DATA SHEET QW0905-LG-5630DBKZ-1-T60-A01 發行 立碁電子 DCC. SMD LED Pb. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only REV. : A
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1 SMD LED Pb Lead-Free Parts LG-5630DBKZ-1-T60-A01 DATA SHEET DOC. NO : QW0905-LG-5630DBKZ-1-T60-A01 REV. : A DATE : 19 - May 發行 立碁電子 DCC
2 Product Model Designation System LG DBK Z T60 - A01 A B C D E F G H A Title LG:Ligitek B C D E Dimension(L) Dimension(W) 56:5.6mm 30:3.0mm Emitting Color DBK:Blue Zener F Chip Modification -1: 1 chip in 1 G Test Current T60: 60mA H Bin Modification Page 1/11
3 Features Typical Applications *. SMTpackage *.Suitable for all SMT assembly and soldering methodes *. Pb-Free Reflow soldering application *. More Energy Efficient than lncandescent and most Halogen lamps. *. RoHS compliant Dimension *. Reading Light (car,bus,aircraft) *. Portable(flashlight,bicycle). *. Backlights(Monitor,TV) / Light Guides. *. Automotive Exterior (Stop-Tail-Tum,CHMSL,Mirror Side Repeat). *. Commercial and Residential Architectural lighting. *. Mini-accent / Uplighters / Downlighters / Orientation lighting *. Fiber Optic Alternative / Decorative / Entertainment lighting. *. Security / Garden lighting. *. Cove / Undershelf / Task lighting. *. Traffic signaling / Beacons / Rail crossing and Wayside lighting Recommended Solder Patterns Slug 5 Anode(+) Cathode(-) NC Note: 1.The tolerance unless mentioned is ±0.1mm,unit=mm. 2.It is strongly recommended to apply on electrically isolated heat conducting film between the slug and contact surfaces. Page 2/11
4 Absolute Maximum Ratings at Ta=25 Parameter Symbol Ratings UNIT DC Forward Current IF 60 ma Power Dissipation PD W Peak pulse current Duty 1/10@10KHz IFP 120 ma Reverse Current(VR=5V) Ir 10 μa Electrostatic Discharge ESD 2000 V Storage Temperature Tstg -40 ~ +100 C Operating Temperature Topr -40 ~ +85 C Soldering Temperature Tp 260 C Typical Electrical & Optical Characteristics (Ta=25 ) Items Symbol Min. Typ. Max. UNIT CONDITION Luminous Intensity Iv mcd IF=60mA Dominant Wavelength λd nm IF=60mA Spectral Line Half-Width λ nm IF=60mA Forward Voltage VF V IF=60mA Viewing Angle 2θ 1/ deg IF=60mA Note : 1.The forward voltage data did not including ±0.1V testing tolerance. 2.The luminous intensity data did not including ±15% testing tolerance. 3.Green emitters are built with InGaN. Page 3/11
5 Luminous Intensity Classification BIN CODE Iv(mcd) at 60mA Min. Max. V V W W Color Code Classification BIN CODE λd(nm) at 60mA Min. Max. 0I H G F Forward Voltage Classification BIN CODE Min. Page 4/11 Vf(v) at 60mA Max
6 Recommended Profile for Reflow Soldering Pb -free solder temperature profile Pb -free solder Temperature profile Pre-heat C Pre-heat time 120 Sec Max Peak-Temperature 260 C Max Soldering time condition 10 Sec Max 260 C.Max. 10 Sec.Max. 1-5 C/Sec. 60 Sec.Max. Above0 C 6 C/Sec. Pre-heating C 1-5 C/Sec. 120 Sec. Max. (1) Reflow soldering should not be done more than two times. (2) When soldering,do not put stress on the LEDs during heating. (3) After soldering,do not warp the circuit board. (4) The encapsulated material of the LEDs is silicone. Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter,the picking up nozzle that does not affect the silicone resin should be used. Hand Soldering Conditions: Do not exceed 3 seconds at maximum 320 C under soldering iron.(one time only) Page 5/11
