FERROXCUBE DATA SHEET Supersedes data of September 2004 2008 Sep 01
SMD COMMON MODE CHOKES FOR EMI-SUPPRESSION General data ITEM Strip material Solderability Taping method SPECIFICATION copper (Cu), tin (Sn) plated IEC 60068-2-58, Part 2, Test Ta, method 1 IEC 60286-3, EIA 481-1-A and EIA 481-2 Grades, parameters and type numbers GRADE Z typ (1) (Ω) at f (MHz) TYPE NUMBER CMS2-5.6/3/4.8 mass 0.3 g 4S2 21 25 CMS2-5.6/3/4.8-4S2 35 100 50 300 CMS2-5.6/3/8.9 mass 0.6 g 4S2 38 25 CMS2-5.6/3/8.9-4S2 60 100 GRADE Z typ (1) (Ω) at f (MHz) CMS4-11/3/4.8 mass 0.6 g 4S2 12 25 CMS4-11/3/4.8-4S2 inner 23 100 channel 42 300 4S2 15 25 outer 30 100 channel 50 300 CMS4-11/3/8.9 mass 1.1 g 4S2 23 25 CMS4-11/3/8.9-4S2 inner 45 100 channel 82 300 4S2 27 25 outer 58 100 channel 97 300 Note 1. Typical values, Z min is 20%. DC resistance <0.6 mω. TYPE NUMBER Mechanical data 8.9 0.5 >5 >1.2 4.75 ±0.3 >1.1 >1.2 1.33 ±0.2 1.27 ±0.07 3.04 max. 3.04 max. CBW180 0.2 0.2 5.6 ±0.2 a. CMS2-5.6/3/8.9 (side view). b. CMS2-5.6/3/4.8 (side view). Front view (a and b). Fig.1 CMS2-5.6/3/4.8 and CMS2-5.6/3/8.9. 2008 Sep 01 1443
8.9 0.5 >5 >1.2 4.75 ±0.3 >1.1 >1.2 1.33 ±0.2 1.27 ±0.07 handbook, handbook, full pagewidth halfpage 3.04 max. 3.04 max. CBW181 0.2 0.2 10.8 ±0.3 a. CMS4-11/3/8.9 (side view). b. CMS4-11/3/4.8 (side view). Front view (a and b). Fig.2 CMS4-11/3/4.8 and CMS4-11/3/8.9. Recommended dimensions of solder lands 1.8 6.4 2.8 MBG063 6.4 1.8 2.0 0.8 MBG064 Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm ( 0.7 mg solder paste per mm 2 ). Fig.3 Solder lands for reflow soldering of CMS2-5.6/3/4.8. Fig.4 Solder lands for wave soldering of CMS2-5.6/3/4.8. 2008 Sep 01 1444
1.8 10.8 7.0 10.8 1.8 6.0 CBW291 CBW292 Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm ( 0.7 mg solder paste per mm 2 ). Fig.5 Solder lands for reflow soldering of CMS2-5.6/3/8.9. Fig.6 Solder lands for wave soldering of CMS2-5.6/3/8.9. 6.4 1.8 2.8 MBG065 6.4 1.8 2.0 0.8 MBG066 Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm ( 0.7 mg solder paste per mm 2 ). Fig.7 Solder lands for reflow soldering of CMS4-11/3/4.8. Fig.8 Solder lands for wave soldering of CMS4-11/3/4.8. 2008 Sep 01 1445
10.8 1.8 10.8 7.0 1.8 6.0 CBW289 CBW290 Dimensions of solder lands are based on a solder paste layer thickness of approximately 200 µm ( 0.7 mg solder paste per mm 2 ). Fig.9 Solder lands for reflow soldering of CMS4-11/3/8.9. Fig.10 Solder lands for wave soldering of CMS4-11/3/8.9. 2008 Sep 01 1446
Soldering profiles Temp in o C Preheat 480 sec max Soldering 20-40 sec 255-260 o C 217 o C max 200 o C 3 o C/s max 6 o C/s max min 150 o C 60-180 sec 60-150 sec 25 o C MFP129 Time in sec Fig.11 Reflow soldering. 300 T ( C) 250 10 s 235 C to 260 C second wave MLA861 200 first wave 5 K/s 150 200 K/s 2 K/s 100 100 C to 130 C forced cooling 50 2 K/s 0 0 50 100 150 200 t (s) 250 Typical values (solid line). Process limits (dotted lines). Fig.12 Double wave soldering. 2008 Sep 01 1447
BLISTER TAPE AND REEL DIMENSIONS handbook, full pagewidth K 0 T D 0 P 0 P 2 E cover tape F W B0 A 0 D 1 MEA613-1 P 1 direction of unreeling For dimensions see Table 1. Fig.13 Blister tape. Table 1 Physical dimensions of blister tape see Fig.13 DIMENSIONS (mm) SIZE CMS2-5.6/3/4.8 CMS2-5.6/3/8.9 CMS2-5.6/3/8.9 CMS4-11/3/8.9 A 0 5.26 5.99 5.23 10.13 B 0 6.07 9.09 11.18 11.56 K 0 3.18 3.18 4.5 4.5 T 0.3 0.33 0.34 0.36 W 12 16 24 24 E 1.75 1.75 1.75 1.75 F 5.5 7.5 11.75 11.5 D 0 1.5 1.5 1.5 1.5 D 1 1.5 1.5 1.5 1.5 P 0 4.0 4.0 4.0 4.0 P 1 8.0 8.0 8.0 16.0 P 2 2.0 2.0 2.0 2.0 2008 Sep 01 1448
handbook, full pagewidth W 2 20.5 12.75 0.15 0 N A W 1 MSA284 For dimensions see Table 2. Fig.14 Reel. Table 2 Reel dimensions see Fig.14 DIMENSIONS (mm) SIZE A N W 1 W 2 12 330 100 ±5 12.4 16.4 16 330 100 ±5 16.4 20.4 24 330 100 ±5 24.4 28.4 2008 Sep 01 1449
DATA SHEET STATUS DEFINITIONS DATA SHEET STATUS Preliminary specification PRODUCT STATUS Development DEFINITIONS This data sheet contains preliminary data. Ferroxcube reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. Product specification Production This data sheet contains final specifications. Ferroxcube reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. DISCLAIMER Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Ferroxcube customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Ferroxcube for any damages resulting from such application. PRODUCT STATUS DEFINITIONS STATUS INDICATION DEFINITION Prototype Design-in Preferred Support These are products that have been made as development samples for the purposes of technical evaluation only. The data for these types is provisional and is subject to change. These products are recommended for new designs. These products are recommended for use in current designs and are available via our sales channels. These products are not recommended for new designs and may not be available through all of our sales channels. Customers are advised to check for availability. 2008 Sep 01 1450