CPC3710CTR (SOT-89) 250V N-Channel Depletion-Mode FET INTEGRATED CIRCUITS DIVISION. Description. Features Low R DS(on) Applications

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CPC371 25V N-Channel epletion-mode FET V (BR)SX / V (BR)GX R S(on) (max) SS (min) Package 25V P 1 22mA SOT-89 Features Low R S(on) at Cold Temperatures Low On-Resistance: 1 max. at 25ºC High Input Impedance High Breakdown Voltage: 25V P Low (off) Voltage: -1.6 to -3.9V Small Package Size SOT-89 Applications Ignition Modules Normally-On Switches Solid State Relays Converters Telecommunications Power Supply escription The CPC371 is an N-channel, depletion-mode, field effect transistor (FET) that utilizes IXYS Integrated Circuits ivision s proprietary third-generation vertical MOS process. The third-generation process realizes world class, high voltage MOSFET performance in an economical silicon gate process. Our vertical MOS process yields a robust device, with high input impedance, for use in high-power applications. The CPC371 is a highly reliable FET device that has been used extensively in our solid state relays for industrial and telecommunications applications. This device excels in power applications requiring low drain-source resistance, particularly in cold environments such as automotive ignition modules. The CPC371 offers a low, 1 maximum, on-state resistance at 25ºC. The CPC371 has a minimum breakdown voltage of 25V P, and is available in an SOT-89 package. As with all MOS devices, the FET structure prevents thermal runaway and thermal-induced secondary breakdown. Ordering Information Part # CPC371CTR escription N-Channel epletion Mode FET, SOT-89 Pkg. Tape and Reel (1/Reel) Package Pinout G S (SOT-89) Circuit Symbol G S S-CPC371-R2 www.ixysic.com 1

CPC371 Absolute Maximum Ratings @ 25ºC Parameter Ratings Units rain-to-source Voltage 25 V P Gate-to-Source Voltage ±15 V P Pulsed rain Current 6 ma Total Package issipation 1 1.4 W Junction Temperature 15 ºC Operational Temperature -55 to +125 ºC Storage Temperature -55 to +125 ºC 1 Mounted on FR4 board 1"x1"x.62" Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Electrical Characteristics @ 25ºC (Unless Otherwise Noted) Parameter Symbol Conditions Min Typ Max Units rain-to-source Breakdown Voltage V (BR)SX = -5V, =1µA 25 - - V P Gate-to-Source Off Voltage (off) = 5V, =1mA -1.6 - -3.9 V Change in (off) with Temperatures d(off) /dt = 5V, =1 A - - 4.5 mv / ºC Gate Body Leakage Current I GSS =±15V, =V - - 1 na V rain-to-source Leakage Current I GS = -5V, =25V - - 1 µa (off) = -5V, =2V, T A =125ºC - - 1 ma Saturated rain-to-source Current SS = V, =15V 22 - - ma Static rain-to-source On-State Resistance R S(on) = V, =22mA - - 1 Change in R S(on) with Temperatures dr S(on) / dt = V, =22mA - - 1.1 % / ºC Forward Transconductance G FS = 1mA, = 1V 225 - - m Input Capacitance C ISS = -5V 1 35 Common Source Output Capacitance C OSS = 25V - 3 8 pf Reverse Transfer Capacitance C RSS f= 1MHz 15 4 Turn-On elay Time t d(on) 23 35 V = 25V Rise Time t r = 15mA 8 2 - Turn-Off elay Time t = V to -1V d(off) 17 25 R gen = 5 Fall time t f 7 8 ns Source-rain iode Voltage rop V S = -5V, I S = 15mA -.6 1.8 V Thermal Resistance (Junction to Ambient) R JA - - 9 - ºC/W Switching Waveform & Test Circuit V INPUT V -1V 1% t on 9% t off PULSE GENERATOR R gen R L OUTPUT t d(on) t f t d(off) tr.u.t. 9% 9% INPUT OUTPUT V 1% 1% R2 2 www.ixysic.com

