LB W5SM. Golden DRAGON. Applications. Features: Produktdatenblatt Version 1.1 LB W5SM. Transportation, Plane, Ship

Transcription

1 Produktdatenblatt Version 1.1 Golden DRAGON Applications Transportation, Plane, Ship Features: Package: white SMD package, colorless clear silicone resin Chip technology: ThinGaN Typ. Radiation: 120 (Lambertian emitter) Color: λ dom = 467 nm ( blue) Corrosion Robustness Class: 3B ESD: 8 kv acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) 1 Version

2 Ordering Information Type Luminous Flux 1) Ordering Code = 350 ma Φ V -FZHX lm Q65110A Version

3 Maximum Ratings Parameter Symbol Values Operating Temperature T op min. max. Storage Temperature T stg min. max. -40 C 125 C -40 C 125 C Junction Temperature T j max. 135 C Junction Temperature for short time applications * T j max. 175 C Forward current T S = 25 C Surge Current t 10 µs; D = ; T S = 25 C ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) min. max. 100 ma 1000 ma S max ma Reverse current 2) I R max. 200 ma V ESD 8kV *The median lifetime (L70/B50) for Tj =175 C is 100h. 3 Version

4 Characteristics = 350 ma; T S = 25 C Parameter Symbol Values Peak Wavelength λ peak typ. 465 nm Dominant Wavelength 3) = 350 ma λ dom min. typ. max. 464 nm 467 nm 476 nm Spectral Bandwidth at 50% I rel,max λ typ. 25 nm Viewing angle at 50 % I V 2φ typ. 120 Forward Voltage 4) = 350 ma V F min. typ. max V 3.20 V 3.70 V Reverse voltage (ESD device) V R ESD min. 45 V Reverse voltage 2) I R = 20 ma V R max. 1.2 V Real thermal resistance junction/solderpoint 5) R thjs real typ. max. 5 K / W 6.4 K / W 4 Version

5 Brightness Groups Group Luminous Flux 1) Luminous Flux 1) Luminous Intensity 6) = 350 ma = 350 ma = 350 ma min. max. typ. Φ V Φ V I v FZ 15 lm 18 lm 05 cd GX 18 lm 21 lm 06 cd GY 21 lm 24 lm 07 cd GZ 24 lm 28 lm 09 cd HX 28 lm 33 lm 10 cd Wavelength Groups Group Dominant Wavelength 3) Dominant Wavelength 3) = 350 ma = 350 ma min. max. λ dom λ dom nm 468 nm nm 472 nm nm 476 nm 5 Version

6 Group Name on Label Example: FZ-3 Brightness Wavelength FZ 3 6 Version

7 Relative Spectral Emission 6) I rel = f (λ); = 350 ma; T S = 25 C 1,0 Φ rel :V λ :blue 0,8 0,6 0,4 0,2 0, λ [nm] Radiation Characteristics 6) I rel = f (ϕ); T S = 25 C ϕ [ ] ,0 Irel 0, ,6-70 0,4-80 0,2-90 0, Version

8 Forward current 6), 7) Relative Luminous Flux 6), 7) = f(v F ); T S = 25 C Φ v /Φ v (350 ma) = f( ); T S = 25 C 1000 [ma] Φ V Φ V (350mA) 2, , , , ,9 3,0 3,2 3,4 3,6 3,7 V F [V] 0, [ma] 1000 Dominant Wavelength 6) λ dom = f( ); T S = 25 C λ dom [nm] [ma] Version

9 Forward Voltage 6) V F = V F - V F (25 C) = f(t j ); = 350 ma Relative Luminous Flux 6) Φ v /Φ v (25 C) = f(t j ); = 350 ma V F [V] 0,3 Φ v Φ v (25 C) 1,4 0,2 1,2 1,0 0,1 0,8 0,0 0,6-0,1 0,4-0,2 0,2-0, T j [ C] 0, T j [ C] Dominant Wavelength 6) λ dom = λ dom - λ dom (25 C) = f(t j ); = 350 ma 520 λ dom [nm] T j [ C] 9 Version

10 Max. Permissible Forward Current = f(t) 1,1 [A] 1,0 0,9 0,8 0,7 0,6 0,5 :T s 0,4 0,3 0,2 0,1 0, T [ C] Permissible Pulse Handling Capability = f(t p ); D: Duty cycle Permissible Pulse Handling Capability = f(t p ); D: Duty cycle T S =0 C C [A] 3,0 T S = 125 C [A] 3,0 2,5 2,5 2,0 :D=1.0 :D=0.5 :D=0.2 :D=0.1 :D=0.05 :D=0.02 :D=0.01 :D= ,0 1,5 :D=1.0 :D=0.5 :D=0.2 :D=0.1 :D=0.05 :D=0.02 :D=0.01 :D= ,5 1,0 1, ,01 0, Pulse time [s] 0, ,01 0, Pulsetime [s] 10 Version

11 Dimensional Drawing 8) Approximate Weight: mg Corrosion test: ESD advice: Class: 3B Test condition: 40 C / 90 % RH / 15 ppm H 2 S / 14 days (stricter then IEC ) LED is protected by ESD device which is connected in paralell to LED-Chip. 11 Version

12 Recommended Solder Pad 8) 12.0 (0.472) 11.6 (0.457) 0.3 (0.012) 11.6 (0.457) 2.3 (0.091) 10 (0.394) 1.6 (0.063) 2.3 (0.091) ø2.5 (0.098) ø4.0 (0.157) Lötstopplack Solder resist Lötpasten Schablone Solder paste stencil Bare Copper Freies Kupfer OHAY0681 For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning. 1.6 (0.063) Kupfer Copper ø4.0 (0.157) Heatsink attach 3 Lötstellen 3 solder points Thermisch optimiertes PCB Thermal enhanced PCB 12 Version

