SOLDERING. Understanding the Basics. Edited by Mel Schwartz. Materials Park, Ohio

Size: px

Start display at page:

Download "SOLDERING. Understanding the Basics. Edited by Mel Schwartz. Materials Park, Ohio"

Phoebe Lambert
6 years ago
Views:

1 SOLDERING Understanding the Basics Edited by Mel Schwartz ASM International Materials Park, Ohio

2 Copyright 2014 by ASM International All rights reserved No part of this book may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the written permission of the copyright owner. First printing, February 2014 Great care is taken in the compilation and production of this book, but it should be made clear that NO WARRANTIES, EXPRESS OR IMPLIED, INCLUDING, WITHOUT LIMITATION, WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE, ARE GIVEN IN CONNECTION WITH THIS PUBLICATION. Although this information is believed to be accurate by ASM, ASM cannot guarantee that favorable results will be obtained from the use of this publication alone. This publication is intended for use by persons having technical skill, at their sole discretion and risk. Since the conditions of product or material use are outside of ASM s control, ASM assumes no liability or obligation in connection with any use of this information. No claim of any kind, whether as to products or information in this publication, and whether or not based on negligence, shall be greater in amount than the purchase price of this product or publication in respect of which damages are claimed. THE REMEDY HEREBY PROVIDED SHALL BE THE EXCLUSIVE AND SOLE REMEDY OF BUYER, AND IN NO EVENT SHALL EITHER PARTY BE LIABLE FOR SPECIAL, INDIRECT OR CONSEQUENTIAL DAMAGES WHETHER OR NOT CAUSED BY OR RESULTING FROM THE NEGLIGENCE OF SUCH PARTY. As with any material, evaluation of the material under end-use conditions prior to specification is essential. Therefore, specific testing under actual conditions is recommended. Nothing contained in this book shall be construed as a grant of any right of manufacture, sale, use, or reproduction, in connection with any method, process, apparatus, product, composition, or system, whether or not covered by letters patent, copyright, or trademark, and nothing contained in this book shall be construed as a defense against any alleged infringement of letters patent, copyright, or trademark, or as a defense against liability for such infringement. Comments, criticisms, and suggestions are invited, and should be forwarded to ASM International. Prepared under the direction of the ASM International Technical Book Committee ( ), Margaret Bush, Chair. ASM International staff who worked on this project include Scott Henry, Senior Manager, Content Development and Publishing; Karen Marken, Senior Managing Editor; Victoria Burt, Content Developer; Sue Sellers, Editorial Assistant; Madrid Tramble, Manager of Production; and Kate Fornadel, Senior Production Coordinator. Library of Congress Control Number: ISBN-13: ISBN 10: SAN: ASM International Materials Park, OH Printed in the United States of America

3 Soldering Understanding the Basics Copyright 2014 ASM International M. Schwartz, editor All rights reserved Contents Preface vii Chapter 1 Soldering Definition and Differences Soldering and History Fundamentals Alloy Formation and Phase Diagrams Process Description and Wetting Intermetallics in Solders Passivation Solderability Joint Design and Guidelines Soldering Process Parameters Chapter 2 Solder Filler Materials Solder Specification Lead Solder Flux- Core Solder Hard Solder Glass Solder Effects of Alloying Elements and Impurities Chapter 3 Lead-Free Solders Changing to Lead- Free Soldering Reasons and Resources Types of Lead- Free Solder

4 iv / Contents Chapter 4 Fluxes Flux and Its Functions Types of Flux Postassembly Cleaning Procedures Fluxes in Electronic Assembly Chapter 5 Solder Pastes Chapter 6 Soldering Processes and Equipment Iron Soldering Torch Soldering Dip Soldering Wave Soldering Induction Soldering Furnace and Infrared Soldering Resistance Soldering Hot Gas Soldering Vapor- Phase Soldering Spray Gun Soldering Ultrasonic Soldering Chapter 7 Soldering in Electronics Assembly Design and Manufacture of Electronic Assemblies Substrate Materials for Electronic Component Applications Storage Corrosion Solder Application Common Types of Electronic Assembly Properties of Common Packaging and Substrate Materials Chapter 8 Quality Control, Inspection, and Reliability Quality Control Assessing Solderability Inspection Reliability Chapter 9 The Future of Soldering Plastic Electronics

5 Contents / v 9.2 Single-Molecule Electronics and Chemical Soldering Thermal Dip-Pen Nanolithography Nanotechnology in Electronic Assembly Dissimilar Material Joining New Applications Conclusion Index

6 Soldering Understanding the Basics Copyright 2014 ASM International M. Schwartz, editor All rights reserved Preface THE SELECTION OF SOLDERS for specific applications is not the haphazard affair it once was. Today (2013), demanding service environments and rigorous specifications require that the precise details of a soldering process be worked out in advance rather than left to the end. The design of a soldering process has thus become part and parcel of the product design process itself. Other trends have had tremendous effects as well. Notably, in recent years, environmental concerns have led to a widespread increase in the use of lead-free solders and much innovation in the soldering processes by which they are applied. Moreover, a drive toward miniaturization has led to sweeping changes in soldering forms and processes for electronics assembly. There is therefore a need for a general introduction to soldering that incorporates up-to-date information on this rapidly changing field an introduction that assumes some basic knowledge of joining processes but does not demand that the reader wade through pages of mathematical formulae. The aim and purpose of this book is to supply practical information to the user materials technologist, metallurgist, electronics technician and engineer, manufacturing designer and planning engineer, soldering and joining specialist, purchasing agent, tooling specialist, or quality-assurance personnel who wishes to become familiar with the current state of the art. Its secondary purpose is to introduce interested readers to the vast and ever-growing world of online literature on soldering; for this purpose, wherever feasible, I have included the URLs of websites and pages that I believe the reader will find especially helpful. Most of these are selected from professional publications that would-be specialists would do well to follow in general, especially because no single book in this field can hope to remain completely current for very long. The subjects to be covered include the various soldering methods and techniques as well as the latest information on solder alloys, solder films, vii

7 viii / Preface surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Again, for most of the chapters the information is geared toward soldering practice and limited with respect to the theory. The hope here is that the book will thereby be rendered useful to scientists, materials engineers, designers, manufacturing engineers, technologists, metallurgists, and so on who need immediate practical guidance rather than theoretical instruction. Thus, this book is intended for the student, engineer, or joining specialist who wishes to learn more about all aspects of the art/science of solders and soldering as it is practiced today. Generally, anyone with some experience with soldering should be able to use the information contained herein. Mel Schwartz Clearwater, Florida

COMPOSITE FILAMENT WINDING

COMPOSITE FILAMENT WINDING Edited by S.T. Peters ASM International Materials Park, Ohio 44073-0002 Copyright 2011 by ASM International All rights reserved No part of this book may be reproduced, stored