CHIP TECHNOLOGY INNOVATOR. World Best CSP LED Platform and Solution Provider High Performance, High Reliability with LM80

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1 CHIP TECHNOLOGY INNOVATOR World Best CSP LED Platform and Solution Provider High Performance, High Reliability with LM80

2 Contents 02 About CTLab 03 Product Line Up 05 CSP Product Line Up SW Series RW Series TW Series CW Series 12 DF Series 6W~108W CSPOB DC015W_R for Down light DB 200W 19 AC LED Product Line Up AW Series 20W, 30W, 40W AW015_Square 22 Model Nomenclature

About CTLab CEO greeting CTLab is a small but strong venture company, producing semiconductor light sources for BLU, Smart phone, Indicator, and Lighting.

3 About CTLab CEO greeting CTLab is a small but strong venture company, producing semiconductor light sources for BLU, Smart phone, Indicator, and Lighting. CTLab has developed and produced a variety of LED package and module for IT and Lighting Application, by using our own CSP (Chip Scale Package) technology. Our miniaturized CSPs have the more different and innovative structures than other conventional LED Packages, making something NEUH. (NEUH is the acronym of No bonding & Au wire, Extremely low cost, Ultra small & thin and High Performance & Reliability) In addition, CTLAB passed the official LM-80 Reliability test (almost 9 months) at the end of CTLab s motto is share light and miracle with us. We know that CSP should be much like the filament of an Edison bulb, so everyone, whoever poor or rich, in the world gets the benefit of light easily and properly. We believe that our CSP technology is like priming water. We will prime the pump to increase the value of customer through CTLab s product. Today and tomorrow, we are always doing our best. Thanks you very much. Establishment CEO Website April 19, 2012 Kim, Chang Tae Company History 2017 Key Intellectual property was registered in USA 03/16 Press Release /04 New factory set up in Bundang Technopark Intellectual properties (15 registered and 18 applied in Korea, China, and USA) /23 Press Release 02/16 KC&HE Certification begun with KTR 03/25 Patent portfolio (14 registered + 13 applied + 3 ready to apply) 12/04 Mass of TV BLU /01 2 nd & 3 rd Government-funded R&D projects initiated. 6/20 Facility for LED lighting system(lamp & luminaire) set up at Suwon 09/01 Factory registered by local government 05/01~10/30 CSP Production line installed (Max. Capa 3KK/month for SW1515) 10/06 Press Release /16 Corporate R&D Center registered by KOITA 09/06 Capital Investment gained from Strategic Investor 11/01 1 st Government-funded R&D project initiated 11/21 Venture Company registered by SMBC 12/07 CSP(1W, IRIS) LM80 Certified by KTR 04/19 CTLab established 10/05 Capital investment gained from 1 st angel

4 Product Line Up SW Series Lighting Series Model Pdiss(W) Vop(V) lop(ma) lm(lumen) Lm/W CCT CRI 2Q1/2(o) Comments SW SW0909CS SW1111HS SW1515NS SW1515QS SW1717US SW2121WS SW Series : Stage Lighting Series Model Pdiss(W) Vop(V) lop(ma) lm(lumen) Lm/W CCT CRI 2Q1/2(o) Comments SW SW1515NS SW Series : BLU Series Model Pdiss(W) Vop(V) lop(ma) lm(lumen) Lm/W CCT CRI 2Q1/2(o) Comments SW SW1313LS / SW Series : Lighting(HV CSP) Series Model Pdiss(W) Vop(V) lop(ma) lm(lumen) Lm/W CCT CRI 2Q1/2(o) Comments SW SW1313DS RW Series : BLU Series Model Pdiss(W) Vop(V) lop(ma) lm(lumen) Lm/W CCT CRI 2Q1/2(o) Comments RW RW1515NS / under development TW Series : BLU Series Model Pdiss(W) Vop(V) lop(ma) lm(lumen) Lm/W CCT CRI 2Q1/2(o) Comments TW TW1515NS / under development CW Series : Mobile Flash Series Model Pdiss(W) Vop(V) lop(ma) lm(lumen) Lm/W CCT CRI 2Q1/2(o) Comments CW CW1515NS under development 3

5 DF Series Lighting Serie s Model Pdiss (W) Vop (V) Lop (ma) lm (lumen) lm/w CCT CRI 2Q1/2(o) LEA_I LEA_O PCB Comments DF DF006A X15.85 DF012A X15.85 DF024C X23.85 DF036C X23.85 DF048E X27.35 DF060E X27.35 DF072E X27.35 DF084G X34.85 DF096G X34.85 DF108G X34.85 AW Series : Lighting Series Model Pdiss (W) Vop (V) Lop (ma) lm (lumen) lm/w CCT CRI 2Q1/2(o) Comments AW AW F AW F AW F Customized Product SPEC Will be discussed with Customer These lm/w are based on 5000K. CTLab all Products are available in 2700K~6500K with ANSI Bin 4

CSP Product Line Up Rise in LED lighting demands brought new opportunities for the industry, but low price and low cost trend caused many manufacturers to incur losses and struggle financially.

