In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below.
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1 Important notice Dear Customer, On 7 February 217 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of or use Instead of sales.addresses@ or sales.addresses@ use salesaddresses@nexperia.com ( ) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - NXP N.V. (year). All rights reserved or Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia
2 IPAK Rev December 21 Product data sheet 1. Product profile 1.1 General description Standard level N-channel enhancement mode Field-Effect Transistor (FET) in a plastic package using TrenchMOS technology. This product is designed and qualified for use in computing, communications, consumer and industrial applications only. 1.2 Features and benefits Higher operating power due to low thermal resistance Suitable for high frequency applications due to fast switching characteristics 1.3 Applications Computer motherboards DC-to-DC converters 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter Conditions Min Typ Max Unit V DS drain-source voltage 25 C T j 175 C V I D drain current T mb =25 C; V GS =1V; A see Figure 1; see Figure 3 P tot total power dissipation T mb =25 C; see Figure W Static characteristics R DSon drain-source on-state resistance V GS =1V; I D =25A; T j =25 C; see Figure 1; see Figure 11 Dynamic characteristics Q GD gate-drain charge V GS =1V; I D =25A; V DS =12V; see Figure 12; see Figure mω nc
3 2. Pinning information Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 G gate 2 D drain mb 3 S source mb D mounting base; connected to drain D G mbb76 S 3. Ordering information SOT533 (IPAK) Table 3. Ordering information Type number Package Name Description Version IPAK plastic single-ended package (IPAK); 3 leads (in-line) SOT Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 6134). Symbol Parameter Conditions Min Max Unit V DS drain-source voltage 25 C T j 175 C - 25 V V DGR drain-gate voltage 25 C T j 175 C; R GS =2kΩ - 25 V V GS gate-source voltage -2 2 V I D drain current V GS =1V; T mb = 1 C; see Figure A V GS =1V; T mb = 25 C; see Figure 1; - 75 A see Figure 3 I DM peak drain current pulsed; t p 1 µs; T mb =25 C; - 24 A see Figure 3 P tot total power dissipation T mb = 25 C; see Figure 2-17 W T stg storage temperature C T j junction temperature C Source-drain diode I S source current T mb =25 C - 75 A I SM peak source current pulsed; t p 1 µs; T mb = 25 C - 24 A Avalanche ruggedness E DS(AL)S non-repetitive drain-source avalanche energy V GS =1V; T j(init) =25 C; I D =32A; V sup 25 V; unclamped; t p =.17 ms; R GS =5Ω - 1 mj All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December 21 2 of 13
4 12 3aab aa16 I der (%) P der (%) T mb ( C) T mb ( C) Fig 1. Normalized continuous drain current as a function of mounting base temperature Fig 2. Normalized total power dissipation as a function of mounting base temperature 1 3 3aab283 I D (A) 1 2 Limit R DSon = V DS / I D t p = 1 μs 1 μs 1 DC 1 ms V DS (V) Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December 21 3 of 13
5 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R th(j-mb) thermal resistance from junction to see Figure K/W mounting base R th(j-a) thermal resistance from junction to ambient vertical in free air K/W 1 3aab284 Z th(j-mb) (K/W) 1 δ = single pulse P t p δ = T t p (s) t p T t Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December 21 4 of 13
6 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics V (BR)DSS drain-source breakdown I D = 25 µa; V GS =V; T j = -55 C V voltage I D = 25 µa; V GS =V; T j = 25 C V V GS(th) gate-source threshold voltage I D =1mA; V DS =V GS ; T j =-55 C; V see Figure 8; see Figure 9 I D =1mA; V DS =V GS ; T j =25 C; V see Figure 8; see Figure 9 I D =1mA; V DS =V GS ; T j =175 C; V see Figure 8; see Figure 9 I DSS drain leakage current V DS =25V; V GS =V; T j = 25 C µa V DS =25V; V GS =V; T j = 175 C µa I GSS gate leakage current V GS =2V; V DS =V; T j = 25 C na V GS =-2V; V DS =V; T j = 25 C na R DSon drain-source on-state resistance V GS =1V; I D =25A; T j =175 C; see Figure 1; see Figure 11 V GS =1V; I D =25A; T j =25 C; see Figure 1; see Figure mω mω R G internal gate resistance (AC) f = 1 MHz Ω Dynamic characteristics Q G(tot) total gate charge I D =A; V DS =V; V GS = 4.5 V nc I D =25A; V DS =12V; V GS =1V; nc Q GS gate-source charge see Figure 12; see Figure nc Q GS1 pre-threshold gate-source nc charge Q GS2 post-threshold gate-source nc charge Q GD gate-drain charge nc V GS(pl) gate-source plateau voltage I D =25A; V DS = 12 V; see Figure 12; V see Figure 13 C iss input capacitance V DS =V; V GS =V; f=1mhz; pf T j =25 C V DS =12V; V GS =V; f=1mhz; pf C oss output capacitance T j = 25 C; see Figure pf C rss reverse transfer capacitance pf t d(on) turn-on delay time V DS =12V; R L =.5Ω; V GS =1V; ns t r rise time R G(ext) =5.6Ω ns t d(off) turn-off delay time ns t f fall time ns All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December 21 5 of 13
