TECHNICAL INFORMATION Revision 0.96 July 2005

Transcription

1 TAA8 STEREO 9W (8Ω) CLASS-T DIGITAL AUDIO AMPLIFIER USING DIGITAL POWER PROCESSING TECHNOLOGY TECHNICAL INFORMATION Revision.96 July 5 GENERAL DESCRIPTION The TAA8 is a 9W/ch continuous average two-channel Class-T Digital Audio Power Amplifier IC using Tripath s proprietary Digital Power Processing technology. The TAA8, in a QFN package, along with extremely high efficiency, allows for a very compact amplifier design. Class-T amplifiers offer both the audio fidelity of Class-AB and the power efficiency of Class-D amplifiers. APPLICATIONS LCD TV s LCD Monitors Plasma TV s Computer/PC Multimedia Battery Powered Systems BENEFITS Fully integrated solution with FETs Compact packaging and board design Reduced system cost with no heat sink Dramatically improves efficiency versus Class- AB Signal fidelity equal to high quality linear amplifiers High dynamic range compatible with digital media such as CD, DVD, and Internet audio Capable of driving a wide range of load impedances TYPICAL PERFORMANCE 5 VDD = V f = khz A V = V/V BW = Hz - khz(aes7) THD+N versus Output Power FEATURES Class-T architecture Single Supply Operation Audiophile Quality Sound.5% 5W, 8Ω.% W, 8Ω 8Ω,.% THD+N 6Ω,.% THD+N High Power 6Ω, % THD+N 8Ω, % THD+N 6Ω, % THD+N Extremely High Efficiency 5W, 6Ω 9W, 8Ω Dynamic Range = 98.5 db Mute and Sleep modes Improved turn-on & turn-off pop suppression Over-current protection with automatic restart circuit Over-temperature protection Space saving 3-pin 8mm x 8mm x mm QFN package with exposed pad R L =6Ω THD+N (%).5.. R L = 8Ω Output Power (W ) TAA8 KL/.96/6.5

2 ABSOLUTE MAXIMUM RATINGS (Note ) SYMBOL PARAMETER Value UNITS V DD Supply Voltage 6 V V5 Input Section Supply Voltage 6. V SLEEP SLEEP Input Voltage -.3 to 6. V MUTE MUTE Input Voltage -.3 to V5+.3 V T STORE Storage Temperature Range -4 to 5 C T A Operating Free-air Temperature Range to 7 C T J Junction Temperature 5 C ESD HB ESD Susceptibility Human Body Model (Note ) V ESD MM ESD Susceptibility Machine Model (Note 3) V Note : Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Note : Human body model, pf discharged through a.5kω resistor. Note 3: Machine model, pf 4pF discharged through all pins. OPERATING CONDITIONS (Note 4) SYMBOL PARAMETER MIN. TYP. MAX. UNITS V DD Supply Voltage (Note 5) V V IH High-level Input Voltage (MUTE, SLEEP) 3.5 V V IL Low-level Input Voltage (MUTE, SLEEP) V Note 4: Recommended Operating Conditions indicate conditions for which the device is functional. See Electrical Characteristics for guaranteed specific performance limits. Note 5: Operation above 3.V requires the use of low and high side schottky diodes as well as uf for C SW. See the Application Section for additional information THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNITS θ JA Junction-to-ambient Thermal Resistance (note 6) C/W Note 6: The θ JA value is based on the exposed pad being soldered down to the printed circuit board. The exposed pad must be soldered to an exposed copper area on the printed circuit board for proper thermal and electrical performance. TAA8 KL/.96/6.5

