PC925L0NSZ0F Series. High Speed, 2.5A Output, Gate Drive DIP 8 pin OPIC Photocoupler. Description. Agency approvals/compliance. Features.
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1 PC9LNSZF Series High Speed,.A Output, Gate Drive DIP pin OPIC Photocoupler Description PC9LNSZF Series contains a LED optically coupled to an OPIC chip. It is packaged in a pin DIP, available in SMT gullwing lead form option. Peak output current is.a, Input-output isolation voltage(rms) is kv and High speed response (t PHL, t PLH : MAX..μs). Features 1. pin DIP package. Double transfer mold package (Ideal for Flow Soldering). Built-in direct drive circuit for MOSFET / IGBT drive (I O(peak) :.A) 4. High speed response (t PHL, t PLH : MAX..μs). Wide operating supply voltage range (V CC =1 to V). High noise immunity due to high instantaneous common mode rejection voltage (CM H : MIN. 1kV/μs, CM L : MIN. 1kV/μs). Long creepage distance type (wide lead-form type only : MIN. mm). High isolation voltage between input and output (V iso(rms) : kv) 9. RoHS directive compliant Agency approvals/compliance 1. Recognized by UL1 (Double protection isolation), fi le No. E4 (as model No. PC9L). Package resin : UL fl ammability grade (94V-). Compliant with RoHS directive (/9/EC) 4. Content status of six substances specifi ed in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法 ) (popular name : China RoHS) ; refer to page 1 Applications 1. IGBT/MOSFET gate drive for inverter control * "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing circuit integrated onto a single chip. Notice The content of data sheet is subject to change without prior notice. In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. 1 Date Oct. 1. SHARP Corporation
2 Internal Connection Diagram Tr1 Tr Interface 1 4 N.C. Anode Cathode N.C. GND V O V O V CC Amp. 1 4 Truth table Input V O Terminal output Tr1 Tr ON High level ON OFF OFF Low level OFF ON Outline Dimensions (Unit : mm) 1. Through-Hole [ex. PC9LNSZF]. SMT Gullwing Lead-Form [ex. PC9LNIPF] SHARP mark "S" 1. ±.. ±. PC9L. ±. Rank mark SHARP mark "S" 1. ±.. ±. PC9L. ±. Rank mark ±. Primary side mark.4 ±. Date code Factory identification mark. ±.. ±.. ±.1. TYP. θ. ±. Epoxy resin. ±.1 θ : TYP. θ 1 9. ±. Primary side mark.4 ±. 4. ±. Date code Factory identification mark. ± ±. Epoxy resin ± Product mass : approx..g Product mass : approx..1g
3 (Unit : mm). Wide SMT Gullwing Lead-Form [ex. PC9LNUPF]. ±. 1. ±. SHARP mark "S" PC9L 1 4 Primary side mark 9. ±.. ±.. ±. Rank mark Date code Factory identification mark. ±.. ±.. ±.1.4 ±. Epoxy resin. ±. 1.1 ±. 1. MAX.. ±. Product mass : approx..g Plating material : Pd (Au flash)
4 Date code ( digit) 1st digit nd digit rd digit Year of production Month of production Week of production A.D. Mark A.D. Mark Month Mark Week Mark 199 A P January 1 1st B R February nd 199 C 4 S March rd 199 D T April 4 4th E U May, th 199 F V June 199 H W July 199 J 9 X August 199 K 1 A September L 11 B October O M 1 C November N 1 N : : December D repeats in a year cycle Factory identification mark Factory identification Mark Country of origin no mark Japan or or Indonesia China * This factory marking is for identification purpose only. Please contact the local SHARP sales representative to see the actural status of the production. Rank mark With or without. 4
5 Absolute Maximum Ratings Input (T a= C) Parameter Symbol Rating Unit *1 Forward current I F ma Reverse voltage V R V * Peak forward current I FM 1 A Output Supply voltage V CC V * Peak output current I O(PEAK). A Output voltage V O V CC V *4 Output power dissipation P O mw * Total power dissipation P tot 9 mw * Isolation voltage V iso(rms) kv Operating temperature T opr 4 to +1 C Storage temperature T stg to +1 C * Soldering temperature T sol C *1 When ambient temperature goes above C, the power dissipation goes down at.ma/ C (Refer to Fig.1). * Pulse width 1μs, pps * Pulse width 1μs, Duty ratio :. *4 When ambient temperature goes above C, the power dissipation goes down at 4.mA/ C (Refer to Fig.11). * When ambient temperature goes above C, the power dissipation goes down at.4ma/ C (Refer to Fig.1). * AC for 1min, 4 to %RH, f=hz * For 1s
