outer) Thick film resistive element Electrode (Inner) EXB4AT Alumina substrate Electrode (Outer) Electrode (Between) A 4 3 B A 4 3 B P P T C C T Di men sions (mm) T A B C P (typical value).8 ±..6 ±..35 ±..35 ±..5 ±..5 ±..5 <Marking Configuration> The bar marking for recognizing terminal direction is located on the side of terminal 3, 4. Mass (eight) [ pcs.] :.7 g Di men sions (mm) T A B C P (typical value). ±.. ±..35 ±..4 ±..5 ±..5 ±..65 <Marking Configuration> The bar marking for recognizing terminal direction is located on the side of terminal 4. Mass (eight) [ pcs.] :. g Ratings EXB4AT, EXB4AT Attenuation Value db, db, 3 db, 4 db, 5 db, 6 db, db Attenuation Value Tolerance db, db, 3 db, 4 db, 5 db : ±.3 db 6 db, db : ±.5 db Characteristic Impedance 5 Ω Power Rating.4 /package Frequency Range at 7 C DC to 3. GHz VSR (Voltage Standing ave Ratio).3 max. Number of Resistors 3 resistors Number of Terminals 4 terminals Category Temperature Range 55 C to +5 C Please inquire about the other Attenuator value Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated Power (%) C 7 C 5 C Ambient Temperature ( C) 5 Sep. 4

53 Surface Mount Resistors Packaging Method (Taping) Products Thick Film Chip Resistors Precision Thick Film Chip Resistors Metal Film (Thin Film) Chip Resistors, High Reliability Type /High Sound Quality Type Thick Film Chip Resistors/ ow Type Current Sensing Resistors, Metal Plate Type Surface Mount Resistors Series Size mm (inch) Pressed Carrier Taping ( mm pitch) Packaging (Standard Quantity : pcs./reel) Punched Carrier Taping ( mm pitch) Punched Carrier Taping (4 mm pitch) Embossed Carrier Taping (4 mm pitch) ERXGN 4(5), 4, ERGN 63() 5, ERGE 5(4),,, ER3GE 68(63) 5, ER6GE (85) 5, ER8GE 36(6) 5, ER4 35() 5, ER 453(8) 5, ERZ 55() 5, ERT 643(5) 4, ERXGN 4(5), ERGN/RH 63() 5, ERRH/RK 5(4), ER3RB/3RE/3EK 68(63) 5, ER6RB/6RE/6EN (85) 5, ER8EN 36(6) 5, ER4N 35() 5, ERN 453(8) 5, ERS 55() 5, ERTN 643(5) 4, ERAA 63() 5, ERAA/H 5(4), ERA3A 68(63) 5, ERA6A (85) 5, ERA8A 36(6) 5, ER/B 5(4), ERBS/BQ 5(4), ER3/3B/3R/3 68(63) 5, ER6/6B/6C ER6D/6R/6 (85) 5, ER8B/8C/8R/8 36(6) 5, ER4B/4R/4 35() 5, ERR/ 453(8) 5, ERZ/D 55() 5, ERTR 643(5) 4, ER 643(5) 3, ERMP 36(6) 3, ERMP3 55() 3, ERMP4 643(5), ERMS4 643(5), ERMS6 6468(56), (8 mm Pitch) ERMB 55(), ERM 643(5) 3, 8P : idth 8 mm, Pitch mm, 4P : idth 4 mm, Pitch mm () Anti-Sulfurated High Power Chip Resistors / ide Terminal Type 5 Mar. 6

54 Surface Mount Resistors Packaging Method (Taping) Products High Power Chip Resistors/ ide Terminal Type High Precision/ Anti-Surge Thick Film Chip Resistors Anti-Pulse Thick Film Chip Resistors Anti-Sulfurated Thick Film Chip Resistors Chip Resistor Array Anti-Sulfurated Chip Resistor Array Chip Resistor Networks Chip Attenuator Surface Mount Resistors Series Size mm (inch) Pressed Carrier Taping ( mm pitch) Packaging (Standard Quantity : pcs./reel) Punched Carrier Taping ( mm pitch) Punched Carrier Taping (4 mm pitch) Embossed Carrier Taping (4 mm pitch) ERA 364(5) 4, ERB/ERC () 55() 5, ERB 63(6) 5, ERB3 (58) 5, ERPA 5(4), ERPB3/P3/PA3 68(63) 5, ERPB6/P6 (85) 5, ERP8 36(6) 5, ERP4 35() 5, ERT6 (85) 5, ERT8 36(6) 5, ERT4 35() 5, ERU 63() 5, ERS/U 5(4), ERS3/U3 68(63) 5, ERS6/U6 ERU6S/U6Q (85) 5, ERS8/U8 36(6) 5, ERS4/U4 35() 5, ERS/U 453(8) 5, ERSD/UD 55() 5, ERST/UT 643(5) 4, EXB4V 86(3), EXB4V (44), EXB34V 66(66) 5, EXBV4V 66(66) 5, EXB8V 46(5), EXB8V (84), EXBN8V (84), EXB38V 36(6) 5, EXBV8V 36(6) 5, EXBS8V 5(9),5 EXBHV 386(56) 5, EXBU4 (44), EXBU34 66(66) 5, EXBU8 (84), EXBU38 36(6) 5, EXBUH 386(56) 5, EXBD 36(6) 5, EXBE 4(68) 4, EXBA 643(5) 4, EXBQ 386(56) 5, EXB4AT 86(3), EXB4AT (44), () Anti-Sulfurated High Power Chip Resistors / ide Terminal Type 53 Mar. 6