3 ELECTRICAL CHARACTERISTICS (Note 7) See Test/Application Circuit. Unless otherwise specified, V DD = V, f = khz, Measurement Bandwidth = khz, R L = 8Ω, T A = 5 C, package exposed pad soldered to the printed circuit board. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNITS P O Output Power (Continuous Average/Channel) THD+N =.% RL = 6Ω RL = 8Ω RL = 6Ω W W W THD+N = % RL = 6Ω RL = 8Ω RL = 6Ω TBD 9 5 W W W VDD = 3.V, THD+N=% RL = 6Ω RL = 8Ω RL = 6Ω W W W I DD,MUTE Mute Supply Current MUTE = V IH 3 36 ma I DD, SLEEP Sleep Supply Current SLEEP = V IH.5 ma I q Quiescent Current V IN = V 6 75 ma THD + N Total Harmonic Distortion Plus P O = 5W/Channel. % Noise IHF-IM IHF Intermodulation Distortion 9kHz, khz, : (IHF)..5 % SNR Signal-to-Noise Ratio A-Weighted, P OUT = 9W, R L = 8Ω 98.5 db CS Channel Separation f = khz 85 db Hz < f < khz 5 6 db PSRR Power Supply Rejection Ratio VDD = 9V to 3.V Vripple = mvrms, f=khz db db η Power Efficiency P OUT = 5W/Channel, R L = 6Ω 89 % V OFFSET Output Offset Voltage No Load, MUTE = Logic Low 5 5 mv V OH High-level output voltage (FAULT & OVERLOAD) 3.5 V V OL Low-level output voltage V (FAULT & OVERLOAD) e OUT Output Noise Voltage A-Weighted, input AC grounded 5 µv Note 7: Minimum and maximum limits are guaranteed but may not be % tested. 3 TAA8 KL/.96/6.5

4 PIN DESCRIPTION Pin Function Description, 9 OAOUT, OAOUT Input stage output pins., 3 INV, INV Single-ended inputs. Inputs are a virtual ground of an inverting opamp with approximately.4vdc bias. 3 BIASCAP Input stage bias voltage (approximately.4vdc). 4, 4, AGND3, AGND, Analog Ground 7 AGND 5 SLEEP When set to logic high, device goes into low power mode. If not used, this pin should be grounded 6 FAULT A logic high output indicates thermal overload, or an output is shorted to ground, or another output. 7, 8 PGND, PGND Power Grounds (high current) 8 DGND Digital Ground. Connect to AGND locally (near the TAA8)., ; OUTP & OUTM; Bridged output pairs 5, 3 OUTP & OUTM, 4 VDD, VDD Supply pins for high current H-bridges, nominally VDC. 7 VDDA Analog VDC. Connect to same supply as VDD and VDD. 9 CPUMP Charge pump output (nominally V above VDDA) 5VGEN Regulated 5VDC source used to supply power to the input section (pins 3 and 8)., DCAP, DCAP Charge pump switching pins. DCAP (pin ) is a free running 3kHz square wave between VDDA and DGND (Vpp nominal). DCAP (pin ) is level shifted volts above DCAP (pin ) with the same amplitude (Vpp nominal), frequency, and phase as DCAP. 3, 8 V5D, V5A Digital 5VDC, Analog 5VDC 5 REF Internal reference voltage; approximately. VDC. 6 OVERLOADB A logic low output indicates the input signal has overloaded the amplifier. 3 MUTE When set to logic high, both amplifiers are muted and in idle mode. When low (grounded), both amplifiers are fully operational. If left floating, the device stays in the mute mode. This pin should be tied to GND if not used. 9, 6, 3 NC Not connected. Not bonded internally. TAA8 PINOUT NC 3-pin QFN (Top View) MUTE INV OAOUT V5A AGND OVRLDB REF 3 3 OAOUT INV BIASCAP AGND3 4 SLEEP 5 FAULT 6 9 PGND DGND AGND V5D DCAP DCAP 5VGEN CPUMP PGND VDDA NC OUTP VDD OUTM OUTM VDD OUTP NC 4 TAA8 KL/.96/6.5

