Search. Login Register. Patrick Gormally -March 24, 2014

Similar documents
Diagnosing the Future of Medical Applications

50W TO220 High Power Resistors

Features and Applications of New Type Inductors

Automotive Full Electric Vehicles (FEVs)

High Frequency (up to 20 GHz) Resistor, Thin Film Surface Mount Chip

tuning and RF circuits wireless automotive inductors inductance (L). Now frequencies

INTRODUCTION. VSMP Series is the rated extremely low TCR. resistor. all in one. 25 C ref.) Coefficient of 5 ppm. h at rated power.

Automotive Body Electronics

Systems Engineering. Passive Components. v1.2 March itic.

(RMG100) TO247 Power Pulse-loading Resistors. Token Electronics Industry Co., Ltd. Version: January 12, Web:

FRSM Series of Precision Chip Resistors Vishay Foil Resistors

Application Note 5011

Automotive Body Electronics

AMERICAN TECHNICAL CERAMICS PRODUCT SELECTION GUIDE QUICK REFERENCE ISO 9001 REGISTERED COMPANY

PH9 Reliability. Application Note # 51 - Rev. A. MWTC MARKETING March 1997

Application Note 5012

ISA-PLAN // Precision resistors. SMT // Size Features

Alternative Energy Smart Grid

Industrial / Power Factory Automation

Type RN73 Series. Thin Film Precision Resistors. Electrical Characteristics. Key Features. Applications

Surface Mount Power Resistor Thick Film Technology

Advanced Medical Applications, Treatment Solutions, and Biotechnology

Metal thin film chip resistor networks RM series

Electromagnetic Integrated Solutions

25 mil or 50 mil Pitch, Termination Thin Film Surface Mount Resistor/Capacitor Network

Low TCR Dual 1:5 Rejustor Micro-Resistor MBD-103-CS

S C A 69 B 104 J W S. Capacitance Code (pf)

TABLE 1 - SPECIFICATIONS PARAMETER CSM2512 CSM3637

High Precision Wraparound - Wide Ohmic Value Range Thin Film Chip Resistors

Surface Mounted Power Resistor Thick Film Technology

Thin Film Ultra Precision Resistors

Thin Film Bar MOS Capacitors

DATA SHEET FUSIBLE CHIP RESISTORS FR series (Pb Free) 5% sizes 0603/1206. Product specification Sep 26, 2005 V.0

CR0603/CR0805/CR Chip Resistors

Metal Film Resistors, Non-Magnetic, Industrial, Precision

Type CPF Series. Thin Film Precision Resistors. Key Features

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC1218 (Pb Free) 5%; 1% Product specification Oct 13, 2004 V.1

(OAR) Open Air Current Sensing Resistors. Token Electronics Industry Co., Ltd. Version: January 12, Web:

Radio Frequency Electronics

Thick Film Resistor Networks Military, MIL-PRF Qualified, Type RZ Dual-In-Line Package, 01, 03, 05 Schematics

IMPROVED PRODUCT DSM. Vishay Foil Resistors FEATURES INTRODUCTION FIGURE 1 - SCHEMATIC

Lecture 4 RF Amplifier Design. Johan Wernehag, EIT. Johan Wernehag Electrical and Information Technology

Approval sheet. WQCW1005 SMD Wire Wound Ceramic Chip Inductors AEC-Q200. *Contents in this sheet are subject to change without prior notice.

MA4P7470F-1072T. Non Magnetic MELF PIN Diode. Features. Description and Applications. Designed for Automated Assembly

303139, Vishay Foil Resistors FEATURES INTRODUCTION. TABLE 1 - TOLERANCE AND TCR VS. RESISTANCE VALUE (- 55 C to C, + 25 C ref.

The 3D Silicon Leader

MILITARY SPECIFICATION SHEET COILS, RADIO FREQUENCY, MOLDED, ENCAPSULATED, VARIABLE, MICRO-MINIATURE, IRON CORE, TYPES LT11V001 TO LT11V021 INCL.

