LC-S RGBW-BW-000

Transcription

1 LCS5544RGBWBW LCS5544RGBWBW LCS5544RGBWBW LCS5544RGBWWT SPECIFICATION RGBW ON TOP SMD TYPE LED Model No.: LCS5544RGBWBW LCS5544RGBWWT Description: 5.5x5x1.6mm Top SMD Type 4chips.4 Watt Power RGBW Flash color LED Rev. No.: 1 Date: ELECTROSTATIC SENSITIVE DEVICES 1/ 6 Document No.: SPC / LCS5544RGBWBW/WT Rev. No.: 1

2 SPECIFICATION OF CHIP ARRAY ON TOP SMD TYPE LED RGBW LED provides the leading Chip on Top SMD type of LED technology for high efficiency solidstate lighting solutions. It offers excellent uniformity, flexibility and cost efficiency along with compact size and wide range of color selections. All components are produced by packing highperformance LED chips and silicon resin with proprietary phosphors. 1. Features and Benefits. Ideal for LED lighting application to avoid multishadows. Higher heat conductivity for better thermal management. Provide variable and innovative array LED layout designs and combinations. Reduce the initial development cost and time. High lumenperformance per dollar cost. Lead free reflow solder compatible with RoHS compliant 2. Applications. Solid State Lighting. Indoor/Outdoor/Decoration. Signal Light Engine. Commercial Display. Industrial Light Engine LCS5544RGBWBW LCS5544RGBWWT 3. Dimensions and Materials. Dimensions: 5.5 mm x 5 mm x 1.6 mm. Packages: Top SMD. Capsulated Resin: Silicone Resin with Silicate Phosphor. Electrodes: Ag Plating. Chips: Total 4 chips packed in cavity Mechanical Dimensions R G 1.6 Notes: 1. All dimensions are in millimeters. 2. Tolerance is ±.2mm unless otherwise noted 5 6 B 7 8 W 2/ 6 Document No.: LCS5544RGBWBW/WT Rev. No.: 1

3 4. Electrical/Optical Characteristics (Thermal Pad ) ITEM SYMBOL TEST CONDITIONS UNI T MIN. TYP. MAX. Forward Voltage Vf If=4*2 ma V Reverse Current Ir Vr=5V μa 5 Viewing Angle 2θ 1/2 If=4*2 ma deg 12 Color Rendering Index(*1) RA If=4*2 ma Color temperature CCT If=4*2 ma K Junction/Solder 4 chips on (*1) Rθjc If=4*2 ma /W 23 R Dominant Wavelength Wd G nm B R 2 3 Luminous Flux(*3) G B Φv If=4*2 ma lm W *1: Rth test condition: Mounted on PC Board FR 4(pad size 16mm2) *2: Measurement tolerance of the luminous intensity: ±1%. This value for reference only. *3: Measurement tolerance of the luminous intensity: ±1%. 5. Absolute Maximum Ratings (Thermal Pad ) ITEM SYMBOL ABSOLUTE MAXIMUM RATING UNIT D.C Forward Current If 4*2 ma Pulse Forward Current (*1) Ifp 1 ma Reverse Voltage Vr 5 V Power Dissipation Pd 4x.65 W Operating Temperature Topr 25~+85 Storage Temperature Tstg 4~+1 Soldering Temperature (Reflow) (*2) Tsld max.24 < 5 sec *1: Ifp conditions: 1/1 Duty Cycle &.1ms for pulse width. *2: Reflow method: 1.6mm from body for 5 seconds not exceeding the recommended maximum temperature. 6. Luminous Flux Rank LEDs are sorted to Luminous Flux lm bins shown. Orders for The LED may be filled with any or all bins contained as below. All Luminous Fluxlm values shown and specified are at IF =4x2mA. LCS5544RGBWBW/WTLUMINOUS Flux Rank RED GREEN Blue WHITE Luminous Flux Rank C D D E1 B C F1 F2 Luminous Flux (lm) / 6 Document No.: SPC / LCS5544RGBWBW/WT Rev. No.: 1 Document No.: LCS5544RGBWBW/WT Rev. No.: 1

4 7. Forward Voltage Rank LEDs are sorted to VF bins shown. Orders for The LED may be filled with any or all bins contained as below. All VF values shown and specified are at IF =4x2mA. Rank V1 V2 V3 V4 V5 V6 V7 V8 Voltage (V) 1.82.V 2.2.2V V V V 2.83.V Note: Measurement tolerance of the forward voltage: ±.6V 8. Dominant Wavelength Rank KLS5544RGBWBW/WT Dominant Wavelength Rank Red Green 3.3.2V Blue V Dominant Wavelength Rank HR1 HR2 PG2 PG3 BL5 BL6 BL7 Dominant Wavelength(nm) Note: Measurement tolerance of the Dominant Wavelength: ±1nm 9. OpticalElectrical Characteristic Graphs Forward Current vs. Typical Relative Luminous Flux Normalized Luminous Flux 12% 1% 8% 6% 4% 2% Forward Current(mA) Forward Voltage vs. Forward Current Forward Current(mA) Forward Voltage(V) Thermal Pad Temperature vs. Relative Light Output Wavelength Characteristics Normalized Luminous Flux 12% 1% 8% 6% 4% 2% Relative Emission Distribution 1% 8% 6% 4% 2% WL WT WS NW CW BW AW Thermal Pad Temperature ( C) Wavelength (nm) Thermal Pad Temperature vs. Forward Current 75 Typical Radiation Pattern 12 Forward Current (ma) Thermal Pad Temperature ( C) Radiation Angle 4/ 6 Document No.: LCS5544RGBWBW/WT Rev. No.: 1

5 Attention CAUTION 1.Storage temperature:4~+8 C Operating temperature:25~+6 C 2.Installation surface must be smooth, clean and dry. 3.The part of LED components can not be fixed on the surface of the sharp edge. 4.Strip should not be collided or crushed. 5.Strip can be cut following the cutting lines. ROHS DESICCANT Shenzhen LED Color Opto Electronic Co.,Ltd 1. Packaging Standard: LCS5544RGBWBW/WT CATHODE IDENTIFICATION TAPE FEED DIRECTION COVER TAPE CARRIER TAPE DANGEROUS DO NOT EAT SILICAGEL 防潮珠 不可食 DESICCANT REEL(178x12mm) (INNER 1pcs LED MAX) ESD POLYETHYLENE BAG Lot No.: LCXXXXXX TR No.: XXXXXXX FLUX Rank: XXXX lm VF Rank: XXXX V CIE Rank: XXXXXXX K Color zone: XX Q'ty: 1pcs 注 : 使用前请除 6 /12H LABEL SKETCHING CARTON (INNER 5 REEL MAX.) CARDBOARD (INNER 5 CARTON MAX.) 5/ 6 Document No.: SPC / LCS5544RGBWBW/WT Rev. No.: 1

6 Change History FCN No. Date Rev. No. Changes/Reason of changes Initial Document Items Signatures Date Note Prepared by Yan CHENSHIHONG Z hu Checked by Andy Liu Approved by Andy Liu FCN# 6/ 6 Document No.: LCS5544RGBWBW/WT Rev. No.: 1