QPB9324SR. High Power Switch LNA Module. Product Overview. Key Features. Functional Block Diagram. Applications. Ordering Information

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Product Overview The Qorvo is a highly integrated front-end module targeted for TDD macro or picocell base stations. The switch module integrates RF functional blocks such as a pin-diode based high power switch capable of handling up to 52 W with an LTE signal (8 db PAR) along with two stages. Further integration is also implemented where the pin diode driver and dc-dc converter circuits are implemented inside the module to enable only the need for an external 5 V power supply. The control voltage for the switch and gain control. mode is with 3.3 V logic. The can be utilized across the 3.4-3.6 GHz range to provide 1.2 db noise figure for operation in the receive mode and.5 db insertion loss in the transmit mode. The s utilize Qorvo s high performance E-pHEMT process while the switch allows for power levels up to 33 W peak power to be routed to an external load termination. The is packaged in a RoHS-compliant, compact 8x8 mm surface-mount leadless package. The switch module is targeted for wireless infrastructure applications configured for TDD-based architectures. 16 Pin 8 mm x 8 mm leadless SMT Package Key Features 3.4-3.6 GHz frequency range Integrates a high power switch, two stages, pin diode driver circuits, and dc converter Ideal for TDD systems with an isolator Only requires a 5 V supply with 3.3 V logic control Max RF Input power: 52 W Pavg (8 db PAR) 33.8 db gain 1.2 db noise figure -.6 dbm IIP3 (Rx mode).5 db Insertion Loss (Tx mode) Compact package size, 8x8 mm Functional Block Diagram Pin 1 Reference Mark Package Topside TERM 16 15 14 13 Applications ANT 1 2 12 11 RXOUT Wireless Infrastructure Macro or picocell base stations TDD-based architectures T/R Vcc 3 4 DC-DC Conversion 1 9 CB CA Ordering Information 5 6 7 8 Exposed Backside Pad GND Part No. TR13 Description 25 pcs on a 13 reel LA LB DA DB SR 1 pcs on a 7 reel Top View EVB Evaluation board Datasheet, May 22, 218 Subject to change without notice 1 of 1 www.qorvo.com

Absolute Maximum Ratings Parameter Rating Storage Temperature -5 to 15 C Operating Temperature +115 C VCC +6 V RF at ANT (Tx Mode), 1sec. (1) +47.2 dbm RF at ANT (Tx Mode), Indefinitely (1) +44.2 dbm RF at ANT (Rx Mode), Indefinitely (1) +2 dbm RF at ANT (Rx Mode), WCDMA PAR=1dB (2) +26 dbm RF at ANT (Rx Mode), CW (2) +29 dbm RF at ANT (Rx Mode), 1 µs pulse 1% duty cycle (3) +31.5 dbm 1. LTE 1ch, 8 db PAR, 88% duty cycle, 1.4 µs repetition time, TCASE = +1 C 2. 12 hours, TCASE = +25 C 3. 2 hour x 2 cycles, TCASE = +6 C & then 2 hour x 3 cycles, TCASE = +75 C Operation of this device outside the parameter ranges given above may cause permanent damage. Recommended Operating Conditions Parameter Min Typ Max Units VCC +4.75 +5 +5.25 V T/R Logic Low Voltage.8 V T/R Logic High Voltage 2. 3.6 V TCASE 4 +15 C Tj for >1 6 hours MTTF (1) +19 C 1. For RX Mode operation Electrical specifications are measured at specified test conditions. Specifications are not guaranteed over all recommended operating conditions. Electrical Specifications Test conditions unless otherwise noted: VCC = +5. V, Temp. = +25 C, 5 Ω system Parameter Conditions Min Typ Max Units Operational Frequency Range 34 36 MHz Gain Rx mode 33.8 db Gain Flatness Rx mode.5 db Noise Figure Rx mode 1.2 db Input IP3 Rx mode, Pin/tone = -33dBm, Δf = 1MHz -.6 dbm Input P1dB Rx mode -15.4 dbm Input Return Loss (ANT) Rx mode 26 db Output Return Loss (Rx Out) Rx mode 23 db Reverse Isolation Rx mode 58 db Insertion Loss Tx mode.5 db Input P.1dB Tx mode 46.6 dbm Return Loss (ANT, TERM) Tx mode 27 db Operating Current Rx mode 24 ma Operating Current Tx mode 145 ma Switching Time (ANT to Rx Out) Reaching RF full output less.1db after 2 μs Switching Time (ANT to Term) T/R command 1 μs Reaching RF full output less.5db after Wakeup Time (ANT to Rx Out/Term) DC turn on 1 sec. In Band Spurious Emission (1) Rx Mode at Rx out with Pin = -49dBm (2) -85 dbc Out of Band Emissions (3) Rx Mode at Rx out from DC to 12275MHz -65 dbm Thermal Resistance Rx mode 22 C/W Thermal Resistance Tx mode 22 C/W 1. Pin is a CW signal swept from 3.4 to 3.6GHz. Specification refers to any mixing product that occurs in 3.4 to 3.6GHz band. 2. Follow Qorvo EVB layout for lowest spur level, any deviation may increase spur level. 3. Measure Pout with IBW = 4.5MHz over frequency range with no input power applied. Datasheet, May 22, 218 Subject to change without notice 2 of 1 www.qorvo.com

