Telecommunications Mobile

Transcription

1 Vishay Intertechnology, Inc. Telecommunications Mobile One of the World s Largest Manufacturers of Discrete Semiconductors and Passive Components

2 Mobile Smartphones 4 Wireless Modems 5 Wireless Charging 6 The Engineer s Toolbox highlights, by market application, some innovative components Vishay manufactures that help design engineers develop superior end products. We recognize that offering unique component solutions helps improve the performance of next-generation devices, overcome technical barriers, and create new markets. More information on the Engineer s Toolbox, including product datasheet links, can be found at For inquiries, please contact your local sales representative.

3 Key components for Telecommunications Mobile SmartPhoneS Wireless Charging Wireless ModemS The Vishay Advantage High-Frequency Operation Small Size Low Profile High Q Optimized Impedance High SRF and more... 3

4 Telecommunications Mobile CAPACITORS 298D Series (Standard) and 298W Series (Extended) Microtan Ideal for Space Constrained Applications Industry s best volumetric efficiency Small sizes including 0402, 0603, and 0805 footprints SmartPhoneS WSL0805 SMD, Power Metal Strip Resistor W current sensing resistor in 0805 package size a very low 5.0 mω to 200 mω resistance value range Standard tolerance of 1.0 % with 0.5 % available High-temperature performance up to C MC Series Thin Film Chip Resistors CECC approved according to EN Available from 1R to 10 M Low TCR down to ± 10 ppm/k, tight tolerance down to 0.1 % High pulse load robustness INDUCTORS IFSC-0806-AZ-01 Low-Profile High-Current Inductor Shielded construction Frequency range up to 5 MHz RoHS-compliant MOSFETs SiA445EDJ/Si8809EDB Single, - 20 V P-Channel Power MOSFETs Maximum current of 9.5 A, 2 mm x 2 mm PowerPAK SC-70 packaging, maximum on-resistance down to Ω, and 2000 V typical ESD protection (SiA445EDJ) Maximum current of 1.5 A, industry smallest chip scale packaging with MICRO FOOT 0.8 mm x 0.8 mm, maximum onresistance down to 0.09 Ω, and 1000 V typical ESD protection (Si8809EDB) SiP32454/SiP A Slew Rate Control Smart Load Switches Low input operating voltage Low and flat R DS(on) on the entire operating voltage Reverse current blocking when the switch is off Compact 1.2 mm x 1.6 mm plastic package and 0.8 mm x 0.8 mm WCSP package SiP4612A/B Power Switch Overcurrent protected high-side load switch 1 A continuous output current 2.4 V to 5.5 V supply voltage range User settable current limit level and low quiescent current Undervoltage lockout and thermal shutdown protection OPTOELECTRONICS VCNL Bit Effective Resolution for Both Proximity and Ambient Sensing Excellent crosstalk immunity; no mechanical barrier required Programmable LED drive current from 10 ma to 200 ma in 10 ma steps Proximity distance up to 20 cm (8 in.) Driver for external emitters to increase range up to 1 meter Ambient light detection from 0.25 lx to 16 klx DIODES VBUS54ED-FBL (USB OTG) 4 Line ESD Protection Array in LLP2510 Compact LLP L package Low package height < 0.6 mm Low capacitance between I/O lines: 0.3 pf Ideal for high speed data line protection like HDMI, USB 3.0 and Thunderbolt CZA Thick Film Chip Attenuator Reduces component count and board space requirements Available in 04S and 06S package sizes, attenuations from 0 db to 20 db Tolerance matching and temperature tracking superior to individual components Simplifies the manufacture of smaller, lighter electronic systems RCWE 0402/0603 Thick Film Surface-Mount Chip Resistor Extremely low resistance value range (10 mω to 976 mω) W/0.2 W power rating and wraparound termination Standard tolerance of 1.0 % and 5.0 % Temperature coefficient: from ± 400 ppm/ C to ± 100 ppm/ C 4