DATA SHEET CURRENT SENSOR - LOW TCR HIGH POWER PT-High power series 5%, 2%, 1% sizes 0402/0603/0805/1206/0815/2010/2512

50 W Power Resistor, Thick Film Technology, TO-220

Monolithic Amplifier CMA-83LN+ Low Noise, Wideband, High IP3. 50Ω 0.5 to 8.0 GHz

Thin Film Microwave Resistors

DATA SHEET THICK FILM CHIP RESISTORS Automotive Precision grade AC series 0.1%, 0.5%, 1%, TC 50

Application Note M540

Wirewound Resistors, Military, MIL-PRF Qualified, Type RE, Aluminum Housed, Chassis Mount

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

A unique 3D Silicon Capacitor with outstanding performances in terms of DC leakage and reliability performances. Catherine Bunel R&D Director

Surface Mounted Power Resistor Thick Film Technology

IMPROVED PRODUCT SMN. Vishay Foil Resistors. RoHS* FEATURES Temperature Coefficient of Resistance (TCR) (- 55 C to C, + 25 C Ref): INTRODUCTION

GaAs MMIC Non-Linear Transmission Line. Packag e. Refer to our website for a list of definitions for terminology presented in this table.

Telecommunications Mobile

(SMW) Power Wire Wound Chip Resistors

DATA SHEET FUSIBLE CHIP RESISTORS FR series (Pb Free) 5% sizes 0603/1206. Product specification Sep 26, 2005 V.0

Integration of Power, Control and Dynamic Braking in AC Motor Drives

High Frequency (up to 40 GHz) Resistor, Thin Film Surface Mount Chip

T.C.R. ( 10-6 / C) [20 C to 60 C] ±20 1m to 50mW. ±20 50m to 500mW. Maximum Working Voltage (V) (P R) 1/2 E R J M P 4 P F 1 M 0 U.

Electronics Tech. (UAR) High Precision, High Frequency Resistors. Direct Electronics Industry Co., Ltd. Version: December 22, 2017

Precision Thin Film Precision Resistors

GaAs MMIC Non-Linear Transmission Line. Description Package Green Status

Telecommunications Mobile

SMR1DZ / SMR3DZ (Z-Foil)

DATA SHEET CURRENT SENSOR - LOW TCR AUTOMOTIVE GRADE PE_L series 5%, 1%, 0.5% sizes 0201/0402/ 0603/ 0805/ 1206/ 2010/ 2512

SMD High Frequency Power Inductor. Designed for Utility Regulator Applications

Metal Film Resistors, Industrial, Precision

DATA SHEET THICK FILM WIDE TERMINAL CHIP RESISTORS AUTOMOTIVE GRADE AC series ±5%, ±1%, ±0.5%

Molded Metal Film High Stability (< 0.25 % after 1000 h) High Temperature (up to 175 C) Precision Resistors

DATA SHEET ARRAY CHIP RESISTORS YC324 (8Pin/4R; Pb Free) 5%, 1% sizes Product specification Feb 22, 2005 V.1 Supersedes Date of Mar.

303133, , , , ,

ATF-531P8 E-pHEMT GaAs FET Low Noise Amplifier Design for 800 and 900 MHz Applications. Application Note 1371

DATA SHEET GENERAL PURPOSE CHIP RESISTORS RC0603 (Pb Free) 5%, 1%

Basic MODAMP MMIC Circuit Techniques. Application Note S001

Limiter Diodes Features Description Chip Dimensions Model DOT Diameter (Typ.) Chip Number St l Style Inches 4 11

Vout SMNZ. Note RESISTANCE RATIO R1/R2 = 1 1 < R1/R < R1/R2 100

400 MHz 4000 MHz Low Noise Amplifier ADL5521

APPLICATION INFORMATION GHz power amplifier with the BFG480W

Surface Mount Multilayer Ceramic Chip Capacitors for High Frequency Applications

APPLICATION NOTE. Using Current Sense Resistors for Accurate Current Measurement

GaAs MMIC Power Amplifier

T/R Switches, Baluns, and Detuning Elements in MRI RF coils Xiaoyu Yang 1,2, Tsinghua Zheng 1,2 and Hiroyuki Fujita 1,2,3.