6 Electro-optical Characteristics * Input Output PC9LNSZF Series (Unless otherwise specified : T a= +4 to +1 C, I F(ON)= to 1mA, V CC=1 to V, V F(OFF)= V to.v) Parameter Symbol Condition MIN. *1 TYP. MAX. Unit Forward voltage V F I F=1mA V Reverse current I R V R=V 1 μa Terminal capacitance C t T a= C, V=, f=1mhz 1 pf * V O=(V CC 4V), I F(ON). 1. A High level output current I OH *9 V O=(V CC 1V), I F(ON) A * V O=.V, V F(OFF).. A Low level output current I OL *9 V O=1V, V F(OFF) A High level output voltage V OH I O=.1A, I F(ON) V CC 4 V CC V Low level output voltage V OL I O=.1A, V F(OFF).1. V *1 High level supply current I CCH I F(ON). ma *1 Low level supply current I CCL V F(OFF). ma UVLO threshold V UVLO V V UVLO V O >V, I F=1mA V UVLO Hysteresis UVLO HYS 1. V *11 "Low High" threshold input current I FLH V O >V, I O= ma Transfer characteristics Response time Isolation resistance R ISO T a= C, DC=V, 4 to %RH Ω "Low High" propagation time t PLH.1.. μs "High Low" propagation time t PHL.1.. μs *1 Distortion of pulse width Δt W R G=1Ω, C G=1nF,. μs Propagation delay skew t PSK f=1khz, Duty ratio %.. μs Rise time t r.1 μs Fall time t f.1 μs UVLO Turn on delay t UVLO ON V O >V, I F=1mA. μs UVLO Turn off delay t UVLO OFF V O >V, I F=1mA. μs Instantaneous common mode rejection voltage (High level output) Instantaneous common mode rejection voltage (Low level output) CM H CM L T a= C, V CM=1.kV(p p), I F=1 to 1mA, V CC=V, V OH >1V T a= C, V CM=1.kV(p p), V F=, V CC=V, V OL <1V 1 kv/μs 1 * It shall connect a by-pass capacitor of.1μf or more between V CC (Pin No. ) and GND (Pin No. ) near the device, when it measures the transfer characteristics and the output side characteristics. * Pulse width μs, Duty ratio :. *9 Pulse width 1μs, Duty ratio :. *1 Output pin is open. *11 I FLH is the value of forward current when output becomes from "L" to "H" *1 Distortion of pulse width Δt W= t PHL-t PLH *1 All typical values are at T a= C, V CC=V kv/μs
7 Model Line-up PC9LNSZF Series Lead Form Through-Hole SMT Gullwing Wide SMT Gullwing Sleeve Taping Package pcs/sleeve 1 pcs/reel Model No. PC9LNSZF PC9LNIPF PC9LNUPF
8 Fig.1 Test Circuit for High Level Output Current Fig. Test Circuit for Low Level Output Current I F PC9L I OH A V CC PC9L I OL A V CC Fig. Test Circuit for High Level Output Voltage Fig.4 Test Circuit for Low Level Output Voltage I F PC9L I O V OH V V CC PC9L V V OL I OL V CC Fig. Test Circuit for High Level / Low Level Supply Current Fig. Test Circuit for UVLO Threshold I F PC9L A I CC V CC I F PC9L V V CC Variable V O >V
9 Fig. Test Circuit for "Low High" Input Threshold Current I F Variable PC9L V V O V CC Fig. Test Circuit for Response Time 1kHz V IN Duty ratio % PC9L V OUT R G C G V CC V IN wave form V OUT wave form t PLH t PHL % 9% % 1% t r t f Fig.9 Test Circuit for Instantaneous Common Mode Rejection Voltage A SW B PC9L V V O V CC V CM wave form CM H, V O wave form SW at A, I F =1 to 1mA V CM (Peak) GND V OH + V CM CM L, V O wave form SW at B, I F = V OL GND 9
10 Fig.1 Forward Currenet vs. Ambient Temperature Fig.11 Power Dissipation vs. Ambient Temperature Forward current IF (ma) 1 1 Output power dissipation PO (mw) Ambient temperature T a ( C) Ambient temperature T a ( C) Fig.1 Total Power Dissipation vs. Ambient Temperature Fig.1 Forward Current vs. Forward Voltage 1 Total power dissipation Ptot (mw) Forward current IF (ma) 1 1 T a = C T a =1 C T a = C T a = C T a = 4 C Ambient temperature T a ( C) Fig.14 High Level Output Voltage Drop vs. Ambient Temperature High level output voltage drop VOH VCC (V) I F =1mA, I O =.1A, V CC =V Ambient temperature T a ( C) Forward voltage V F (V) Fig.1 High Level Output Voltage Drop vs. Supply Voltage High level output voltage drop VOH VCC (V) T a = C, I F =1mA, I O =.1A 4 1 Supply voltage V CC (V) 1
11 Fig.1 Low Level Output Voltage vs. Ambient Temperature Low level output voltage VOL (V) I F =ma, I O =.1A, V CC =V Fig.1 Low Level Output Voltage vs. Supply Voltage Low level output voltage VOL (V) T a = C, V F =.ma, I O =.1A Ambient temperature T a ( C) Fig.1 High Level Supply Current vs. Ambient Temperature High level supply current ICCH (ma) Fig. Low Level Supply Current vs. Ambient Temperature High level supply current ICCL (ma) I F =1mA, V CC =V I F =ma, V CC =V Ambient temperature T a ( C) Ambient temperature T a ( C) 1 Supply voltage V CC (V) Fig.19 High Level Supply Current vs. Supply Voltage High level supply current ICCH (ma) T a = C, I F =1mA 1 Supply voltage V CC (V) Fig.1 Low Level Supply Current vs. Supply Voltage Low level supply current ICCL (ma) T a = C, I F =ma 1 Supply voltage V CC (V) 11
