Reference Guide & Test Report

Similar documents
TI Designs: Biometric Steering Wheel. Amy Ball TIDA-00292

TIDA Test Report 1/4/2016. TIDA Test Report 1/4/2016

Low Voltage Brushed Motor System

Texas Instruments. PMP4435 REVA Test Procedure. China Power Reference Design REVA

TI Designs TIDA Automotive 1.3M Camera Module Design with OV10640, DS90UB913A and power over Coax Test Data

1 Photo. Bottom side. 11/7/2014 PMP10783 Rev A Test Results

TI Designs: TIDA Passive Equalization For RS-485

PHOTO OF THE PROTOTYPE

SEPIC, added CC charging by additional current ctr ( via TLC272) TPS40210 and CSD18563Q5A

Topology: Active Clamp Forward Device: UCC2897A Unless otherwise mentioned the measurements were done with about 2A output current.

Test Report TIDA November 2015

Collin Wells, Jared Becker TI Designs Precision: Verified Design Low-Cost Digital Programmable Gain Amplifier Reference Design

Rahul Prakash, Eugenio Mejia TI Designs Precision: Verified Design Digitally Tunable MDAC-Based State Variable Filter Reference Design


TI Designs Precision: Verified Design Window Comparator Reference Design

Test Data For PMP /05/2012

TIDA Brushless DC Propeller Controller Reference Design

TIDA Dual High Resolution Micro-Stepping Driver

AN-2119 LM8850 Evaluation Board Application Note

11/27/2012 Milan Marjanovic PMP7246 Rev.B Test Results

TI Precision Designs: Reference Design 50 ma-20 A, Single-Supply, Low-Side or High-Side, Current Sensing Solution

AN-87 Comparing the High Speed Comparators

TIDA00322: Design Overview. Description:

Test Report: PMP30267RevC Automotive Power Solution

Application Report. 1 Background. PMP - DC/DC Converters. Bill Johns...

SLM6260. Sillumin Semiconductor Co., Ltd. Rev. 02 December V 6A PWM STEP-UP DC-DC CONVERTER

AN-288 System-Oriented DC-DC Conversion Techniques

PMP6857 TPS40322 Test Report 9/13/2011

Design PMP4489 Test Results

bq40zxx Manufacture, Production, and Calibration


TI Designs: TIDA Transient Robustness for Current Shunt Monitor

TI Designs Precision: Verified Design Instrumentation Amplifier with DC Rejection Reference Design

Tom Hendrick, Jose Duenas TI Designs Precision: Verified Design ±15A Current Sensor using Closed-Loop Compensated Fluxgate Sensor Reference Design

Application Report ...

Introduction to Isolated Topologies

LM325 LM325 Dual Voltage Regulator

MHz Dual-Channel Receiver With 16-Bit ADC and 100 MHz of IF

DPI Evaluation TPS65310-Q1

Design Resources Ask The Analog Experts WEBENCH Design Center TI Precision Designs Library R I R F

Ultra-Small Footprint P-Channel FemtoFET MOSFET Test EVM

TI Precision Designs: Verified Design Hardware Pace using Slope Detection

TI Designs: PMP9772 Low-Input Voltage High-Current Boost Converter With TPS61088

Power Systems Design Tools

User's Guide. SLOU262 July 2009 Isolated CAN Transceiver EVM 1

A Numerical Solution to an Analog Problem

Application Report. Tahar Allag / Chris Glaser... Battery Power Applications

AN-1453 LM25007 Evaluation Board

TI Precision Designs: Verified Design Band-Pass Filtered, Inverting -40 db Attenuator, 10 Hz 100 khz, 0.1 db Error

PMP8020 TPS92560 High Power 20W AR111 Boost LED Driver Reference Design

PMP6017 TPS Vac Single Stage Non-Dimmable 50W LED Driver Reference Design

High-Side Measurement CURRENT SHUNT MONITOR

3.3 V Dual LVTTL to DIfferential LVPECL Translator

1.5 C Accurate Digital Temperature Sensor with SPI Interface

DS9638 DS9638 RS-422 Dual High Speed Differential Line Driver

Design Note DN503. SPI Access By Siri Namtvedt. Keywords. 1 Introduction CC1100 CC1101 CC1150 CC2500 CC2550. SPI Reset Burst Access Command Strobes

