HIGH POWER OP-AMP MSK0021FP

Transcription

1 MILPRF8 AND 8 CERTIFIED FACILITY FEATURES: Available as SMD # High Output Current Amps Peak Low Power ConsumptionClass C Design Programmable Current Limit High Slew Rate Continuous Output Short Circuit Duration Replacement for LH00 Functionally Equivalent Rad Hard Device MSK06RH HIGH POWER OPAMP MSK00FP 00 SERIES MSK00 DESCRIPTION: MSK00FPG The MSK00, 00FP and 00FPG are general purpose Class C power operational amplifiers. These amplifiers offer large output currents, making them an excellent low cost choice for motor drive circuits. The amplifier and load can be protected from fault conditions through the use of internal current limit circuitry that can be user programmed with two external resistors. These devices are also compensated with a single external capacitor. The MSK00 is available in a hermetically sealed 8 pin TO package. The MSK00FP is packaged in a 0 pin hermetic metal flatpack and the 00FPG is lead formed by MSK. EQUIVALENT SCHEMATIC PINOUT INFORMATION TYPICAL APPLICATIONS Servo Amplifer Audio Amplifier Motor Driver Programmable Power Supply MSK00 ISC+ +VCC GND Compensation Input 6 +Input 7 VCC 8 ISC MSK00FP/MSK00FPG ISC ISC ISC VOUT VOUT 6 VOUT 7 VOUT 8 ISC+ 9 ISC+ 0 ISC+ CASEOUTPUT CASE IS ALSO VOUT 0 VCC 9 NC 8 +VIN 7 NC 6 VIN NC Compensation NC GND +VCC 888 Rev. E 9/

2 ABSOLUTE MAXIMUM RATINGS ±VCC Supply Voltage ±8V IOUT Peak Output Current A VIN Differential Input Voltage ±0V VIN Common Mode Input Voltage ±V RTH Thermal ResistanceJunction to Case MSK00.0 C/W MSK00FP/FPG 6.0 C/W 8 TST Storage Temperature Range 6 to +0 C TLD Lead Temperature Range (0 Seconds) 00 C PD Power Dissipation (TO) 6W TJ Junction Temperature 0 C TC Case Operating Temperature Range Military Versions (H/B) C to + C Industrial Versions 0 C to +8 C ELECTRICAL SPECIFICATIONS Parameter STATIC Supply Voltage Range Quiescent Current Power Consumption INPUT Input Offset Voltage Input Bias Current Input Offset Current Input Capacitance Input Resistance Common Mode Rejection Ratio Power Supply Rejection Ratio Input Noise Voltage OUTPUT Output Voltage Swing Output Short Circuit Current Settling Time TRANSFER CHARACTERISTICS Slew Rate Open Loop Voltage Gain Transition Times Overshoot Test Conditions VIN = 0V VIN = 0V VIN = 0V V < VCC < 8V VCM = 0V, V < VCC <8V Either Input VCM = 0V V < VCC < 8V F=DC F=DC F = 0HZ VCM = ±0V VCC= ±V to ±V F = 0HZ to 0KHZ RL =00Ω F =00HZ RL =0Ω F =00HZ RSC = 0.Ω VOUT = MAX RSC = Ω VOUT = GND 0.% V step VOUT = ±0V RL = 00Ω F = 0HZ RL = KΩ Rise and Fall Small Signal Group A Subgroup,,,,,,,,6,,6,6 Min. ± ±. ±. ± Military Typ. ± ±.0 7 ±0. ±.0 ±00 ±0. ± ± ± ± Max. ±8 ±. 0 ±.0 ±.0 ±00 ±.0 ±00 ± Industrial Min. Typ. Max. ± ±.0 ± ± ±.0 90 ±0. ±0 ± ± ± ±8 ±.0 0 ±.0 ±00 ± Units V ma mw mv µv/ C na µa na na pf MΩ db db db db µvrms V V V A ma µs V/µS V/mV V/mV µs % NOTES: Unless otherwise specified, ±VCC= ±V, CC = 000pF. Guaranteed by design but not tested. Typical parameters are representative of actual device performance but are for reference only. Industrial devices shall be tested to subgroups and unless otherwise specified. Military grade devices (B/H suffix) shall be 00% tested to subgroups,, and. Subgroup, TA=TC=+ C Subgroup, TA=TC=+ C Subgroup, 6 TA=TC= C Reference DSCC SMD for electrical specifications for devices purchased as such. Subgroup and 6 testing available upon request. Continuous operation at or above absolute maximum ratings may adversely effect the device performance and/or life cycle. 888 Rev. E 9/