7 Typical Electro Optical Characteristics Curves Fig.1 Forward current vs. Forward Voltage Fig.2 Forward current vs.luminous Intensity Forward Voltage(V) Forward Current(mA) Relative Luminous Intensity(%) Forward Current(mA) Fig.3 Directivity Radiation % 75% 50% 25% 0 25% 50% 75% 100% Relative Intensity@60mA Fig.4 Relative Intensity vs. Wavelength Wavelength (nm) Page 6/11
8 Carrier Type Dimensions Polarity ± Note : The tolerances unless mentioned is ±0.2mm. Packing Specifications Label Aluminum Moist-Proof bag Label Desiccant Page 7/11
9 Label Explanation Pb PART : LOT : QTY(PCS): LIGITEK ELECTRONICS CO., LTD. LG-5630DBKZ-1-T60-A01 GS BIN : Luminous Flux HUE : Dominant Wavelength VF : Forward Voltage BIN/HUE : V-1/0H VF: Reel Dimensions 16.0± ± ±1 Page 8/11
10 Box Explanation 1. 4 BAG / INNER BOX 2. INNER BOX SIZE : L X W X H 23cm X 8.5cm x 26cm H W L INNER BOXES / CARTON 4. CARTON SIZE : L X W X H 58cm X 34cm x 35cm L W H Page 9/11
11 Reliability Test Classification Test Item Test Condition Sample Size Operating Life Test 1.Ta=25 C 2.If=60mA 3.t=1000 hrs (-24hrs,+72hrs) High Temperature Storage Test 1.Ta=100 C±5 C 2.t=1000 hrs (-24hrs,+72hrs) Endurance Test Low Temperature Storage Test 1.Ta=-40 C±5 C 2.t=1000 hrs (-24hrs,+72hrs) High Temperature High Humidity Storage Test 1.Ta=85 C 2.RH=85% 3.t=1000hrs(-24hrs,+72hrs) Thermal Shock Test 1.Ta=100 C±5 C ~ -40 C±5 C 20min/ 10sec / 20min 2.total 100 cycles Environmental Test Temperature Cycling C±5 C ~ -40 C±5 C 30mins / 5mins / 30mins Cyeles IR Reflow 1.T=260 C Max. 10sec.Max Min Page 10/11
12 Precautions For Use: Storage time: 1. Calculated shelf life before opening is 12 months at < 30 C and < 90% relative humidity (RH) 2. After bag is opened, devices which will be subjected to reflow soldering or other high temperature processes must be a) Assemblied within 168 hours in an environment of 30 C / 60% RH, or b) Stored at ambient of 10% RH or less 3. Devices are required baking before assembly if: a) Humidity Indicator Card reads >10% (for level 2a -5a) or >60% (for level 2) at ambient temperature 23±5 C b) 2.a) or 2.b) doesn't meet 4. If baking is required, devices should be baked for >72 hours at 60±5 C / 5% RH.Performing baking only once, and using the baked devices within 72 hours. Drive Method: LED is a current operated device, and therefore, requirer some kind of current limiting incorporated into the driver circuit. This current limiting typically takes the form of a current limiting resistor placed in series with the LED. Consider worst case voltage variations than could occur across the current limiting resistor. The forward current should not be allowed to change by more than 40% of its desired value. Circuit model A LED Circuit model B LED (A) Recommended circuit. (B) The difference of brightness between LED could be found due to the VF-IF characteristics of LED. Cleaning: Use alcohol-based cleaning solvents such as isopropyl alcohol to clean the LED. ESD(Electrostatic Discharge): Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Page 11/11
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PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan, R.O.C. Tel: 886-2-2225-3733 Fax: 886-2-2225-4800 E-mail: para@para.com.tw http://www.para.com.tw DATA SHEET
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