12 Fig. "Low High" Relative Threshold Input Current vs. Ambient Temperature Relative threshold input current (%) V CC =V 1% at T a = C Fig. "Low High" Relative Threshold Input Current vs. Supply Voltage Relative threshold input current (%) T a = C 1% at V CC =V Ambient temperature T a ( C) Fig.4 Output Voltage vs. Supply Voltage (UVLO Threshold) Output voltage VO (V) T a = C I F =1mA Supply voltage V CC (V) Fig. Propagation Delay Time vs. Ambient Temperature Propagation delay time tplh, tphl (μs) t PLH V CC =V R L =1Ω C G =1nF T a =1 C t PHL T a = 4 C T a = 4 C T a = C Forward current I F (ma) T a = C T a =1 C Supply voltage V CC (V) Fig. Relative UVLO Threshold vs. Ambient Temperature Relative UVLO threshold (%) I F =1mA V O >V Ambient temperature T a ( C) 1% at T a = C V UVLO+ V UVLO Remarks : Please be aware that all data in the graph are just for reference and not for guarantee. 1
13 Design Considerations Recommended Operating Conditions Parameter Symbol MIN. MAX. Unit Input current (ON) I F (ON) 1 ma Input voltage (OFF) V F (OFF). V Supply voltage V CC 1 V Operating temperature T opr 4 1 C Notes about static electricity Transistor of detector side in bipolar confi guration may be damaged by static electricity due to its minute design. When handling these devices, general countermeasure against static electricity should be taken to avoid breakdown of devices or degradation of characteristics. Design guide In order to stabilize power supply line, please certainly connect a by-pass capacitor of.1μf or more between V CC and GND near the device. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals of photocoupler some current caused by it is fl oating capacitance may be generated and result in false operation since current may go through LED or current may change. If the photocoupler may be used under the circumstances where noise will be generated we recommend to use the bypass capacitors at the both ends of LED. The detector which is used in this device, has parasitic diode between each pins and GND. There are cases that miss operation or destruction possibly may be occurred if electric potential of any pin becomes below GND level even for instant. Therefore it shall be recommended to design the circuit that electric potential of any pin does not become below GND level. This product is not designed against irradiation and incorporates non-coherent LED. Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (% degradation over years) into the design consideration. Please decide the input current which become times of MAX. I FLH. 1
14 Recommended Foot Print (reference) SMT Gullwing Lead-form (Unit : mm) Wide SMT Gullwing Lead-form (Unit : mm) For additional design assistance, please review our corresponding Optoelectronic Application Notes. 14
15 Manufacturing Guidelines Soldering Method Refl ow Soldering : Refl ow soldering should follow the temperature profi le shown below. Soldering should not exceed the curve of temperature profi le and time. Please don't solder more than twice. ( C) Terminal : C peak (package surface : C peak) 1 Preheat 1 to 1 C, 1s or less Reflow C or more, s or less 1 4 (min) Flow Soldering : Due to SHARP s double transfer mold construction submersion in fl ow solder bath is allowed under the below listed guidelines. Flow soldering should be completed below C and within 1s. Preheating is within the bounds of 1 to 1 C and to s. Please don t solder more than twice. Hand soldering Hand soldering should be completed within s when the point of solder iron is below 4 C. Please don t solder more than twice. Other notice Please test the soldering method in actual condition and make sure the soldering works fi ne, since the impact on the junction between the device and PCB varies depending on the tooling and soldering conditions. 1