Application Circuit Schematic and Layout J3 TERM 16 15 14 13 J1 ANT 1 12 J2 RXOUT 2 11 J4-P4 T/R R1 C2 1 pf J4-P1 Vcc C1 1 uf 3 4 5 DC-DC Conversion 6 7 8 1 9 C5 2.2 uf C4 2.2 uf L1 1 uh D1 Note: L1 placement for in band spur suppression - 5mm from bottom edge of U1 to top edge of L1 Bill of Material Ref Des Value Description Manuf. Part Number n/a n/a Printed Circuit Board U1 n/a Qorvo R1, R2 Ω Resistor, Chip, 42, 5% Various C1 1 uf Capacitor, Chip, 63, 2%, X7R Various C2 1 pf Capacitor, Chip, 42, NPO/COG, 5% Various C4, C5 2.2 uf Capacitor, Chip, 121, 1 V, 1%, X7R Various D1 n/a Diode 2 V 2 ma SOT23 Various L1 1 uh Inductor, Power, 1 uh, 2%,.84 A Coilcraft LPS4183ML Logic Table Parameter High Low T/R Switch Control Rx Mode Tx Mode Datasheet, May 22, 218 Subject to change without notice 3 of 1 www.qorvo.com

Input P1dB S12 (db) Noise Figure (db) Input IP3 (dbm) S21 (db) S11 (db) S22 (db) Typical Performance Rx Mode Parameter Conditions (1) Typical Value Units Frequency 34 35 36 MHz Gain 34. 33.8 33.5 db Input IP3 Pin = -33 dbm/tone, Δf=1 MHz -2. -.6 -.6 dbm Input P1dB -15.5-15.4-14.9 dbm Noise Figure De-embedded from Evaluation board PCB 1.2 1.2 1.2 db Return Loss ANT port 18 26 24 db Return Loss Rx Out port 24 23 21 db Reverse Isolation Rx Out to ANT port 58 58 58 db 1. Test conditions unless otherwise noted: V CC = +5. V, T/R = 3 V, Temp. = +25 C Performance Plots Rx Mode Test conditions unless otherwise noted: V CC = +5. V, T/R = 3 V; Temp.= +25 C 37 RX Gain ANT Return Loss Rx Out Return Loss 36 35 34 33 32 31 3 29-5 -15-2 -25-3 -35-5 -15-2 -25-3 Reverse Isolation 2. Noise Figure 5 Input IP3 vs Frequency -2-3 -4 1.5 1. -5-6.5-5 -7. Input P1dB vs frequency -11-12 -13-14 -15-16 -17-18 -19-2 34 345 35 355 36 Datasheet, May 22, 218 Subject to change without notice 4 of 1 www.qorvo.com

Gain Compression (db) S31 (db) S11 (db) S33 (db) Typical Performance Tx Mode Parameter Conditions (1) Typical Value Units Frequency 34 35 36 MHz Insertion Loss De-embedded from Evaluation board PCB.5.5.5 db Input Compression Pin = +47.6 dbm.1.2.1 db Return Loss ANT port 26 35 4 db Return Loss TERM port 25 27 29 db 1. Test conditions unless otherwise noted: V CC = +5. V, T/R = V, Temp. = +25 C Performance Plots Tx Mode Test conditions unless otherwise noted: VCC = +5. V, T/R = V; Temp.= +25 C Tx mode Insertion Loss. -.1 -.2 -.3 -.4 -.5 -.6 -.7 -.8 -.9 De-embedded from eval board -1. ANT Return Loss -5-15 -2-25 -3-35 -4-45 -5 Term Return Loss -5-15 -2-25 -3-35 1. Input P.1dB.8.6 at Pin = +46.6dBm at Pin = +47.6dBm at Pin = +47.5dBm.4.2. 34 345 35 355 36 Datasheet, May 22, 218 Subject to change without notice 5 of 1 www.qorvo.com

Application Circuit for Spurious Reduction This section describes an alternative way to route the DC-DC converter signals for further improvement of in-band spurious emissions. Spurious (Mixing Products) Plots Rx Mode Test conditions unless otherwise noted: V CC = +5. V, T/R = +3. V, RF input at ANT = -35dBm CW; Temp.= +25 C With Original EVB With Modified Circuits and PCB Datasheet, May 22, 218 Subject to change without notice 6 of 1 www.qorvo.com