5 APPLICATION / TEST CIRCUIT TAA8.uF + OAOUT R F KΩ INV 9 3 VDD 5 OUTP VDD L o uh, A D O ** (Pin 4) C A.uF R I KΩ BIASCAP 3 5V Processing & Modulation PGND VDD 3 (Pin 8) (Pin 8) VDD L o uh, A OUTM D O ** C o.uf C o.uf C Z.uF R Z Ω, /4W C DO.uF R L 8Ω or 6Ω 5V MUTE 3 PGND (Pin 8).uF + R F KΩ R I KΩ OAOUT INV 6 6 VDD FAULT (connect to MUTE for auto restart) OVERLOADB VDD L o uh, A OUTP D O ** +V (Pin 4) MΩ R REF 8.5KΩ, % C D.uF 5 5 REF DCA P DCA P SLEEP Processing & Modulation PGND VDD PGND (Pin 7) VDD L o uh, A OUTM D O ** (Pin 7) (Pin 7) C o.uf C o.uf C Z.uF R Z Ω, /4W C DO.uF R L 8Ω or 6Ω N.C. To Pin.uF C S.uF C S.uF V5D AGND V5A AGND 5V CPUMP VDDA DGND 5VGEN C P uf C S.uF C S.uF To Pins 3,8 4 AGND3 VDD PGND 4 8 C SW.uF + C SW ** uf, 6V VDD (+V) NC NC NC VDD PGND 7 C SW.uF Note: Analog and Digital/Pow er Grounds must be connected locally at the TAA8 Analog Ground Digital/Pow er Ground ** For VDD voltages above 3.V, output diodes (D O ) should be used and the value of C SW should be increased to uf. All Diodes are Motorola MBRS3T3 or equivalent. 5 TAA8 KL/.96/6.5

6 EXTERNAL COMPONENTS DESCRIPTION (Refer to the Application/Test Circuit) Components Description R I Inverting Input Resistance to provide AC gain in conjunction with R F. This input is biased at the BIASCAP voltage (approximately.4vdc). R F Feedback resistor to set AC gain in conjunction with R I ; A V = (RF / RI). Please refer to the Amplifier Gain paragraph in the Application Information section. AC input coupling capacitor which, in conjunction with R I, forms a highpass filter at fc = (πri) R REF Bias resistor. Locate close to pin 5 (REF) and ground at pin 4 (AGND). C A BIASCAP decoupling capacitor. Locate close to pin 3 (BASCAP) and ground at pin 4 (AGND3). C D Charge pump input capacitor. This capacitor should be connected directly between pins (DCAP) and (DCAP) and located physically close to the TAA8. C P Charge pump output capacitor that enables efficient high side gate drive for the internal H-bridges. To maximize performance, this capacitor should be connected directly between pin 9 (CPUMP) and pin 7 (VDDA). Please observe the polarity shown in the Application/ Test Circuit. C S Supply decoupling for the low current power supply pins. For optimum performance, these components should be located close to the pin and returned to their respective ground as shown in the Application/Test Circuit. C SW Supply decoupling for the high current, high frequency H-Bridge supply pins. These components must be located as close to the device as possible to minimize supply overshoot and maximize device reliability. Both the high frequency bypassing (.uf) and bulk capacitor (uf/uf) should have good high frequency performance including low ESR and low ESL. Recommended capacitor families include Nichicon HE series and Panasonic FM series for thru-hole types. Qualified SMT electrolytics include Nichicon UD series and Panasonic FK series. C Z Zobel Capacitor. R Z Zobel resistor, which in conjunction with C Z, terminates the output filter at high frequencies. The combination of R Z and C Z minimizes peaking of the output filter under both no load conditions or with real world loads, including loudspeakers which usually exhibit a rising impedance with frequency. D O Schottky diodes that minimize undershoots and overshoots of the outputs with respect to power ground and VDD during switching transitions. These components are recommended for supply voltages above 3.V. For maximum effectiveness, these diodes must be located close to the output pins and returned to their respective PGND. Please see Application/Test Circuit for ground return pin. L O Output inductor, which in conjunction with C O and C DO, demodulates (filters) the switching waveform into an audio signal. Forms a second order filter with a cutoff frequency of f = (π L C ) and a quality factor of C O C DO C O TOT Q = R C L C where C L TOT O TOT TOT = C O * C DO. Output capacitor. Differential Output Capacitor. Differential noise decoupling for reduction of conducted emissions. Must be located near chassis exit point for maximum effectiveness. 6 TAA8 KL/.96/6.5