16 Cleaning instructions Solvent cleaning : Solvent temperature should be 4 C or below. Immersion time should be minutes or less. PC9LNSZF Series Ultrasonic cleaning : The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size of PCB and mounting method of the device. Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of mass production. Recommended solvent materials : Ethyl alcohol, Methyl alcohol and Isopropyl alcohol In case the other type of solvent materials are intended to be used, please make sure they work fi ne in actual using conditions since some materials may erode the packaging resin. Presence of ODC etc. This product shall not contain the following materials. And they are not used in the production process for this product. Regulation substances : CFCs, Halon, Carbon tetrachloride, 1,1,1-Trichloroethane (Methylchloroform) Specific brominated flame retardants such as the PBB and PBDE are not used in this product at all. The RoHS directive (/9/EC) This product complies with the RoHS directive (/9/EC). Object substances: lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) and polybrominated diphenyl ethers (PBDE) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic Information Products Regulation (Chinese : 电子信息产品污染控制管理办法 ) Toxic and hazardous substances Category Lead (Pb) Mercury (Hg) Cadmium (Cd) Hexavalent chromium (Cr(VI)) Polybrominated biphenyls (PBB) Polybrominated diphenyl ethers (PBDE) Photocoupler : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is below the concentration limit requirement as described in SJ/T 11- standard. 1
17 Package specification Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The product shall be arranged in the sleeve with its anode mark on the tabless stopper side. MAX. sleeves in one case. Sleeve outline dimensions 1 ±. 1.. (Unit : mm) 1
18 Tape and Reel package 1. SMT Gullwing Lead-Form Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E D G I J H H A B C C D E K Dimensions List A B 1. ±.. ±.1 1. ±.1 1. ±.1 H I J K 1.4 ±.1.4 ±. 4. ±.1 1. ±.1. ±.1 MAX. (Unit : mm) F G 4. ±.1 φ Reel structure and Dimensions e d g c a f b Dimensions List (Unit : mm) a φ b 1. ±1. c φ1 ±1 d φ1. ±. e φ ±1 f. ±. g. ±. Direction of product insertion Pull-out direction [Packing : 1 pcs/reel] 1
19 Tape and Reel package. Wide SMT Gullwing Lead-Form Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F E D G I J H H A B C C D E K Dimensions List A B 4. ±. 11. ±.1 1. ±.1 1. ±.1 H I J K 1.4 ±.1.4 ±. 4. ±.1 1. ±.1. ±.1 MAX. (Unit : mm) F G 4. ±.1 φ Reel structure and Dimensions e d g a c f b Dimensions List a φ e φ ±1 b c. ±1. f g. ±.. ±. (Unit : mm) d φ1 ±1 φ1. ±. Direction of product insertion Pull-out direction [Packing : 1 pcs/reel] 19
20 Important Notices The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for any problems related to any intellectual property right of a third party resulting from the use of SHARP's devices. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device. SHARP reserves the right to make changes in the specifications, characteristics, data, materials, structure, and other contents described herein at any time without notice in order to improve design or reliability. Manufacturing locations are also subject to change without notice. Observe the following points when using any devices in this publication. SHARP takes no responsibility for damage caused by improper use of the devices which does not meet the conditions and absolute maximum ratings to be used specifi ed in the relevant specifi cation sheet nor meet the following conditions: (i) The devices in this publication are designed for use in general electronic equipment designs such as: --- Personal computers --- Offi ce automation equipment --- Telecommunication equipment [terminal] --- Test and measurement equipment --- Industrial control --- Audio visual equipment --- Consumer electronics (ii) Measures such as fail-safe function and redundant design should be taken to ensure reliability and safety when SHARP devices are used for or in connection with equipment that requires higher reliability such as: --- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.) --- Traffi c signals --- Gas leakage sensor breakers --- Alarm equipment --- Various safety devices, etc. (iii) SHARP devices shall not be used for or in connection with equipment that requires an extremely high level of reliability and safety such as: --- Space applications --- Telecommunication equipment [trunk lines] --- Nuclear power control equipment --- Medical and other life support equipment (e.g., scuba). If the SHARP devices listed in this publication fall within the scope of strategic products described in the Foreign Exchange and Foreign Trade Law of Japan, it is necessary to obtain approval to export such SHARP devices. This publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, for any purpose, in whole or in part, without the express written permission of SHARP. Express written permission is also required before any use of this publication may be made by a third party. Contact and consult with a SHARP representative if there are any questions about the contents of this publication. [E1]
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GL480E00000F Infrared Emitting Diode Features. Side view emission type. Plastic mold with resin lens 3. Medium directivity angle (Δθ: ±3 TYP.) Peak emission wavelength: 950 nm TYP. 4. Radiant flux φe:
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S1D01 Series Zero cross type is also available. (S1D02 Series/ S201D02 Series) IT(rms) 1.2A, Non-Zero Cross type DIP 16pin Triac output SSR Description S1D01 Series and Solid State Relays (SSR) are an
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GL4800E0000F Infrared Emitting Diode Features. Side view emission type. Plastic mold with resin lens 3. Medium directivity angle (Δθ: ±30 TYP.) Peak emission wavelength: 950 nm TYP. 4. Radiant flux φe:
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GPS94JF Gap : 3.5mm Slit :.3mm Phototransistor Output, Compact Transmissive Photointerrupter Description GPS94JF is a compact-package, phototransistor output, transmissive photointerrupter, with opposing
More information* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signalprocessing
GPA57HRJF Gap : mm, Slit :.8mm *OPIC Output Case package Transmissive Photointerrupter Description GPA57HRJF is a standard, OPIC output, transmissive photointerrupter with opposing emitter and detector
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IT(rms) 0.3A, Non-Zero Cross type DIP 8pin Triac output SSR Description and Solid State Relays (SSR) are an integration of an infrared emitting diode (IRED), a Phototriac Detector and a main output Triac.
More informationREFERENCE PC817X*CSZ9F. Product name : PHOTOCOUPLER. Model No. : PC817 PC817XNCSZ9F PC817X1CSZ9F PC817X2CSZ9F PC817X3CSZ9F PC817X4CSZ9F
Product name : PHOTOCOUPLER Model No. : PC817 Business dealing name PC817XNCSZ9F PC817X1CSZ9F PC817X2CSZ9F PC817X3CSZ9F PC817X4CSZ9F 1. These specification sheets include materials protected under copyright
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PC3HU7xYIP1B Series Mini-flat Half Pitch Package, Reinforced Insulation Type Photocoupler Description PC3HU7xYIP1B Series contains an IRED optically coupled to a phototransistor. It is packaged in a Mini-flat
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PCSDNTZ Series Non-zero cross type is also available. (PCSDNTZ Series) VDRM : 800V Zero cross type DIP 6pin Phototriac Coupler for triggering Description PCSDNTZ Series Phototriac Coupler include an infrared
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PCSHYFZ Series PCSHYFZ Series Non-zero cross type is also available. (PCSHYFZ Series) VDRM : 600V, Reinforced insulation type Zero cross type DIP pin Phototriac Coupler for triggering Description PCSHYFZ
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S2S5 Series VDRM : 600V, Cost effective Non-zero cross type Mini-Flat Package Phototriac Coupler for triggering Description S2S5 Series Phototriac Coupler include an infrared emitting diode (IRED) optically
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More information* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signalprocessing
GPA53HRJF Gap : 5mm, Slit :.5mm *OPIC Output Case package Transmissive Photointerrupter Description GPA53HRJF is a standard, OPIC output, transmissive photointerrupter with opposing emitter and detector
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PR9MFxNSZ Series/PR39MFxNSZ Series/PR49MFNSZ Series PR9MFxNSZ Series PR39MFxNSZ Series PR49MFNSZ Series Zero cross type is also available. (PR9MFxNSZ Series/ PR39MFxNSZ Series) IT(rms) 0.9A, Non-Zero Cross
