Mat'l Density (Kg/cubic Material
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- Sybil McDowell
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1 Mat'l Density (Kg/cubic Material inches) Ceramic Glass (LS-0113) Leadframe (Alloy 42) Wire vol = E-07 Aluminum Wire Silicon Die Attach (Ag glass) Tin Lead Solder (63/37) Pkg Pin Component Volume(cubic inches) Component Weight (Kg) True Weight (Kg) Percent Error JG 8 Ceramic(Base) Small Cavity Glass (Base) E-05 Ceramic (Cap) Glass (Cap) E-05 L/F Wire E E-08 Silicon E-06 Die Attach Solder E-06 Total Weight (Kg)= % JG 8 Ceramic(Base) Large Cavity Glass (Base) E-05 Ceramic (Cap) Glass (Cap) E-05 L/F Wire E E-08 Silicon E-06 Die Attach Solder E-06 Total Weight (Kg)= % U 10 Ceramic(Base) E-05 Glass (Base) E-05 Ceramic (Cap) E-05 Glass (Cap) E-05
2 L/F E-05 Wire E E-08 Silicon E-06 Die Attach E-06 Solder E-06 Total Weight (Kg) = % W 14 Base Glass (Base) E-05 Cap Glass (Cap) E-05 L/F E-05 Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = % W 16 Base Glass (Base) E-05 Cap Glass (Cap) E-05 L/F E-05 Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = % W 20 Base Glass (Base) E-05 Cap Glass (Cap) E-05 L/F E-05 Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = %
3 WD 48 Base Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-05 Die Attach Solder E-05 Total Weight (Kg) = % WD 56 Base Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-05 Die Attach Solder E-05 Total Weight (Kg) = % J 14 Base Small Cavity Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = % J 14 Base Large Cavity Glass (Base) Cap Glass (Cap) L/F
4 Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = % WA 14 Base E-05 Glass (Base) E-05 Cap E-05 Glass (Cap) E-05 L/F E-05 Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = % J 16 Base Small Cavity Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = % J 16 Base Large Cavity Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = %
5 J 20 Base Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = % J 24 Base Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-05 Die Attach E-06 Solder E-05 Total Weight (Kg) = % JT 24 Base Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = % W 24 Base Glass (Base) Cap Glass (Cap) L/F Wire E E-07
6 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = % J 28 Base Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-05 Die Attach Solder E-05 Total Weight (Kg) = % JT 28 Base Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-05 Die Attach Solder E-05 Total Weight (Kg) = % HV 68 Base Glass (Base) Cap Glass (Cap) L/F Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % HFP 132 Base
7 Glass (Base) Cap Glass (Cap) L/F Wire E E-06 Silicon E-05 Die Attach E-05 Solder Total Weight (Kg) = % Multilayered HFG 132 Header Small Cavity Lid L/F Tie Bars Wire E E-06 Silicon E-05 Die Attach E-05 Solder Total Weight (Kg) = % HFH 352 Header Lid L/F Tie Bars Wire E E-06 Silicon Die Attach Solder Total Weight (Kg) = % HFG 132 Header Large Cavity Lid L/F Tie Bars Wire E E-06 Silicon E-05 Die Attach E-05 Solder Total Weight (Kg) = %
8 HFH 320 Header Lid Heat Sink L/F Tie Bars Wire E E-06 Silicon Die Attach Solder Total Weight (Kg) = % HFG 196 Header Lid L/F Tie Bars Wire E E-06 Silicon E-05 Die Attach E-05 Solder Total Weight (Kg) = % HFG 164 Header Lid L/F Tie Bars Wire E E-06 Silicon E-05 Die Attach E-05 Solder Total Weight (Kg) = HFG 84 Header Lid L/F Tie Bars Wire E E-07 Silicon E-05 Die Attach E-05
9 Solder E-05 Total Weight (Kg) = % FJ 44 Header Large Cavity Lid L/F Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % FJ 44 Header Small Cavity Lid Seal Glass E-05 L/F Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % FJ 68 Header Lid Lid Lens Seal Glass L/F Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % FJ 68 Header Lid L/F Wire E E-07 Silicon E-05 Die Attach E-05
10 Solder E-05 Total Weight (Kg) = % JD 40 Header Small Cavity Lid L/F Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % JD 40 Header Large Cavity Lid L/F Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % GB 68 Header Lid Pins Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % GFA 141 Header Small Cavity Lid Pins Wire E E-06 Silicon E-05 Die Attach Solder E-05 Total Weight (Kg) = %
