T A S - X 5 U S 1 - Q 1 1

Specification Small Form Factor Pluggable Duplex LC Receptacle XFP Optical Transceivers OC-192 / STM-64 / 10 Gigabit Ethernet Ordering Information T A S - X 5 U S 1 - Q 1 1 Voltage / Temperature 5 : 3.3V / -5 ~ +70 Model Name Voltage Category Device type Interface LOS Temperature Distance TAS-X5US1-Q11 3.3V With DDMI 1550 nm EML AC / AC LVTTL -5 C~+70 C 80Km Coupling 1

Features 10Gb/s Serial Optical Interface Compliant to 802.3ae 10GBASE ZR/ZW 1550nm Cooled EML Transmitter with TEC, PIN Photo-Detector XFP Mechanical Interface with Bail Latch and Hot Pluggable XFI High Speed Electrical Interface 2-Wire Interface for Management And Digital Diagnostic Monitor Operating Case Temperature: -5 to 70 C All-Metal Housing for Superior EMI Performance Advanced Firmware Allow Customer System Encryption Information to Be Stored in Transceiver RoHS compliant No reference clock needed Applications Sonet(OC-192)/SDH(STM-64) Line Card 10GBASE-ZR(10.3125Gbps) 10GBASE-ZW(9.953Gbps) 10G Ethernet Switches and Routers 10GE Storage Figure1: Application in System 2

General Description The TAS-X5US1-Q11 is a very compact 10Gb/s optical transceiver module for serial optical communication applications at 10Gb/s. The TAS-X5US1-Q11 converts a 10Gb/s serial electrical data stream to 10Gb/s optical output signal and a 10Gb/s optical input signal to 10Gb/s serial electrical data streams. The high speed 10Gb/s electrical interface is fully compliant with XFI specification and allows FR4 host PCB trace up to 200mm. The TAS-X5US1-Q11 is designed for use in a variety of 10Gb/s SONET/SDH equipment including FEC (9.95Gb/s to 10.7Gb/s) and Ethernet LAN (10.3Gb/s) and WAN (9.95Gb/s) applications. The high performance cooled 1550nm EML transmitter and high sensitivity PIN receiver provide superior performance for SONET /SDH and Ethernet applications at up to 80km links. The fully XFP compliant form factor provides hot pluggability, easy optical port upgrades and low EMI emission. Functional Description The TAS-X5US1-Q11 contains a duplex LC connector for the optical interface and a 30-pin connector for the electrical interface. Chart of section 3 shows the functional block diagram of TAS-X5US1-Q11 XFP Transceiver. Transmitter Operation The transceiver module receives 10Gb/s electrical data and transmits the data as an optical signal. The transmitter contains a Clock Data Recovery (CDR) circuit that reduces the jitter of received signal and reshapes the electrical signal before the electrical to optical (E-O) conversion. The optical output power is maintained constant by an automatic power control(apc) circuit. The transmitter output can be turned off by TX disable signal, at TX_DIS pin.when TX_DIS is asserted high, the transmitter is turned off. Receiver Operation The received optical signal is converted to serial electrical data signal. The optical receiver contains a CDR circuits that reshapes and retimes an electrical signal before sending out to the XFI channel (i.e. XFP connector and high speed signal traces). The RX_LOS signal indicates insufficient optical power for reliable signal reception at the receiver. Management Interface A 2-wire interface (SCL, SDA) is used for serial ID, digital diagnostics and other control/monitor functions. The address of XFP transceiver is 1010000x. MOD_DESEL signal can be used in order to support multiple XFP modules on the same 2-wire interface bus. Interface is compliant to XFP MSA. 3

Transceiver Block Diagram Pin Definition and Descriptions Bottom View Top View XFP Transceiver Electrical Pad Layout 4