55 Surface Mount Resistors Packaging Method (Taping) Carrier Tape Pressed Carrier Punched Carrier Embossed Carrier fd P P P B F E T T T A P ( mm Pitch) fd (Only Emboss) Pressed Carrier Taping ( mm Pitch) Chip Resistors / Precision Chip / Metal Film(Thin Film)Chip / ow / Anti-Surge / Anti-Sulfur (Unit : mm) Size mm (inch) A B F E P P P D T ERXGN 4(5).4 ±.3.45 ±.3.3 ±.5 ERGN ERR 63 ERU ().38 ±.5.68 ±.5 8. ±. 3.5 ±.5.75 ±.. ±.. ±.5 4. ± ERAA.4 ±.5 ER 5(4).68 ±.. ±..6 ±.5 ERB 5(4).67 ±..7 ±..6 ±.5 Punched Carrier Taping ( mm Pitch) Chip Resistors / Precision Chip / Metal Film(Thin Film)Chip / ow / Anti-Surge / Anti-Sulfur ER ERPA ER ERA Punched Carrier Taping (4 mm Pitch) Chip Resistors / Precision Chip / Metal Film(Thin Film)Chip / ow / High Power / High Precision / Anti-Surge / Anti-Pulse / Anti-Sulfur Size mm (inch) ER3 ER3( mω) ER3B 68 ER 3 (63) ERA3A ER3(5 mω) ER6 ER 6 ERU6S, U6Q ERA6A ERB3 (58) ER6B ER6 (85) ER6C ER8 ER8 ER 8 ERA8A Size mm (inch) 5 (4) ERB 63(6) A B F E P P P D T.67 ±.5.7 ±.5 8. ±. 3.5 ±.5.75 ±.. ±.. ±.5 4. ± ±.5 A B F E P P P D T. ±..9 ±. (85).65 ±.5.5 ±..55 ±.5.3 ±. 8. ±. 3.5 ±.5.75 ±. 4. ±.. ±.5 4. ± (Unit : mm) Chip Resistor Array / Anti-Sulfurated Chip Resistor Array / Chip Attenuator (Unit : mm) Size mm (inch) A B F E P P P D T EXB4V 86 EXB4AT (3) EXB8V 46(5).6 ±. EXB4V EXBU4 8. ±. 3.5 ±.5.75 ±.. ±.. ±.5 4. ± ±.5 EXB4AT (44) EXB8V EXBU8 EXBN8V (84). ±.. ±.. ±. (Unit : mm).7 ±.5.84 ±.5.94 ±.5 36 (6). ± ±..84 ±.5 May. 6 54