7 TYPICAL PERFORMANCE.5 VDD = V P O = W BW = Hz - khz THD+N versus Frequency 5 R L = 6Ω f = khz A V = V/V BW = Hz - khz(aes7) THD+N versus Output Power.. VDD =V %.5. R L = 8Ω R L = 6Ω THD+N (%).5. VDD =3.V k k 5k k k Hz Output Power (W) Efficiency and Power Dissipation versus Total output Power 5 Efficiency and Power Dissipation versus Total output Power 9 9 Eff (%) Efficiency Power Dissipation 4 3 Pdiss (W) Eff (%) Power Dissipation Efficiency Pdiss (W) Total Output Power (W ) VDD = V R L = 8Ω f= khz BW = Hz - khz(aes7) 6 4 Total Output Power (W ) 6 VDD = V R L = 6Ω f= khz BW = Hz - khz(aes7) 8 Efficiency and Power Dissipation versus Total output Power 5 Efficiency and Power Dissipation versus Total output Power Power Dissipation Efficiency Efficiency 8 Eff (%) Pdiss (W) Eff (%) Power Dissipation 6 4 Pdiss (W) VDD = V R L = 6 Ω f= khz BW = Hz - khz(aes7) VDD = 3.V R L = 6 Ω f= khz BW = Hz - khz(aes7) 5 3 Total Output Power (W) Total Output Power (W ) 7 TAA8 KL/.96/6.5

8 TYPICAL PERFORMANCE kHz, khz : P O = W VDD = V R L = 8Ω 3k FFT F S = 65kHz BW = <Hz - 8kHz Intermodulation Distortion VDD = V R L = 8Ω 3k FFT F S = 65kHz BW = Hz - khz(aes7) Noise Floor FFT (dbr) d B V k k 5k k k 3k Frequency (Hz) k k 5k k k Hz Output Power (W) R L = 8Ω f = khz BW= Hz - khz(aes7) Output Power versus Supply Voltage THD+N = % THD+N = % Output Power (W) R L = 6 Ω f = khz BW= Hz - khz(aes7) Output Power versus Supply Voltage THD+N = % THD+N = % Supply Voltage (V) Supply Voltage (V) Output Power (W) R L = 6Ω f = khz BW= Hz - khz(aes7) Output Power versus Supply Voltage THD+N = % THD+N = % Max. Supply Current (I DC ) THD=N = % f= khz BW= Hz - khz(aes7) Both chanels driven Maximum Supply Current versus Supply Voltage R L = 6 Ω R L = 8 Ω. R L = 6 Ω Supply Voltage (V) Supply Voltage (V) 8 TAA8 KL/.96/6.5