Pin# Name Logic Description Note 1 GND Module Ground 1 2 VEE5-5.2V Power Supply, not in use 3 MOD_DESEL LVTTL-I 4 INTERRUPTb LVTTL-O 5 TX_DIS LVTTL-I 6 VCC5 +5V Power Supply Module De-select; When held Low allows module to respond to 2-wire serial interface Indicates presence of an important condition, which can be read over the 2-wire serial interface. This pin is an open collector output and must be pulled up to host_vcc on the host board. Transmitter Disable; When asserted High, transmitter output is turned off. This pin is pulled up to VCC3 in the module 2 7 GND Module Ground 1 8 VCC3 +3.3V Power Supply 9 VCC3 +3.3V Power Supply 10 SCL I/O 11 SDA I/O 12 MOD_ABS LVTTL-O 13 MOD_NR LVTTL-O 14 RX_LOS LVTTL-O 2-wire serial interface clock. Host shall resistor connected to host_vcc of +3.3V. 2-wire serial interface data. Host shall use a pull-up resistor connected to host_vcc of +3.3V. Indicates Module is not present. Host shall pull up this pin, and grounded in the module. "High" when the XFP module is absent from a host board. Module not ready; When High, Indicates Module Operational Fault. This pin is an open collector and must be pulled to host_vcc on the host board. Receiver Loss of Signal; When high, indicates insufficient optical input power to the module. This pin is an open collector and must be pulled to host_vcc on the host board. 2 2 2 2,3,4 2 15 GND Module Ground 16 GND Module Ground 17 RDN CML-O 18 RDP CML-O Receiver Inverted Data Output; AC coupled inside the module. Receiver Non-Inverted Data Output; AC coupled in side the module. 19 GND Module Ground 1 20 VCC2 +1.8V Power Supply; not in use 21 P_DOWN/RST LVTTL-I Power down; When High, module is limited power mode. Low for normal operation. Reset; The falling edge indicates complete reset of the module. This pin is pulled up to VCC3 in the module. 22 VCC2 +1.8V Power Supply; not in use 23 GND Module Ground 1 24 REFCLKP PECL-I Reference clock Non-Inverted Input; not in use 5

Pin# Name Logic Description Note 25 REFCLKN PECL-I Reference clock Inverted Input; not in use 26 GND Module Ground 1 27 GND Module Ground 1 28 TDN CML-I 29 TDP CML-I Transmitter Inverted Data Input; AC coupled in side the module. Transmitter Non-Inverted Data Input; AC coupled in side the module. 30 GND Module Ground 1 Table 1: SFP+ Module PIN Definition Note: 1. Module ground pins are isolated from the module case and chassis ground within the module. 2. Shall be pulled up with 4.7k to 10k ohm to a voltage between 3.15V and 3.45V on the host board. 3. Response time: typ. 20msec ( XFP MSA Rev. 4.5 1msec) 4. MOD_NR = (TX LOL) OR (RX LOL ). Recommended Power Supply Filter 6

Recommended Electrical Interface to Host Absolute Maximum Ratings Parameter Symbol Min Max Unit Note Storage Temperature Tst -40 85 degc Relative Humidity (non-condensation) RH - 85 % Operating Case Temperature Topc -5 70 degc 1 Supply Voltage #5 VCC3-0.5 3.6 V Supply Voltage #5 VCC3-0.5 6.0 V Voltage on LVTTL Input Vilvttl -0.5 VCC3+0.5 V LVTTL Output Current Iolvttl - 15 ma Voltage on Open Collector Output Voco 0 6 V Receiver Input Optical Power(Average) Mip - -7 dbm 2 Note: 1. Ta: -10 to 60degC with 1.5m/s airflow with an additional heat sink. 2. APD Receiver. 7

Recommended Operating Conditions And Supply Requirements Parameter Symbol Min Max Unit Operating Case Temperature Topc -5 70 degc Relative Humidity (non-condensing) Rhop - 85 % Main Power Supply Voltage #3 VCC3 3.13 3.45 V Main Power Supply Current #3 ICC3-750 ma Power Supply Voltage #5 VCC5 4.75 5.25 V Power Supply Current #5 ICC5-200 ma Power Supply Voltage #2 VCC2 1.71 1.85 V Power Supply Current #2 ICC2-100 ma Total Power Consumption Pd - 3.5 W Low Speed Control And Alarm Signals Electrical Interface Parameter Symbol Min Max Units Note XFP Interrupt, Mod_NR, RX_LOS XFP TX_DIS, P_DOWN/RST XFP SCL and SDA Output XFP SCL and SDA Input Vol 0.0 0.4 V 1 Voh Vcc-0.5 Vcc+0.3 2 Vil -0.3 0.8 V 3 Vih 2.0 VCC3+0.3 4 Vol 0.0 0.4 V 1 Voh Vcc-0.5 Vcc+0.3 2 Vil -0.3 VCC3*0.3 V 5 Vih VCC3*0.7 VCC3+0.5 6 Capacitance for XFP SCL and SDA I/O pin Ci - 14 pf Total bus capacitive load for SCL and SDA Cb - 100 pf 7 400 pf 8 Note: 1. Pull-up resistor must be connected to host_vcc on the host board. Iol(max)=3mA 2. Pull-up resistor must be connected to host_vcc on the host board. 3. Pull-up resistor connected to VCC3 within XFP module. Iil(max)= -10μA. 4. Pull-up resistor connected to VCC3 within XFP module. Iih(max)= 10μA. 5. Pull-up resistor must be connected to host_vcc on the host board. Iol(max)= -10μA. 6. Pull-up resistor must be connected to host_vcc on the host board. Iol(max)= 10μA. 7. At 400KHz, 3.0kohms pull-up resister, at 100kHz 8.0kohms pull-up resister max. 8. At 400KHz, 0.8kohms pull-up resister, at 100kHz 2.0kohms pull-up resister max. 8

Optical Characteristics Transmitter Optical Interface Parameter Symbol Min Typical Max Unit Note Operating Data Rate - 9.95 10.70 Gb/s 1 Output Center Wavelength ltc 1530 1550 1565 nm SMSR SMSR 30 - db Average Output Power Po 0 +4 dbm 2 Disabled Power Poff - -30 dbm 2 Extinction Ratio ER 9 10 - db 2 Eye Mask 1(SONET/SDH) GR-253-CORE/ITU-T G.691 2 Eye Mask 2 (10G Ethernet) IEEE802.3ae 3 Generation Jitter 1 (20kHz - 80MHz) - 0.15 UIp-p 2,4 Generation Jitter 2 (4MHz - 80MHz) - 0.1 UIp-p 2,4 RIN RIN - -130 db/hz Receiver Optical Interface Parameter Symbol Min Typical Max Unit Note Operating Data Rate - 9.95 10.70 Gb/s 1 Input Center Wavelength lrc 1260 1600 nm Overload Rovl -7.0 - dbm Minimum Sensitivity Pmin - - -24.0 dbm 2 RX_LOS Assert Level RLOSa -35 dbm RX_LOS Deassert Level RLOSd -30 dbm RX_LOS Hysteresis RLOSh 1 5 db Optical Path Penalty PN - 2 db 1 Optical Return Loss ORL 27 - db Jitter Tolerance JTL GR-253-CORE/ITU-T G.783 9

Note: 1. Data rate tolerance -IR-2/S-64.2b,10GBASE-EW:typ.+/-20ppm -10GBASE-ER: typ.+/-100ppm 2. Measured at 10.3125Gbps,Non-framed PRBS2^31-1,NRZ 3. Measured by using FormericaOE XFP evaluation board. Digital Diagnostic Functions The following digital diagnostic characteristics are defined over the Recommended Operating Environment unless otherwise specified. It is compliant to SFF8472 Rev10.2 with internal calibration mode. For external calibration mode please contact our sales stuff. Parameter Symbol Min. Max Unit Notes Temperature monitor absolute error DMI_Temp -2.5 2.5 degc Over operating temp Laser power monitor absolute error RX power monitor absolute error Supply voltage monitor absolute error Bias current monitor DMI_TX -2.5 2.5 db DMI_RX -2.5 2.5 db DMI_VCC -0.08 0.08 V DMI_Ibias -10% 10% ma Table 2: Digital diagnostic specification table -1dBm to -15dBm range Full operating range 10

Content in 2-Wire Address A0H Address HEX Name of Field Description 128 06 Identifier XFP Power 3.5Wmax, with CDR, No TX Ref Clock,No CLEI code 129 90 Extended Identifier 130 07 Connector type LC 131 00 10G Ethernet Compliance Codes 10G Base ZR 132 00 Transceiveroptical~electricalcompatibility 1200-SM-LL-L 133 00 Transceiveroptical~electricalcompatibility Not compliant 134 00 Transceiveroptical~electricalcompatibility Not compliant 135 00 Transceiveroptical~electricalcompatibility Not compliant 136 00 Transceiveroptical~electricalcompatibility Not compliant 137 04 Transceiveroptical~electricalcompatibility G.959.1 P1L1-2D2 138 00 Transceiveroptical~electricalcompatibility Not compliant 139 10 Encoding NRZ 140 63 Bit Rate-min MIN Speed 9.9G/S 141 6F Bit Rate-max MIN Speed 11.1G/S 142 50 Length(SMF)-km 80 (units of km) 143 00 Length(E-50um) (units of 2m) 144 00 Length(50um) (units of 1m) 145 00 Length(62.5um) (units of 1m) 146 00 Length(copper) N/A (copper not supported) 147 76 Device TECH 46,4F,52,4D,45,52,49,43 Vendor Name 148 ~ 163,41,4F,45,20,20,20,20,20 1550EML NO wavelength control with cooled control APD detected FORMERICAOE CDR Support for 9.95Gb/s 10.3Gb/s 10.5Gb/s 10.7Gb/s 11.1Gb/s, 164 FC CDR support 165 ~ 167 00,00,00 Vendor OUI Unspecified 54,41,53,2D,58,35,55,53,31, 168 ~ 183 2D,51,31,31,20,20,20 Part Number TAS-X5US1-Q11 184 ~ 185 00,00 Vendor Revision number Unspecified 186 ~ 187 79,18 Laser Wavelength 1550nm 188 ~ 189 0F,A0 Wavelength Tolerance 20nm The highest working temperature (70 ) 190 46 Max Temp 191 Checksum Address 128-190 192 AF POWER Supply Supreme power (3500mW) 193 96 POWER Supply. Consume the power (1500mW) 194 66 POWER Supply 195 00 POWER Supply 196 ~ 211 Serial Number Serial Number 212 ~ 217 yy/mm/dd Date Code 218 ~ 219 20,20 Vendor specific lot code Unspecified 3.3V Electric current of largest consumption (600mA) 220 08 Diagnostic Monitoring Type NO FEC Bert support & average power suppor 221 40 Enhanced Options Soft TX_DISABLE implemented, 74 Aux Monitoring AUX 1:3.3V supply voltage, AUX 2:Laser temperature 222 223 Checksum Address 192-222 224~255 Vendor specific 11

Content in 2-Wire Address A2H Add Bytes Name Hex Real Value 00-01 2 Operation Description 0600 02-03 2 Temp High Alarm 5200 82 04-05 2 Temp Low Alarm F100-15 06-07 2 Temp High Warning 4D00 77 08-09 2 Temp Low Warning F600-10 10-11 2 Reserved FFFF Reserved 12-13 2 Reserved FFFF Reserved 14-15 2 Reserved FFFF Reserved 16-17 2 Reserved FFFF Reserved 18-19 2 Bias High Alarm C350 100Ma 20-21 2 Bias Low Alarm 1388 10mA 22-23 2 Bias High Warning AFC8 90MA 24-25 2 Bias Low Warning 1D4C 15mA 26-27 2 TX Power High Alarm 7B6D 5dBm 28-29 2 TX Power Low Alarm 1F00-1dBm 30-31 2 TX Power High Warning 6E00 4.5dBm 32-33 2 TX Power Low Warning 22D0-0.5dBm 34-35 2 RX Power High Alarm 0C5A -5dBm 36-37 2 RX Power Low Alarm 0010-27.96dBm 38-39 2 RX Power High Warning 09D0-6dBm 40-41 2 RX Power Low Warning 0014-26.99dBm 42-43 2 Voltage High Alarm 8CA0 3.6V 44-45 2 Voltage Low Alarm 7530 3V 46-47 2 Voltage High Warning 88B8 3.5V 48-49 2 Voltage Low Warning 7918 3.1V 50-51 2 Laser Temperature High Alarm 2A00 42 52-53 2 Laser Temperature Low Alarm 1800 24 54-55 2 Laser Temperature High Warning 2500 37 56-57 2 Laser Temperature Low Warning 1D00 29 58-69 12 Reserved 0000 0 70 1 Acceptable Ber 00 0 71 1 Actual Ber 00 0 72-73 2 Wavelength Set MSB 0000 0 74-75 2 Wavelength Error MSB 0000 0 76 1 Amplitude adjustment 00 0 77 1 Phase adjustment 00 0 78 1 Reserved 00 0 12

Mechanical Dimensions MSA Compliant EEPROM Structure 13

ESD This transceiver is specified as ESD threshold 2kV for all electrical input pins, tested per MIL-STD-883, Method 3015.4 /JESD22-A114-A (HBM). However, normal ESD precautions are still required during the handling of this module. This transceiver is shipped in ESD protective packaging. It should be removed from the packaging and handled only in an ESD protected environment. LASER Safety This is a Class 1 Laser Product according to IEC 60825-1:1993:+A1:1997+A2:2001. This product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser Notice No. 50, dated (July 26, 2001) 14