7 Table 6. Characteristics continued Symbol Parameter Conditions Min Typ Max Unit Source-drain diode V SD source-drain voltage I S =25A; V GS =V; T j =25 C; V see Figure 15 t rr reverse recovery time I S =2A; di S /dt = -1 A/µs; V GS =V; ns V DS =25V Q r recovered charge I S =2A; di S /dt = -1 A/µs; V GS = V nc 8 I D (A) V GS (V) = 1 3aab I D (A) 8 3aab T j = 15 C 25 C V DS (V) V GS (V) Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values Fig 6. Transfer characteristics: drain current as a function of gate-source voltage; typical values 1 4 3aab aab33 C (pf) V GS(th) (V) 3 max typ C iss min C rss V GS (V) T j ( C) Fig 7. Input and reverse transfer capacitances as a function of gate-source voltage; typical values Fig 8. Gate-source threshold voltage as a function of junction temperature All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December 21 6 of 13
8 1-3 3aab34 2 3af18 I D (A) 1-4 min typ max a V GS (V) T j ( C) Fig 9. Sub-threshold drain current as a function of gate-source voltage Fig 1. Normalized drain-source on-state resistance factor as a function of junction temperature 2 R DSon (mω) 15 V GS (V) = 5.2 3aab V DS I D 7 V GS(pl) V GS(th) V GS 5 Q GS1 Q GS2 Q GS Q GD Q G(tot) I D (A) 3aaa58 Fig 11. Drain-source on-state resistance as a function of drain current; typical values Fig 12. Gate charge waveform definitions All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December 21 7 of 13
9 1 V GS (V) 8 I D = 25 A T j = 25 C 3aab C (pf) 3aab V V DS = 19 V C iss 2 C oss Q G (nc) C rss V DS (V) 1 2 Fig 13. Gate-source voltage as a function of gate charge; typical values Fig 14. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values 8 3aab289 I S (A) C T j = 25 C V SD (V) Fig 15. Source current as a function of source-drain voltage; typical values All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December 21 8 of 13
10 7. Package outline Plastic single-ended package (IPAK); 3 leads (in-line) SOT533 E A E 1 A 1 D 1 mounting base D 2 L 1 Q L e 1 b w M c e mm scale DIMENSIONS (mm are the original dimensions) UNIT A A 1 b c D D2 E E e e L (2) L 1 max Q w mm BSC (1) BSC (1) Notes 1. Basic spacing between centers. 2. Terminal dimensions are uncontrolled within zone L 1. OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE SOT533 TO Fig 16. Package outline SOT533 (IPAK) All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December 21 9 of 13
11 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes v Product data sheet - PHD_ v.1 Modifications: Type number separated from data sheet PHD_ v.1. Various changes to content. PHD_ v Product data sheet - - All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December 21 1 of 13
12 9. Legal information 9.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between and its customer, unless and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the product is deemed to offer functions and qualities beyond those described in the Product data sheet. 9.3 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. In no event shall be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of. Right to make changes reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an product can reasonably be expected to result in personal injury, death or severe property or environmental damage. accepts no liability for inclusion and/or use of products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications Applications that are described herein for any of these products are for illustrative purposes only. makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using products, and accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 6134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale products are sold subject to the general terms and conditions of commercial sale, as published at unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December of 13
13 agreement shall apply. hereby expressly objects to applying the customer s general terms and conditions with regard to the purchase of products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. Non-automotive qualified products Unless this data sheet expressly states that this specific product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond specifications such use shall be solely at customer s own risk, and (c) customer fully indemnifies for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond standard warranty and product specifications. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE are trademarks of NXP B.V. HD Radio and HD Radio logo are trademarks of ibiquity Digital Corporation. 1. Contact information For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. NXP B.V. 21. All rights reserved. Product data sheet Rev December of 13
14 11. Contents 1 Product profile General description Features and benefits Applications Quick reference data Pinning information Ordering information Limiting values Thermal characteristics Characteristics Package outline Revision history Legal information Data sheet status Definitions Disclaimers Trademarks Contact information Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP B.V. 21. All rights reserved. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 21 December 21 Document identifier:
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