56 Surface Mount Resistors Packaging Method (Taping) Chip Resistor Array / Anti-Sulfurated Chip Resistor Array / Chip Resistor Networks (Unit : mm) Size mm (inch) A B F E P P P D T EXB34V EXBU34 66(66).95 ±. EXB38V EXBU38 36(6) 3.6 ±..7 ±.5 EXBHV.95 ±.5 386(56) 4.±.5 EXBUH 8. ±. 3.5 ±.5.75 ±. 4. ±.. ±.5 4. ± EXBV4V 66(66).95 ±. EXBV8V 36(6) 3.6 ±..84 ±.5 EXBD 36(6). ±. 3.6 ±..84 ±. EXBQ 386(56).9 ±. 4. ±..64 ±.5 Embossed Carrier Taping ( mm Pitch) Chip Resistors (Unit : mm) Size mm (inch) A B F E P P P D T ERXGN 4(5).5 ±.5.45 ±.5 4. ±..8 ±.5.9 ±.. ±.. ±.. ±..8 ±..5 max. Embossed Carrier Taping (4 mm Pitch) Chip Resistors / Precision Chip / ow / High Power / Anti-Surge / Anti-Pulse / Anti-Sulfur Pulse / Anti-Sulfur (Unit : mm) Size mm (inch) A B F E P P P D T D ER4 35 ER 4 ().8 ±. 3.5 ±. 8. ± ±.5 ER 453 ER (8) 3.5 ±. 4.8 ±. ERZ 55 ERS ER D () ERB 55 ERC () ERT ER T 643 (5). +.. ±..8 ±. 5.3 ±..75 ±. 4. ±.. ±.5 4. ± ± ±..5 min. 3.6 ±. 6.9 ±. ER.6 ±. ERA 364(5) 3.5 ±. 6.8 ±.. ±. Current Sensing Resistors, Metal Plate Type Chip Resistor Array / Chip Resistor Networks Size mm (inch) A B F E P P P D T D EXBS8V 5(9).8 ±. 5.7 ±..6 max. EXBE 4(68).5 ±. 4.4 ±.. ± ±..75 ±. 4. ±.. ±.5 4. ± min.. ±. EXBA 643(5) 3.5 ±. 6.8 ±. (Unit : mm).55±. Size mm (inch) A B F E P P P D T D ERMP (m Ω) 36(6).55 ±. ERMP (m Ω) 36(6).9 ±. 3.5 ±. 8. ± ±..4 ±. ERMP (3 to 5m Ω) 36(6).±. ERMP3 ( to m Ω) 55() ERMP3.9 ±. 5.4 ±.. ± ±..75 ±. 4. ±.. ±.5 4. ± (3 to 5m Ω) 55().5±. ERMB 55().55 ±. ERMP4 ( to m Ω) 643(5).6 ±..5 min. ERMP4 (3 to 5m Ω) 643(5) 3.5 ±. 6.9 ±.. ± ±..±. ERMS4 643(5).6 ±..5 min. ERM 643(5).8 ±..5 min. (Unit : mm) May. 6 55

57 Surface Mount Resistors Packaging Method (Taping) Embossed Carrier Taping (8 mm Pitch) Current Sensing Resistors, Metal Plate Type (Unit : mm) Size mm (inch) A B F E P P P D T D ERMS6 6468(56) 6.9 ±. 7.5 ±.. ± ±.5.75 ±. 8. ±.. ±.5 4. ± ±..5 min. Taping Reel fc fn ±3. (Unit : mm) Tape idth () A N C 4mm idth ±.5 7. ± fa 8mm idth ± ±. mm idth ±. 4mm idth 38. ±. 8. ±. 5.4 ±. 9.4 ±. May. 6 56

58 Surface Mount Resistors and Pattern Recommended and Pattern An example of a land pattern for the Rectangular Type is shown below. Size mm/inch a b Chip Resistor High power (double-sided resistive elements structure) type c Dimensions (mm) a b c ER/B 5/4.5.4 to.6.4 to.6 ER3/3B 68/63.5 to.8.5 to.7.9 to. ER6 /85.6 to.8 3. to 3.8. to.4 ER6B / to 3.8. to.4 ER6C /85.7 to.9 3. to 3.8. to.4 ( to 3 mω) ER6C /85.9 to. 3. to 3.8. to.4 (5 to 3 mω) ER8B ER8C ( to 6 mω) 36/ to 5..3 to.8 ER8C 36/6. to to 5.. to.8 (8 to 5 mω) Size Dimensions (mm) mm/inch a b c 4/5.5 to..5 to.7. to.5 63/.3 to.4.8 to.9.5 to.35 5/4.5 to.6.4 to.6.4 to.6 68/63.7 to.9. to..8 to. /85. to.4 3. to to.4 36/6. to to 5.. to.8 35/. to to 5..8 to.8 453/8 3.3 to to to / 3.6 to to 7..8 to.8 643/5 5. to to to /5 3.6 to to to 3.5 ER An example of a land pattern for High Power Chip Resistors / ide Terminal Type is shown below. c b b a Dimensions (mm) a b c ERA ERB () ERC ERB ERB () Anti-Sulfurated High Power Chip Resistors / ide Terminal Type 8 57 Mar. 6