9 T T T T T T T T Tripath Technology, Inc. - Technical Information TYPICAL PERFORMANCE VDD = V R L = 8Ω P O = W BW = Hz - khz Channel Separation VDD = V P O = W + Frequency Response d B r d B r R L = 6Ω R L = 8Ω R L = 6Ω k k 5k k k Hz k k 5k k k Hz APPLICATION INFORMATION Layout Recommendations The TAA8 is a power (high current) amplifier that operates at relatively high switching frequencies. The outputs of the amplifier switch between the supply voltage and ground, at high speeds, while driving high currents. This high-frequency digital signal is passed through an LC low-pass filter to recover the amplified audio signal. Since the amplifier must drive the inductive LC output filter and speaker loads, the amplifier outputs can be pulled above the supply voltage and below ground by the energy in the output inductance. To avoid subjecting the TAA8 to potentially damaging voltage stress, it is critical to have a good printed circuit board layout. It is recommended that Tripath s layout and application circuit be used for all applications and only be deviated from after careful analysis of the effects of any changes. Please contact Tripath Technology for further information regarding reference design material regarding the TAA8. Output Stage layout Considerations and Component Selection Criteria Proper PCB layout and component selection is a major step in designing a reliable TAA8 power amplifier. The supply pins require proper decoupling with correctly chosen components to achieve optimal performance and reliability. The output pins need proper protection to keep the outputs from going below ground and above VDD. 9 TAA8 KL/.96/6.5

10 The above layout shows ideal component placement and routing for supply decoupling. C and C3 are.uf surface mount capacitors placed directly across their respective VDD and PGND pins. C is a low ESR bulk capacitance electrolytic (at least uf). C s VDD pin is routed to the TAA8 s VDD and VDD pins on the opposite side of the PCB as the TAA8. Vias return the supply trace to the TAA8 side of the PCB at the VDD and VDD pins. This arrangement allows C s PGND pin to have a low impedance return path to PGND and PGND through the PCB s ground plane and allows the output traces (OUTM, OUTP, OUTM, AND OUTP) to be routed directly to the low pass filter. By having C s supply pins directly across the TAA8 s VDD and PGND pins supply overshoots will be controlled and mean supply elevation will be reduced. Effectively decoupling VDD will shunt any power supply trace length inductance. The construction of the bulk electrolytic is critical. This capacitor should be a low ESR, ripple rated SMT, or through-hole component. Water based through-hole electrolytic capacitors offer very cost competitive solutions with extremely low impedance (ESR). These include Nichicon HE series and Panasonic FM series. Qualified SMT electrolytics include Nichicon UD series and Panasonic FK series. Panasonic FC capacitors also work well but are likely more costly with no improvement in performance over the capacitor families mentioned above. The output L L4 should be placed close to the TAA8 without compromising the locations of the closely placed supply decoupling capacitors. The purpose of placing the inductors close to the TAA8 output pins in to reduce the trace length of the switching outputs. This will aid in reducing radiated emissions. For VDD voltages above 3.V, or on designs where a tight layout cannot be adhered to due to physical constraints, it is strongly recommended that the value of C SW is increased to uf and that both low and high side schottky diodes are implemented. These changes will ensure that the output over shoots will not exceed the absolute maximum rating of 6V. The output diodes, D O, should be located as close to the output pins as possible and returned to their respective PGND or VDD, as shown in the Application / Test Diagram. Please see the External Component Description section on page 6 for more details on the abovementioned components. The Application/ Test Circuit refers to both supply decoupling capacitors as C SW, and the output diodes as D O. TAA8 Amplifier Gain The ideal gain of the TAA8 is set by the ratio of two external resistors, R I and R F, and is given by the following formula: V V O I = R R F I where V I is the input signal level and V O is the differential output signal level across the speaker. Please note that V O is 8 out of phase with V I. TAA8 KL/.96/6.5

