ULN2803AP,ULN2803AFW,ULN2804AP,ULN2804AFW (Manufactured by Toshiba Malaysia)

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Transcription:

TOSHIBA BIPOLAR DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC ULN2803AP,ULN2803AFW,ULN2804AP,ULN2804AFW (Manufactured by Toshiba Malaysia) 8CH DARLINGTON SINK DRIVER The ULN2803AP / AFW Series are high voltage, high current darlington drivers comprised of eight NPN darlington pairs. All units feature integral clamp diodes for switching inductive loads. Applications include relay, hammer, lamp and display (LED) drivers. FEATURES Output current (single output) 500 ma (Max.) High sustaining voltage output 50 V (Min.) Output clamp diodes Inputs compatible with various types of logic. Package Type AP : DIP 18pin Package Type AFW : SOL 18pin Weight DIP18 P 300 2.54F : 1.478 g (Typ.) SOL18 P 300 1.27 : 0.48 g (Typ.) TYPE INPUT BASE RESISTOR DESIGNATION ULN2803AP / AFW 2.7 kω TTL, 5 V CMOS ULN2804AP / AFW 10.5 kω 6~15 V PMOS, CMOS PIN CONNECTION (TOP VIEW) 1

SCHEMATICS (EACH DRIVER) ULN2803AP / AFW ULN2804AP / AFW Note: The input and output parasitic diodes cannot be used as clamp diodes. MAXIMUM RATINGS (Ta = 25 C) CHARACTERISTIC SYMBOL RATING UNIT Output Sustaining Voltage V CE (SUS) 0.5~50 V Output Current I OUT 500 ma / ch Input Voltage V IN 0.5~30 V Clamp Diode Reverse Voltage V R 50 V Clamp Diode Forward Current I F 500 ma Power Dissipation AP P D 1.47 W AFW 0.92 / 1.31 (Note) Operating Temperature T opr 40~85 C Storage Temperature T stg 55~150 C Note: On Glass Epoxy PCB (75 114 1.6 mm Cu 20%) 2

RECOMMENDED OPERATING CONDITIONS (Ta = 40~85 C) CHARACTERISTIC SYMBOL TEST CONDITION MIN TYP. MAX UNIT Output Sustaining Voltage V CE (SUS) 0 50 V Output Current AP AFW I OUT T pw = 25 ms, Duty = 10%, 8 Circuits T pw = 25 ms, Duty = 50%, 8 Circuits T pw = 25 ms, Duty = 10%, 8 Circuits T pw = 25 ms, Duty = 50%, 8 Circuits 0 347 0 123 0 268 0 90 Input Voltage V IN 0 30 V Input Voltage (Output On) ULN2803AP / AFW ULN2804AP / AFW V IN (ON) 3.5 30 8 30 Clamp Diode Reverse Voltage V R 50 V Clamp Diode Forward Current I F 400 ma Power Dissipation AP Ta = 85 C 0.76 P D AFW Ta = 85 C (Note) 0.48 Note: On Glass Epoxy PCB (75 114 1.6 mm Cu 20%) ma / ch V W 3

ELECTRICAL CHARACTERISTICS (Ta = 25 C) CHARACTERISTIC Output Leakage Current ULN2804AP / AFW SYMBOL TEST CIR CUIT I CEX 1 Collector Emitter Saturation Voltage VCE (sat) 2 Input Current Input Voltage (Output On) TEST CONDITION MIN TYP. MAX UNIT V CE = 50 V Ta = 25 C 50 V CE = 50 V Ta = 85 C 100 V CE = 50 V V IN = 1 V 500 I OUT = 350 ma, I IN = 500 µa 1.3 1.6 I OUT = 200 ma, I IN = 350 µa 1.1 1.3 I OUT = 100 ma, I IN = 250 µa 0.9 1.1 ULN2803AP / AFW V IN = 3.85 V 0.93 1.35 ULN2804AP / AFW ULN2803AP / AFW ULN2804AP / AFW I IN (ON) 2 V IN = 5 V 0.35 0.5 ma V IN = 12 V 1.0 1.45 I IN (OFF) 4 I OUT = 500 µa, Ta = 85 C 50 65 µa V IN (ON) 5 V CE = 2 V, I OUT = 200 ma 2.4 V CE = 2 V, I OUT = 250 ma 2.7 V CE = 2 V, I OUT = 300 ma 3.0 V CE = 2 V, I OUT = 125 ma 5.0 V CE = 2 V, I OUT = 200 ma 6.0 V CE = 2 V, I OUT = 275 ma 7.0 V CE = 2 V, I OUT = 350 ma 8.0 DC Current Transfer Ratio h FE 2 V CE = 2 V, I OUT = 350 ma 1000 Clamp Diode Reverse Current I R 6 Ta = 25 C (Note) 50 Ta = 85 C (Note) 100 Clamp Diode Forward Voltage V F 7 I F = 350 ma 2.0 V Input Capacitance C IN 15 pf Turn On Delay t ON 8 R L = 125 Ω, V OUT = 50 V 0.1 Turn Off Delay t OFF R L = 125 Ω, V OUT = 50 V 0.2 µa V V µa µs Note: V R = V R MAX. 4

TEST CIRCUIT 1. I CEX 2. V CE (sat), h FE 3. I IN (ON) 4. I IN (OFF) 5. V IN (ON) 6. I R 7. V F 5

8. t ON, t OFF Note 1: Pulse Width 50 µs, Duty Cycle 10% Output Impedance 50 Ω, t r 5 ns, t f 10 ns Note 2: See below. INPUT CONDITION TYPE NUMBER R1 V IH ULN2803AP / AFW 0Ω 3 V ULN2804AP / AFW 0Ω 8 V Note 3: C L includes probe and jig capacitance PRECAUTIONS for USING This IC does not integrate protection circuits such as overcurrent and overvoltage protectors. Thus, if excess current or voltage is applied to the IC, the IC may be damaged. Please design the IC so that excess current or voltage will not be applied to the IC. Utmost care is necessary in the design of the output line, COMMON and GND line since IC may be destroyed due to short circuit between outputs, air contamination fault, or fault by improper grounding. 6

7

8

PACKAGE DIMENSIONS DIP18 P 300 2.54F Unit: mm Weight: 1.478 g (Typ.) 9

PACKAGE DIMENSIONS SOL18 P 300 1.27 Unit: mm Weight: 0.48 g (Typ.) 10

RESTRICTIONS ON PRODUCT USE 000707EBA TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the Handling Guide for Semiconductor Devices, or TOSHIBA Semiconductor Reliability Handbook etc.. The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ( Unintended Usage ). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer s own risk. The products described in this document are subject to the foreign exchange and foreign trade laws. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. The information contained herein is subject to change without notice. 11

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