59 Surface Mount Resistors and Pattern An example of a land pattern for Chip Resistor Array, Anti-Sulfurated Chip Resistor Array and Chip Attenuator is shown below. a d Conductor f a Solder resist b c b P c EXB4V EXB4A EXB4V EXBU4 EXB4A Dimensions (mm) a b c d to to to.5 Dimensions (mm) a b c f P EXB8V. to.3.5 to..5 to..8 to.9.4 EXBV4V,V8V.7 to.9.4 to.45.4 to.45 to.4.8 EXB34V,38V EXBU34,U38.7 to.9.4 to.5.4 to.5. to.6.8 EXBS8V to..5 to.75.5 to to f a f a b d c d c d b b d c d c d c d c d c d c d b Dimensions (mm) a b c d f EXB8V EXBU8 EXBN8V.45 to.5.35 to to. EXBHV EXBUH Dimensions (mm) a b c d f An example of a land pattern for Chip Resistor Networks is shown below. EXBA EXBE Pitch.7 mm Pitch.8 mm.8.35 to.4 For popular pattern. to to to.5.4 to.5 3. to to to to 5.4 Pitch.635 mm Through-hole less. EXBAP EXBAE Pitch.4 mm Through-hole less. to to.4 For high density pattern to to EXBD EXBQ Pitch.635 mm.635. to.3 Pitch.5 mm For popular pattern.3 to.4.6 to to 4..9 to.. to.6. to.6.9 to.. to.5.5 hen designing high density land patterns, examine the reliability of isolation among the lines and adopt the chip resistor networks Mar. 6

60 Recommended Soldering Conditions Recommendations and precautions are described below. Rectagular Type Surface Mount Resistors Recommended Soldering Conditions Recommended soldering conditions for reflow Reflow soldering shall be performed a maximum of two times. Please contact us for additional information when used in conditions other than those specified. Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. Temperature Peak Preheating Heating For soldering (Example : Sn/Pb) Temperature Time Preheating 4 C to 6 C 6 s to s Main heating Above C 3 s to 4 s Peak 35 ± 5 C max. s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Time Preheating 5 C to 8 C 6 s to s Main heating Above 3 C 3 s to 4 s Peak max. 6 C max. s Time Recommended soldering conditions for fl ow For soldering For lead-free soldering Temperature Time Temperature Time Preheating 4 C to 8 C 6 s to s 5 C to 8 C 6 s to s Soldering 45 ± 5 C s to 3 s max. 6 C max. s Chip Resistor Array, Chip Resistor Networks and Chip Attenuator Recommended soldering conditions for reflow Reflow soldering shall be performed a maximum of two times. Please contact us for additional information when used in conditions other than those specified. Please measure the temperature of the terminals and study every kind of solder and printed circuit board for solderability be fore ac tu al use. For soldering (Example : Sn/Pb) Temperature Time Preheating 4 C to 6 C 6 s to s Main heating Above C 3 s to 4 s Peak 35 ± 5 C max. s For lead-free soldering (Example : Sn/Ag/Cu) Temperature Peak Preheating Heating Temperature Time Preheating 5 C to 8 C 6 s to s Main heating Above 3 C 3 s to 4 s Peak max. 6 C max. s Time Flow soldering e do not recommend flow soldering, because a solder bridge may form. Please contact us regarding flow sol der ing of EXBA se ries. 59 Sep. 4

61 Surface Mount Resistors Safety precautions Safety Precautions (Common precautions for Surface Mount Resistors) The following are precautions for individual products. Please also refer to the common precautions for Fixed Resistors in this catalog.. Take measures against mechanical stress during and after mounting of Surface Mount Resistors (hereafter called the resistors) so as not to damage their electrodes and protective coatings. Be careful not to misplace the resistors on the land patterns. Otherwise, solder bridging may occur.. Keep the rated power and ambient temperature within the specified derating curve. Some circuit boards, wiring patterns, temperatures of heat generated by adjacent components, or am bi ent tem per a tures can become factors in the rise of the temperature of the re sis tors, regardless of the level of power applied. Therefore, check the conditions before use and op ti mize them so as not to damage the boards and peripheral components. Make sure to contact us before using the resistors under special conditions. 3. If a transient load (heavy load in a short time) like a pulse is expected to be applied, check and evaluate the operations of the resistors when installed in your products before use. Never exceed the rated power. Otherwise, the performance and/or reliability of the resistors may be impaired. 4. Before using halogen-based or other high-activity flux, check the possible effects of the flux residues on the per for mance and reliability of the resistors. 5. hen soldering with a soldering iron, never touch the resistors'bodies with the tip of the soldering iron. hen using a soldering iron with a high temperature tip, finish soldering as quickly as possible (within three seconds at 35 C max.). 6. As the amount of applied solder becomes larger, the mechanical stress applied to the resistors increases, causing problems such as cracks and faulty characteristics. Avoid applying an excessive amounts of solder. 7. hen the resistors' protective coatings are chipped, flawed, or removed, the characteristics of the resistors may be impaired. Take special care not to apply mechanical shock during automatic mounting or cause damage during handling of the boards with the resistors mounted. 8. Do not apply shock to the resistors or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, the resistors' protective coatings and bodies may be chipped, affecting their performance. 9. Avoid excessive bending of printed circuit boards in order to protect the resistors from abnormal stress.. Do not immerse the resistors in solvent for a long time. Before using solvent, carefully check the effects of im mer sion.. Transient voltage If there is a possibility that the transient phe nom e non (significantly high voltage ap plied in a short time) may oc cur or that a high voltage pulse may be applied, make sure to evaluate and check the char ac ter is tics of Fixed Metal (Oxide) Film Resistors mounted on your product rather than only depending on the calculated pow er limit or steady-state conditions to complete the de sign or decide to use the resistors.. Do not apply excessive tension to the terminals. 6 Sep. 4