11 The ideal gain of the TAA8 is V/V, whereas typical values are: A V =.7V/V for 8Ω. The low frequency roll-off characteristic is dictated by the choice of and R I. The 3dB frequency is: f 3dB = Π C I R I The figure below shows the roll-off characteristic for different values of, assuming an R I value of kω. As can be seen, the larger the value of, the lower the 3dB cutoff point. On the EB- TAA8, a value of.µf is used for which creates a nearly flat response down to Hz. In many cases, a lower value of can be used because the speakers used in LCD TV s or similar applications do not have the ability to reproduce low frequency signals. + Frequency Response + - d B r - =.uf =.uf =.47uF =.uf VDD = V P O = W R L = 8Ω k k 5k k k Hz Mute Pin The mute pin must be driven to a logic low or logic high state for proper operation. To enable the amplifier, connect the mute pin to a logic low. To enable the mute function, connect the mute pin to a logic high signal. Please note that the mute pin is a 5V CMOS input pin and the mute signal should be de-bounced to eliminate a possibility of falsely muting. When in mute, the internal processor bias voltages are still active in the TAA8. This minimizes any turn on pop caused by charging the input coupling capacitor. It is recommended that the mute is held high during power up or power down to eliminate audible transients. If turn-on and/or turn-off noise is still present with a TAA8 amplifier, the cause may be other circuitry external to the TAA8 such as an audio processor or preamp. Multiple audio processors used in LCD TV s create audible pops as their power supply collapses. If the TAA8 is still active (mute pin is low), then these audible pops will be amplified and output to the speakers. To eliminate this problem, simply activate the mute before the power supply collapses. The delay going into mute is approximately us, as compared to several hundred milliseconds on the previous Tripath IC s such as TA4B. Sleep Pin The SLEEP pin is a 5V logic input that when pulled high (>3.5V) puts the part into a low quiescent current mode. This pin is internally clamped by a zener diode to approximately 6V thus allowing the pin to be pulled up through a large valued resistor (MΩ recommended) to V DD. To disable SLEEP mode, the sleep pin should be grounded. Protection Circuits The TAA8 is guarded against over-temperature and over-current conditions. When the device goes into an over-temperature or over-current state, the FAULT pin goes to a logic HIGH state indicating a fault condition. When this occurs, the amplifier is muted, all outputs are TRI- TAA8 KL/.96/6.5

12 STATED, and will float to / of V DD. The FAULT pin can be connected directly to MUTE to automatically recover from an overcurrent condition. Over-temperature Protection An over-temperature fault occurs if the junction temperature of the part exceeds approximately 55 C. The thermal hysteresis of the part is approximately 45 C, therefore the fault will automatically clear when the junction temperature drops below C. Over-current Protection An over-current fault occurs if more than approximately 7 amps of current flows from any of the amplifier output pins. This can occur if the speaker wires are shorted together or if one side of the speaker is shorted to ground. An over-current fault sets an internal latch that can only be cleared if the MUTE pin is toggled or if the part is powered down. Alternately, if the MUTE pin is connected to the FAULT pin, the HIGH output of the FAULT pin will toggle the MUTE pin and automatically reset the fault condition. Overload The OVRLDB pin is a 5V logic output. When low, it indicates that the level of the input signal has overloaded the amplifier resulting in increased distortion at the output. The OVRLDB signal can be used to control a distortion indicator light or LED through a simple buffer circuit, as the OVRLDB cannot drive an LED directly. Fault Pin The FAULT pin is a 5V logic output that indicates various fault conditions within the device. These conditions include: low supply voltage, low charge pump voltage, low 5V regulator voltage, over current at any output, and junction temperature greater than approximately 55 C. All faults except overcurrent automatically reset upon removal of the condition. The FAULT output is capable of directly driving an LED through a series kω resistor. If the FAULT pin is connected directly to the MUTE input an automatic reset will occur in the event of an over-current condition. Output Voltage Offset The DC offset voltages that appear at the speaker terminals of a TAA8 amplifier are typically small and for most applications no DC offset correction is necessary. The TAA8 is % tested to ensure that the differential output DC offset voltage is less than +/-5mV. However this DC offset can cause a small turn on and turn off pop, depending on the offset value for that specific IC. Every TAA8 IC will have a different offset voltage for each channel. If the output offset is deemed unacceptable from a turn on/off pop standpoint, there are three recommended methods for correcting it. These methods of trimming the offset voltage are optional and for most cases the additional circuitry is not needed. ) A potentiometer can be used at the input of the TAA8 as shown in the figure below. By changing the input bias voltage the output DC offset voltage can be trimmed. Two separate potentiometers must be used to trim both channels. TAA8 KL/.96/6.5

