Product Description. Ordering Information. Optimum Technology Matching Applied GaAs HBT GaAs MESFET InGaP HBT

Transcription

1 5MHz to 1MHz, Push-Pull, High Linearity InGaP HBT Amplifier Package Style: SOIC-8 Features 5V Single Supply Excellent Linearity Performance at +34dBmV Output Power per Tone Two Amplifiers in Each SOIC-8 Package Simplify Push-Pull Configuration PC Board Layout Available in Lead-free, RoHS Compliant, and Green Packaging SOIC-8 Package Applications CATV Head End Driver and Predriver Amplifier CATV Line Driver Amplifier Product Description Functional Block Diagram RFMD's RFCA18 is a high performance InGaP HBT MMIC amplifier designed with the InGaP process technology for excellent reliablility. The heterojunction increases breakdown voltage and minimizes leakage current between junctions. A Darlington configuration is utilized for broadband performance. The RFCA18 contains two amplifiers for use in wideband push-pull CATV amplifiers requiring excellent second order performance; the second and third order non-linearities are greatly improved in the push-pull configuration Ordering Information RFCA18SQ 25 Piece sample bag RFCA18SR 7 Sample reel with 1 pieces RFCA18TR13 13 Reel with 25 pieces RFCA18PCK-41 5MHz to 1MHz, PCBA with 5-piece sample bag Optimum Technology Matching Applied GaAs HBT GaAs MESFET InGaP HBT SiGe BiCMOS Si BiCMOS SiGe HBT GaAs phemt Si CMOS Si BJT GaN HEMT BiFET HBT SOI RF MICRO DEVICES, RFMD, Optimum Technology Matching, Enabling Wireless Connectivity, PowerStar, POLARIS TOTAL RADIO and UltimateBlue are trademarks of RFMD, LLC. BLUETOOTH is a trademark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. 212, RF Micro Devices, Inc. 1 of 23

2 Absolute Maximum Ratings Parameter Rating Unit Max Device Current (I D ) 3 ma Max Device Voltage (V D ) 6 V Max RF Input Power 18 dbm Max Junction Temp (T J ) 15 C Operating Temperature Range (T L ) -4 to +85 C Storage Temperature -4 to +15 C Notes: 1. Operation of this device beyond any one of these limits may cause permanent damage. For reliable continuous operation, the device voltage and current must not exceed the maximum operating values specified in the Absolute Maximum Ratings table above. 2. Bias Conditions should also satisfy the following expression: I D V D < (T J - T L )/R TH, j - l and T L = T LEAD Nominal Operating Parameters Parameter Specification Min. Typ. Max. Unit Condition 17dB Application, V CC = 5V, I CC = 215mA Frequency Range 5 1 MHz Small Signal Gain 16.8 db 5MHz; 5V, 17.4 db 5MHz; 5V, 17.9 db 1MHz; 5V, Gain Flatness ±.5 db 5MHz to 1MHz per ANSI/SCTE Output IP3 4 dbm 55MHz, Tone Spacing = 6MHz, P OUT per Tone = +5dBm Output IP2 Plus 65 dbm 55MHz, Tone Spacing = 3MHz P OUT per Output IP2 Minus 7 dbm Tone = db P1dB 23 dbm 5MHz Input Return Loss 27 db Output Return Loss 16 db Noise Figure (Balun Insertion Loss 4. db 5MHz to 1MHz Included) CSO 8 dbc 79 Channel, Flat Tilt, +34dBmV CTB 76 dbc XMOD 69 dbc Device Operating Voltage 5. V Device Operating Current 215 ma V CC = 5V Thermal Resistance 4 C/W Junction to backside PCB under IC Note: V CC = 5V, I C = 215mA, T L =, Z S = Z L = 75, Push Pull Application Circuit 2 of 23