6 CSP Product Line Up Rise in LED lighting demands brought new opportunities for the industry, but low price and low cost trend caused many manufacturers to incur losses and struggle financially. Chip Scale Packaging (CSP) products are the industry s latest attempt to lowering costs, as the technology is able to eliminate Au wiring, bonding and lead frames during the process. With improving CSP technology and rising market acceptance, CSP developments now are highly anticipated by the LED industry. CTLab as the world first CSP LED platform and Solution Provider is ready to meet your purpose, assuring high performance and reliability with LM80

7 ± ± ± ± ± SW0909CS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 0.90 x 0.90 x 0.42 Application : Signal, Consumer s Electronics, Lighting Package Dimension ± ± Pdiss 0.3 [W] Forward Current [ma] Luminous Flux 45 [lm] Cathode(Au) Anode(Au) Forward Voltage [V] [Top View] [Side View] [Bottom View] [NOTE] 1. Unit : mm 2. STD Tolerance : ± [ /W] 0.52 [Recommended PCB Solder PAD] [Recommended Stencil Opening] 0.50 SW1111HS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 1.10 x 1.10 x 0.32 Application : Signal, Consumer s Electronics, Lighting Package Dimension 1.10± ± ± Pdiss 1.0 [W] Forward Current [ma] Luminous Flux 120 [lm] Cathode(Au) Anode(Au) Forward Voltage [V] [Top View] [Side View] [Bottom View] [NOTE] 1. Unit : mm 2. STD Tolerance : ± [ /W] [Recommended PCB Solder PAD] [Recommended Stencil Opening] 6

8 SW1515NS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 1.50 x 1.50 x 0.42 Application : Signal, Consumer s Electronics, Lighting Package Dimension Pdiss 1.0 [W] Forward Current [ma] Luminous Flux 130 [lm] Forward Voltage [V] 7.8 [ /W] SW1515QS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 1.50 x 1.50 x 0.42 Application : Signal, Consumer s Electronics, Lighting Package Dimension Pdiss 1.0 [W] Forward Current [ma] Luminous Flux 132 [lm] Forward Voltage [V] 6.85 [ /W] 7

9 SW1717US CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 1.70 x 1.70 x 0.32 Application : Signal, Consumer s Electronics, Lighting Package Dimension Pdiss 3.0 [W] Forward Current [ma] Luminous Flux 140 [lm] Forward Voltage 2.8 [V] 5.21 [ /W] SW2121WS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 2.10 x 2.10 x 0.32 Application : Signal, Consumer s Electronics, Lighting Package Dimension Pdiss 5.0 [W] Forward Current [ma] Luminous Flux 145 [lm] Forward Voltage 2.8 [V] 4.14 [ /W] 8

SW1313LS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 1.30 x 1.30 x 0.32 Application : BLU Package Dimension Pdiss 1.

10 SW1313LS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 1.30 x 1.30 x 0.32 Application : BLU Package Dimension Pdiss 1.0 [W] Forward Current [ma] Luminous Flux 86 [lm] Forward Voltage 2.9 [V] CCT Will be discussed with Customer 9.2 [ /W] SW1313DS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 1.30 x 1.30 x 0.40 Application : Signal, Consumer s Electronics, Lighting Package Dimension Pdiss 0.42 [W] Forward Current 20 [ma] Luminous Flux 35 [lm] Forward Voltage 21 [V] [ /W] 9

RW1515NS CSP Product Line Up No die attach, No

32 Application : BLU Package Dimension Pdiss 1.

8 [ /W] TW1515NS CSP Product Line Up No die

11 RW1515NS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 1.50 x 1.50 x 0.32 Application : BLU Package Dimension Pdiss 1.0 [W] Forward Current [ma] Luminous Flux 105 [lm] Forward Voltage [V] CCT Will be discussed with customer 7.8 [ /W] TW1515NS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 1.50 x 1.50 x 0.32 Application : BLU Package Dimension Pdiss 1.0 [W] Forward Current [ma] Luminous Flux 105 [lm] Forward Voltage [V] CCT Will be discussed with customer 7.8 [ /W] 10

12 CW1515NS CSP Product Line Up No die attach, No wire bonding, No substrate High Performance; Better Heat Ag Free Chip & Package Size : 1.50 x 1.50 x 0.32 Application : Flash Package Dimension Pdiss 1.0 [W] Forward Current [ma] Luminous Flux 130 [lm] Forward Voltage [V] CCT 7000 [K] CRI 70 [Ra] 7.8 [ /W] 11

The DC modules(csp array) are not COB type, but innovative POB type. They are specifically designed for applications requiring high flux packages.