13 Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020D C T C 217 C 200 t P t L T p OHA C 150 t S C s 300 t Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat *) 25 C to 150 C 2 3 K/s Time t S t S s T Smin to T Smax Ramp-up rate to peak *) 2 3 K/s T Smax to T P Liquidus temperature T L 217 C Time above liquidus temperature t L s Peak temperature T P C Time within 5 C of the specified peak temperature T P - 5 K Ramp-down rate* T P to 100 C t P s 3 6 K/s Time 480 s 25 C to T P All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range 13 Version

14 Taping 8) Cathode/Collector Side 4 (0.157) 1.55 (0.061) 2 (0.079) 1.75 (0.069) 11.5 (0.453) 12.4 (0.488) 24 (0.945) 0.3 (0.012) 0.3 (0.012) 6.35 (0.250) 8 (0.315) OHAY (0.289) 1.9 (0.075) 14 Version

15 Tape and Reel 9) Reel dimensions [mm] A W N min W 1 W 2 max Pieces per PU 180 mm / / Version

16 _< C). _< If wet, 5% parts still adequately dry. change desiccant If wet, 10% examine units, if necessary bake units If wet, 15% examine units, if necessary bake units WET Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) CAUTION LEVEL If blank, see bar code label This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours OSRAM Moisture-sensitive label or print Barcode label Humidity indicator Barcode label Comparator check dot Desiccant Humidity Indicator MIL-I-8835 OSRAM OHA00539 Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD Version

17 _< C). _< ML C R 2a (9D) D/C: Bin2: Q-1-20 Bin3: ML Temp ST C R 2a Transportation Packing and Materials 8) Barcode label Barcode label CAUTION This bag contains MOISTURE SENSITIVE OPTO SEMICONDUCTORS 1. Shelf life in sealed bag: 24 months at < 40 C and < 90% relative humidity (RH). 2. After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow, or equivalent processing (peak package body temp. If blank, see bar code label a) Mounted within at factory conditions of 30 C/60% RH. Floor time see below b) Stored at 10% RH. 3. Devices require baking, before mounting, if: a) Humidity Indicator Card is > 10% when read at 23 C ± 5 C, or b) 2a or 2b is not met. 4. If baking is required, reference IPC/JEDEC J-STD-033 for bake procedure. Bag seal date (if blank, seal date is identical with date code). Date and time opened: Moisture Level 1 Floor time > 1 Year Moisture Level 4 Floor time 72 Hours Moisture Level 2 Floor time 1 Year Moisture Level 5 Floor time 48 Hours Moisture Level 2a Floor time 4 Weeks Moisture Level 5a Floor time 24 Hours Moisture Level 3 Floor time 168 Hours Moisture Level 6 Floor time 6 Hours LEVEL If blank, see bar code label OSRAM Opto Semiconductors LSY T676 Multi TOPLED Bin1: P-1-20 Bin2: Q-1-20 Bin3: Temp ST 240 C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OHA02044 Muster (6P) BATCH NO: (1T) LOT NO: (9D) D/C: (X) PROD NO: 1 123GH (Q)QTY: 2000 OSRAM Opto Semiconductors (6P) BATCH NO: (1T) LOT NO: (X) PROD NO: 1 123GH1234 Muster (Q)QTY: 2000 LSY T676 Multi TOPLED Bin1: P C R C RT Additional TEXT R077 PACKVAR: (G) GROUP: DEMY R18 P-1+Q-1 OSRAM Packing Sealing label Dimensions of transportation box in mm Width Length Height 195 ± 5 mm 195 ± 5 mm 42 ± 5 mm 17 Version

18 Type Designation System Wavelength Emission Color Color coordinates (lλ dom typ.) acc. to CIE 1931/Emission color: B: 470 nm blue CW: warm white T: 528 nm true green UW: ultra white Y: 587 nm yellow W: white A: 617 nm amber CY: color on demand D: 460 nm deep blue H: 645 nm hyper-red R: 625 nm red V: 505 nm verde green Technology Concept P: Low CRI high brightness Binning Information: Converted colors C: ANSI fine binning L: Light emitting diode Package Type W: DRAGON L CW W 5 A M. P C Lead / Package Properties 5: gullwing leads Encapsulant Type / Lens Properties A: outcoupling lens P: plabar compression molded silicon (120 ); with volume conversion S: silicone Chip Technology: M: standard performance 18 Version

19 Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the LED specified in this data sheet fall into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure time, eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. As is also true when viewing other bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this LED contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize LED exposure to aggressive substances during storage, production, and use. LEDs that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC For further application related informations please visit 19 Version

20 Disclaimer Disclaimer Language english will prevail in case of any discrepancies or deviations between the two language wordings. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer or Customer supplied by Buyer considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer. 20 Version

21 Glossary 1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3). 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Wavelength: The wavelength is measured at a current pulse of typically 25 ms, with an internal reproducibility of ±0.5 nm and an expanded uncertainty of ±1 nm (acc. to GUM with a coverage factor of k = 3). 4) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3). 5) Thermal Resistance: Rth max is based on statistic values (6σ). 6) Typical Values: Due to the special conditions of the manufacturing processes of LED, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differences between single LEDs within one packing unit. 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC and specified in mm. 21 Version

22 Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D Regensburg All Rights Reserved. 22 Version