13 OAOUT 9.uF + R I KΩ R F KΩ INV 3 V5A (pin 8) R OFA KΩ Offset Trim Potentiometer R OFB MΩ C OF.uF TAA8 OAOUT.uF + R I R F KΩ KΩ INV V5A (pin 8) R OFB MΩ R OFA KΩ Offset Trim Potentiometer C OF.uF ) In cases where manually trimming potentiometers is not possible, resistors can be used in place of potentiometers. Since each TAA8 has different offset voltage, the output offset voltage will need to be measured for both channel and channel and then resistors will have to be added on the PC board to trim the offset. Below is a lookup table for resistor values for corresponding offset voltages. Both Rx and Ry values should be % tolerance resistors. Please refer to the EB-TAA8 document for more information on this manual trim method using resistors. OAOUT 9.uF + R F R I KΩ KΩ INV 3 V5A (pin 8) R OFB MΩ R X TAA8 R Y OAOUT.uF + R I R F KΩ KΩ INV V5A (pin 8) R OFB MΩ R X R Y 3 TAA8 KL/.96/6.5

14 OFFSET Ry Rx (%) 5mV kω 3.3kΩ 4mV kω 3.7kΩ 3mV kω 4.3kΩ mv kω 4.7kΩ mv kω 5.4kΩ mv kω 5.8kΩ 9mV kω 6.kΩ 8mV kω 6.9kΩ 7mV kω 7.4kΩ 6mV kω 7.8kΩ 5mV kω 8.7kΩ 4mV kω 9.kΩ 3mV kω 9.6kΩ mv kω.5kω mv kω kω mv kω.5kω -mv kω.6kω -mv kω 3.kΩ -3mV kω 4.3kΩ -4mV kω 4.9kΩ -5mV kω 5.5kΩ -6mV kω 6.7kΩ -7mV kω 7.4kΩ -8mV kω 8.kΩ -9mV kω 9.4kΩ -mv kω 3.kΩ -mv kω 3.6kΩ -mv kω 3.4kΩ -3mV kω 33.kΩ -4mV kω 34.8kΩ -5mV kω 35.7kΩ 3) A DC servo using a dual op amp can also be used to automatically null any offset voltage. This DC servo will only eliminate the turn off pop since the RC time constant of the DC servo is very slow. Please contact Tripath sales for additional information on the DC servo circuit. Power Dissipation Derating The TAA8, as a result of high efficiency and good package thermal characteristics, can operate at elevated ambient temperatures without having to derate the output power, assuming 8 ohm output loads or higher. This in stark contrast to many other competitive solutions from other semiconductor vendors, many of which can only provide full power at ambient temperatures of 5 C, or slightly higher, without exceeding a junction temperature of 5 C. Lower die temperatures result in a more robust and reliable amplifier solution that can only be facilitated by a combination of high efficiency and good package thermal characteristics. The exposed pad must be soldered to the PC Board to increase the maximum power dissipation capability of the TAA8 package. Soldering will minimize the likelihood of an overtemperature fault occurring during continuous heavy load conditions. There should be vias for connecting the exposed pad to the copper area on the printed circuit board. 4 TAA8 KL/.96/6.5

