PAN2450 Low power RF transceiver for narrow band systems Datasheet

Transcription

1 PAN2450 Low power RF transceiver for narrow band systems Datasheet - preliminary - DRAFT PAN2450 Ernst 1 of 13

2 Content Index 0. DOCUMENT HISTORY APPLICATIONS PRODUCT DESCRIPTION FEATURES PIN ASSIGNMENT ELECTRICAL SPECIFICATION SIMPLIFIED SCHEMATIC APPLICATION CIRCUIT CONFIGURATION OVERVIEW CONFIGURATION SOFTWARE MICROCONTROLLER INTERFACE FREQUENCY PROGRAMMING APPLICATION GUIDELINES FOR USE IN EUROPEAN ISM BANDS CONFIGURATION REGISTERS MODULE DRAWING SOLDERING INFORMATION Recommended reflow soldering temperature-time profile Recommended land pattern CARRIER TAPE AND REEL SPECIFICATION Embossed Tape Component Direction LABELING INFORMATION ORDERING INFORMATION GENERAL INFORMATION LIFE SUPPORT POLICY...13 DRAFT PAN2450 Ernst 2 of 13

3 0. Document History Revision Date Modification / Remarks Initial DRAFT version Add some limits 1. Applications wireless control 868 and 915 MHz ISM/SRD band systems RKE Two-way Remote Keyless Entry Home automation Wireless alarm and security systems AMR Automatic Meter Reading Low power telemetry Toys 2. Product Description The Module consists of an rf transceiver and a microcontroller. It is suited for a wide range of wireless communication applications using the license free ISM frequency bands at 868 or 915MHz. With its high Tx power, narrow channel bandwidth and high Rx sensitivity the transceiver is especially suited for reliable long range communication links. Ultra low power modes allow the use in battery powered devices. PAN2450 complies with EN Features Small dimensions (30mm x 20mm x 3.7mm) Frequency range MHz Low current consumption High sensitivity (typically -114dBm at 2.4 kbaud) Data rates from 1.8 to 4.8 kbaud Variable Tx output power Low supply voltage (2.7 V to 3.3 V) Digital RSSI and carrier sense Single port antenna connection Programmable frequency in 600 Hz steps and AFC feature provided for crystal oscillator drift compensation Development kit available DRAFT PAN2450 Ernst 3 of 13

4 4. Pin Assignment Table 1 shows an overview of the PAN2450 pins. The package for this module is a SMD package, for details please see chapter 14 Module Drawing Top View PAN2450 package (Top View) Table 1 Pin Assignment Pin no Pin name Pin type Description 1 GND ground ground connection (0Vdc) 2 VCC supply +3Vdc 3 GND ground ground connection (0Vdc) 4 GND ground ground connection (0Vdc) 5 P1.6 I/O digital I/O (1) 6 GND ground ground connection (0Vdc) 7 P1.7 I/O digital I/O (1) 8 P1.5 I/O digital I/O (1) 9 P1.4 I/O digital I/O (1) 10 P1.2 I/O digital I/O (1) 11 P1.1 I/O digital I/O (1) 12 TEST input select of test mode for JTAG pins on port1 13 P2.5 I/O digital I/O (1) 14 RST/NMI input reset (active low) or non maskable interrupt input 15 GND ground ground connection (0Vdc) 16 P2.1 I/O digital I/O (1) 17 P2.2 I/O digital I/O (1) 18 P3.0 I/O digital I/O (1) 19 P3.3 I/O digital I/O (1) 20 P3.2 I/O digital I/O (1) 21 P3.1 I/O digital I/O (1) 22 P2.4 I/O digital I/O (1) 23 P3.4 I/O digital I/O (1) 24 GND ground ground connection (0Vdc) 25 P3.5 I/O digital I/O (1) 26 GND ground ground connection (0Vdc) DRAFT PAN2450 Ernst 4 of 13

