IC - S O Single Interface Transformer Selection Guide

Transcription

1 - S O Single Interface Transformer Selection Guide Talema manufactures a wide range of transformers for all S O ISDN applications. complete listing of transceiver s with recommended Talema transformers is listed on the following cross reference chart. Performance has been proven in the many designin s of our products in these applications. Quality and consistency is guaranteed through 00% testing of the specified parameters for Primary Inductance, Leakage Inductance, Turns Ratio, DC resistance and Interwinding Capacitance. This ensures that the Return Loss and Pulse Waveshape requirements for S-Interface can be met. dditionally, all parts are tested for 00V minimum isolation. Standard Packaging: SMD styles - Tape and Reel; TH T styles - nti Static tubes. Manufacturer lcatel Micro Cologne Chip Legerity (MD) Lucent ISDN - SO Interface Transformer Cross Reference Guide MTC0, MTC0, MTC0 MTC0, MTC0 HFC-Sxxx Series Flat ISF-0 ISF-0 ISF-0 ISF-0 Through Hole Vertical ISV-0 ISV-0 ISV-0 ISV-0 Talema part Number kv Flat Miniature ISHF-0 ISHF-0 ISHF-0 ISHF-0 MC, MC ISF-0 ISV-0 ISHF-0 T, T0, T, T, T, T, T0, 000 T0, T0 Mietec MTC-0 Mitel MT, MT Motorola National TP0, TP NEC D0 SGS ST0, ST Infineon ISF- ISV- ISHF- ISF-0 ISF-0 ISF-0 ISF-0 ISF-0 ISF-0 ISV-0 ISV-0 ISV-0 ISV-0 ISV-0 ISV-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 MC, ISF-00 ISV-00 ISHF-00 MC ISF- ISV- ISHF- PE000, PEF0, 0 PEF,,, PEF0, 0 PE/PEF, PS/PSF, 0 PS,, VLSI VNS0000 Yahama YM0 Zarlink MT/ ISF-0 ISF-0 ISF-0 ISF-0 ISF-0 ISF-0 ISF-0 ISF-0 ISV-0 ISV-0 ISV-0 ISV-0 ISV-0 ISV-0 ISV-0 ISV-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 ISF-00 ISV-00 ISHF-00 ISF-0 ISF-0 ISF-0 ISF-0 ISF-0 ISF-0 ISV-0 ISV-0 ISV-0 ISV-0 ISV-0 ISV-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 ISHF-0 ISJ-0 ISJ-0D ISJ-0 ISJ-0D ISJ-0 ISJ-0D ISJ-0 ISJ-0D ISJ-0 ISJ-0D ISJ-0 ISJ-0D ISJ-00 ISJ-00D ISJ-0 ISJ-0D ISJ-0 ISJ-0D ISJ-0 ISJ-0D ISJ-0 ISJ-0D ISJ-00 ISJ-00D ISJ-0 ISJ-0D ISJ-0 ISJ-0D ISJ-0 ISJ-0D Compact SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ- SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-00 SMJ- SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-00 SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-0 SMJ-0 Surface Mount Standard THE TLEM GROUP Magnetic Components for ISDN / xdsl / LN Data Communications kv SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-0 SWJ-0C SWJ- SWJ-D SHJ-0 SHJ-0C SHJ- SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-00 SWJ-00C SWJ- SWJ-D SHJ-00 SHJ-00C SHJ- SHJ-C SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-00 SWJ-00C SHJ-00 SHJ-00C SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C SWJ-0 SHJ-0 SWJ-0C SHJ-0 or C