Application Circuit Schematic and Layout Modified EVB J3 J1 C2 C1 U1 R3 C5 C4 J2 L1 D1 R2 R1 J4 Note: R3 is the additional component along with PCB trace modifications. All other parts are same as the Evaluation Board on page 3. Bill of Material Modified Circuits and PCB Ref Des Value Description Manuf. Part Number n/a n/a Printed Circuit Board U1 n/a Qorvo R1, R2 Ω Resistor, Chip, 42, 5% Various C1 1 μf Capacitor, Chip, 63, 2%, X7R Various C2 1 pf Capacitor, Chip, 42, NPO/COG, 5% Various C4, C5 2.2 μf Capacitor, Chip, 121, 1 V, 1%, X7R Various D1 n/a Diode 2 V 2 ma SOT23 Various L1 1 μh Inductor, Power, 1 uh, 2%,.84 A Coilcraft LPS4183ML R3 1 kω Resistor, Chip, 42, 5% Various Datasheet, May 22, 218 Subject to change without notice 7 of 1 www.qorvo.com

Pin Configuration and Description Pin 1 Reference Mark Package Topside TERM 16 15 14 13 ANT 1 12 RXOUT 2 11 T/R 3 DC-DC Conversion 1 CB Vcc 4 9 CA 5 6 7 8 Exposed Backside Pad GND LA LB DA DB Top View Pin No. Label Description 1 ANT RF antenna input/output port, 5 ohm 2, 11, 13, 14, 15 No Internal Connection. 3 T/R Switch Control, Tx mode Low state, Rx mode High state. 4 VCC DC Power Supply Voltage. 5 LA External inductor connection for DC-DC convertor. 6 LB External inductor connection for DC-DC convertor. 7 DA External diode anode connection for DC-DC convertor. 8 DB External diode cathode connection for DC-DC convertor. 9 CA External filtering capacitor connection for DC-DC convertor. 1 CB External filtering capacitor connection for DC-DC convertor. 12 Rx OUT RF output port, 5 ohm 16 TERM RF termination port, 5 ohm Backside Pad GND Ground connection. The back side of the package should be connected to the ground plan though as short of a connection as possible. PCB via holes under the device are required. Datasheet, May 22, 218 Subject to change without notice 8 of 1 www.qorvo.com

Package Marking and Dimensions Marking: Part number Trace Code Assigned by assembly sub-contractor 1. All dimensions are in microns. Angles are in degrees. 2. Dimension and tolerance formats conform to ASME Y14.4M-1994. 3. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-12. Datasheet, May 22, 218 Subject to change without notice 9 of 1 www.qorvo.com

Handling Precautions Parameter Rating Standard ESD Human Body Model (HBM) Class 1C ESDA / JEDEC JS-1-212 ESD Charged Device Model (CDM) Class C3 JEDEC JESD22-C11F MSL Moisture Sensitivity Level Level 3 IPC/JEDEC J-STD-2 Caution! ESD-Sensitive Device Solderability Compatible with both lead-free (26 C max. reflow temp.) and tin/lead (245 C max. reflow temp.) soldering processes. Solder profiles available upon request. Contact plating: Electrolytic plated Au over Ni RoHS Compliance This part is compliant with 211/65/EU RoHS directive (Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment) as amended by Directive 215/863/EU. This product also has the following attributes: Product uses RoHS Exemption 7c-I to meet RoHS Compliance requirements. Halogen Free (Chlorine, Bromine) Antimony Free TBBP-A (C15H12Br42) Free PFOS Free SVHC Free Contact Information For the latest specifications, additional product information, worldwide sales and distribution locations: Web: www.qorvo.com Tel: 1-844-89-8163 Email: customer.support@qorvo.com For technical questions and application information: Email: appsupport@qorvo.com Important Notice The information contained herein is believed to be reliable; however, Qorvo makes no warranties regarding the information contained herein and assumes no responsibility or liability whatsoever for the use of the information contained herein. All information contained herein is subject to change without notice. Customers should obtain and verify the latest relevant information before placing orders for Qorvo products. The information contained herein or any use of such information does not grant, explicitly or implicitly, to any party any patent rights, licenses, or any other intellectual property rights, whether with regard to such information itself or anything described by such information. THIS INFORMATION DOES NOT CONSTITUTE A WARRANTY WITH RESPECT TO THE PRODUCTS DESCRIBED HEREIN, AND QORVO HEREBY DISCLAIMS ANY AND ALL WARRANTIES WITH RESPECT TO SUCH PRODUCTS WHETHER EXPRESS OR IMPLIED BY LAW, COURSE OF DEALING, COURSE OF PERFORMAE, USAGE OF TRADE OR OTHERWISE, ILUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE. Without limiting the generality of the foregoing, Qorvo products are not warranted or authorized for use as critical components in medical, life-saving, or life-sustaining applications, or other applications where a failure would reasonably be expected to cause severe personal injury or death. Copyright 218 Qorvo, Inc. Qorvo is a registered trademark of Qorvo, Inc. Datasheet, May 22, 218 Subject to change without notice 1 of 1 www.qorvo.com