5 Pin no Pin name Pin type Description 27 ANT antenna single ended antenna connection (2) 28 GND ground ground connection (0Vdc) 29 GND ground ground connection (0Vdc) 30 GND ground ground connection (0Vdc) 31 GND ground ground connection (0Vdc) 32 GND ground ground connection (0Vdc) 33 GND ground ground connection (0Vdc) 34 GND ground ground connection (0Vdc) 35 GND ground ground connection (0Vdc) 36 GND ground ground connection (0Vdc) Note (1) digital I/O pins are fed through to the corresponding pins of the microcontroller MSP430F1232 on the module. The pin names at the module and at the microcontroller are the same. Note (2) The integrated circuit used in PAN2450 is a CHIPCON CC1020, available at Additional information and application hints can be found in the datasheet of CC1020 and the related application notes. 5. Electrical Specification Table 2 Electrical Specification Conditions: 50Ω load, Tc = 25 C, Vdd = 3.0 V, 869MHz, 14dBm output power, GFSK,4.8kBaud, 4.95kHz separation, PN9 sequence as modulation data, 25kHz channel width if not otherwise stated. Note Specification of minimum/maximum data is intended to be inserted after evaluation of data from mass production and / or corresponding data sheet updates of CC1020. Parameter Min. Typ. Max. Unit Condition / Note Overall Supply voltage Vdd Vdc Storage temperature range C Operating temperature range C Supply current 53 tbd ma Transmit Supply current 29 ma Transmit +3dBm output pwr. Supply current 18 ma Receive mode Supply current 802 ua Power down mode RF Frequency Range MHz nominal load impedance 50 Ohm Frequency steps 600 Hz Frequency deviation khz limited by ACP limitations Channel width khz Modulation FSK, GFSK Coding NRZ, Manchester Transmit Section Transmit data rate kbaud Binary FSK frequency separation khz A logic "0" data input voltage corresponds to the rf output frequency f0, whilef1 corresponds to a logic "1". The frequency separation f1- f0 is programmable in 250 Hz DRAFT PAN2450 Ernst 5 of 13

6 Parameter Min. Typ. Max. Unit Condition / Note Output power note (3) note (3) note (3) , dbm dbm dbm dbm dbm dbm RF output impedance 50 Ω Harmonics dbm general steps..the RF carrier center frequency, fc, is fc=(f0+f1)/2. The frequency deviation fd is fd=+/-(f1-f0)/2. GFSK pseudo random modulated carrier for CC1020 setting +5dBm for CC1020 setting +3dBm for CC1020 setting +0dBm for CC1020 setting -10dBm for CC1020 setting -18dBm for CC1020 setting -20dBm Adjacent channel power -39,5-37 dbm 25kHz channel width. Measured in a ±8.5kHz bandwidth at 25kHz offset Spurious emissions 47-74, , , -52 tbd dbm (3) +14dBm output power MHz dbm for +9dBm output 25 C <1GHz tbd -36 dbm >1GHz tbd -30 dbm Note (3) for an output power > 9dBm antenna attenuation has to be provided for compliance with the EN spurious emissions limit of 54dBm. For +14dBm module output power setting an antenna with at least 5dB attenuation has to be used. Receive Section rf input levels stated for Bit Error Rate B.E.R.=10E-3 Receiver class 2 EN V1.3.1 part 4.1 Receiver Sensitivity Modulation: FSK NRZ PN9 sequence 1.8kBaud tbd dbm ±1.35kHz frequ. deviation 1.8kBaud -114 dbm ±2.4 khz frequ. deviation 2.4kBaud -113 dbm ±2.4 khz frequ. deviation 4.8kBaud -111 dbm ±2.4 khz frequ. deviation Saturation 10 dbm (maximum input level) Co-channel rejection -11 db Wanted signal 3dB above the sensitivity level, Cochannel with FM jammer (4) Adjacent channel rejection (ACR) 32 db Wanted signal 3dB above the sensitivity level, Adj. channel with FM jammer (4) Blocking/Desensitation +-1MHz +-2MHz +-5MHz +-10MHz db db db db Wanted signal 3dB above the sensitivity level, CW jammer at 1, 2, 5 and 10MHz offset. Note (4) 1kHz sine, +-2.5kHz deviation DRAFT PAN2450 Ernst 6 of 13

7 Parameter Min. Typ. Max. Unit Condition / Note RSSI Carrier sense programmable range 40 db RSSI dynamic range 63 db RSSI accuracy ±3 db RSSI linearity ±1 db IF section AFC resolution 150 Hz at 2.4kBaud Frequency synthesizer Reference frequency f REF MHz internal f REF tolerance ±10 ppm Note (5) f REF temp. characteristics ±20 ppm -40 C to +85 C (Ref. +25 C) f REF aging tolerance ±2 ppm per year Note (5) The deviation of the rf output carrier frequency f C from the programmed carrier frequency f P is f C = (tolerance + temp.char. + years x aging tol./year) x f p Digital Inputs/Outputs Logic 0 input voltage V Logic 1 input voltage 0.7 Vdd V Logic 0 output voltage V -2mA output current Logic 1 output voltage 2.5 Vdd V 2mA output current 6. Simplified schematic Vdd Tx amplifier Rx/Tx switch digital I/O MSP430F1232 uc CC1020 transceiver ANT crystal 32kHz crystal MHz GND DRAFT PAN2450 Ernst 7 of 13