62 Metal (Oxide) Film Resistors Metal (Oxide) Film Re sis tors Type: ERG(X)S (Small size) (.5,,, 3, 5 ) ERG(X)F (Anti-heat conducting for PCB) (,, 3, 5 ) Features Miniaturized 5 % smaller compared to existing models Non-fl ammable High Reliability Automatic Insertion Reference Standards IEC 65-, IEC 65-4, IS C 5-4, EIA RC-38 RoHS compliant Explanation of Part Numbers Ex. : ERX type E R X S Z R E Product Metal Film ERX Resistors E Power Rating at 7 C ERXS Style Specification Small size S.5 to 5 Small size Anti-heat conducting type F (Fe lead wire) to 5 Z is added according to resistance. Value Range (Ω) Tolerance G ±5 % ± % Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. Decimal point is expressed by (Ex.) R :. Ω Tolerance ERX SZ ERX S Forming / Packaging S S S 3S 5S F F 3F 5F ±5 %. to.8. to 9. Straight lead wire type ± %. to.9. to 9. P Cut & Forming type V Axial taping type (Straight lead) U V Axial taping type (Stand off) E Radial taping type (E type) E Radial taping type (E type) H Cut & Forming type S E Radial taping type (SE type) ERXS ±5 %. to.8. to 9. ERXF ± %. to.9. to 9. ERXS ±5 %. to.. to 9. ERXF ± %. to.9. to 9. ERX3S ±5 %. to.. to 9. ERX3F ± %. to.9. to 9. ERX5S ±5 %.33 to 9. ERX5F ± %. to 9. R 3 4 G 5 6 S The matrix of forming and packaging is as shown in the table below. Forming & Taping matrix E The above example shows a small metal film resistor, power rating, resistance value of. Ω, tolerance ±5 %, and package of radial taping. Ex. : ERG type Product Metal Oxide ERG Film Resistors Power Rating at 7 C Style Specification S Small size.5 to 5 Small size Anti-heat conducting type F (Fe lead wire) to 5 Tolerance Value The first two digits are significant figures G ±5 % ± % of resistance and the third one denotes number of zeros following. Decimal point is expressed by (Ex.) 3 : kω The matrix of forming and packaging is as shown in the table below. P V U V E E H S E Forming / Packaging Straight lead wire type Cut & Forming type Axial taping type(straight lead) Axial taping type(stand off) Radial taping type(e type) Radial taping type(e type) Cut & Forming type Radial taping type(se type) Forming & Taping matrix S S S 3S 5S F F 3F 5F The above example shows a small metal oxide film resistor, power rating, resistance value of kω, tolerance ±5 %, and package of radial taping. 6 Sep. 4