3 Parameter Specification Min. Typ. Max. Unit Condition 15dB Application, V CC = 5V, I CC = 15mA Frequency Range 5 1 MHz Small Signal Gain 14.7 db 5MHz; 5V, 15.5 db 5MHz; 5V, 16.5 db 1MHz; 5V, Gain Flatness ±.5 db 5MHz to 1MHz per ANSI/SCTE Output IP3 36 dbm 55MHz, Tone Spacing = 6MHz, P OUT per Tone = +5dBm Output IP2 Plus 6 dbm 55MHz, Tone Spacing = 3MHz P OUT per Output IP2 Minus 66 dbm Tone = db P1dB 2 dbm 5MHz Input Return Loss 2 db Output Return Loss 2 db Noise Figure (Balun Insertion Loss 4.5 db 5MHz to 1MHz Included) CSO 77 dbc 79 Channel, Flat Tilt, +34dBmV CTB 7 dbc XMOD 61 dbc Device Operating Voltage 5. V Device Operating Current 15 ma V CC = 5V Thermal Resistance 4 C/W Junction to backside PCB under IC 17dB Application, V CC = 5V, I CC = 217mA Frequency Range 5 3 MHz Small Signal Gain 17.4 db 15MHz; 5V, Gain Flatness ±.2 db 5MHz to 3MHz, per ANSI/SCTE Output IP3 41 dbm 5MHz to 3MHz, Tone Spacing = 6MHz, P OUT per Tone = +5dBm Output IP2 Plus 73 dbm 15MHz, Tone Spacing = 6MHz P OUT per Output IP2 Minus 73 dbm Tone = db P1dB 22 dbm 5MHz to 3MHz Input Return Loss db Output Return Loss db Noise Figure (Balun Insertion Loss 4. db 5MHz to 21MHz Included) CSO 8 dbc 7 Channel, Flat Tilt, +5dBmV CTB 67 dbc XMOD 66 dbc Device Operating Voltage 5. V Device Operating Current 217 ma V CC = 5V Thermal Resistance 4 C/W Junction to backside PCB under IC 3 of 23

4 Performance 17dB Application Circuit V CC = 5V, I CC = 215mA Input Return Loss versus Frequency 18.5 Gain versus Frequency Input Return Loss (db) Gain (db) Isolation versus Frequency Output Return Loss versus Frequency Isolation (db) Output Return Loss (db) Noise Figure versus Frequency 24 Output P1dB versus Frequency Noise Figure (db) Output P1dB (dbm) of 23

5 Performance 17dB Application Circuit V CC = 5V, I CC = 215mA 45 Output IP3 Plus versus Frequency 45 Output IP3 Minus versus Frequency Output IP3 Plus (dbm) Output IP3 Minus (dbm) Output IP2 Plus versus Frequency 9 Ouput IP2 Minus versus Frequency Output IP2 Plus (dbm) Output IP2 Minus (dbm) Gain Flatness versus Frequency 18.2 Mean Linear Response versus Measured Gain Gain Flatness (db) Flatness Flatness Flatness Measured Gain (db) Mean Linear Response Measured Gain Grand Total Grand Total 5 of 23

6 Performance 17dB Application Circuit V CC = 5V, I CC = 215mA 7. XMOD versus Frequency (34dBmV per Channel) 79 CTB versus Frequency (34dBmV per Channel) XMOD (dbc) CTB (dbc) CSO Upper versus Frequency (34dBmV per Channel) 15 CSO Lower versus Frequency (34dBmV per Channel) CSO Upper (dbc) CSO Lower (dbc) of 23

7 Evaluation Board Schematic (17dB, 5MHz to 1MHz Application Circuit) HDR1 Vdd C16 1μF C15.1μF C14 C13 68pF C12 C4 R2 412 L1 39nH J1 IN COAX-F R3. C2 68pF C2 U1 C18 T1 1 RF IN RF OUT/VCC 8 C6 68pF J2 OUT COAX-F 2 7 T RF IN RF OUT/VCC 5 C17 C1 68pF C19 C5 68pF C3 R1 412 L2 39nH HDR2 Vdd HDR3 GND C7 1μF C8.1μF C9 C1 68pF C11 HDR4 GND 7 of 23