50ppm/ C, 50µA in SOT23-3 CMOS VOLTAGE REFERENCE

TRF3765 Synthesizer Lock Time

TL317 3-TERMINAL ADJUSTABLE REGULATOR

2 C Accurate Digital Temperature Sensor with SPI Interface

HF Power Amplifier (Reference Design Guide) RFID Systems / ASP

Precision Summing Circuit Supporting High Output Current From Multiple AFEs in Ultrasound Application

DC-Coupled, Fully-Differential Amplifier Reference Design

LOAD SHARE CONTROLLER

Small, Dynamic Voltage Management Solution Based on TPS62300 High-Frequency Buck Converter and DAC6571

PMP6025 TPS VAC Input, 3.5W Output LED Driver Candelabra (E12) and Small Form Factor LED Lightbulbs Test Report

Hands-On: Using MSP430 Embedded Op Amps

High sensitive photodiodes

Embedded Scheduler in Cell Battery Monitor of the bq769x0

+15V. -15V 0.1uF. 0.1uF. 4.7uF +VSENSE CMP DAC8760 IOUT GND. 0.1uF

Inside the Delta-Sigma Converter: Practical Theory and Application. Speaker: TI FAE: Andrew Wang

POSITIVE-VOLTAGE REGULATORS

TL594 PULSE-WIDTH-MODULATION CONTROL CIRCUIT

Effect of Programmable UVLO on Maximum Duty Cycle Achievable With the TPS4005x and TPS4006x Family of Synchronous Buck Controllers

DRV10963 Evaluation Module

Class-D Amplifier External Load Diagnostics

TI Precision Designs: Verified Design ±10V 4-Quadrant Multiplying DAC

SN54HC365, SN74HC365 HEX BUFFERS AND LINE DRIVERS WITH 3-STATE OUTPUTS

Technical Documents. SLVSD67 SEPTEMBER 2015 TPS65651 Triple-Output AMOLED Display Power Supply

TL-SCSI285 FIXED-VOLTAGE REGULATORS FOR SCSI ACTIVE TERMINATION

LM2925 LM2925 Low Dropout Regulator with Delayed Reset

PMP6015 TPS Vac TRIAC Dimmable LED Driver Reference Design

PIN-PIN Compatible Cross-Reference Guide Competitor

4423 Typical Circuit A2 A V

ORDERING INFORMATION PACKAGE

NE555, SA555, SE555 PRECISION TIMERS

TL FIXED-VOLTAGE REGULATORS FOR SCSI ACTIVE TERMINATION

AM26LS31 QUADRUPLE DIFFERENTIAL LINE DRIVER

APPLICATION BULLETIN

High-Voltage Signal Conditioning for Low-Voltage ADCs

TL494 PULSE-WIDTH-MODULATION CONTROL CIRCUITS

AN-Note 1374 Use of LMV225 Linear-In-dB RF Power Detector in. CDMA2000 1X and EV_DO Mobile Station and Access Terminal

LM124, LM124A, LM224, LM224A LM324, LM324A, LM2902 QUADRUPLE OPERATIONAL AMPLIFIERS

Moving from legacy 24 GHz to state-of-the-art 77 GHz radar

SN75150 DUAL LINE DRIVER

SN54HC175, SN74HC175 QUADRUPLE D-TYPE FLIP-FLOPS WITH CLEAR

The TPS61042 as a Standard Boost Converter

SN5407, SN5417, SN7407, SN7417 HEX BUFFERS/DRIVERS WITH OPEN-COLLECTOR HIGH-VOLTAGE OUTPUTS

TPS51124 User s Guide. SLUU252A APRIL 2006 Revised JULY High Performance Synchronous Buck EVM Using the TPS User s Guide

ORDERING INFORMATION PACKAGE

Transcription:

Advanced Low Power Reference Design Florian Feckl Low Power DC/DC, ALPS Smart Meter Power Management with Energy Buffering Reference Guide & Test Report CIRCUIT DESCRIPTION Smart Wireless Sensors are typically powered by Long-Life Batteries like the LiSOCl2 chemistry - which are limited in current. However, these sensors require high current pulses for transmitting the gathered data wirelessly. This Reference Designs provides a solution for powering the MCU by down conversion of the battery voltage. As well, it provides a high current rail for the power pulses of the radio frequency power amplifier (RF-PA). The pulses are decoupled from the battery by Energy Buffering. BENEFITS Buck Rail for lower MCU voltage Boost Rail for the RF-PA Load Decoupling with Energy Buffering Ultra Low Iq Longer Battery runtime by VDD Down Conversion APPLICATIONS IoT Wireless Sensor Nodes Smart Flow Meter Heat Cost Allocator LINKS TPS62740 Product Page TPS61291 Product Page Energy Buffering Application Note PMP9753 Energy Buffering Reference Design Advanced Low Power Solutions Page 1/10