15 Conducting initial testing or characterization without the exposed pad soldered to the printed circuit board will give erroneous case temperature measurements. The TAA8 is an extremely robust device, so not soldering the device to the printed circuit board, due to potential rework issues, should not be a concern. These devices do not fail unless the operating supply voltages maximums are exceeded, and/or an improper printed board design is utilized. The maximum device power dissipation, for a given ambient temperature, can be calculated based on a 5 C maximum junction temperature, T JMAX, as given by the following equation: PDISS (TJMAX TA ) = θja where: P DISS = maximum power dissipation T JMAX = maximum junction temperature of TAA8 T A = operating ambient temperature θ JA = junction-to-ambient thermal resistance = C/W when soldered to PCB From the above formula, the maximum power dissipation at an ambient temperature of 5 C is 5.68W, and at 7 C is 3.64W. The amount of power dissipation can easily be calculated given the output power and efficiency for that output level. The Typical Performance Characteristics section has a significant amount of efficiency and power dissipation data. The relation between P DISS, Output Power and Efficiency is given in the formula below. P DISS = Total Output Power Efficiency Total Output Power The efficiency for the TAA8 is 86% at 9 watts per channel. Thus, the power dissipation is: 8W P DISS = 8W = Watts Since.93 Watts is less than the maximum power dissipation of 3.64 Watts at 7 C, the TAA8 is not thermally limited assuming maximum output power into 8 ohms loads. The resultant junction temperature, T J, can be calculated using the formula below: T J = P DISS * Θ JA + T A The power dissipation at 9 watts per channel into 8 ohms is.93w, as calculated above. Assuming an ambient temperature of 4 C, this results in a junction temperature of 5 C. This junction temperature is much lower than competitive solutions at similar output power levels with 8 ohm loads, resulting in a more reliable amplifier design. A similar set of calculations can be done for a 6 ohm load. But since the efficiency is higher and the output power is lower for a 6 ohm load, as opposed to an 8 ohm load, the power dissipation will be smaller. Since the TAA8 is not thermally limited into 8 ohm loads, it will not be thermal limited into 6 ohm loads. Performance Measurements of the TAA8 The TAA8 operates by generating a high frequency switching signal based on the audio input. This signal is sent through a low-pass filter (external to the Tripath amplifier) that recovers an 5 TAA8 KL/.96/6.5

16 amplified version of the audio input. The frequency of the switching pattern is spread spectrum and typically varies between khz and.mhz, which is well above the Hz khz audio band. The pattern itself does not alter or distort the audio input signal but it does introduce some inaudible components. The measurements of certain performance parameters, particularly noise related specifications such as THD+N, are significantly affected by the design of the low-pass filter used on the output as well as the bandwidth setting of the measurement instrument used. Unless the filter has a very sharp roll-off just beyond the audio band or the bandwidth of the measurement instrument is limited, some of the inaudible noise components introduced by the Tripath amplifiers switching pattern will degrade the measurement. One feature of the TAA8 is that it does not require large multi-pole filters to achieve excellent performance in listening tests, usually a more critical factor than performance measurements. Though using a multi-pole filter may remove high-frequency noise and improve THD+N type measurements (when they are made with wide-bandwidth measuring equipment), these same filters degrade frequency response. The TAA8 Evaluation Board uses the Test/Application Circuit in this data sheet, which has a simple two-pole output filter and excellent performance in listening tests. Measurements in this data sheet were taken using this same circuit with a limited bandwidth setting in the measurement instrument. 6 TAA8 KL/.96/6.5

17 PACKAGE INFORMATION 3 PIN QFN - 8MM x 8MM X MM 7 TAA8 KL/.96/6.5

18 Tripath Technology Inc. reserves the right to make changes without further notice to any products herein to improve reliability, function or design. Tripath does not assume any liability arising out of the application or use of any product or circuit described herein; neither does it convey any license under its patent rights, nor the rights of others. Tripath and Digital Power Processing are trademarks of Tripath Technology Inc. Other trademarks referenced in this document are owned by their respective companies. TRIPATH S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN CONSENT OF THE PRESIDENT OF TRIPATH TECHNOLOGY INC. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in this labeling, can be reasonably expected to result in significant injury to the user.. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Contact Information TRIPATH TECHNOLOGY, INC 56 Orchard Parkway, San Jose, CA P F For more Sales Information, please visit For more Technical Information, please visit 8 TAA8 KL/.96/6.5