8 Description Evaluation Board Bill of Materials (BOM) (17dB, 5MHz to 1MHz Application Circuit) Reference Manufacturer Designator Manufacturer's P/N PCB, DEMO, 31MIL BALAED SOIC-8 CATV GA DDI 22517(B) DUAL CATV 5MHz to 1MHz HI LIN GaAs HBT U1 RFMD RFCA18 CAP,, +/-.25pF, 5V, CG, 42 C19-C2 Taiyo Yuden (USA), Inc. RM UMK15CG1CW-F CAP,, 1%, 5V, X7R, 42 C3-C4 Murata Electronics GRM155R71H12KA1E CAP,, +/-.25pF, 5V, CG, 63 C11-C12, C17-C18 Murata Electronics GRM1885C1H1RCZ1D CAP, 68pF, 5%, 5V, CG, 63 C1, C13 Murata Electronics GRM1885C1H68JA1D CAP, 68pF, 1%, 5V, X7R, 63 C1-C2, C5-C6 Murata Electronics GRM188R71H681KA1D CAP,, 1%, 5V, X7R, 63 C9, C14 Murata Electronics GRM188R71H12KA1D CAP,, 1%, 5V, X7R, 63 C8, C15 Murata Electronics GRM188R71H13KA1D CAP, 1μF, 1%, 1V, X5R, 63 C7, C16 Murata Electronics GRM188R61A15KA61D RES,, 42 R3 Panasonic ERJ-2GER RES, 412, 1%, 1/16W, 42 R1-R2 Panasonic ERJ-2RKF412X IND, 39nH, 5%, W/W, 18 L1-L2 Coilcraft 18CS-391XJBC TRANSFORMER, S3, 5MHz to 1MHz, 1:1, UNBAL T1-T2 MiniRF XFM-12-1UH CONN, HDR, ST, 1-PIN,.1" JP1-JP4 Sullins PECO1SAAN CONN, F, EDGE MOUNT, 3 MIL J1-J2 Trompeter CBJE13-2 HEATSINK BLOCK, 1.5 X 2. IN SCREW, 2-56 x 3/16", SOCKET HEAD McMaster-Carr Supply Co A76 8 of 23

9 Evaluation Board Assembly Drawing (17dB, 5MHz to 1MHz Application Circuit) JP1 JP Screw (6X) NOTE: Attach assembled PCB to heat sink block EEF using six (6) 2-56 screws J1 J2 JP3 JP4 9 of 23

10 Performance 15dB Application Circuit V CC = 5V, I CC = 15mA Input Return Loss versus Frequency 17. Gain versus Frequency Input Return Loss (db) Gain (db) Isolation versus Frequency Output Return Loss versus Frequency Isolation (db) Output Return Loss (db) Noise Figure versus Frequency 23 Output P1dB versus Frequency 5 22 Noise Figure (db) Output P1dB (dbm) of 23

11 Performance 15dB Application Circuit V CC = 5V, I CC = 15mA 38 Output IP3 Plus versus Frequency 38 Output IP3 Minus versus Frequency Output IP3 Plus (dbm) Output IP3 Minus (dbm) Output IP2 Plus versus Frequency 9 Output IP2 Minus versus Frequency 7 8 Output Plus IP2 (dbm) Ouput IP2 Minus (dbm) Gain Flatness versus Frequency 17. Mean Linear Response versus Measured Gain Gain Flatness (db) Flatness Flatness Flatness Measured Gain (db) Mean Linear Response Measured Gain 11 of 23

12 Performance 15dB Application Circuit V CC = 5V, I CC = 15mA 6.5 XMOD versus Frequency (34dBmV per Channel) 7 CTB versus Frequency (34dBmV per Channel) XMOD (dbc) CTB (dbc) CSO Upper versus Frequency (34dBmV per Channel) 15 CSO Lower versus Frequency (34dBmV per Channel) CSO Upper (dbc) 8 75 CSO Lower (dbc) of 23