2 ISDN - S O SMD Single Interface Transformers designed for optimum compatability with all established interface s compact sizes in through-hole and surface mount packages complies fully with CCITT.I. recommendations and corresponding national standards for S-Interface manufactured in ISO-00:000, TS-:00 and ISO-00:00 certified Talema facility J-STD-00C operating temperature: 0 to C Electrical C Turns Ratio: old = side windings ISJ, SMJ & SWJ SMD Series comply with asic Insulation Level EN00, UL0 and UL0 Test Conditions: Inductance: side windings in series - 0kHz, 00mV Coupling capcitance: side windings in series to side windings in series - 00mV Leakage Inductance: side windings in series, side windings short circuited - 00kHz, 00mV Test Voltage: kv for Sec. - side windings in series to side windings in series. Standard Packaging: Tape and Reel ISJ L P (mh min) Turns Ratio L L ) (μh ^I D C (m) C C (pf Max) P S V P (Vrms) ISJ-00 : ISJ-0 : SMJ-00 : SMJ-0!:: SMJ-,:, SMJ-0 : SWJ-00 or C /: / / C SWJ- /:,/, SWJ-0 or C /: / / C SHJ Series Interface Transformers comply with Reinforced Insulation Level EN00 and UL0 ** SHJ-00, C or D : 0 00 /C/ D SHJ SHJ-, C or D,:, /C/ D SHJ-0, C or D : /C/ D 0 (.0) (.) x 00 ( x ) 0 (.0) (.0) 0 x 0 (0 x 0) ISJ- 00 Wk/Yr (.0) Suggested Pad Layout (00) (.00) x 00 ( x ) 0 (0) Surface Coplanarity will be 00(0) Tolerance: ±00 () unless specified otherwise THE TLEM GROUP Magnetic Components for Universal pplications

3 Packaging and Dimensions S O Chip Style SMD Single Interface Transformers Tolerance: ±00 () unless specified otherwise Surface Coplanarity will be 00(0) maximum Package Style SMJ (.00) (.00) TLEM IN WK/YR 0 (.) (00) 00 (.) 0-0 (.00) 0 (.0) Suggested Pad Layout 0 (.) 0 (0) (.0) (.0) 00 x (0 x ) SHJ & SWJ Suggested Pad Layout 0 00 () (.0) (.00) (0) (0) TLEM IN WK/YR 00 (.0) 00 () 0 (.0) 00 (.) 00 x (0 x ) 0-0 (.00) 0 (.0) 0 (0) C D Eastern Europe & Czech Republic NT MGNETS s.r.o. Chebská 00 Plzeñ Tel: Int Fax: Int talema@talema.cz Web Site: Sales & Marketing, Design and Manufacturing Facilities Germany TLEM ELEKTRONIK GMH Sembdnerstr., Postfach 0 Germering Tel: Int Fax: Int info@talema.de Ireland NUVOTEM TEO. Crolly Co. Donegal Tel: Int. + - Fax: Int info@nuvotem.com India TLEM ELECTRON PVT. LTD. Opposite the SIDCO Industrial Estate Gins Towers /S.H/, Omalur Main Road Salem - 00, Tamil Nadu Tel: Int. + - Fax: Int talema@talemaindia.com Web Site: THE TLEM GROUP Magnetic Components for ISDN / xdsl / LN Data Communications

4 ISDN S O DIL Style Through Hole Interface Transformers designed for optimum compatability with all established interface s complies fully with CCITT.I. recommendations and corresponding national standards for S-Interface manufactured in ISO-00:000, TS-:00 and ISO-00:00 certified Talema facility J-STD-00C operating temperature: 0 to C Electrical C Turns Ratio: old = side windings ISF & ISV Series comply with Supplementry Insulation Level EN00, UL0 and UL0 L P (mh Min) Turns Ratio L L ) (μh ^I D C (m) C C (pf Max) P S V P (Vrms) ISF / ISV-00 : ISF / ISV ISF / ISV-,:, ISF / ISV-0 : ISHF Series Interface Transformers comply with Reinforced Insulation Level EN00-:00 ISHF-00 : ISHF ISHF-,:,.. 00 ISHF-0 :.. 00 Package Style ISF 00 (.0) () (.00) 00 (.0) 0 (00) 0 (0) (.0) (.) 0 x 0 ( x ) ISV (.00) 0 (.) (.0) 0 (0) (.0) 00 (.00) () (.) 0 0 x 0 ( x ) ISHF (.0) (.00) (.0) (.0) (.00) (.0) 0 (.00) (.0) 0 (0) Tolerance: ±00 () unless specified otherwise Germany: Int Ireland: Int.+ - Czech Rep: Int.+0 - India: Int.+ -