63 Metal (Oxide) Film Resistors Construction Dimensions in mm (not to scale) High reliable metal oxide fi lm (ERG) High reliable metal plating fi lm (ERX) ead wire S type : Cu wire F type : Fe wire ( ) k k fd fd Ceramic core (High ther mal con duc tiv i ty) Dimensions (mm) D k d Mass (eight) [g/pc.] Spi ral ling turns Marking ERG(X)S ±3..65 ±.5.6 ERG(X)S.65 ± ±.5 3. ±3. ERG(X)F.8 ±.5.33 End cap Flame and solvent retardant ERG(X)S ERG(X)F.+.5. ERG(X)3S ERG(X)3F 5.±.5 ERG(X)5S ERG(X)5F 4.±.5 4. ±. 3. ±3..8 ± ±. 38. ±3..8 ± ±. 38. ±3..8 ± Ratings Power Rating at 7 C () imiting Element Voltage () (V) Maximum Overload Voltage () (V) Maximum Intermittent Overload Voltage (3) (V) Dielectric ith stand ing Voltage Res. Tol. (%) (4) Range (Ω) (5) T.C.R. ( 6 / C) Standard Value (VAC) min. (6) max. ERG(X)S G (±) k (±5). 47 k ±35 E4 ERG(X)S G (±) 68 k ERG(X)F (±5). k ±35 E4 ERG(X)S G (±) k ERG(X)F (±5). k ±35 E4 ERG(X)3S G (±) k ERG(X)3F (±5). k ±3 E4 ERG(X)5S G (±) k ERG(X)5F (±5).33 k ± E4 () Rated Continuous orking Voltage (RCV) shall be determined (4) tolerance is of use besides range listed, please inquire. from RCV= Power Rating Value or imiting Element (5) Range Type ERG : > Ω Voltage listed above whichever less. Type ERX : <9. Ω () Overload (Short-time Overload) Test Voltage (SOTV) shall be (6) As for the low resistance value range, "Z" is given to the part determined from SOTV=.5 Power Rating or max. Overload number. (Refer to the explanation of part numbers.) Voltage listed above whichever less. (3) Intermittent Overload Test Voltage (IOTV) shall be determined from IOTV=4. Power Rating or max. Intermittent Overload Voltage listed above whichever less. Z type is non standard resistance values. Res.Tol. Res. Value Range Res.Tol. Res. Value Range Z S ± %. to.9 Ω S ± %. to.9 Ω ±5 %. to.8 Ω F ±5 %. to. Ω Z S ± %. to.9 Ω 3S ± %. to.9 Ω F ±5 %. to.8 Ω 3F ±5 %. to. Ω Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C 7 C 8 ERG(X)S, F 6 ERG(X)S, F ERG(X)S ERG(X)3S, 3F 4 ERG(X)5S, 5F 3 C 35 C Ambient Temperature ( C) 6 Sep. 4

64 Metal (Oxide) Film Resistors Packaging Methods Taped & Box ERG(X) S V Stand-off Taped & Box ERG(X) S U V 6.±.5 fd P P fd H H crush width.8 mm ( ). mm (, 3 ) Part Number Standard Quantity (pcs./box) Taping (mm) Box (mm) P 5 P H d a b c ERG(X) S V, 5. ±.3 5 ± 5. ±.5.65 ± ERG(X) S V, 5. ±.3 5 ± 5. ±.5 ±.5.65 ERG(X) S U V ERG(X) S V, 5. ±.3 5 ± 5. ±.5 ±.5.8 ERG(X) S U V Marking a c b ERG(X) 3S V,. ±.5 5 ± 74. ±. ±.5.8 ERG(X) 3S U V Cut & Formed Type ERG(X) S P S f.65±.5 (.5, ) f.8±.5 (, 3, 5 ) fd Upper surface h of P board h.8 (.5, ). (, 3, 5 ).±. (.5, ).4±. (, 3, 5 ) Part Number Standard Quantity (pcs./box) Dimensions (mm) D S h h ERG(X) S P, ±.5 4. ±.5 4. ±.5 ERG(X) S P, ±.5.5 ±.5 4. ±.5 4. ±.5. ERG(X) S P, ±. 5. ±.5 6. ±.5 4. ±.5. ERG(X) 3S P, 5. ± ±.. ±. 6.5 ±.5 4. ±.5 ERG(X) 5S P 5 4. ±.5 8. ±. 3. ±. 7.5 ±.5 4. ±.5 ERG(X) F H S f.8±.5 fd Part Number Standard Quantity (pcs./box) Dimensions (mm) D S h h ERG(X)F H, ±.5.5 ±.5 8 ± 4. ±.5..4±. h Upper surface of P board h ERG(X)F H, ±. 5. ±.5 6 ± 5. ±.5 ERG(X)3F H, 5. ± ±.. ±. ± 5. ±.5 ERG(X)5F H 5 4. ±.5 8. ±. 3. ±. ± 5. ±.5 63 Sep. 4