13 Evaluation Board Schematic (15dB, 5MHz to 1MHz Application Circuit) HDR1 Vdd C16 1μF C15.1μF C14 C13 68pF C12 C4 R2 3 L1 39nH J1 IN COAX-F R3 6.2 T1 C2 68pF R4 5.6 k C2 1 2 RF IN U1 RF OUT/ VCC 8 7 C6 68pF C18 T2 J2 OUT COAX-F RF IN RF OUT/ VCC 5 HDR2 Vdd C1 68pF R5 5.6k C19 C3 R1 3 L2 39nH C5 68pF C17 C7 1μF C8.1μF C9 C1 68pF C11 HDR3 GND HDR4 GND 13 of 23

14 Description Evaluation Board Bill of Materials (BOM) (15dB, 5MHz to 1MHz Application Circuit) Reference Manufacturer Designator Manufacturer's P/N PCB, DEMO, 31 MIL BALAED SOIC-8 CATV GA RFMD 22517(B) CONN, HDR, ST, 1-PIN,.1" JP1-JP4 Sullins Electronics Corp. PECO1SAAN CONN, F, EDGE MOUNT, 3 MIL J1-J2 Trompeter Electronics, Inc. CBJE13-2 IND, 39nH, 5%, W/W, 18 L1-L2 Coilcraft 18CS-391XJBC CAP,.1μF, 1%, 5V, X7R, 63 C8, C15 Johanson Dielectrics 5R14W13KV4 CAP,, +/-.25pF, 5V, CG, 63 C11-C12, C17-C18 Murata Electronics GRM1885C1H1RCZ1D CAP,, +/-.25pF, 5V, CG, 42 C19-C2 Murata Electronics GRM1555C1H1RCZ1E CAP,, 1%, 5V, X7R, 42 C3-C4 Murata Electronics GRM155R71H12KA1E CAP,, 1%, 5V, X7R, 63 C9, C14 Murata Electronics GRM188R71H12KA1D CAP, 1μF, 1%, 25V, X5R, 63 C7, C16 Taiyo Yuden (USA), Inc. RM TMK17BJ15KA-T CAP, 68pF, 5%, 5V, CG, 63 C1, C13 Murata Electronics GRM1885C1H68JA1D CAP, 68pF, 1%, 5V, X7R, 63 C1-C2, C5-C6 Murata Electronics GRM188R71H681KA1D RES, 6.2, 5%, 1/16W, 63 R3 Panasonic Industrial Co ERJ-3GEYJ6R2V RES, 3, 5%, 1/16W, 42 R1-R2 Panasonic Industrial Co ERJ-2GEJ31 RES, 5.6K, 5%, 1/16W, 63 R4-R5 Panasonic Industrial Co ERJ-3GEYJ562 TRANSFORMER, S3, 5MHz to 1MHz, 1:1, UNBAL T1-T2 MiniRF XFM-12-1UH DUAL CATV 5MHZ to 1MHZ HI LIN GaAs HBT U1 RFMD RFCA18 HEATSINK BLOCK, 1.5 x 2. IN EEF-1682(B) SCREW, 2-56 x 3/16", SOCKET HEAD McMaster-Carr Supply Co A76 14 of 23

15 Evaluation Board Assembly Drawing (15dB, 5MHz to 1MHz Application Circuit) Gnd Vs 2-56 Screw (6X) NOTE: Attach assembled PCB to heat sink block EEF-1682 using six (6) 2-56 screws J1 J2 Vs Gnd 15 of 23

16 Performance 17dB Return Path V CC = 5V, I CC = 215mA Input Return Loss versus Frequency 2 Gain versus Frequency Input Return Loss (db) Gain (db) Isolation versus Frequency Output Return Loss versus Frequency Isolation (db) Output Return Loss (db) Noise Figure versus Frequency 23. Output P1dB versus Frequency Noise Figure (db) Output P1dB (dbm) of 23

17 Performance 17dB Return Path V CC = 5V, I CC = 215mA 43.5 Output IP3 Plus versus Frequency 42. Output IP3 Minus versus Frequency Output IP3 Plus (dbm) Output IP3 Minus (dbm) Output IP2 Plus versus Frequency 78 Output IP2 Minus versus Frequency 8 76 Output IP2 Plus (dbm) Output IP2 Minus (dbm) Gain Flatness versus Frequency Mean Linear Response versus Measured Gain Gain Flatness (db) Flatness Flatness Flatness Measured Gain (db) Mean Linear Response Measured Gain of 23