5 Telecommunications Mobile CapacitorS Wireless ModemS WSL0805 SMD, Power Metal Strip Resistor W current sensing resistor in 0805 package size a very low 5.0 mω to 200 mω resistance value range Standard tolerance of 1.0 % with 0.5 % available High-temperature performance up to C TNPW e3 Series High Stability Thin Film Chip Resistors Low temperature coefficient and tight tolerances: ± 0.1 %, ± 10 ppm/k Excellent overall stability at harsh environmental conditions AEC-Q200 qualified, automotive grade Case sizes: 0402 to D/592W Series Low-Profile, Ultra High Capacitance Tantamount Low-Profile High Capacitance Tantalum Capacitors Capacitance values up to 2200 µf Ideal for use in creating a capacitance bank for energy storage These high capacitance devices minimize component count Low profile package will fit in your design (1.5 mm to 2.0 mm) INDUCTORS IFSC-1111AZ Low-Profile High-Current Inductor Shielded construction Frequency range up to 5 MHz RoHS-compliant MOSFETs SiA431DJ/Si8809EDB Single, - 20 V P-Channel Power MOSFETs Maximum current of 7.7 A, 2 mm x 2 mm PowerPAK SC-70 packaging, maximum on-resistance down to Ω at V GS = 4.5 V (SiA431DJ) Maximum current of 1.5 A, industry smallest chip scale packaging with MICRO FOOT 0.8 mm x 0.8 mm, maximum onresistance down to 0.09 Ω, and 1000 V typical ESD protection (Si8809EDB) SiP2802DY Low-Power PWM Current Mode Controller Supports DC/DC and off-line power supplies Less than 500 µa operating current Internal soft start mlcc Capacitors VJ1812Y High-Capacitance MLCC Vishay Vitramon Commercial Series C0G (NP0) and X7R dielectrics with voltages up to 1000 V X7R dielectric version offers high C/V values, available in large case sizes Reliable Noble Metal Electrode (NME) system built with wet process RECTIFIERS SS2PH10 2 A, 100 V Schottky in SMP Very low profile - typical height of 1.0 mm for SMP Low forward voltage drop Ideal for automated placement RoHS-compliant, halogen-free OPTOELECTRONICS VLMx LED Indicator Super red, soft orange, yellow, yellow-green, true-green, and blue Exceptionally bright in a chip LED package Viewing angle of mm x 0.8 mm x 0.8 mm height RCWE 0402/0603 Thick Film Surface-Mount Chip Resistor Extremely low resistance value range (10 mω to 976 mω) W/0.2 W power rating and wraparound termination Standard tolerance of 1.0 % and 5.0 % Temperature coefficient: from ± 400 ppm/ C to ± 100 ppm/ C THE VISHAY ADVANTAGE High-Frequency Operation Small Size Low Profile High Q Optimized Impedance High SRF and more... 5

6 Telecommunications Mobile CAPACITORS CAPACITORS 298D Series (Standard) and 298W Series (Extended) Microtan Ideal for Space Constrained Applications Industry s best volumetric efficiency Small sizes including 0402, 0603, and 0805 footprints Wireless Charging WSL0603 SMD, Power Metal Strip Resistor 0.1 W current sensing resistor in 0603 package size a very low 10 mω to 100 mω resistance value range Standard tolerance of 1.0 % with 0.5 % available High-temperature performance up to C VJ...W1BC Series SMD Multilayer Ceramic Chip Capacitors (Including X5R) Available from 0201 to 1210 body sizes C0G (NP0), X5R, X7R, Y5V, high Q, and ultra high Q/low ESR dielectrics Chip array size 0612 with 4 capacitors inside Build with dry sheet technology process and 100 % tin termination, fully ROHS-compliant INDUCTORS IWAS-3827 Wireless Charging Receiving Coil/Shield Used for Rx applications up to 10 W Optimized for 5 V charging circuitry High permeability shielding for wireless charging Blocks charging flux from sensitive components or batteries RECTIFIERS MSS2P2/MSS2P3, SS2P2L/SS2P3L 2 A, 20 V and 30 V Schottky in MicroSMP, SMP Very low profile - typical height of 0.68 mm for MicroSMP, typical height of 1.0 mm for SMP Low forward voltage drop Ideal for automated placement RoHS-compliant, halogen-free, NON-LINEAR NTCS0402E3 Glass-Protected SMD 0402 NTC Thermistor Tolerance on R 25 down to 1 %, and on B 25/85 down to 1 % High operating temperature up to 150 C SiP12107/SiP12108 Scalable 3 A/5 A Compact Buck Regulators Ultrafast transient response Supports all ceramic capacitor solution with no external ESR requirement Full protection set of OTP, SCP, UVP, OVP Compact 16 lead QFN 3 mm x 3 mm package MOSFETs SiS472DN, SiA915EDJ, SiA426DJ Single 20 V to 30 V N-Channel, Dual - 30 V P-Channel Power MOSFETs Maximum current up to 12 A Thermally enhanced 3.3 mm x 3.3 mm PowerPAK (1/3 the size of an SO-8) and 2 mm x 2 mm PowerPAK SC-70 packaging Maximum on-resistance down to Ω CZA Thick Film Chip Attenuator Reduces component count and board space requirements Available in 04S and 06S package sizes, attenuations from 0 db to 20 db Tolerance matching and temperature tracking superior to individual components Simplifies the manufacture of smaller, lighter electronic systems Vishay Intertechnology s reputation for innovation, reliability, and quality is complemented by a decades-long record of service to and improvements for the telecommunications industry. Detailed Applications Information Cell Phones POL Power Design Support Tools Thermal Simulation Tools, Performance Calculators, and Spice and 3D Models Technical Library technical-library/ View datasheets for these products at 6

7 Vishay Intertechnology, Inc. BUILD VISHAY into your DESIGN VMN-MS