PA System in a Box. Edwin Africano, Nathan Gutierrez, Tuan Phan

Transcription

1 PA System in a Box Edwin Africano, Nathan Gutierrez, Tuan Phan

2 Overview A public address system (PA System) is an electronic sound distribution system that allows music and speech to reach a large amount of people. Goal: Create a portable and easy to setup system with the features of larger, more expensive systems.

3 Motivation Sound translates naturally to the analog domain Unnecessary to convert to digital for majority of applications Most PA systems are large and expensive How can we package modules together Relatively affordable Practical Personal playback / recording On-campus group events Parties We love sound

4 Block Diagram Signals between all modules are single ended and at an average of +4 dbu (1.23 Vrms) (professional line level) Signals on right side of diagram are all stereo

5 Microphone / Line Input Channel Receives balanced (differential) or unbalanced signals ranging in amplitude (microphone level to line level) and outputs a single +4 dbu signal. Preamplifier Up to 60 db of adjustable gain 15dB pad switch Filter (Sallen Key) Switchable lowpass and highpass LP 900 Hz -> 8 khz HP 33 Hz -> 185 Hz EQ (Wien Bridge) Single-band parametric ±12 db of boost or cut 120 Hz -> 1300 Hz sweepable frequency Peak Detection Provides visual indication for setting average input levels (should light up only on peaks)

6 Mixer Allows multiple signal sources to be mixed together in stereo while providing sends and returns. Volume Faders Panning LR Bus Signal attenuated with logarithmic relation Moves sound between left and right speakers Follows 3 db pan-law The summation of the various input channels Send / Returns Buffered and switchable Allows the audio signal to be sent to another module for processing Balanced Output Allows for connection to recording devices Outputs a balanced differential signal

7 Compressor Purpose: To maintain a more consistent dynamic level. Lowers the signal level for loud transients. With gain allows for boosting the level when the signal is too quiet. Gain Control Element: Attenuates or boost the signal based on control voltages created by the. Make-up Gain: Provides gain to output signal to make-up for loss of level after compression Feedback Element: Allows user to set response of the compressor (Attack, Decay, Threshold) Converts audio signal into control voltage for gain control element

8 Power Amplifier Purposes: To amplify the input signal for the speakers. Class G Amplifier: Input Stages: Uses a differential pair of transistors Minimal noises and bandwidth from 20 Hz - 20 khz Voltage Amplification Stage: Boost incoming line level feeding into the output stage full voltage swing. Class G output: Enhance version of class AB Allows use of multiple power rails Inner drive - class B; Outer class - class C

9 Power Supply Motivation: Provide power for our system Make the system portable Minimize footprint Design: Transformer and linear rectifier for AC-DC Filtering to reduce noise and minimize ripple Take ± 35 V rails from this output Buck converter circuit: -15 V Boost converter circuit : 15 V

10 Physical Build Motivation: Ensure that the system is portable and user friendly Design: Plexiglass/Acrylic enclosure Design using Coreldraw Manufacture using EDS Must consider cooling User panel ease of access and use Integrate LED Metering / Visualization Consideration of internal components layout

11 Challenges / Stretch Goals Making sure relations between controls and audio make sense I.E. Volume controls should be logarithmic, pan controls sin-cos like Maintain low noise and full frequency response Ensure enclosure meets cooling requirements and is also as small as possible Minimize power supply noise/ripple while meeting power requirement Headphone Amplifier Class AB, fed from mixer output Allows use of equipment without speakers Graphic EQ PCBs Placed as an insert on mixer Allows frequencies to be boost or cut Graphic refers to visual representation of interface (sliders correspond to frequencies) If time allows, create PCBs for modules

12 Timeline Week of April 11th Have initial designs completed Breadboard prototypes of core modules Week of April 18th Have core modules functional and meeting specs Begin integration of core modules Complete construction of power supply and finish testing Week of April 25th Continue testing and debugging Work on stretch goals Design enclosure Week of May 2 Testing and debugging Package modules into a single enclosure Demonstration of project