8 7. Application Circuit Typical application and test circuit 0 shows a typical application circuit for the action. To set the module in different modes, can be done over the groper after flashing the µ PAN2450 module. There are different sensors (D1 to D7 [LEDs]) and actors (S1 to S3 [groper]) to activate or indicate a special C with your software over the JTAG adapter (X4). The SMA connector (X1), is used for the rf signal in transmit and receive mode. Pins X2 and X3 are mainly used for the received data and clock data. 8. Configuration Overview see CHIPCON CC1020 Datasheet (rev.1.4), necessary register settings REGISTER VALUE COMMENT MATCH 0x0F0 FRONTEND 0x076 ANALOG 0x087 INTERFACE 0x00F (8) PLL_BW 0x0AE (8) when entering the power down mode, this register has to be changed to 0x001 to ensure lowest power consumption DRAFT PAN2450 Ernst 8 of 13

9 9. Configuration Software see CHIPCON CC1020 Datasheet (rev.1.4), Microcontroller Interface see TEXAS INSTRUMENTS Inc. MSP430x12x2 Datasheet Frequency Programming see CHIPCON CC1020 Datasheet (rev.1.4), Application Guidelines for use in European ISM bands see CHIPCON CC1020 Datasheet (rev.1.4), pg and ETSI EN Configuration Registers see CHIPCON CC1020 Datasheet (rev.1.4), Module Drawing DRAFT PAN2450 Ernst 9 of 13

10 15. Soldering Information 15.1 Recommended reflow soldering temperature-time profile 10 ±1s Temp [ C] 150 ±10 C 235 C max. 220 ±5 C 200 C /-10 s 90 ±30s Recommended temperature profile for PAN2450 Time [s] 15.2 Recommended land pattern We prefer the same dimensions for the solder paste screen but it depends on your solder screen thickness. 30,40mm 7,40mm 0,20mm 0,60mm 0,40mm 3,80mm 20,40mm Pin 1 Sign "D1" on the Module (Bottom Side) 32*1,20mm 0,40mm 0,60mm 0,20mm 1,40mm Recommended foot pattern for PAN2450 DRAFT PAN2450 Ernst 10 of 13

11 16. Carrier Tape and Reel Specification 16.1 Embossed Tape (1) Dimension of the tape (EIAJ-tbd) 1.75 φ B 0.35 (Units : mm) 3deg. max φ 2.0 A A R0.5 typ B deg. max B - B A - A (2) Cover tape reel strength Force direction θ = 10deg Speed = 300mm/min. Cover tape reel strength =0.098~0.68N (10~70g) (3) Empty hollow Direction of feed Empty hollow more than 10 pitch Component packed area Empty hollow more than 10pitch Top cover tape more than 200mm Empty hollow in component packed area shall be less than two per reel and those hollows shall not be consecutive Component Direction Top cover tape shall not be found on reel holes and shall not stick out from reel. Tape running direction Laufrichtung des Bandes fig.1 (top view) DRAFT PAN2450 Ernst 11 of Part No Component direction Komponentenrichtung

12 17. Labeling Information 30,0mm 20,0mm ENW59602ND1 Serial Number Date Code 18,5mm Labeling drawing for the Module 1,0mm 14,0mm The black circle indicates the pinning 1, please see also the chapter Pin Assignment and Recommended land pattern. 18. Ordering Information Table 3 Ordering table Ordering part number Description MOQ ENW5Z602ND1 Engineering Sample 1 PAN2450, Version 868 MHz, Output 14dBm ENW59602ND1 PAN2450, Version 868 MHz, Output 14dBm tbd ENW5Y602ND1 Application Board for PAN DRAFT PAN2450 Ernst 12 of 13

13 19. General Information Matsushita GmbH All rights reserved. This product description does not lodge the claim to be complete and free of mistakes. Please contact the related product manager in every case. If we deliver samples to the customer, these samples have the status Engineering Samples. This means, the design of this product is not yet concluded. Engineering Samples may be partially or fully functional, and there may be differences to be published Data Sheet. Engineering Samples are not qualified and are not to be used for reliability testing or series production. Waiver: Customer acknowledges that samples may deviate from the Data Sheet and may bear defects due to their status of development and the lack of qualification mentioned above. Matsushita rejects any liability or product warranty for Engineering Samples. In particular, Matsushita waives liability for damages caused by the use of the Engineering Sample other than for Evaluation Purposes, particularly the installation or integration in an other product to be sold by Customer, deviation or lapse in function of Engineering Sample, improper use of Engineering Samples. Matsushita waives any liability for consequential and incidental damages. In case of any questions, please contact your local sales partner or the related product manager. 20. Life Support Policy This Matsushita product is not designed for use in life support appliances, devices, or systems where malfunction can reasonably be expected to result in a significant personal injury to the user, or as a critical component in any life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Matsushita customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Matsushita for any damages resulting DRAFT PAN2450 Ernst 13 of 13

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