3 APPLICATION NOTES HEAT SINKING To select the correct heat sink for your application, refer to the thermal model and governing equation below. Thermal Model: CURRENT LIMIT The MSK00 has an onboard current limit scheme designed to limit the output drivers anytime output current exceeds a predetermined limit. The following formula may be used to determine the value of the current limit resistance necessary to establish the desired current limit. RSC= 0.7 ISC Current Limit Connection Governing Equation: TJ = PD X (RθJC + RθCS + RθSA) + TA Where TJ PD RθJC RθCS RθSA TC TA TS = Junction Temperature = Total Power Dissipation = Junction to Case Thermal Resistance = Case to Heat Sink Thermal Resistance = Heat Sink to Ambient Thermal Resistance = Case Temperature = Ambient Temperature = Sink Temperature Example: (TO PACKAGE) In our example the amplifier application requires the output to drive a 0 volt peak sine wave across a 0 ohm load for amp of output current. For a worst case analysis we will treat the amp peak output current as a D.C. output current. The power supplies are ± VDC..) Find Power Dissipation PD=[(quiescent current) X (+VCC (VCC))] + [(VS VO) X IOUT] =(. ma) X (0V) + (V) X (A) =0.W + W =.W.) For conservative design, set TJ = + C..) For this example, worst case TA = + C..) RθJC =.0 C/W typically for the TO package..) Rearrange governing equation to solve for RθSA: RθSA = (TJ TA) / PD (RθJC) (RθCS) = ( C C) /.W (.0 C/W) (0. C/W) = 7. C/W The heat sink in this example must have a thermal resistance of no more than 7. C/W to maintain a junction temperature of less than + C. See "Application Circuits" in this data sheet for additional information on current limit connections. POWER SUPPLY BYPASSING Both the negative and the positive power supplies must be effectively decoupled with a high and low frequency bypass circuit to avoid power supply induced oscillation. An effective decoupling scheme consists of a 0. microfarad ceramic capacitor in parallel with a.7 microfarad tantalum capacitor from each power supply pin to ground. It is also a good practice with high power opamps, such as the MSK00, to place a 00 microfarad capacitor with a low effective series resistance, in parallel with the other two power supply decoupling capacitors. This capacitor will eliminate any peak output voltage clipping which may occur due to poor power supply load regulation. All power supply decoupling capacitors should be placed as close to the package power supply pins as possible. SAFE OPERATING AREA The safe operating area curve is a graphical representation of the power handling capability of the amplifier under various conditions. The wire bond current carrying capability, transistor junction temperature and secondary breakdown limitations are all incorporated into the safe operating area curves. All applications should be checked against the S.O.A. curves to ensure high M.T.B.F. 888 Rev. E 9/

4 APPLICATION CIRCUITS 888 Rev. E 9/

5 TYPICAL PERFORMANCE CURVES 888 Rev. E 9/

6 MECHANICAL SPECIFICATIONS MSK00 WEIGHT= GRAMS TYPICAL ALL DIMENSIONS ARE SPECIFIED IN INCHES ORDERING INFORMATION Part Number MSK00 Screening Level Industrial MSK00B X MILPRF8 CLASS H DSCC SMD Rev. E 9/

7 MECHANICAL SPECIFICATIONS CONTINUED MSK00FP ESD TRIANGLE INDICATES PIN WEIGHT= GRAMS TYPICAL ALL DIMENSIONS ARE SPECIFIED IN INCHES ORDERING INFORMATION Part Number MSK00FP Screening Level Industrial MSK00FPH TBD MILPRF8 CLASS H DSCC SMD Rev. E 9/

8 MECHANICAL SPECIFICATIONS CONTINUED MSK00FPG ESD TRIANGLE INDICATES PIN WEIGHT= GRAMS TYPICAL ALL DIMENSIONS ARE SPECIFIED IN INCHES ORDERING INFORMATION Part Number MSK 00FPG Screening Level Industrial MSK 00FPG H TBD MILPRF8 CLASS H DSCC SMD Rev. E 9/

9 REVISION HISTORY MSK The information contained herein is believed to be accurate at the time of printing. MSK reserves the right to make changes to its products or specifications without notice, however and assumes no liability for the use of its products. Please visit our website for the most recent revision of this datasheet Rev. E 9/