TABLE OF CONTENTS 1 Introduction... 3 2 Reference Design Description... 4 3 Schematics... 6 4 Measurement Results... 8 4.1 Power System Start-Up... 8 4.2 Protocol Transmission... 9 5 Summary... 10 LIST OF FIGURES Figure 1: Smart Wireless Sensor Node - Power Block-Diagram... 3 Figure 2: Reference Design Block Diagram... 4 Figure 3: Energy Buffering Sequence... 5 Figure 4: Low-Iq Buck incl. Energy Buffering Circuit Excerpt... 6 Figure 5: Low-Iq Boost Circuit... 7 Figure 6: System start-up waveforms... 8 Figure 7: Load Pulse Cycle Overview... 9 Advanced Low Power Solutions Page 2 of 10

1 Introduction Smart Wireless Sensor Nodes are one of the main enabler in the IoT. These Sensor nodes provide measurement data from anywhere every time. This means that these nodes are being placed somewhere in the field. They need to gather and process data to be sent to a centralized server. Therefore they do not only have to be smart (pre-calculation of data), they also have to be wireless (enable the measurement of data without cable infrastructure) and long-life (as every maintenance cycle is cost). From a power perspective, this means that the overall average power consumption needs to be very low, which is achieved by the usage of Low Power MCU s. It means, however, an occasional high current is needed to transmit the data to the base station. The required voltage and current depends on the radio standard and distance to the receiver. To achieve long system runtime, Smart Wireless Sensor Nodes are usually powered from Lithium Primary Batteries. These battery types feature a very long lifetime for itself and a high energy density in combination with very low self-discharge. A widely used example is LiSOCl2 chemistry types which feature a very high energy density. This type of battery brings, however, a high internal impedance and the property of losing available capacity due to higher currents. The smart wireless sensor node can be split in two Blocks with different power requirements (Figure 1): The MCU which needs to be supplied all time with a very low average current consumption in the range of hundreds of Micro Amperes. The radio frequency power amplifier requires a higher voltage and currents like 200mA for example. Lithium Primary Battery? Rail A:1.9V MCU RF-PA Rail B: 3.3V Pulsed current Figure 1: Smart Wireless Sensor Node - Power Block-Diagram Advanced Low Power Solutions Page 3 of 10

2 Reference Design Description This Reference Design shows a whole power architecture to provide the optimized rails for a smart wireless sensor. It contains the Energy Buffering Concept based on the TPS62740, a 360nA quiescent current buck converter, in combination with an EDLC (electric double layer capacitor) or a so called Supercapacitor. MCU Control Power VSEL LowIq-Buck TPS62740 LowIq-Boost TPS61291 RF Power - Amplifier Figure 2: Reference Design Block Diagram The circuit uses a resistor at the output of the TPS62740 to limit the current into the Storage Capacitor as well as the battery current drawn from the primary cell. The resistor is selected in a way to keep the load, and thereby the battery current, below a level that the primary battery can support. The TPS62740 features digital inputs to adjust the output voltage by four VSEL Pins. During the charging of the EDLC, the output voltage can be stepped up in 100mV steps. This helps to minimize the power losses caused by the resistor. The step-up converter TPS61291 provides a regulated 3.3V supply with higher current capability out of the storage capacitor without stressing the battery at all. It draws its power from the energy stored in the Storage Capacitor. Advanced Low Power Solutions Page 4 of 10

In an application like a wireless sensor, the MCU is supplied from the output of the TPS62740 step-down converter. Therefore the voltage must stay above the MCU minimum supply voltage (e.g. 1.9V). The maximum voltage of a single layer super-cap is typically 2.7V which leads to a usable capacitor voltage range of 1.9V to 2.7V. Figure 3 shows the basic flow of a recharge cycle. V MAX 2.7V - 1.9V V MIN idle charge discharge idle 1 2 3 1 V SEL [V] 1.9 Stepping 1.9.. 2.7 1.9 1.9 V RF-PA [V] OFF 3.3V OFF Figure 3: Energy Buffering Sequence Most of the time the voltage is kept at 1.9V to minimize the losses of the microcontroller and other leakage currents in the application (Phase 1). Before a wireless data transmission, the capacitor is charged up to 2.7V (Phase 2). During transmission, the stored energy in the capacitor can be extracted down to 1.9V (Phase 3). During Phase 3, the boost converter TPS61291 is enabled to step-up the voltage of the storage capacitor to 3.3V for the RF-PA. During all other Phases, this converter is disabled. For a more detailed description including component and parameter calculations, please see Application Report TIDU628. Advanced Low Power Solutions Page 5 of 10

