CT DELSS1.12 FIREFLY E1608. Applications. Features: Produktdatenblatt Version 1.1 CT DELSS1.12
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- Ethelbert Reynolds
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1 Produktdatenblatt Version 1.1 FIREFLY E1608 The FIREFLY E1608 family expands OSRAM Opto Semiconductors portfolio of visible products for use in mobile devices like fitness tracking or health monitoring. It offers one of the smallest LED footprints in a highly reliable and proven package. The compact size of only 0.8 mm x 1.6 mm x 0.6 mm allows customers the benefit of more flexible product designs. The true green CT DELSS1.22 is specially designed for Heart Rate Monitor applications. It features a typical brightness of mcd and a wavelength of 525 nm, that is ideally matched to these applications. Applications Health monitoring (Heart rate monitoring, pulse oximetry) Features: Package: white SMT package, colorless clear resin Chip technology: UX:3 Typ. Radiation: 120 (Lambertian emitter) Color: λ dom = 530 nm ( true green) Corrosion Robustness Class: 1B ESD: 2 kv acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) 1 Version
2 Ordering Information Type Luminous Intensity 1) Ordering Code = 20 ma I v -AABA-36-44G mcd Q65112A Version
3 Maximum Ratings Parameter Symbol Values Operating Temperature T op min. max. Storage Temperature T stg min. max. -40 C 85 C -40 C 85 C Junction Temperature T j max. 90 C Forward current T S = 25 C Surge Current t 10 µs; D = ; T S = 25 C Reverse voltage 2) T S = 25 C ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) min. max. 3 ma 30 ma S max. 70 ma V R max. 5 V V ESD 2 kv 3 Version
4 Characteristics = 20 ma; T S = 25 C Parameter Symbol Values Peak Wavelength λ peak typ. 525 nm Dominant Wavelength 3) = 20 ma λ dom min. typ. max. 519 nm 530 nm 543 nm Viewing angle at 50 % I V 2φ typ. 120 Forward Voltage 4) = 20 ma Reverse current 2) V R = 5 V V F I R min. typ. max. typ. max. Real thermal resistance junction/ambient 5), 6) R thja real typ. max. Real thermal resistance junction/solderpoint 5) R thjs real typ. max V 3.20 V 3.70 V 0.01 µa 10 µa 420 K / W 580 K / W 51 K / W 68 K / W 4 Version
5 Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7) = 20 ma = 20 ma = 20 ma min. max. typ. I v I v Φ V AA 1120 mcd 1400 mcd 3960 mlm AB 1400 mcd 1800 mcd 5020 mlm BA 1800 mcd 2240 mcd 6340 mlm Forward Voltage Groups Group Forward Voltage 4) Forward Voltage 4) = 20 ma = 20 ma min. max. V F V F V 3.10 V V 3.30 V C V 3.50 V G V 3.70 V Wavelength Groups Group Dominant Wavelength 3) Dominant Wavelength 3) = 20 ma = 20 ma min. max. λ dom λ dom nm 525 nm nm 531 nm nm 537 nm nm 543 nm 5 Version
6 Group Name on Label Example: AA-3-44 Brightness Wavelength Forward Voltage AA Version
7 Relative Spectral Emission 7) I rel = f (λ); = 20 ma; T S = 25 C 1,0 I rel :V λ :true green 0,8 0,6 0,4 0,2 0, λ [nm] Radiation Characteristics 7) I rel = f (ϕ); T S = 25 C ϕ [ ] ,0 Irel :0 : 90 0, ,6-70 0,4-80 0,2-90 0, Version
8 Forward current 7) = f(v F ); T S = 25 C Relative Luminous Intensity I v /I v (20 ma) = f( ); T S = 25 C 7), 8) 70 [ma] I V I V (20mA) 2, ,0 40 1,5 30 1,0 20 0, ,7 2,8 3,0 3,2 3,4 3,6 3,8 V F [V] 0, [ma] Dominant Wavelength 7) λ dom = f( ); T S = 25 C λ dom [nm] [ma] 8 Version
9 Forward Voltage 7) V F = V F - V F (25 C) = f(t j ); = 20 ma Relative Luminous Intensity 7) I v /I v (25 C) = f(t j ); = 20 ma V F [V] I v I v (25 C) 1,2 0,2 1,0 0,8 0,0 0,6-0,2 0,4 0,2-0, T j [ C] 0, T j [ C] Dominant Wavelength 7) λ dom = λ dom - λ dom (25 C) = f(t j ); = 20 ma 10 λ dom [nm] T j [ C] 9 Version
10 Max. Permissible Forward Current = f(t) [ma] :T a :T s T [ C] Permissible Pulse Handling Capability = f(t p ); D: Duty cycle [ma] T S =0 C C :D=1.0 :D=0.5 :D=0.2 :D=0.1 :D=0.05 :D=0.02 :D=0.01 :D= ,01 0, Pulse time [s] 10 Version