Vishay Thin Film Product Training Module: Quick-Net : Custom Precision Resistor Networks - Prototypes to Production

AN4819 Application note


HIGH TEMPERATURE 150 C 180 C 200 C 230 C 250 C 350 C

Thick Film Resistor Networks, Dual-In-Line, Molded DIP

Ultra High Precision Z-Foil Flip Chip Resistor with TCR of ± 0.05 ppm/ C, 35 % Space Saving vs. Wraparound Design and PCR of 5 ppm at Rated Power

MELF Coated Thin Film Precision Resistors (MELFC Series)

DATA SHEET THICK FILM CHIP RESISTORS AUTOMOTIVE GRADE AC series ±5%, ±1%, ±0.5%

The 3D silicon leader. March 2012

High Precision Foil Wraparound Surface Mount Chip Resistor with TCR of ± 2 ppm/ C and Load Life Stability of ± 0.01 % (100 ppm)

AN4630. PCB design guidelines for the BlueNRG and BlueNRG-MS devices. Application note. Introduction

303261, , , , ,

Transcription:

EDN MOMENT Space Shuttle Columbia is delivered, March 25, 1979 Search Login Register Patrick Gormally -March 24, 2014 Share Tweet 0 Like 0 Over the years medical devices have continually been made smaller; smaller implantable devices offer improved patient comfort and less disruption to the body. To fulfill the need for smaller hybrids within the implantable medical device, continuous improvements in the hybrid layout and packaging techniques for the microcontroller (MCU) or application-specific integrated circuit (ASIC) and power systems are being implemented. This article discusses the passive component selection process to reduce hybrid and board space in medical devices. Introduction Passive components are produced in large-scale manufacturing facilities with good process controls to reduce lot-to-lot variability. Medical devices require higher levels of reliability and performance in smaller sizes than commercial components. Component manufacturing methods can facilitate a variety of options that reduce hybrid and board space and increase reliability. Capacitor selection criteria Each capacitor technology has unique properties that should be considered as part of the specifying criteria for the end application. MLCCs (multilayer ceramic capacitors) for implantable devices in the 0201 case size (0.024 in x 0.012 in) are used for decoupling or for tuning in radio/telemetry systems. The largest MLCC is the 2225 size (0.22 in x 0.25 in), which is often used in medical devices outside of the body as a resonant capacitor. Solid tantalum capacitors for medical device applications are available in the 0402 case size (.045

in x.026 in x.024 in) with low profiles to save space. Reliable, high-capacitance solid tantalums are also available in the 1210 T case size (0.138 in x 0.11 in x 0.063 in). Silicon-based capacitors are available in the 20 mil square size and in capacitances up to 1000 pf. Silicon capacitors can be mounted by epoxy or eutectic die attach and are wire- bondable. Surface-mount flip-chip silicon capacitors are available to 27 pf in the 0402 case size. Silicon-based capacitor technology provides a reliable wideband operation (20 GHz), high Q, low DCR, and high SRF. Magnetics selection criteria Most magnetic components are custom designed to fit into limited space for specific medical device applications in collaboration between the device manufacturer and the magnetics company engineers. Custom magnetics for implantable devices typically consist of bobbin- style transformers, toroid transformers, molded inductors, and antennas that have unique properties for performance and shape. Additionally, various core materials and shapes are used to optimize performance and fit requirements for each application. Tradeoffs in size, price, and performance are discussed to zero-in on the most cost-effective and highest performance device that fits in the available space. Once the design is complete, exacting manufacturing processes, controls, and test procedures are developed to ensure the highest level of quality and reliability for both dimensional and magnetic performance. Smaller form factor designs often require 3D CAD simulation for accurate component layout and prototyping. In the manufacturing of custom magnetics, a wide variety of specialized air coil, bobbin, and toroidal winding equipment is used. This equipment produces tightly controlled critical electrical requirements. Inspection equipment such as optical gauging is used for measurement of critical dimensions. Custom-designed test stations and fixtures allow monitoring and testing of electrical parameters. The use of these automated test stations allows for data analysis for use in design for manufacturability. The size and shapes of magnetic components used in medical applications varies greatly depending on the application. Small 0402 size inductors (0.040 in x 0.020 in) are used in telemetry/communications applications. These inductors can be wire-bondable and are manufactured with ceramic cores and have inductance values up to 150 nh.