5 - S O Interface Module Selection Guide Talema manufactures a wide range of signal transformers for all S O ISDN applications. Space saving modules, available in through hole and surface mount packages, offer a cost effective alternative to individual transformers and chokes and are compatible with all common s. complete listing of transceiver s with recommended Talema transformer modules is listed on the following cross reference chart. Performance has been proven in the many design-in s of our products in these applications. Quality and consistency is guaranteed through 00% testing of the specified parameters for Primary Inductance, Leakage Inductance, Turns Ratio, DC resistance and Interwinding Capacitance. This ensures that the Return Loss and Pulse Waveshape requirements for S-Interface can be met. dditionally, all parts are tested for 00V minimum isolation. Standard Packaging: SMD styles - Tape and Reel; TH styles - nti Static tubes. Manufacturer ISDN - SO Interface Module Cross Reference Guide lcatel Micro MTC0, MTC0, MTC0 Cologne Chip Legerity (MD) Lucent Vertical Mount DIL IEC 0 pproved HVM-0 HVM-0C Standard ISM-0 ISM-0C Talema IEC 0 Reinforced Insulation MHJ-0 HFC-Sxxx Series HVM0C ISM-0C MHJ-0 MC, MC HVM-0 HVM-0C ISM-0 ISM-0C MHJ-0 T, T0, T, T, T HVM-C ISM-C MHJ- T0, T0 Mietec MTC-0 Mitel MT, MT Motorola National TP0, TP NEC D0 SGS ST0, ST Infineon HVM-0 HVM-0C HVM-0 HVM-0C HVM-0 HVM-0C ISM-0 ISM-0C ISM-0 ISM-0C ISM-0 ISM-0C MHJ-0 MHJ-0 MHJ-0 MC, MC HVM-00C ISM-00C MHJ-00 MC HVM-C ISM-C MHJ- PE00, 0, 0, 0, 0 PS, PS PE00, 0, 0, PE(V), PE(V) PS(.V), PS, PS PS(.V), PE, PS VLSI VNS000 Yahama YN0 HVM-0 HVM-0C HVM-0 HVM-0C HVM-0 HVM-0C HVM-0 HVM-0C HVM-0 HVM-0C ISM-0 ISM-0C ISM-0 ISM-0C ISM-0 ISM-0C ISM-0 ISM-0C ISM-0 ISM-0C MHJ-0 MHJ-0 MHJ-0 MHJ-0 MHJ-0 HVM-00C ISM-00C MHJ-00 HVM-0 HVM-0C HVM-0 HVM-0C ISM-0 ISM-0C ISM-0 ISM-0C MHJ-0 MHJ-0 Surface Mount Standard/ Compact MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-00 MJ-00 MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-0 MJ-0 MSJ-00 MJ-00 MSJ-0 MJ-0 MSJ-0 MJ-0 Miniature MUJ-0 MUJ-0 MUJ-0 MUJ-0 MUJ-0 MUJ-0 MUJ-0 MUJ-00 MUJ-0 MUJ-0 MUJ-0 MUJ-0 MUJ-0 MUJ-0 MUJ-00 MUJ-0 MUJ-0 Germany: Int Ireland: Int.+ - Czech Rep: Int.+0 - India: Int.+ -

6 ISDN S O Miniature SMD Interface Modules excellent output characteristics ensure compliance with CCITT.I. pulse waveform template when used with recommended pairing SMD modules are designed for pick and place compatability modular design maximizes suppression effectivity and transmission properties full compatibility with all common 's manufactured in ISO-00:000, TS-:00 and ISO-00:00 certified Talema facility J-STD-00C operating temperature: -0 to C storage temperature: -0 to + C Electrical C Turns Ratio: old = side windings Test Conditions: Polarity and Turns Ratio: ±% Inductance: mh minimum, line side windings in 0kHz, 00mV Leakage Inductance: side windings in series, side windings short circuited - 00kHz, 00mV Coupling capacitance: side windings in series to side windings in 0kHz, 00mV Common Mode Choke Inductance: 00kHz, 0mV Test Voltage: kv for Sec. - side windings in series to side windings in series Standard Packaging: Tape and Reel MUJ Miniature Module (.0) Miniature Chip SMD Modules comply with asic Insulation Level EN00, UL0 and UL (.0) 0 () TLEM IN WK/YR 0 (.) 0 (.0) L P (mh Min) Surface Coplanarity will be 00 (0) Tolerance: ±00 () unless specified otherwise 0 - Turns Ratio Suggested Pad Layout 00 () (0) 0 (.00) L L (μh Max) 0 (.) C C (pf Max) 0 (0) P S V P ) (Vrms (Without Choke) s - With Choke 0 MUJ-00 or -XXX : or MUJ-0 or -XXX : or MUJ-0 or -XXX.: or asic P/N + Suffix MUJ Common Mode Choke L N) R C U asic P/N + Suffix ( μh ( Ohms) No Choke MUJ R C U asic P/N + Suffix ( Ohms) No Choke MUJ R U C ) (Ohms No Choke MUJ-00 or MUJ-0 or -00 MUJ-0 or -00 MUJ-00 or MUJ-0 or -0 MUJ-0 or -0 MUJ-00 or MUJ-0 or -0 MUJ-0 or -0 MUJ-00 or MUJ-0 or -0 MUJ-0 or -0 (.00) (.0) Pins: 0x0 (0 x 0) 0 0 THE TLEM GROUP Magnetic Components for ISDN / xdsl / LN Data Communications

7 ISDN S O Miniature SMD Interface Modules excellent output characteristics ensure compliance with CCITT.I. pulse waveform template when used with recommended pairing SMD modules are designed for pick and place compatability modular design maximizes suppression effectivity and transmission properties full compatibility with all common 's manufactured in ISO-00:000, TS-:00 and ISO-00:00 certified Talema facility J-STD-00C operating temperature: -0 to C storage temperature: -0 to + C Electrical C Turns Ratio: old = side windings Miniature Chip SMD Modules comply with asic Insulation Level EN00, UL0 and UL L P (mh Min) Turns Ratio L L (μh Max) C C (pf Max) P S V P ) (Vrms MMJ-00 or -XXX : or MMJ-0 or -XXX : or MMJ-0 or -XXX.: or asic P/N + Suffix MMJ Common Mode Choke L N) R C U asic P/N + Suffix ( μh ( Ohms) No Choke MMJ R C U asic P/N + Suffix ( Ohms) No Choke MMJ R U C ) (Ohms No Choke MMJ-00 or MMJ-0 or -00 MMJ-0 or -00 MMJ-00 or MMJ-0 or -0 MMJ-0 or -0 MMJ-00 or MMJ-0 or -0 MMJ-0 or -0 MMJ-00 or MMJ-0 or -0 MMJ-0 or -0 Test Conditions: Polarity and Turns Ratio: ±% Inductance: mh minimum, line side windings in 0kHz, 00mV Leakage Inductance: side windings in series, side windings short circuited - 00kHz, 00mV Coupling capacitance: side windings in series to side windings in 0kHz, 00mV Common Mode Choke Inductance: 00kHz, 0mV Test Voltage: kv for Sec. - side windings in series to side windings in series (Without Choke) Standard Packaging: Tape and Reel MMJ Miniature Module (.0) (.0) (.0) 0 () (.0) TLEM IN WK/YR 0 (.) (0) Pins: 0 x 0 (0 x 0) Surface Coplanarity will be 00 (0) Tolerance: ±00 () unless specified otherwise 0 - Suggested Pad Layout 00 () (0) 0 (.00) 0 (.) 0 () s - With Choke Germany: Int Ireland: Int.+ - Czech Rep: Int.+0 - India: Int

8 ISDN S O Compact SMD Interface Modules excellent output characteristics ensure compliance with CCITT.I. pulse waveform template when used with recommended pairing SMD modules are designed for pick and place compatability modular design maximizes suppression effectivity and transmission properties full compatibility with all common 's manufactured in ISO-00:000, TS-:00 and ISO-00:00 certified Talema facility J-STD-00C operating temperature: -0 to C storage temperature: -0 to + C Electrical C Turns Ratio: old = side windings Compact SMD Modules comply with asic Insulation Level EN00, UL0 and UL L P (mh Min) Turns Ratio L L (μh Max) ^I C D C C P ( m) ( pf Max) S V P ( Vrms) MJ-00-XXX : 0 00 MJ-0-XXX : MJ-0-XXX.: MJ-00-XXX- : 0 00 MJ-0-XXX- : MJ-0-XXX-.: Common Mode Choke asic P/N + Suffix (Example: MJ-0-0 L N (μh) -000 No Choke R U C ) (Ohms Test Conditions: Polarity and Turns Ratio: ±% Inductance: mh minimum, line side windings in 0kHz,00mV Leakage Inductance: side windings in series, side windings short 00kHz, 00mV Coupling Capacitance: side windings in series to side windings in 0kHz, 00mV Common Mode Choke Inductance: 00kHz, 0mV Test Voltage: kv for Sec. - side windings in series to side windings in series Standard Packaging: Tape and Reel MJ Compact Chip Module Suggested Pad Layout (.00) (.00) (.00) 0 () (.0) TLEM IN WK/YR x 00 (,) (00) 00 x (0 x ) Surface Coplanarity will be 00(0) maximum 0-00 (.) (.00) (.0) 00 (.) 0 (0) 0 Tolerance: ±00 () unless specified otherwise Germany: Int Ireland: Int.+ - Czech Rep: Int.+0 - India: Int.+ -

9 ISDN S O Miniature SMD Interface Modules excellent output characteristics ensure compliance with CCITT.I. pulse waveform template when used with recommended pairing SMD modules are designed for pick and place compatability modular design maximizes suppression effectivity and transmission properties full compatibility with all common 's manufactured in ISO-00:000, TS-:00 and ISO-00:00 certified Talema facility J-STD-00C operating temperature: -0 to C storage temperature: -0 to + C Electrical C Turns Ratio: old = side windings Compact SMD Modules comply with asic Insulation Level EN00, UL0 and UL L P (mh Min) Turns Ratio L L (μh Max) ^I C D C C P ( m) ( pf Max) S V P ( Vrms) MSJ-00-XXX : MSJ-0-XXX : MSJ-0-XXX.: Common Mode Choke asic P/N + Suffix (Example: MSJ-0-0 L N (μh) -000 No Choke R U C ) (Ohms Test Conditions: Polarity and Turns Ratio: ±% Inductance: mh minimum, line side windings in 0kHz,00mV Leakage Inductance: side windings in series, side windings short 00kHz, 00mV Coupling Capacitance: side windings in series to side windings in 0kHz, 00mV Common Mode Choke Inductance: 00kHz, 0mV Test Voltage: kv for Sec. - side windings in series to side windings in series Standard Packaging: Tape and Reel MSJ Module Suggested Pad Layout (.00) (.0) (.) TLEM IN WK/YR x 00 (.) (.00) 0-00 (.) (.00) (00) 0 (0) (.00) (.0) 00 x (0 x ) 00 (.) 0 Surface Coplanarity will be 00(0) maximum Tolerance: ±00 () unless specified otherwise THE TLEM GROUP Magnetic Components for ISDN / xdsl / LN Data Communications

10 MHJ Series S O kv Interface Transformer Modules excellent output characteristics ensure compliance with CCITT.I. pulse waveform template when used with recommended pairing SMD modules are designed for pick and place compatability modular design maximizes suppression effectivity and transmission properties full compatibility with all common 's manufactured in ISO-00:000, TS-:00 and ISO-00:00 certified Talema facility J-STD-00C operating temperature: -0 to C storage temperature: -0 to + C Electrical C Turns Ratio: old = side windings kv Modules comply with Reinforced Insulation Level EN00 L P (mh Min) Turns Ratio ±% L L (μh Max) ^I C D C C P ( m) ( pf Max) S V P ( Vrms) MHJ-00-XXX : 0 00 MHJ-0-XXX : MHJ--XXX.: Common Mode Quad Choke asic P/N + Suffix (Example: MHJ-0-0 L N (μh) -000 No Choke R U C ) (Ohms Test Conditions: Polarity and Turns Ratio: w : w : w : w ±%. Inductance: mh Minimum, line side windings (w+w) in 0kHz, 00mV. Leakage Inductance: 0μH 00kHz, 00mV. Quad Choke Inductance: 00kHz, 0mV. Winding Capacitance: C W 0pF Max. (w+w). Coupling Capacitance: C C pf Max. (w+w to 0kHz, 00mV. High Voltage Test: kv, minute U(w+w to w+w) High Voltage Pulse Test: U PULSE (w+w to w+w); 0kV OP for,μs/0μs wave form U PULSE (w+w to w+w); 0kV OP for 0μs/00μs wave form S O Transformer modules comply with Reinforced Insulation Level EN00:/:, para.... when tested in accordance with.. MHJ Module Suggested Pad Layout (.) (0) (.0) (.) (.) TLEM IN WK/YR 00 (0) x 00 (,) (.00) 0 - (.) 00 (.) 0 (.) 00 (.) 0 (0) W W W W W W W 0 W Pins - 0 x 00 ( x ) Surface Coplanarity will be 00(0) maximum Tolerance: ±00 () unless specified otherwise Germany: Int Ireland: Int.+ - Czech Rep: Int.+0 - India: Int.+ -