65 Metal (Oxide) Film Resistors Packaging Methods For Panasert Au to mat ic Insertion Machine Radial Taped & Box ERG(X) S E (S, S, S) Insulated ead P P fd A F P H H fd P fd Dimensions (mm) Dimensions (mm) Dimensions (mm) Dimensions (mm) Dimensions (mm) P.7±. 8.±.5 S 3 max. P.7±.3 9.±.5 H S 3 max. S S.8±.5 A S D S P 3.85±.7 S 38 max. S S 4.±. P 6.35±. H 6.±.5 d.65±.5 F 5.±.8 D 4.±. Radial Tape Package Specifi cations b Marking a c Part Number Dimensions (mm) Standard Quantity (pcs./box) a b c ERG(X) S E , ERG(X) S E , ERG(X) S E , For Panasert Automatic Insertion Machine Radial Taped & Box ERG(X) S E (S, S, S, 3S) Dimensions (mm) Dimensions (mm) P P A B P F fd P fd H H fd S.7±. D S, S, S, 3S 4.±. P S, S, 3S 3.±. S P P P F S.7±.3 S A S, S, 3S 5.±.3 S S 6.35±. 3S 5.±.5 S, S, 3S 7.5±. S. max. S 3.85±.7 S 4. max. B S, S, 3S 3.75±.5 S 7. max. S 5.±.5 3S. max. S, S, 3S 7.5±.8 S S, S, S, 3S 8.±.5 S.8±.5 D S, S, S, 3S 9.±.5 S 4.±. S 6.±.5 3S 5.5±. H H S, S 8.±. S.65±.5 d 3S 9.±. S, S, 3S.8±.5 S S, S S Sep. 4

66 Metal (Oxide) Film Resistors Packaging Methods For Panasert Automatic Insertion Machine Radial Taped & Box ERG(X) F S E (F, F, 3F) P P Dimensions (mm) Dimensions (mm) P 3.±. H.±.3 H A F H B fd P 5.±.3 D 4.±. P 7.5±. F P 3.75±.5 A F. +.5 F 7.5±.8 3F 5.±.5.. P H 8.±.5 F 4 max. fd fd 9.±.5 B F 7 max. H F max. F D F.8±.5 P H F F 4.±. 3F F 5.5±. d.8±.5 Radial Tape Package Specifi cations Dimensions (mm) a b c Standard Quantity (pcs./box) ERG(X) S E , ERG(X) S E ERG(X) F S E , b ERG(X) S E ERG(X) F S E Marking a c ERG(X) 3F S E Sep. 4

67 Metal (Oxide) Film Resistors Hot-spot Temperature (for Reference) The temperature of the resistor body increases with the curve below. A touching vinyl wire may cause damages to resistor element. Do not place vinyl wires around resistors and be sure to consider where the resistors will be placed. Measuring position A B F-A Temperature T ( C) S-A S-B S-A S-B Temperature T ( C) S-A S-B F-B Rated oad (%) Rated oad (%) F-A 3S-A + 5F-A 5S-A Temperature T ( C) S-B 3F-B Temperature T ( C) S-B 5F-B Rated oad (%) Rated oad (%) Safety Precautions The following are precautions for individual products. Please also refer to the common precautions for Fixed Resistors in this catalog.. Transient voltage If there is a possibility that the transient phenomenon (significantly high voltage applied in a short time) may occur or that a high voltage pulse may be applied, make sure to evaluate and check the characteristics of Metal(Oxide) Film Resistors (hereafter called the resistors) mounted on your product rath er than only depending on the calculated pow er limit or steady-state conditions to complete the design or decide to use the resistors.. The resistors are covered with a special coating. Do not apply shock or vibration to them, or pinch them with long-nose pliers. Otherwise, the resistors may be damaged. 3. Do not apply excessive tension to the lead-connect ed sections. hen bending the lead wire, do not apply excessive stress to the resistors and provide the wire with a natural curvature. 4. Do not brush the resistors during or after the cleaning process, which may be conducted after soldering. Otherwise, the coating film may be damaged. 66 Sep. 4

68 Metal (Oxide) Film Resistors (Data for Reference) Pulse Char ac ter is tics (Usual) PP (VP) t P P V P : Pulse limit power () : Pulse limit voltage (V) t : Pulse continuous time (s) T : Period (s) V R : Rated voltage (V) P : Rated power () R : value (Ω) V p max. : Max. pulse limit volt age (V) T ithstand pulse limit power is calculated by the next method. P P = K P T/t V P = K P R T/t Reference to the right about a fixed number of V P max. T>(s) T=(s) T/t> T/t= P P<P P stands for P P (V P<V R V R stands for V P) Added voltage<v p max. P P or V P is referent value Conditions: Pulse added time= h change=±5 % Room temperature K Vp max. (V) ERG(X) S.5 6 ERG(X) S.5 6 ERG(X) S.5 7 ERG(X) 3S.5 7 ERG(X) 5S.5 67 Sep. 4