11 GFA 141 Header Large Cavity Lid Pins Wire E E-06 Silicon E-05 Die Attach Solder E-05 Total Weight (Kg) = % GF 305 Header Lid Heat Sink Pins Wire E E-06 Silicon Die Attach Solder Total Weight (Kg) = GB 68 Header Lid Lid Lens Seal Glass Pins Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % GB 181 Header Lid Pins Wire E E-06 Silicon E-05 Die Attach E-05 Solder Total Weight (Kg) = %
12 GB 132 Header Lid Pins Wire E E-06 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % GB 145 Header Lid Pins Wire E E-06 Silicon Die Attach Solder Total Weight (Kg) = % GLP 429 Header Lid Balls Silicon E-05 Total Weight (Kg) = % FD 68 Header Large Cavity Lid Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % FD 68 Header Small Cavity Lid Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = %
13 HFH 256 Header Small Cavity Lid L/F Tie Bars Wire E E-06 Silicon Die Attach Solder Total Weight (Kg) = HFH 256 Header Large Cavity Lid L/F Tie Bars Wire E E-06 Silicon Die Attach Solder Total Weight (Kg) = FK 20 Header Lid Seal Glass E-05 Wire E E-07 Silicon E-06 Die Attach E-06 Solder E-05 Total Weight (Kg) = % FK 28 Header Small Cavity Lid Seal Glass E-05 Wire E E-07 Silicon E-06 Die Attach Solder E-05 Total Weight (Kg) = %
14 FK 28 Header Large Cavity Lid Seal Ring Wire E E-07 Silicon E-06 Die Attach Solder E-05 Total Weight (Kg) = % GB 84 Header Lid Pins Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = % HFG 100 Header Lid L/F Tie Bars Wire E E-07 Silicon E-05 Die Attach E-05 Solder Total Weight (Kg) = % HFN 408 Header Lid L/F Wire E E-06 Silicon Die Attach Solder Total Weight (Kg) = % HFH 288 Header Lid
15 L/F Tie Bars Wire E E-06 Silicon E-05 Die Attach Solder Total Weight (Kg) = FK 44 Header Lid Wire E E-07 Silicon E-05 Die Attach E-05 Solder E-05 Total Weight (Kg) = %
16 Multi-Layered Ceramic Packages Pin Package HFG HFH Group MIL MIL Description Comments Body Size X X X X 3.00 Package Mass Item Component CAS # Substance % Amount Amount Header Ceramic Al2O % NCTB Ceramic Al2O % Leadframe Kovar Fe % Leadframe Kovar Co % Leadframe Kovar Ni % Leadframe Kovar Manganese 0.500% Leadframe Kovar Silicon 0.200% Leadframe Kovar Carbon 0.040% Leadframe Kovar Aluminum 0.100% Leadframe Kovar Magnesium 0.100% Leadframe Kovar Zirconium 0.100% Leadframe Kovar Titanium 0.100% Leadframe Kovar Copper 0.200% Leadframe Kovar Chromium 0.200% Leadframe Kovar Molybdenum 0.200% Lid Kovar Fe % Lid Kovar Co % Lid Kovar Ni % Lid Kovar Manganese 0.500% Lid Kovar Silicon 0.200% Lid Kovar Carbon 0.040% Lid Kovar Aluminum 0.100% Lid Kovar Magnesium 0.100% Lid Kovar Zirconium 0.100% Lid Kovar Titanium 0.100% Lid Kovar Copper 0.200% Lid Kovar Chromium 0.200% Lid Kovar Molybdenum 0.200% Lid Ceramic Al2O % Die Attach N/A Silver %
17 lead vanadium tellurium filler (lead, vanadium, tellurium glass) % Die Attach N/A Die Attach N/A solvent/binder 9.000% Seal Glass LS SiO % Seal Glass LS TiO % Seal Glass LS ZrO % Seal Glass LS Al2O % Seal Glass LS Fe2O % Seal Glass LS Cr2O % Seal Glass LS PbO % Seal Glass LS CoO 0.100% Seal Glass LS CaO 0.010% Seal Glass LS MgO 0.010% Seal Glass LS K2O 0.010% Seal Glass LS Na2O 0.010% Seal Glass LS B2O % Bond Wire Aluminum Aluminum % Bond Wire Aluminum Silicon 1.000% Leadframe Plating Solder dipped Tin % Leadframe Plating Solder dipped Lead % Leadframe Plating non-solder dipped Nickel % Leadframe Plating non-solder dipped Gold % Lid Plating N/A Nickel % Lid Plating N/A Gold % Heat Sink N/A Tungsten % Heat Sink N/A Copper % Product Content Methodology For an explanation of the methods used to determine material weights, See Product Content Methodology, Important Warranty and Disclaimer Information TI bases its material content knowledge on information provided by third parties and has taken and continues to take re provide representative and accurate information, but may not have conducted destructive testing or chemical analysis o and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other lim not be available for release. TI provides an exclusive warranty for certain material content representations in the Materi Certificate for Semiconductor Products, which can be found at All other material content informati
18 HFH HFG HFG HFG FJ FJ MIL MIL MIL MIL MIL MIL X X X X X X X X X X X X Amount Amount Amount Amount Amount Amount
19 easonable steps to on incoming materials ited information may ial Declaration ion is provided "as is."