11 Dimensional Drawing 9) Approximate Weight: Package marking: 2.0 mg Cathode Corrosion test: Class: 1B Test condition: 25 C / 75 % RH / 200ppb SO 2, 200ppb NO 2, 10ppb H 2 S, 10ppb Cl 2 / 21 days (EN (Method 4)) 11 Version
12 Electrical internal circuit 12 Version
13 Recommended Solder Pad 9) For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. 13 Version
14 Reflow Soldering Profile Product complies to MSL Level 3 acc. to JEDEC J-STD-020E 300 C T C 217 C 200 t P t L T p OHA C 150 t S C s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat *) 25 C to 150 C 2 3 K/s Time t S t S s T Smin to T Smax Ramp-up rate to peak *) 2 3 K/s T Smax to T P Liquidus temperature T L 217 C Time above liquidus temperature t L s Peak temperature T P C Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 C t P s 3 6 K/s Time 480 s 25 C to T P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 14 Version
15 Taping 9) 15 Version
16 Tape and Reel 10) Reel dimensions [mm] A W N min W 1 W 2 max Pieces per PU 180 mm / Version
17 _< C). _< If wet, 5% parts still adequately dry. change desiccant If wet, 10% examine units, if necessary bake units If wet, 15% examine units, if necessary bake units WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Barcode-Product-Label (BPL) Dry Packing Process and Materials 9) CAUTION LEVEL If blank, see bar code label This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD Version
18 _< C). _< ML C R 2a (9D) D/C: Bin2: Q-1-20 Bin3: ML Temp ST C R 2a Transportation Packing and Materials 9) Barcode label Barcode label CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours LEVEL If blank, see bar code label OSRAM Opto Semiconductors LSY T676 Multi TOPLED Bin1: P-1-20 Bin2: Q-1-20 Bin3: Temp ST 240 C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OHA02044 Muster (6P) BATCH NO: (1T) LOT NO: (9D) D/C: (X) PROD NO: 1 123GH (Q)QTY: 2000 OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: (X) PROD NO: 1 123GH1234 Muster (Q)QTY: 2000 LSY T676 Multi TOPLED Bin1: P C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OSRAM Packing Sealing label Dimensions of transportation box in mm Width Length Height 200 ± 5 mm 195 ± 5 mm 30 ± 5 mm 18 Version
19 Type Designation System Wavelength (λ dom typ.) Emission Color T: 528 nm true green H: 645 nm hyper-red B: 470 nm blue R: 625 nm red W: white Technology Concept S: Silicone casting 3: Silicone encapsulation C: Consumer Segment L: Automotive Multimarket Package Type D: Top emitting device, leadframe based, white reflector package Product version C H D E L S S Lead / Package Properties TOPlooker: B: 2218 E: 1608 Special characteristics Saturated colors 1: InGAN saturated 2: InGaAIP saturated Encapsulant Type / Lens Properties L: No lens (Lambertian) Binning Information: Saturated colors 2: mcd Chip Technology: P: Standard power class S: Highest power class 19 Version
20 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet falls into the class exempt group (exposure time s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize LED exposure to aggressive substances during storage, production, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC For further application related informations please visit 20 Version
21 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer or Customer supplied by Buyer considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 21 Version
22 Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size 16 mm² per pad) 7) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single LEDs within one packing unit. 9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 10) Tape and Reel: All dimensions and tolerances are specified acc. IEC and specified in mm. 22 Version
23 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D Regensburg All Rights Reserved. 23 Version
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