18 Performance 17dB Return Path V CC = 5V, I CC = 215mA XMOD (dbc) XMOD versus Frequency (5dBmV per Channel) CTB (dbc) CTB versus Frequency (5dBmV per Channel) CSO Upper versus Frequency (5dBmV per Channel) 11 CSO Lower versus Frequency (5dBmV per Channel) CSO Upper (dbc) CSO Lower (dbc) Frequency (GHz) of 23

19 Evaluation Board Schematic (17dB, 5MHz to 3MHz Application Circuit) JP1 Vcc C14 1μF C13.1μF C12 C11 68pF C4.1μF R2 47 L1 1μH C2.1μF J1 IN COAX-F R3 T U1 RF OUT/ RF IN VCC C6.1μF T2 J2 OUT COAX-F 4 RF IN RF OUT/ VCC 5 JP2 C1.1μF C3.1μF R1 47 L2 1μH C5.1μF Vcc C7 1μF C8.1μF C9 C1 68pF JP3 GND JP4 GND 19 of 23

20 Description Evaluation Board Bill of Materials (BOM) (17dB, 5MHz to 3MHz Application Circuit) Reference Manufacturer Designator Manufacturer's P/N PCB, DEMO, 31 MIL BALAED SOIC-8 CATV GA RFMD 22517(B) DUAL CATV 5MHz to 1MHZ HI LIN GaAs HBT U1 RFMD RFCA18 CAP,.1μF, 1%, 25V, X7R, 63 C1-C2, C5-C6 Kemet C63C14K3RAC CAP,.1μF, 1%, 16V, X7R, 42 C3-C4 Murata Electronics GRM155R71C14KA88D CAP, 1μF, 1%, 25V, X5R, 63 C7, C14 Taiyo Yuden (USA), Inc. RM TMK17BJ15KA-T CAP, 68pF, 5%, 5V, CG, 63 C1-C11 Murata Electronics GRM1885C1H68JA1D CAP,, 1%, 5V, X7R, 63 C8, C13 Murata Electronics GRM188R71H13KA1D CAP,, 1%, 5V, X7R, 63 C9, C12 Murata Electronics GRM188R71H12KA1D RES,, 63 R3 Panasonic Industrial Co. ERJ-3GEYRV RES, 47, 5%, 1/16W, 42 R1-R2 Panasonic Industrial Co. ERJ-2GEJ471 IND, 1μH, 1%, W/W, 18 L1-L2 Coilcraft 18LS-13XJLC CONN, F, EDGE MOUNT, 3 MIL J1-J2 Trompeter Electronics, Inc. CBJE13-2 CONN, HDR, ST, 1-PIN,.1" JP1-JP4 Sullins Electronics Corp. PBC1SAAN TRANSFORMER, S3, 1:1, UNBAL T1-T2 MiniRF XFM-21-1WH HEATSINK BLOCK, 1.5 x 2. IN EEF-1682(B) SCREW, 2-56 x 3/16", SOCKET HEAD McMaster-Carr Supply Co A76 2 of 23

21 Pin Names and Descriptions Pin Name Description 1 RFIN RF input pin. External DC-blocking capacitor is required. 2 GND Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as possible. 3 GND Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as possible. 4 RFIN RF input pin. External DC-blocking capacitor is required. 5 RFOUT/VCC RF output and bias pin (open collector). 6 GND Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as possible. 7 GND Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as possible. 8 RFOUT/VCC RF output and bias pin (open collector). EPAD GND Exposed area on the bottom side of the package must be soldered to the ground plane of the board for optimum thermal and RF performance. Several vias should be located under the EPAD as shown in the recommended land pattern. Suggested Pad Layout 21 of 23

22 Package Drawing Dimensions in millimeters 22 of 23

23 Branding Diagram 23 of 23