20 JD GB GFA GF GB GB MIL MIL MIL MIL MIL MIL X X X X X X X X X X X X Amount Amount Amount Amount Amount Amount
21
22 GB GB GLP FD HFH FK MIL MIL MIL MIL MIL MIL X X X X X X X X X X X 8.89 X Amount Amount Amount Amount Amount Amount
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24 FK GB HFG HFN HFH FK MIL MIL MIL MIL MIL MIL X X X X X X X X X X Amount Amount Amount Amount Amount Amount
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26 Pressed Ceramic Packages Pin 8 10 Package JG U Group MIL MIL Description Comments Body Size 9.65 X 6.30 X X 6.12 X 1.24 Package Mass Item Component CAS # Substance % Amount Amount Header Ceramic Aluminum Oxide % Lead Frame Alloy Iron % Lead Frame Alloy Nickel % Lead Frame Alloy Manganese 0.800% Lead Frame Alloy Silicon 0.300% Lead Frame Alloy Carbon 0.050% Lead Frame Alloy Chromium 0.250% Lead Frame Alloy Phosphorus 0.025% Lead Frame Alloy Sulfur 0.025% Lead Frame Alloy Aluminum 0.100% Die Attach N/A Silver % lead vanadium tellurium filler (lead, vanadium, tellurium glass) % Die Attach N/A Die Attach N/A solvent/binder 9.000% Seal Glass LS SiO % Seal Glass LS TiO % Seal Glass LS ZrO % Seal Glass LS Al2O % Seal Glass LS Fe2O % Seal Glass LS Cr2O % Seal Glass LS PbO % Seal Glass LS CoO 0.100% Seal Glass LS CaO 0.010% Seal Glass LS MgO 0.010% Seal Glass LS K2O 0.010%
27 Seal Glass LS Na2O 0.010% Seal Glass LS B2O % Bond Wire Aluminum Aluminum % Bond Wire Aluminum Silicon 1.000% Leadframe Plating Solder Dipped Tin % Leadframe Plating Solder Dipped Lead % Product Content Methodology For an explanation of the methods used to determine material weights, See Product Content Methodology, Important Warranty and Disclaimer Information TI bases its material content knowledge on information provided by third parties and has taken and continues to take rea provide representative and accurate information, but may not have conducted destructive testing or chemical analysis on materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and information may not be available for release. TI provides an exclusive warranty for certain material content representatio Declaration Certificate for Semiconductor Products, which can be found at All other material conte provided "as is."
28 W W W WD WD J WA MIL MIL MIL MIL MIL MIL MIL 8.64 X 6.12 X X 6.76 X X 6.73 X X 9.65 X X 9.65 X X 7.31 X X 4.85 X Amount Amount Amount Amount Amount Amount Amount
29 asonable steps to n incoming other limited ons in the Material nt information is
30 J J J JT W J MIL MIL MIL MIL MIL MIL X 7.32 X X 7.32 X X X X 7.32 X X 8.89 X X X Amount Amount Amount Amount Amount Amount
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32 JT HV HFP MIL MIL MIL X 7.32 X X X X X Amount Amount Amount
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