MC10645 1:9 TT Clock Driver Description The MC10645 is a single supply, low skew, TT I/O 1:9 Clock Driver. Devices in the 600 clock driver family utilizes the PCC 28 for optimal power and signal pin placement. The device features a 24 ma TT output stage with AC performance specified into a 50 pf load capacitance. A 2:1 input Mux is provided on chip to allow for distributing both system and diagnostic clock signals or designing clock redundancy into a system. With the SE input held OW the DO input will be selected, while the input is selected when the SE input is forced IG. Features ow Skew Typically 0.65 Within Device Guaranteed Skew Spec 1.25 Part to Part Input Clock Muxing Differential EC Internal Design Single Supply Extra TT and EC Power/Ground Pi Pb Free Packages are Available* PCC FN SUFFI CASE 776 MARKING DIAGRAM MC10645G AWYYWW A W YY WW G = Assembly ocation = Wafer ot = Year = Work Week = Pb Free Package ORDERING INFORMATION See detailed ordering and shipping information in the package dimeio section on page 4 of this data sheet. *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SODERRM/D. Semiconductor Components Industries, C, 2006 February, 2006 Rev. 6 1 Publication Order Number: MC10645/D
MC10645 TT Outputs Q6 Q7 Q8 TT Inputs Q0 25 24 23 22 21 20 19 MU Q1 26 18 Q Q Q2 Q3 Q5 Q4 27 28 1 17 16 15 E S S Q4 2 14 SE SE Q5 Q6 Q3 3 4 5 6 7 8 9 10 11 13 12 GE Q7 Q2 Q1 Q0 Figure 1. ogic Diagram Q8 Figure 2. Pinout: 28 ead PCC (Top iew) Table 1. PIN NAMES PIN FUTION E GE Dn Q0 Q8 SE EC CC (+5.0 ) EC Ground (0 ) TT Signal Input TT Signal Outputs TT Mux Select Table 2. PIN DESCRIPTIONS Pin Symbol Description Pin Symbol Description 1 2 3 4 5 6 7 8 9 10 11 12 13 14 Q4 Q3 Q2 Q1 Q0 GE SE No Connection EC Ground Select Input (TT) 15 16 17 18 19 20 21 22 23 24 25 26 27 28 E Q8 Q7 Q6 Q5 EC CC (+5.0 ) Signal Input (TT) Signal Input (TT) No Connection Table 3. TRUT TABE SE Q 2
MC10645 Table 4. ABSOUTE RATINGS (Do not exceed) Symbol Characteristic alue Unit E (EC) Power Supply oltage to +7.0 (TT) Power Supply oltage to +7.0 I (TT) Input oltage to +7.0 out Disabled 3 State Output 0.0 to T T stg Storage Temperature 65 to 150 C T amb Operating Temperature 0.0 to +85 C Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditio) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. Table 5. DC CARACTERISTICS ( = E = 5.0 ±5%) 0 C 25 C 85 C Symbol Characteristic Min Max Min Max Min Max Unit Condition I EE Power Supply Current EC 30 30 30 ma E Pin I CC TT 30 30 30 ma Total all pi I CC 35 35 35 ma O Output IG oltage I O = 3.0 ma I O = 15 ma O Output OW oltage I O = 24 ma I OS Output Short Circuit Current 100 225 100 225 100 225 ma OUT = 0 NOTE: Device will meet the specificatio after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained traverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditio is not implied. Device specification limit values are applied individually under normal operating conditio and not valid simultaneously. Table 6. TT DC CARACTERISTICS ( = E = 5.0 ±5%) 0 C 25 C 85 C Symbol Characteristic Min Max Min Max Min Max Unit Condition I I Input IG oltage Input OW oltage 0.8 0.8 0.8 I I Input IG Current 20 100 20 100 20 100 A IN = 2.7 IN = 7.0 I I Input OW Current 0.6 0.6 0.6 ma IN = O Output IG oltage I O = 3.0 ma I O = 24 ma O Output OW oltage I O = 24 ma IK Input Clamp oltage 1.2 1.2 1.2 I IN = 18 ma I OS Output Short Circuit Current 100 225 100 225 100 225 ma OUT = 0 NOTE: Device will meet the specificatio after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained traverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditio is not implied. Device specification limit values are applied individually under normal operating conditio and not valid simultaneously. 3