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SPEC. No. ED-14P018A ISSUE April 27, 2015 SYSTEM DEVICE UNIT ELECTRONIC COMPONENTS AND DEVICES DIVISION SHARP CORPORATION SPECIFICATION DEVICE SPECIFICATION FOR MODEL No. PHOTOCOUPLER PC817 Business dealing
More information( ) DIN EN : successor standard of DIN VDE0884
PC3SFYVZ Series Non-zero cross type is also available. (PC3SFYVZ Series) VDRM : 600V, Reinforced insulation type Zero cross type DIP 6pin Phototriac Coupler for triggering Description PC3SFYVZ Series reinforced
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GPA75EJ000F Gap : 5mm Slit : 0.5mm *OPIC Output, Screw fixing type Transmissive Photointerrupter with Connector Description GPA75EJ000F are standard, OPIC output, transmissive photointerrupters with opposing
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GP1S50J0000F Gap : 3mm, Slit : 0.5mm Phototransistor Output, Case package Transmissive Photointerrupter Description GP1S50J0000F is a standard, phototransistor output, transmissive photointerrupter with
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PCSHYFZ Series Zero cross type is also available. (PCSHYFZ Series) VDRM : 600V, Reinforced insulation type Non-zero cross type DIP pin Phototriac Coupler for triggering Description reinforced insulation
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GP2Y0AH01K0F High-precision Displacement Sensor Unit Measuring distance: 4.5 to 6.0 mm Analog output type Description GP2Y0AH01K0F is a distance measuring sensor unit, composed of an integrated combination
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GPS5VJF GPS5VJF Gap : mm Slit :.5mm Phototransistor Output, Case package Transmissive Photointerrupter Description GPS5VJF is a standard, phototransistor output, transmissive photointerrupter with opposing
More information( ) DIN EN : successor standard of DIN VDE0884
PC3SFYVZ Series PC3SFYVZ Series Zero cross type is also available. (PC3SFYVZ Series) VDRM : 600V, Reinforced insulation type Non-zero cross type DIP 6pin Phototriac Coupler for triggering Description PC3SFYVZ
More information5-0.4 (1.27) Parameter Symbol Rating Unit Forward current IF 50 ma
GPA7HR GPA7HR Wide Gap Type OPIC Photointerrupter Features. Wide gap between LED and detector (mm ). High accuracy mounting type with positioning pin 3. Built-in schmidt-trigger circuit 4. PWB mounting
More informationParamerter Symbol Rating Unit Forward currnt IF 50 ma
GP1A58HR OPIC Photointerrupter Features 1. High sensing accuracy (Slit width:.5mm ). PWB mounting type Applications 1. OA equipment such as printers, facsimiles, etc.. VCRs Outline Dimensions (.5) A58
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GP2S700HCP SMT, Detecting Distance : 3mm Phototransistor Output, Compact Reflective Photointerrupter Description GP2S700HCP is a compact-package, phototransistor output, reflective photointerrupter, with
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GP1A054RDKLF Case Type With Encoder Function Digital 2 Output (A Phase / B Phase) Transmissive Photointerrupter Description GP1A054RDKLF is a transmissive photointerrupter with digital 2 output (phase
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GP1A173LCSVF Gap : 5.0mm Slit : 0.5mm *OPIC Output, Snap-in type Compact Transmissive Photointerrupter with connector Description GP1A173LCSVF is a standard, OPIC output, transmissive photointerrupter
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More informationGap : 5.0mm Slit : 0.5mm Phototransistor Output, Compact Transmissive Photointerrupter with connector
GP1S173LCS2F Gap : 5.0mm Slit : 0.5mm Phototransistor Output, Compact Transmissive Photointerrupter with connector Description GP1S173LCS2F is a standard, phototransistor output, transmissive photointerrupter
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S2S4 Series Non-zero cross type is also available. (S2S3 Series) VDRM : 600V, Zero cross type Mini-Flat Package Phototriac Coupler for triggering Description S2S4 Series Phototriac Coupler include an infrared
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PCSDNTZ Series V DRM : 600V type is also available. (PC3SDNTZ Series) VDRM : 400V Nonzero cross type DIP 6pin Phototriac Coupler for triggering Description PCSDNTZ Series Phototriac Coupler include an