High-frequency wire-bondable RF spiral inductors are available in two sizes: (0.030 in x 0.030 in x 0.020 in) and (0.050 in x 0.050 in x 0.020 in). These inductors perform well in the RF band for biasing, tuning, and lumped-element filters. Resistor selection criteria Standard thin and thick film surface-mount resistors are available in case sizes ranging from 0402 to 2512. The criteria for resistor selection includes pulse handling, operating voltage, operating temperature, and long-term stability. Wire-bondable resistors range in size from 0.015 in by 0.015 in by 0.010 in with a 125 mw power rating, to 0.055 in by 0.055 in by 0.010 in with values up to 30 MΩ and operating voltage of 100 V. Sample Vishay wire-bondable resistors Thin film resistors provide the ability to densely populate circuits, while offering the benefit of a highly reliable resistor film. Tolerances as tight as 0.01 % and TCR as low as 5 ppm provide for fine tuning of amplifiers, Tx/Rx circuitry, and power distribution. For medical applications, these chip resistors are available in any standard resistance value (10 Ω to 25 MΩ). High-reliability testing Avoiding catastrophic and drift failures in passive components for medical devices is a primary concern. Ultimately, product reliability predictions are based upon the suppliers test data and medical device manufacturers' specified application operating temperatures over a defined period of time. Process control at the passive component supplier is an important factor in achieving high reliability. Establishing reliability of the passive component and qualifying components for use in critical medical device applications is done by performing life testing at elevated temperatures at the rated voltage, or higher, for a specified time. Passive component testing is based upon customer requirements and MIL specifications where applicable. Reliability prediction for passive components is available online using modeling programs that are based upon MIL Handbook 217 or IEC863. Below is an example of a supplier reliability modeling:

Solid tantalum test standards are based upon MIL-PRF-55365. Solid tantalum capacitors undergo internal qualifications and periodic maintenance testing at elevated temperature and voltage. For critical applications, tantalum capacitors are designed, manufactured, and tested in accordance to limits that meet custom requirements. The table below shows failure rate predictions based on Weibull testing of solid tantalum capacitors. Resistors are qualified for critical medical applications in accordance with MIL-PRF-55342. Resistor failures fall into two categories: catastrophic failures, such as open or shorted resistors, and drift failures, which result in poor circuit operation. Resistor performance after testing can be compared to MIL-PRF-55342 limits, as shown in the table below. Internal reliability testing of custom magnetics is based on MIL-PRF-27. Some of the tests performed are solderability, resistance to solvents, terminal strength, shock and vibration, moisture resistance, and thermal shock. These tests are detailed in MIL-STD-202 and other ASTM or JEDEC standards. Summary Smaller medical devices allow for less-invasive, less-complicated procedures, making it easier for

the physician to perform and easier on patients. As newer passive devices with reduced sizes are introduced, better techniques in production and testing are necessary to improve the quality of the components. Suppliers of newer, smaller-form-factor passive components may require equipment investment and automation to achieve the process capability required by medical device manufacturers. Qualification testing and reliability testing in accordance with customer requirements and industry standards are requirements of the development process. Also see: Roundup: PCB protection/coatings Product how-to: Uses of copper barrier capacitors in MRI RoHS Recast (RoHS2) An update on RoHS Electronic features of implantable circuits Share Tweet 0 Like 0 Write a Comment To comment please Log In