Ultra-Low Phase Jitter SMD Clock Oscillator

Transcription

1 ASMX Moisture Sensitivity Level MSL 3 FEATURES: Excellent integrated phase jitter ±50ppm total frequency stability over -40 C to +85 C temperature range Output Type: LCMOS, LDS, LPECL, HCSL Industry standard 6-Pin 7 x 5mm LGA package APPLICATIONS: Fiber Channel 10G/12G SERDES Communications Backplane reference clock 10/40/400 Gigabit Ethernet FPGA gh Performance PCI-Express Storage KEY ELECTRICAL SPECIFICATIONS Absolute Ratings Item Supply oltage Storage Temp. Lead Temp.(soldering, 10s) ESD (HBM) Unit C C k Condition Common Key Electrical Specifications LCMOS, LPECL, LDS, HCSL Please see Table 1- Frequency Code for available frequencies LCMOS, L PECL, LDS, HCSL Frequency Output Type Operating Temperature (TA) Overall Frequency Stability (1) Supply oltage (DD) C ppm Key Electrical Specifications LCMOS DD = , TA = -40 C to +85 C, output terminated with 50 Oh to DD/2.(2) Start-up time (Tstart) RMS Phase Noise OH OL DD No load to 80 Key Electrical Specifications LPECL DD = , TA = -40 C to +85 C, outputs terminated with 50 Oh to DD - 2.(2) OH OL Peak to Peak Output Swing (swing) Start-up Time RMS Phase Jitter 1 DD-1.35 DD-1.01 DD-0.8 DD-2.0 DD-1.78 DD Single ended RL=50Ω, CL=0pF to 80 REISED:

2 ASMX Moisture Sensitivity Level MSL 3 KEY ELECTRICAL SPECIFICATIONS (Continued) Key Electrical Specifications LDS DD = , TA = -40 C to +85 C, outputs terminated with Oh between Q and /Q.(2) Common Mode Output oltae (CM) Output Differential oltage (OD) m OH OL Start-up Time RMS Phase Jitter OH max = CM max + ½ OD max OH min = CM min ½ OD max RL=Ω, CL=0pF to 80 Key Electrical Specifications HCSL DD = , TA = -40 C to +85 C, outputs terminated with 50 Oh to DD - 2.(2) Start-up Time RMS Phase Jitter : OH OL m m Inclusive of initial accuracy, temperature drift, aging, shock, vibration from -40 C to +85 C. Guaranteed after thermal equilibrium REISED:

3 ASMX Moisture Sensitivity Level MSL 3 PART IDENTIFICATION ASMX- MHz- Output Frequency (See ) See Table 1 for developed frequencies. e.g for MHz for MHz - Output Format Code See Table 2 for output format codes Frequency Code See Table 1 for frequency codes and the corresponding developed frequencies Packaging Blank: Bulk or Tube T: Tape & Reel Overall Frequency Stability B: ±50ppm over -40 C ~ +85 C for OE= Pin 1 N: ±50ppm over -40 C ~ +85 C for OE= Pin 2 Developed Frequencies Table 1 Frequency Codes vs. Developed Frequencies 3E D Frequency Codes 3A 3N 3B L S REISED:

4 ASMX PART IDENTIFICATION Developed Frequencies Table 1 Frequency Codes vs. Developed Frequencies (continued) 4E Frequency Codes 4J 4B A Note: 1. For LCMOS output, max. output frequency is 250MHz 2. Please contact Abracon for frequencies not listed in the above table. Table 2 Output Format Codes Output Format Codes A: LPECL B: LDS C: LCMOS D: HCSL F: LPECL G: LDS H: LCMOS J: HCSL L: LPECL M: LDS N: LCMOS P: HCSL R: LPECL S: LDS T: LCMOS U: HCSL Pinout Description Pin #1 = O/E Active High, Pullup (50kΩ) Pin #2 = NC Pin #6 = cc Pin #1 = O/E Active Low, Pulldown (50kΩ) Pin #2 = NC Pin #1 = NC Pin #2 = O/E Active Low, Pulldown (50kΩ) Pin #1 = NC Pin #2 = O/E Active High, Pullup (50kΩ) Pin #6 = cc Pin #6 = cc Pin #6 = cc REISED:

5 ASMX OUTLINE DIMENSION: Recommended Land Pattern OUTLINE DIMENSION Ref. A A1 A2 D D1 E E1 b c e f k m n Min Nom. Max BSC BSC DESCRIPTION: BSC Dimensional Tolerance aaa 0. bbb Dimensions: mm REISED:

6 ASMX ASMP PIN CONFIGURATION Pin # DESCRIPTION: Pin Type I, SE Pin Level LCMOS 3 Pin Name OE DNC DNC OE GND I, SE PWR LCMOS 4 Q O LCMOS/LPECL/ LDS/HCSL DNC (for LCMOS) /Q O DD PWR LPECL/ LDS/HCSL Low Jitter Pin Function Output Enable, disables output to tri-state. Make no connection, leave floating Make no connection, leave floating Output Enable, disables output to tri-state. Power Supply Ground Clock Output Make no connection, leave floating for LCMOS output type Complimentary Clock Output for differential output type Power Supply REFLOW PROFILE Average Ramp-up Rate Pre-Heat Temp C Temp > 217 C Peak Temperature Peak Temperature Ramp-down Rate Time 25 C to Peak Temp. Specifications 3 C /second max second second 40 second 260 C + 0 C / -5 C -6 C / second max. 8 minutes max. REISED:

7 ASMX TAPE & REEL ASMP DESCRIPTION: Low Jitter T= Tape & Reel, 0pcs/reel. Reel Size = 7-inch Reel MSL-3 packaging applies to T option. Blank = Bulk or Tube (43pcs/tube) MSL-3 packaging applies to MOQ=43 units (tube) ~ ±0.10 All sides 5.50± Ref / Ref. Dimensions: mm ATTENTION: Abracon Corporation s products are COTS Commercial-Off-The-Shelf products; suitable for Commercial, Industrial and, where designated, Automotive Applications. Abracon s products are not specifically designed for Military, Aviation, Aerospace, Life-dependant Medical applications or any application requiring high reliability where component failure could result in loss of life and/or property. For applications requiring high reliability and/or presenting an extreme operating environment, written consent and authorization from Abracon Corporation is required. Please contact Abracon Corporation for more information. REISED: