Maintenance/ Discontinued

Transcription

1 DT SHEET Part No. Package Code No. N446 HSOP4-P-4D Publication date: March 4 SFEB

2 N446 Contents Features.. 3 Block Diagram Pin Descriptions. bsolute Maximum Ratings. 6 Recommended Operating Range... 7 Electrical Characteristics. 8 Test Circuit Diagram... Electrical Characteristics Test Procedures..... Test Circuit Diagram Electrical Characteristics Test Procedures Test Circuit Diagram Electrical Characteristics Test Procedures Test Circuit Diagram 4.. Terminal Equivalent Circuits. Usage Notes.. 3 SFEB

3 N446 N446 IC for Stepping Motor Drives Function 4-phase input (W - and -phase excitation enabled; exclusive OR function incorporated for simultaneous-on prevention) Built-in CR chopping (with frequency fixed) Built-in thermal protection circuit Built-in - power supply SFEB 3

4 N446 Block Diagram PHB IN IN3 ENBLEB. µf ENBLE PH IN IN kω PHB ENBLEB IN3 IN REFB REF IN IN PH kω BC BC ENBLE REG 9 3 FIN Sensor Current OSC BLNK Sensor Current Booster R R Q S S Q ref ref EN. OFF GTE CIRCUIT TSD signal GTE CIRCUIT Reg. M BOUT RCSB M Rs Rs BOUT OUT RCS OUT. µf M FIN 4 3 PUMP. µf 4. µf 47 µf Note) : Recommendable values are shown in the diagram. SFEB 4

5 N446 Pin Descriptions Pin No. Function Pin No. Function PH PHB IN IN IN IN3 ENBLE M ENBLEB BOUT RCSB BOUT OUT Phase phase selection input Phase B phase selection input Phase output torque control Phase output torque control Phase B output torque control Phase B output torque control Phase start/stop signal input Motor power supply Phase B start/stop signal input Phase B motor drive output Phase B current detection Phase B motor drive output Phase motor drive output FIN RCS OUT BC BC PUMP M REF REFB REG Phase current detection Phase motor drive output Booster capacitor connection Booster capacitor connection Boost circuit output Motor power supply Phase torque reference voltage input Phase B torque reference voltage input Internal reference voltage (- output) Signal ground Signal ground SFEB

6 N446 bsolute Maximum Ratings bsolute Maximum Ratings No. Parameter Symbol Rating Unit Note Storage temperature Operating ambient temperature T opr - to +7 3 Operating ambient atmospheric pressure P opr 4 Operating constant gravity G opr M.3 ±.6 Operating shock S opr 49 Supply voltage T stg - to + C C Pa m/s m/s T Power dissipation P D W a = C.4 Notes) : Except for the storage temperature, operating ambient temperature, and power dissipation all ratings are for T a = C. 3 SFEB 6

7 N446 bsolute Maximum Ratings bsolute Maximum Ratings No. 8 9 Output pin voltage Motor drive current Flywheel diode current Boost circuit output voltage oltage applied to the pins Recommended Operating Range Operating supply voltage range Parameter Symbol Rating Unit Pin No. OUT I OUT I f PUMP PH, PHB, IN, IN, IN, IN3, ENBLE, ENBLEB M , 7, 4,, to 8., 4,, 7, 4,, 7,, 3, 4,, 6, 7, 9 Note) : Do not apply current or voltage from outside to any pin not listed above. In the circuit current, (+) means the current flowing into IC and (-) means the current flowing out of IC. SFEB 7

8 N446 Electrical Characteristics B Electrical Characteristics (T a = C ± C unless otherwise specified) No. 3 4 [Power Block] I = -. I =. I =. Conditions Limits Min Typ Max I M ENBLE = ENBLEB = m Parameter High-level output saturation voltage Low-level output saturation voltage Flywheel diode forward voltage Output leakage current Supply current (with two circuits turned on) [I/O Block] High-level IN input voltage Low-level IN input voltage High-level IN input current Low-level IN input current High-level PH/PHB input voltage Low-level PH/PHB input voltage High-level PH/PHB input current Low-level PH/PHB input current Symbol OH OL DI I LEK Test Circuit OUT = 3, RCS = IN=IN=IN=IN3= IN=IN=IN=IN3= PH = PHB = PH = PHB = M REG M INH INL I INH I INL PHH PHBH PHL PHBL I PHH I PHBH I PHL I PHBL.. - CC.6 - Unit µ µ µ µ µ Note Note) : M = 4 unless otherwise specified. SFEB 8

9 N446 Electrical Characteristics B Electrical Characteristics (T a = C ± C unless otherwise specified) No Parameter High-level ENBLE/ ENBLEB input voltage Low-level ENBLE/ ENBLEB input voltage High-level ENBLE/ ENBLEB input current Low-level ENBLE/ ENBLEB input current [Torque Control Block] Input bias current PWM frequency IN = IN = Cmp threshold H (%) T H IN = IN3 = Cmp threshold C (67%) Cmp threshold L (33%) T C T L IN =, IN = IN =, IN3 = IN =, IN = IN =, IN3 = 回路 Pulse blanking time REF = REFB =.. 3. µs [Reference oltage Block] Symbol ENBLEH ENBLEBH ENBLEL ENBLEBL I ENBLEH I ENBLEBH I ENBLEL I ENBLEBL I REF I REFB f PWM T B Test Circuit Conditions. REG.6 ENBLE = ENBLEB = - ENBLE = ENBLEB = REF = REFB = Min Typ Max Reference voltage REG M = Output impedance Z REG M = 4, I SREG = - m 8 Ω 67 Limits Unit µ µ µ khz Note SFEB 9

10 N446 Electrical Characteristics B Electrical Characteristics (T a = C ± C unless otherwise specified) No [Output Block] Output sleue rate Output sleue rate Dead time Parameter [Thermal Protection] Thermal protection operating temperature Thermal protection hysteresis width Symbol T r T f T D TSD on Test Circuit Conditions Rising edge Falling edge TSD Note) : The characteristics listed above are reference values based on the IC design and not guaranteed. Limits Min Typ Max 4 /µs Unit /µs µs C C Note SFEB

11 N446 Test Circuit Diagram Test Circuit FIN I PH PH PHB IN REG IN SREFB I REFB REFB IN SREF REF IN3 I REF M N446 ENBLE M FIN PUMP M BC ENBLEB BC OUT BOUT I PHB I SREG REG I IN SPH SPHB SIN I IN SIN. µf I IN SIN I IN3 SIN3 SEN I EN S7. µf SENB I ENB S6 3. µf I S8 S SB I B S 3 kω RCS RCSB B kω kω S4 S OUT BOUT 4 SRCS SRCSB kω S I S I RCS RCSB B I B 3 S I SB S3 3 B SFEB

12 N446 Electrical Characteristics Test Procedures No. 4 Test Circuit Testing Conditions Measuring Pin 4 4, 7 4, 9, 3, 7, 8,,,, 3, 4,, 6, 7, 9, 3, 4,, S /S4 Relay Conditions S /S S3 /S6 S7,, 3, 4, 8,, 6, 6, 7, 9 6, 7, 3 3,, 3 3 4,, 4,, , 3 3, 3 3 3, S8 OFF OFF OFF ON ON ON ON ON ON ON ON ON SPH / SPHB SIN / SIN SIN / SIN3 oltage Conditions SEN / SENB SRCS / SRCSB Ground through kω Ground Ground Ground Ground Ground through through through through through kω kω kω kω kω S/ SB 3 Load R Load R Load R S/ SB 3 Load R Load R Load R I S /I SB 3m 3m M SREF / SREFB I SREG -m SFEB

13 N446 Electrical Characteristics Test Procedures 6. High-level IN input voltage INH 7. Low-level IN input voltage INL / B 4 Measuring Pin OUT / BOUT OUT / BOUT Region SPEC INL.6 SPH / SPHB.... Region B. INH oltage Conditions IN / IN.6... SPEC IN / IN SIN. High-level PH/PHB input voltage PHH, PHBH. Low-level PH/PHB input voltage PHL, PHBL / B 4 4 / B SPEC SPEC Low High High Low.6. SPEC SPEC SPH / SPHB SPH / SPHB Check the conditions by measuring the OUT voltage with the input voltage set to high level and low level respectively. Region : Power transistor on the flow-in side turned on. Region B : Power transistor on the flow-in side turned off. The power transistor on the flow-out side is turned off in the above regions. Status OUT/BOUT = OUT/BOUT = 4 OUT/BOUT = OUT/BOUT = 4 Check the conditions by measuring the OUT/BOUT voltage and OUT/BOUT voltage with the input voltage set to high level and low level respectively. Measuring Pin oltage Conditions SPH / SPHB Status OUT / BOUT OUT / BOUT.6.6 Low-level output High-level output OUT / BOUT. High-level output OUT / BOUT. Low-level output SFEB 3

14 N446 Electrical Characteristics Test Procedures 4. High-level ENBLE/ENBLEB input voltage ENBLEH, ENBLEBH. Low-level ENBLE/ENBLEB input voltage ENBLEL, ENBLEBL ( B ) 4 Region SPEC ENL.6 Region B. SPEC ENH SEN / SENB Check that the threshold voltage is in the specification range (SPEC) under the following condition. SPH = SPHB = SEN / SENB.6. OUT / BOUT 4 Region : Power transistor on the flow-in side turned on. Region B: Power transistor on the flow-in side turned off. The power transistor on the flow-out side is turned off in the above regions. SFEB 4

15 N446 Electrical Characteristics Test Procedures. Comp threshold H TH. Comp threshold C TC 3. Comp threshold L TL Symbol TH TC TL ( B) 4 Measuring Pin Region OUT / BOUT OUT / BOUT OUT / BOUT Region B RCS / RCSB oltage Conditions SPH / SPHB SIN / SIN SIN / SIN3. Output impedance Z REG REG Perform RCS voltage sweeping and measure the threshold voltages on the output pins respectively. Region : lways high-level output Region B: High-level output with the duty kept to a minimum Measurement Conditions Measure the OUT / BOUT threshold voltage. Measure the OUT / BOUT threshold voltage. Measure the OUT / BOUT threshold voltage. B Z REG = - B m m - m I SREG SFEB

16 N446 Test Circuit Diagram Test Circuit PH FIN PH PHB IN IN IN IN3 N446 ENBLE FIN M ENBLEB OUT BOUT PHB REG. µf REFB M 4 REF M 47 µf. µf PUMP. µf BC BC Ω.39 Ω RCS RCSB RCS RCSB.39 Ω 33 µh OUT BOUT 4 Ω 33 µh SFEB 6

17 N446 Electrical Characteristics Test Procedures 9. PWM frequency t PWM. Pulse blanking time T B These values are obtained from the RCS and RCSB voltages with both PH and PHB set to and respectively under the following condition. REF = REFB = The RCS / RCSB output waveform is shown below. RCS / RCSB output waveform m T B t PWM T B t [µs] PWM frequency t PWM Measure the cycle time of output voltage pulses and obtain the value from the following formula. f PWM = Pulse blanking time t PWM T B Measure the high-level time of RCS voltage output. SFEB 7

18 N446 Test Circuit Diagram 3 Test Circuit 3 PH FIN PH PHB IN IN IN IN3 N446 ENBLE FIN M ENBLEB BOUT PHB REG REFB 4. µf SREF = SREFB = REF M M I IN. µf PUMP S µf BC BC B OUT RCS RCSB B OUT BOUT 4 SFEB 8

19 N446 Electrical Characteristics Test Procedures 3. High-level output saturation voltage OH. Low-level output saturation voltage OL No. PH PHB OUT OUT BOUT BOUT Measuring Pin OUT/OUT BOUT/BOUT OUT/OUT BOUT/BOUT oltage Conditions IN, IN, IN, IN3 I IN Remarks Judge each logic of the OUT, OUT, BOUT, and BOUT at to 4 above. Judge each logic of the OUT, OUT, BOUT, and BOUT at to 8 above. SFEB 9

20 N446 Test Circuit Diagram 4 Test Circuit 4 FIN PH PHB IN REG IN REFB IN REF IN3 M N446 ENBLE FIN PUMP M BC ENBLEB BC OUT BOUT Flywheel diode voltage DI I DI S9 3 4 RCS RCSB OUT OUT BOUT OUT BOUT BOUT 4 Relay Conditions No. 3 Measuring Pin OUT S9 Measure the diode voltage at each level on contacts,, 3, and 4 of S9. SFEB

21 N446 Terminal Equivalent Circuits Pin Equivalent Circuit Pin Equivalent Circuit Pin (PH) Pin (PHB) Pin 3 (IN) Pin 4 (IN) Pin (IN) Pin 6 (IN3) Pin 7 (ENBL E) Pin 9 (ENBL EB) Pin (BOUT) Pin 3 (RCSB) Pin 4 (BOUT) IN 3 4IN IN 6 IN3 7 ENBLE 9 ENBLEB k k k 4k PH PHB 4k k BOUT 4 BOUT 3 RCSB Pin (OUT) Pin 6 (RCS) Pin 7 (OUT) Pin 9 (BC) Pin (BC) Pin (PUM P) BC k k k k 4 OUT 7 OUT 6 RCS 9 BC PUMP SFEB

22 N446 Terminal Equivalent Circuits Pin Equivalent Circuit Pin Equivalent Circuit Pin 3 (REF) Pin 4 (REFB) Symbols REF 3 REFB 4 REG (Pin 4) M (Pin 8, Pin ) Diode k k.k Zener diode 9k Ground (FIN).6k SFEB

23 N446 Usage Notes [Precautions for this IC] Perform thermal design work with consideration of a sufficient margin to keep the power dissipation based on supply voltage, load, and ambient temperature conditions. The protection circuit is incorporated for the purpose of securing safety if the IC malfunctions. Therefore, design the protection circuit so that the protection circuit will not operate under normal operating conditions. The temperature protection circuit, in particular, may be destructed before the temperature protection circuit operates if the area of safety operation of the device or the maximum rating is exceeded instantaneously due to the short-circuiting between the output pin and M pin or a ground fault caused by the output pin and ground pin. Pay utmost attention to the pattern layout in order to prevent the IC from destruction resulting from the short-circuiting of pins. See page 7 Pin Descriptions for allocations of the pins of the IC. When driving a motor coil or transformer (L) load, the device may be destructed as a result of a negative or excessive voltage generated at the time of turning the load on and off. Unless otherwise provided in the specifications, do not apply any negativeor excessive voltage. Do not make mistakes in the PCB mounting direction. If power is supplied with the pins mounted in the wrong direction, the IC may be destructed. The IC may be destructed by the solder bridge between the pins of semiconductor devices. Fully make a visual check on the PCB before supplying power. Furthermore, the IC may be destructed if conductive foreign matters like solder chips are stuck to the IC during transportation after PCB mounting. Therefore, conduct full technical verification of the mounting quality of the IC. The IC is destructed under an abnormal condition, such as the short-circuiting between the output and M pins, output and ground pins, or output pins (i.e., load short-circuiting), in which case smoke may be generated. Pay utmost attention to the use of the IC. Pay special attention to the following pins so that they are not short-circuited with the M pin, ground pin, other output pin, or current detection pin. () OUT (pin 7), OUT (pin ), BOUT (pin 4), BOUT (pin ) () BC (pin ), PUMP (pin ) (3) M (pin 8), M (pin ), REG (pin ) (4) RCS (pin 6), RCSB (pin 3) The higher the current capacity of power supply is, the higher the possibility of the above destruction or smoke generation. Therefore, it is recommended to take safety countermeasures, such as the use of a fuse. When using the IC for model expansion or new sets, be sure to make full safety checks including a long-term reliability check on each set. SFEB 3

24 N446 Usage Notes (continued) Set the value of the capacitor between the PUMP and pins so that the voltage on the PUMP pin (pin ) will not exceed 4 in any case regardless of whether it is a transient phenomenon or not while the motor standing by is started. This IC employs a PWM drive method that switches the high-current output of the output transistor. Therefore, the IC is apt to generate noise that may cause the IC to malfunction or have fatal damage. To prevent these problems, the power supply must be stable enough. Therefore, the capacitance between the REG and pins must be a minimum of µf and the one between the M and pins must be a minimum of 47 µf and as close as possible to the IC so that PWM noise will not cause the IC to malfunction or have fatal damage. The HBM electrostatic breakdown voltage (with a capacitance of pf and a resistance of. kω) of BC pin (pin 9) is approx.. On the other hand, the minimum MM electrostatic breakdown voltage (with a capacitance of pf and a resistance of Ω) applicable to all pins is. PH pin (pin ) and PHB pin (pin ) are pulled up with kω to REG. There will be no problem if the input device connected to this IC is a microcontroller operating at. If the microcontroller used operates at a voltage less than (e.g., 3.3 ), however, a problem may result, because will be applied to the microcontroller output pin when the pin is at high impedance, which may be in excess of the dielectric strength of the microcontroller. If a state of high impedance is likely to occur, pull down PH pin (pin ) and PHB pin (pin ) with appropriate resistance for the protection of the microcontroller. In order to prevent mistakes in current detection resulting noise, this IC is provided with a pulse blanking time of. µs (typ.). The motor current will not be less than the current determined by blanking time. Pay utmost attention at the time of minute current control. The graph on the right-hand side shows the relationship between the pulse blanking time and minute current value. RCS current waveform while in normal operation The increase or decrease in the motor current is Set current determined by the resistance of the internal winding of the motor. RCS current waveform when the set current is less than the minimum current Minimum current Set current f PWM : PWM frequency (See No. 9 of Electrical Characteristics.) T B : Pulse blanking time (See No. of Electrical Characteristics.) T B f PWM SFEB 4

25 N446 Usage Notes (continued) high current flows into the IC. Therefore, the common impedance of the PCB pattern cannot be ignored. Take the following points into consideration and design the PCB pattern of the motor. high current flows into the line between the M (pin 8) and M (pin ) pins. Therefore, noise is generated with ease at the time of switching due to the inductance (L) of the line, which may result in the malfunctioning or destruction of the IC (see the circuit diagram on the left-hand side). s shown in the circuit diagram on the right-hand side, the escape way of the noise is secured by connecting a capacitor to the connector close to the M pin of the IC. This makes it possible to suppress the direct M pin voltage of the IC. Make the settings as shown in the circuit diagram on the right-hand side as much as possible. M Noise is generated with ease C L M IC RCS M Recommended PCB L C M IC Low spike amplitude due to the capacitance between the M pin and ground pin RCS SFEB

26 Request for your special attention and precautions in using the technical information and semiconductors described in this book () If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and regulations of the exporting country, especially, those with regard to security export control, must be observed. () The technical information described in this book is intended only to show the main characteristics and application circuit examples of the products, and no license is granted under any intellectual property right or other right owned by our company or any other company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other company which may arise as a result of the use of technical information described in this book. (3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. ny applications other than the standard applications intended. (4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. t the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. () When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions (operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS, thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages. (7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.