11 ISDN S O THT Interface Modules excellent output characteristics ensures compliance with CCITT.I. pulse waveform template when used with recommended pairing modular design maximizes suppression effectivity and transmission properties full compatibility with all common 's HMV Series approved to IEC0 (see note at bottom of chart) manufactured in ISO-00:000, TS-:00 and ISO-00:00 certified Talema facility J-STD-00C operating temperature: -0 to C storage temperature: -0 to + C Electrical C Turns Ratio: old = side windings ISM Series DIL Modules comply with Supplementary Insulation Level EN00, UL0 and UL L P Turns L L ^I DC C C P S V P ( mh Min) R atio ( μh Max) ( m) ( pf Max) ( Ohms) ( Ohms) (Vrms) ISM-00C-XXX /: / C ISM-0-XXX /: ISM-C-XXX /:./ C ISM-0C-XXX /: / C HVM Series DIL Modules are pproved to IEC0 - Supplementry Insulation Level HVM-00C-0 /: / C HVM-0-0 /: HVM-C-0 /:./ C HVM-0C-0 /: / C Common Mode Quad asic P/N + Suffix (Example: ISM-00C-0) Choke L N) R C U ( μh -000 No Choke Note: The HVM Series with a mh quad choke is approved to IEC0 Supplementary Insulation level for connection between SELV and TNV in systems which have a rated mains supply of 0Vrms to earth (Certificate Nr. NL). Other choke inductances also available. Standard Packaging: nti-static tubes ISM & HVM THT Modules 0 00 x 00 (0, x 0,) 0 (.00) x 00 (,) 0 (.) (0,0) 0 (0) (.0) ±00 (,0 ±0,0) C Tolerance: ±00 () unless specified otherwise 0 THE TLEM GROUP Magnetic Components for ISDN / xdsl / LN Data Communications

12 Tape & Reel Packaging and Dimensions E±0 P±0 P0±0 Dimensions for Carrier Tape (Unit : mm) + D0-0 D T±0 W± F±0 0±0 S0±0 P±0 0±0 K0±0 Section - Type Dimensions in mm W F E P P 0 D 0 D P 0 0 S 0 T K 0 Reel Size Quantity (Pcs/Reel) Quantity (Reel/Cased) SWJ Ø Ø x 00 /000 SHJ Ø Ø x 00 /000 MJ Ø Ø x 0 /0 MSJ Ø Ø x 0 /0 MHJ Ø Ø x 0 /0 E±0 P±0 P0±0 D0 + D -0 T±0 W± F±0 0±0 P±0 0±0 K0±0 Section - Type Dimensions in mm W F E P P 0 D 0 D P 0 0 T K 0 Reel Size Quantity (Pcs/Reel) Quantity (Reel/Cased) ISJ Ø0 Ø x 000 /0000 SMJ Ø0 Ø x 00 /000 MUJ Ø0 Ø x 00 /00 MMJ Ø0 Ø x 00 /00 THE TLEM GROUP Magnetic Components for Universal pplications

13 Tape & Reel Packaging and Dimensions Reel Dimensions (Unit : mm) N C Reel Dimensions in mm Type C N x 00 x 00 x 00 END TLEM IN IN Wk/Yr M/Y MMJ-00-0 TLEM IN IN Wk/Yr M/Y MMJ-00-0 IN TLEM IN M/Y Wk/Yr MMJ-00-0 STRT lank Components lank Min. 0mm Min. 00mm Drawing direction Inner Carton Outer Carton 0 THE TLEM GROUP Magnetic Components for Universal pplications

14 Tube Packaging and Dimensions Dimensions for Tube (Unit : mm) C G Outer Carton D F E Type Packing Tube Outer Dimensions (in mm) C D E F G Quantity (Pcs/Tube) Quantity (Tube/ Carton) ISV /,0 ISHF /,0 ISM /,0 HVM /,0 Eastern Europe & Czech Republic NT MGNETS s.r.o. Chebská 00 Plzeñ Tel: Int Fax: Int talema@talema.cz Web Site: Sales & Marketing, Design and Manufacturing Facilities Germany TLEM ELEKTRONIK GMH Sembdnerstr., Postfach 0 Germering Tel: Int Fax: Int info@talema.de Ireland NUVOTEM TEO. Crolly Co. Donegal Tel: Int. + - Fax: Int info@nuvotem.com India TLEM ELECTRON PVT. LTD. Opposite the SIDCO Industrial Estate Gins Towers /S.H/, Omalur Main Road Salem - 00, Tamil Nadu Tel: Int. + - Fax: Int talema@talemaindia.com Web Site: Germany: Int Ireland: Int.+ - Czech Rep: Int.+0 - India: Int (0-0) Communications\ISDN\So Transformers