13 The DC modules(csp array) are not COB type, but innovative POB type. They are specifically designed for applications requiring high flux packages. They deliver optimized combinations of light quality and light output needed in lighting applications. They are based on our own world first true CSP technology protected by CTLAB s own intellectual properties. These revolutionary packages combined with PCB circuit design enable CTLab to meet various desire of our customers.

14 DF006A Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : x x 1.1 (LEA_I : Φ10.5) 0.32± ± ± ± [W]?4.00 Luminous Flux 748 [lm] Forward Voltage [V] + CTLAB LEA?10.50 [Note] 1. Unit : mm 2. STD Tolerance : ± 0.02 Forward Current 175 [ma] DF006A [ /W] DF012A Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : x x 1.1 (LEA_I : Φ10.5) 12 [W] Luminous Flux 1549 [lm] Forward Voltage [V] Forward Current 350 [ma] [Note] 1. Unit : mm 2. STD Tolerance : ± [ /W]

15 0.32± ± ± ± DF024C Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : x x 1.1 (LEA_I : Φ19) 25 [W] Luminous Flux 3098 [lm] Forward Voltage [V] [Note] 1. Unit : mm 2. STD Tolerance : ± 0.02 Forward Current 700 [ma] 0.42 [ /W] DF036C Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : x x 1.1 (LEA_I : Φ19) 37 [W] Luminous Flux 4646 [lm] Forward Voltage [V] Forward Current 1050 [ma] [Note] 1. Unit : mm 2. STD Tolerance : ± [ /W]

16 0.32± ± ± ± DF048E Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : x x 1.1 (LEA_I : Φ23) 50 [W] Luminous Flux 6195 [lm] Forward Voltage [V] Forward Current 1400 [ma] [Note] 1. Unit : mm 2. STD Tolerance : ± [ /W] DF060E Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : x x 1.1 (LEA_I : Φ23) 62 [W] Luminous Flux 7744 [lm] Forward Voltage [V] Forward Current 1750 [ma] [Note] 1. Unit : mm 2. STD Tolerance : ± [ /W]

0.32±0.02 1.1±0.2 34.85 0.32±0.02 1.1±0.2 27.35 DF072E Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : 27.35 x 27.35 x 1.

17 0.32± ± ± ± DF072E Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : x x 1.1 (LEA_I : Φ23) 74 [W] Luminous Flux 9293 [lm] Forward Voltage [V] [Note] 1. Unit : mm 2. STD Tolerance : ± 0.02 Forward Current 2100 [ma] 0.20 [ /W] DF084G Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : x x 1.1 (LEA_I : Φ31) 87 [W] Luminous Flux [lm] Forward Voltage [V] Forward Current 2450 [ma] [Note] 1. Unit : mm 2. STD Tolerance : ± [ /W]

18 0.32± ± ± ± DF096G Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : x x 1.1 (LEA_I : Φ31) 99 [W] Luminous Flux [lm] Forward Voltage [V] [Note] 1. Unit : mm 2. STD Tolerance : ± 0.02 Forward Current 2800 [ma] 0.16 [ /W] DF108G Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : x x 1.1 (LEA_I : Φ31) 112 [W] Luminous Flux [lm] Forward Voltage [V] Forward Current 3150 [ma] [Note] 1. Unit : mm 2. STD Tolerance : ± [ /W]

DC015_R Not Chip On Board, Package On Board Higher luminous efficiency

Forward Voltage 34 36 [V] Forward Current 450 [ma] DB200W Not Chip On

Max Unit #Ch1 / #CH2 200 [W] Luminous Flux #Ch1 / #CH2 19000 [Lm]

19 DC015_R Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : Φ [W] Luminous Flux 1800 [lm] Forward Voltage [V] Forward Current 450 [ma] DB200W Not Chip On Board, Package On Board Higher luminous efficiency Lower thermal resistance Size : 65.0 x 65.0 (LEA_I : Φ41) Application : Broadcast Lighting Item Chanel Min Typ Max Unit #Ch1 / #CH2 200 [W] Luminous Flux #Ch1 / #CH [Lm] Forward Voltage #Ch1 / #CH2 42 [V] Forward Current #Ch1 / #CH [ma] CCT #Ch1 / #CH [K] CRI #Ch1 / #CH2 80 [Ra] 18

20 AC LED Product line Up The Concept of an AC LED is an elegant one. Because you can eliminate the AC to DC Converter and several other electronic components that DC LEDs require, the electronics are simplified between the AC power source and the LED. AW series is a combination of Drive on Board and CSP products. If you just put AW series into your lamp or luminaire, you can experience low cost but high performance solution with design flexibility in Lighting business.