69 Anti-Pulse Power Resistors Anti-Pulse Power Resistors Type: ERGD (.5,,, 3 ) Features Miniaturized Non-fl ammable Anti-Pulse Characteristic Automatic Insertion RoHS compliant Explanation of Part Numbers E R G D 4 Product Anti-Pulse Power Resistors Power Rating Tolerance G ± % ±5 % Value The first two digits are significant figures of resistance and the third one denotes number of zeros following. (Ex.) 4 : kω V P U V E E Forming / Packaging Straight lead wire type Axial paping type (Straight lead) Cut & Forming type Axial paping type (Stand off) Radial Taping type (E type) Radial Taping type (E type) Forming & Taping matrix D D D 3D The above example shows an anti-pulse resistor, pow er rat ing, re sis tance value of k ohms, tolerance ±5 %, and pack age of stan dard bulk packing. Construction Dimensions in mm (not to scale) High reliable special fi lm ead wire k k fd fd Ceramic core (High ther mal con duc tiv i ty) Spi ral ling turns Marking Dimensions (mm) D k d Mass (eight) [g/pc.] ERGD ±3..65 ±.5.6 ERGD ±.5 3. ±3..65 ±.5.33 Flame and solvent retardant ERGD ±. 3. ±3..8 ±.5.66 End cap ERG3D 5. ± ±. 38. ±3..8 ± Sep. 4

70 Anti-Pulse Power Resistors Ratings Power Rating at 7 C () imiting Element Voltage () (V) Maximum Overload Voltage () (V) Maximum Dielectric Intermittent ith stand ing Overload Voltage Voltage (3) (V) (VAC) Res. Tol. (%) Range (Ω) (4) min. max. Standard Value ERGD (±5) G (±) 5 k 4 k E4 ERGD 5 5 (±5) G (±) k 33 k E4 ERGD 5 7 (±5) G (±) k 5 k E4 ERG3D (±5) G (±) k 75 k E4 () Rated Continuous orking Voltage (RCV) shall be determined from RCV= Power Rating Val ue or imiting Element Voltage list ed above whichever less. () Overload (Short-time Overload) Test Voltage (SOTV) shall be determined from SOTV=.5 Power Rating or max. Overload Volt age list ed above which ev er less. (3) Intermittent Overload Test Voltage (IOTV) shall be determined from IOTV=4. Power Rating or max. Intermittent Over load Volt age listed above whichever less. (4) tolerance and resistance range is of use besides range listed, please inquire. Power Derating Curve For resistors operated in ambient temperatures above 7 C, power rating shall be derated in accordance with the figure on the right. Rated oad (%) 55 C 7 C 8 ERGD ~ 3D 6 ERGD 4 3 C 35 C Ambient Temperature ( C) As for Packaging Methods and / or cut formed leads, Please see Metal (Oxide) Film Resistors Packaging Methods Safety Precautions The following are precautions for individual products. Please also refer to the common precautions for Fixed Resistors in this catalog.. Transient voltage If there is a possibility that the transient phenomenon (significantly high volt age applied in a short time) may occur or that a high voltage pulse may be applied, make sure to evaluate and check the characteristics of Anti-Pulse Power Resistors (hereafter called the resistors) mount ed on your product rather than only depending on the calculated power limit or steady-state conditions to complete the design or decide to use the resistors.. The resistors are covered with a special coating. Do not ap ply shock or vibration to them, or pinch them with long-nose pliers. Otherwise, the resistors may be damaged. 3. Do not apply excessive tension to the lead-connect ed sections. hen bend ing the lead wire, do not apply excessive stress to the resistors and provide the wire with a natural curvature. 4. Do not brush the resistors during or after the cleaning process, which may be conducted after soldering. Otherwise, the coating film may be damaged. 69 Sep. 4

71 Metal Film Resistors, ow Re sis tance Value Metal Film Re sis tors Type: ERX (ow Value) (.5,, ) Features Miniaturized Non-fl ammable Automatic Insertion RoHS compliant Explanation of Part Numbers E R X 4 7 M ERX Product Metal Film Resistors Power Rating.5 Special Feature Small size ow resistance value Tolerance ±5 % Value The first two digits are significant figures of resistance and it shows by the unit of the "mω". Decimal point is expressed by M as 47 mω = 47M. V P E E Forming / Packaging Straight lead wire type Axial paping type (Straight lead) Cut & Forming type Radial Taping type (E type) Radial Taping type (E type) Forming & Taping matrix The above example shows a small size and low resistance value met al film re sis tor, pow er rat ing, resistance value of 47 m ohms, tol er ance ±5 %, and pack age of standard bulk packing. Construction Dimensions in mm (not to scale) High reliable metal plating fi lm ead wire k k fd fd Ceramic core (High ther mal con duc tiv i ty) Spiral ling turns Marking Dimensions (mm) D k d Mass (eight) [g/pc.] Flame and solvent retardant ERX ±3..65 ±.5.6 ERX ±.5 3. ±3..65 ±.5.33 End cap ERX ±. 3. ±3..8 ± Sep. 4