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GPS96HCZF GPS96HCZSF Gap :.mm, Slit :.3mm Phototransistor Output, Compact Transmissive Photointerrupter Description GPS96HCZF is a compact-package, photo-transistor output, transmissive photointerrupter,
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GP2S60 SMT, Detecting Distance : 0.5mm Phototransistor Output, Compact Reflective Photointerrupter Description GP2S60 is a compact-package, phototransistor output, reflective photointerrupter, with emitter
More informationParameter Symbol Rating Unit. Reverse voltage V R 5 V *1 *2Power dissipation P 40 mw. P C 60 mw
PC9D PC9D Ultra-high Speed Response, -channel OPIC Photocoupler Features. Built-in -channel. Ultra-high speed response ( tphl, t PLH : TYP. ns at R L= Ω ). Isolation voltage between input and output (
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PC PC Compact, Surface Mount Ultra-high Speed Response OPIC Photocoupler Features Outline Dimensions ( Unit : mm). Mini-flat package 2. Ultra-high speed response ( tplh, : TYP. ns at R L = Ω ).27 ±.2 Internal
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GPS74PJF GPS74PJF Gap : 5mm Slit :.5mm Phototransistor Output, Snap-in fixing Transmissive Photointerrupter with Connector Description GPS74PJF is a standard, phototransistor output, transmissive photointerrupter
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PC96 PC96 DC Input Type OPIC Photocoupler with Built-in ON/OFF Delay Circuit Features Outline Dimensions (Unit : mm ) 1. Propagation delay time 2. ±.2 ( t PHL, t PLH : TYP..7ms ) 16 1 1 13 12 11 1 9 2.
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GP2S60 SMT, Detecting Distance : 0.5mm Phototransistor Output, Compact Reflective Photointerrupter Description GP2S60 is a compact-package, phototransistor output, reflective photointerrupter, with emitter
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PC3SH13YFZAX VDRM : 600V, Reinforced insulation type Non-zero cross type DIP 4 pin Phototriac Coupler for triggering Description PC3SH13YFZAX reinforced insulation type Phototriac Coupler include an infrared
More informationREFERENCE PC817X*NIP1B
1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please handle with great cares and do not reproduce or cause anyone to reproduce them without Sharp's
More information* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signalprocessing
Gap : 5mm Slit :.5mm *OPIC Output, Snap-in type Transmissive Photointerrupter with Connector Description is a standard, OPIC output, transmissive photointerrupter with opposing emitter and detector in
More informationREFERENCE PC817X*NSZ1B
1. These specification sheets include materials protected under copyright of Sharp Corporation ("Sharp"). Please handle with great cares and do not reproduce or cause anyone to reproduce them without Sharp's
More informationPC123. Anode mark PC123F 1.2 ± ± ± MIN.
PC/PCF PC/PCF DIN-DE88 approved type (PCY/PCFY) is also available as an option. Features. Conform to European Safetty Standard. Internal isolation distance:.mm or more. High collector-emitter voltage (
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More informationParameter Symbol Rating Unit Forward current. IF 50 ma. P C 150 mw P tot 170 mw V iso 3.75 kv rms T opr - 30 to C.
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GP2Y0A41SK0F Distance Measuring Sensor Unit Measuring distance : 4 to 30 cm Analog output type Description GP2Y0A41SK0F is a distance measuring sensor unit, composed of an integrated combination of PSD
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GP1A173LCS3F GP1A173LCS3F Gap : 5.0mm, Slit : 0.5mm, Low voltage operation, *OPIC Output, Snap-in type Compact Transmissive Photointerrupter with connector Description GP1A173LCS3F is a standard, low voltage
More informationDistributed by: www.jameco.com -800-8-44 The content and copyrights of the attached material are the property of its owner. GPA0AJ000F Series GPA0AJ000F Series Gap : mm, Slit : 0.mm *OPIC Output Transmissive
More information* "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signalprocessing
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