INTEGRATE CIRCUITS IVISION CPC371 PERFORMANCE ATA* Output Characteristics (T A =25ºC) 3 27 =.V 24 21 18 =-1.V 15 12 9 =-1.5V 6 3 =-2.V 1 2 3 4 5 6 35 3 25 2 15 1 5 Transfer Characteristics ( =5V) +125ºC +25ºC -4ºC -3. -2.5-2. -1.5-1. (off) -.5-1. -1.5-2. -2.5-3. (off) vs. Temperature ( =1V, =1mA) -3.5-4 - 4 8 12 Temperature (ºC) ( ) 14. 12. 1. 8. 6. 4. 2. vs. Temperature ( =V, =1mA) -4-4 8 12 Temperature (ºC) Power (W) 1.6 1.4 1.2 1..8.6.4.2. Power issipation vs. Ambient Temperature 2 4 6 8 1 12 14 Ambient Temperature (ºC) G FS (m ) 3 25 2 15 1 5 Transconductance Vs. rain Current ( =1V) +125ºC +25ºC -55ºC 1 2 3 4 5 6 7 8 9 1 rain Current (A) 1.1.1 Max Rated Safe Operating Area.1.1 1 1 1 1 rain-source Voltage Capacitance (pf) Capacitance vs. rain Source Voltage ( =-5V) 16 14 12 C ISS 1 8 6 4 C OSS 2 C RSS 1 2 3 4 ( ) On-Resistance vs. rain Current ( =V) 2 18 16 14 12 1 8 6 4 2.6.12.18.24.3 (A) *The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application department. R2 www.ixysic.com 3

CPC371 Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits ivision classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEEC J-ST-2, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEEC J-ST-33. evice Moisture Sensitivity Level (MSL) Rating CPC371C MSL 1 ES Sensitivity This product is ES Sensitive, and should be handled according to the industry standard JES-625. Reflow Profile This product has a maximum body temperature and time rating as shown below. All other guidelines of J-ST-2 must be observed. evice CPC371C Maximum Temperature x Time 26ºC for 3 seconds Board Wash IXYS Integrated Circuits ivision recommends the use of no-clean flux formulations. However, board washing to remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be used. R2 4 www.ixysic.com

CPC371 CPC371C 1.626 / 1.829 (.64 /.72) R.254 (R.1) MECHANICAL IMENSIONS 1.397 / 1.6 (.55 /.63) PCB Land Pattern 1.9 (.75) Pin 1.889 / 1.194 (.35 /.47) 4.394 / 4.597 (.173 /.181).356 /.483 (.14 /.19).432 /.559 (.17 /.22) 3.937 / 4.242 (.155 /.167).864 / 1.16 (.34 /.4) 2.286 / 2.591 (.9 /.12).356 /.432 (.14 /.17).432 /.58 (.17 /.2) 1.4 (.55) 45º 5º 2.45 (.96).6 (.24) TYP 3 1.9 (.74) 5. (.197) 1.118 / 1.27 (.44 /.5) 5º 2.845 / 2.997 (.112 /.118) 1.422 / 1.575 (.56 /.62) 2.921 / 3.73 (.115 /.121) imensions mm MIN / mm MAX (inches MIN / inches MAX) CPC371CTR Tape & Reel 177.8 ia (7. ia) Top Cover Tape Thickness.12 Max (.4 Max) 5.5 ±.5 (.217 ±.2) 2. ±.5 (.79 ±.2) 4. ±.1 (.157 ±.4) 1.75 ±.1 (.69 ±.4) W=12. ±.3 (.472 ±.12) B =4.6 ±.1 (.181 ±.4) Embossed Carrier Embossment K =1.8 ±.1 (.71 ±.4) A =4.8 ±.1 (.189 ±.4) P=8. ±.1 (.315 ±.4) imensions mm (inches) For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits ivision makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits ivision s Standard Terms and Conditions of Sale, IXYS Integrated Circuits ivision assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits ivision s product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits ivision reserves the right to discontinue or make changes to its products at any time without notice. 5 Specification: S-CPC371-R2 Copyright 214, IXYS Integrated Circuits ivision All rights reserved. Printed in USA. 8/1/214