AC LED Product Line Up AW020H AC LED Product Line Up Not AC to DC converter type, AC Direct type No Chip On Board, Package On Board No emission of harmful short wavelength light Size : Φ 57

5 Φ 57 Efficiency 115 [lm/w] Operating Frequency 50/60 [Hz] Factor Over 0.

21 AC LED Product Line Up AW020H AC LED Product Line Up Not AC to DC converter type, AC Direct type No Chip On Board, Package On Board No emission of harmful short wavelength light Size : Φ 57 (LEA_I : Φ20) Φ [W] Φ 20 Luminous Flux 2300 [lm] Forward Voltage [V] Forward Current 91 [ma] Φ 2.5 Φ 57 Efficiency 115 [lm/w] Operating Frequency 50/60 [Hz] Factor Over AW030H AC LED Product Line Up Not AC to DC converter type, AC Direct type No Chip On Board, Package On Board No emission of harmful short wavelength light Size : Φ 57 (LEA_I : Φ20) [W] Φ Φ 20 Luminous Flux 3400 [lm] Forward Voltage [V] Forward Current 136 [ma] Φ 2.5 Φ 57 Efficiency 115 [lm/w] Operating Frequency 50/60 [Hz] Factor Over

Customized Product Line Up AW040H AC LED Product Line Up Not AC to DC converter type, AC Direct type No Chip On Board, Package On Board No emission of harmful short wavelength light Size :

5 Φ 57 Efficiency 110 [lm/w] Operating Frequency 50/60 [Hz] Factor Over 0.

22 Customized Product Line Up AW040H AC LED Product Line Up Not AC to DC converter type, AC Direct type No Chip On Board, Package On Board No emission of harmful short wavelength light Size : Φ 57 (LEA_I : Φ20) [W] Φ Φ 20 Luminous Flux 4400 [lm] Forward Voltage [V] Forward Current 182 [ma] Φ 2.5 Φ 57 Efficiency 110 [lm/w] Operating Frequency 50/60 [Hz] Factor Over AW015_Square AC LED Product Line Up Not AC to DC converter type, AC Direct type No Chip On Board, Package On Board No emission of harmful short wavelength light Size : 44 x 32 (LEA_I : Φ13) [W] Luminous Flux 1400 [lm] Forward Voltage [V] Forward Current 68 [ma] Efficiency 95 [lm/w] Operating Frequency 50/60 [Hz] Factor Over

23 Model Nomenclature CSP Part No. System S W N S CSP Type Package Size Chip Size Chip Q ty Package Type SW RW TW CW Chip Size (mil) 2424 C 3210 F 3030 E 3535 H Simple White Reflective White True White Clear Window White 4545 N 5252 Q 6060 U 7676 W Chip Q ty 1 chip S 2 chip D 3 chip T 4 chip Q 5~ chip & Module M Module Part No. System D F E A W H Module Type PKG Q ty PCB Size Module Type Pdiss PCB Size Module Type AC Module Size (Circle PCB Size Φ) DF Daffodil Flat H 57Φ DC Daffodil Customized DB Daffodil Bi-Color AW AC LED White Module Size (Watt / Square PCB Size mm) 006A 6W / x A 12W / x C 25W / x C 37W / x E 50W / x E 62W / x E 74W / x G 87W / x G 99W / x G 108W / x

24 Company Address : Head Office : C-Dong 501, (BUNDANG TECHNOPARK), 744 Pangyo-ro, Bundang-gu, Seongnam-si, Gyeonggi-do, Korea 경기도성남시분당구판교로 744, 분당테크노파크 C 동 501 호 Head office : (TEL) , (FAX) Ted DH Oh / 오대훈 : , dhoh@chiptechnologylab.com Website : 3 CTLab 2018Catalog Version 1.2

Product Brief. Acrich2.5 30W. Product Data Sheet. Integrated AC LED Solution SMJD-3V30W2PJ. RoHS. Description. Features and Benefits.

Product Brief. Acrich2.5 30W. Product Data Sheet. Integrated AC LED Solution SMJD-3V30W2PJ. RoHS. Description. Features and Benefits. Integrated AC LED Solution Acrich2.5 30W SMJD-3V30W2PJ RoHS Product Brief Description The Acrich2.5 series of products are designed to be driven directly off of AC line voltage, therefore they do not need