MC10645 Table 7. AC CARACTERISTICS ( = E = 5.0 ±5%) 0 C 25 C 85 C Symbol Characteristic Min Max Min Max Min Max Unit Condition t P t P D 0 to Output Only D 1 to Output Q0 Q8 5.2 6.2 C = 50 pf 5.2 6.2 t P D 0 to Output D 1 to Output 5.2 5.2 6.2 6.2 t skpp Part to Part Skew D 0 to Output Only 1.0 1.0 1.0 t skwd * Within Device Skew D 0 to Output Only 0.65 0.65 0.65 t P SE to Q Q0 Q8 4.5 6.5 5.0 7.0 5.2 7.2 C = 50 pf t r t f Output Rise/Fall Time 0.8 to Q0 Q8 C = 50 pf t S Setup Time SE to D 1.0 1.0 1.0 NOTE: Device will meet the specificatio after thermal equilibrium has been established when mounted in a test socket or printed circuit board with maintained traverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared operating temperature range. Functional operation of the device exceeding these conditio is not implied. Device specification limit values are applied individually under normal operating conditio and not valid simultaneously. *Within Device Skew defined as identical traitio on similar paths through a device. Table 8. DUTY CYCE SPECIFICATIONS (0 C T A 85 C; Duty Cycle Measured Relative to 1.5 ) Symbol Characteristic Min Nom Max Unit Condition PW Range of CC and C to Meet Min Pulse Width (IG or OW) at f out 50Mz CC C PW 75 10.0 9.0 5.0 5.125 50.0 11.0 pf All Outputs ORDERING INFORMATION Device Package Shipping MC10645FN PCC 28 37 Units / Rail MC10645FNG PCC 28 (Pb Free) 37 Units / Rail MC10645FNR2 PCC 28 500 / Tape & Reel MC10645FNR2G PCC 28 (Pb Free) 500 / Tape & Reel For information on tape and reel specificatio, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specificatio Brochure, BRD8011/D. 4
MC10645 PACKAGE DIMENSIONS PCC 28 FN SUFFI CASE 776 02 ISSUE E N Y BRK B 0.007 (0.180) M T M S N S U 0.007 (0.180) M T M S N S D M Z 28 1 W D IEW D D G1 0.010 (0.250) S T M S N S Z A R 0.007 (0.180) M T M S N S 0.007 (0.180) M T M S N S 0.007 (0.180) M T M S N S C E K1 G G1 J IEW S 0.004 (0.100) T SEATING PANE K F 0.007 (0.180) M T M S N S 0.010 (0.250) S T M S N S IEW S NOTES: 1. DATUMS, M, AND N DETERMINED WERE TOP OF EAD SOUDER EITS PASTIC BODY AT MOD PARTING INE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM T, SEATING PANE. 3. DIMENSIONS R AND U DO NOT IUDE MOD FAS. AOWABE MOD FAS IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOERAING PER ANSI Y14.5M, 1982. 5. CONTROING DIMENSION: I. 6. TE PACKAGE TOP MAY BE SMAER TAN TE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT TE OUTERMOST ETREMES OF TE PASTIC BODY ECUSIE OF MOD FAS, TIE BAR BURRS, GATE BURRS AND INTEREAD FAS, BUT IUDING ANY MISMATC BETWEEN TE TOP AND BOTTOM OF TE PASTIC BODY. 7. DIMENSION DOES NOT IUDE DAMBAR PROTRUSION OR INTRUSION. TE DAMBAR PROTRUSION(S) SA NOT CAUSE TE DIMENSION TO BE GREATER TAN 0.037 (0.940). TE DAMBAR INTRUSION(S) SA NOT CAUSE TE DIMENSION TO BE SMAER TAN 0.025 (0.635). IES MIIMETERS DIM MIN MA MIN MA A 0.485 0.495 12.32 17 B 0.485 0.495 12.32 17 C 0.165 0.180 4.20 4.57 E 0.090 0.110 2.29 2.79 F 0.013 0.019 0.33 0.48 G 0.050 BSC 1.27 BSC 0.026 0.032 0.66 0.81 J 0.020 1 K 0.025 0.64 R 0.450 0.456 11.43 11.58 U 0.450 0.456 11.43 11.58 0.042 0.048 1.07 1.21 W 0.042 0.048 1.07 1.21 0.042 0.056 1.07 1.42 Y 0.020 0 Z 2 10 2 10 G1 0.410 0.430 10.42 10.92 K1 0.040 1.02 5
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