3 Schematics Figure 4: Low-Iq Buck including Energy Buffering Circuit Excerpt Advanced Low Power Solutions Page 6 of 10

Figure 5: Low-Iq Boost Circuit Advanced Low Power Solutions Page 7 of 10

4 Measurement Results This section provides the measurement results of typical scenarios in a smart wireless sensor. For further measurements on the Energy Buffering technique, please refer to PMP9753 Energy Buffering Reference Design 4.1 Power System Start-Up Figure 6 shows the start-up waveforms when the system is turned on. The green trace shows the required battery current for the whole power up sequence. This includes providing the MCU supply and the charging of the storage capacitor. The battery current reaches a maximum value of less than 4mA at the beginning. The magenta trace reflects the battery voltage of 3.6V without any drop due to the limited battery current. The Buck Converter output voltage is reflected by the yellow trace. This is the MCU supply voltage and is present immediately, which means the MCU can be operated without any significant delay. The voltage of the storage capacitor is shown by the blue trace. The plot shows that the EDLC is charged to the operating voltage of 1.9V. During start-up, the boost converter is shut down and not reflected in this plot. Battery Current Battery Voltage Buck Converter Output Voltage EDLC Voltage Figure 6: System start-up waveforms After this sequence, the power system is ready. Startup is just required at the very first initialization when the battery is first inserted. Advanced Low Power Solutions Page 8 of 10

4.2 Protocol Transmission For the transmission of data, the required energy is buffered in advance. Figure 7 shows the waveforms of one whole cycle including storing energy in the EDLC and extracting it for a transmission pulse afterwards. The battery current is shown in the upper part in green. The maximum current drawn out of the battery is less 4mA. The yellow curve represents the output voltage of the TPS62740 step-down converter. During the charging phase, this voltage is incremented in 100mV steps for efficient charging of the storage capacitor, whose voltage is shown in blue. After the EDLC is charged to the maximum voltage of 2.7V, the boost converter is enabled and provides a regulated 3.3V for the active time of the power amplifier (magenta trace). Battery Current Buck Converter Output Voltage EDLC Voltage Boost Converter Ouptut Voltage Figure 7: RF-PA Pulse Cycle Overview Advanced Low Power Solutions Page 9 of 10

5 Summary Typical Wireless Smart Meters are powered by sources capable of low currents only. They require a low voltage/low current MCU supply rail which is always active. They require as well a high voltage/high current rail for the radio, which only needs to be active during the transmission of data. This design provides two supply rails with the requirements stated above. One rail is optimized for being always active and low supply currents. The other rail provides higher pulse currents with a voltage of 3.3V. The design features the load decoupling technique Energy Buffering and does not require more than 4mA from the battery. This value, however, is programmable by the user. For further Information s on the Energy Buffering technique, please refer to PMP9753 Energy Buffering Reference Design The design features following advantages: Low Iq supply rail for reduced MCU current by the Low-I Q Buck Converter TPS62740 3.3V supply rail for wm-bus RF-PA s by the Low-I Q Boost Converter TPS61291 Optimized for EDLC Storage Capacitors which are widely available with highest capacity Pulsed currents are decoupled from the battery to extend the available capacity from Lithium Primary Batteries System runtime is extended by lower voltage supply of the MCU Advanced Low Power Solutions Page 10 of 10

IMPORTANT NOTICE FOR TI REFERENCE DESIGNS Texas Instruments Incorporated ("TI") reference designs are solely intended to assist designers ( Buyers ) who are developing systems that incorporate TI semiconductor products (also referred to herein as components ). Buyer understands and agrees that Buyer remains responsible for using its independent analysis, evaluation and judgment in designing Buyer s systems and products. TI reference designs have been created using standard laboratory conditions and engineering practices. TI has not conducted any testing other than that specifically described in the published documentation for a particular reference design. TI may make corrections, enhancements, improvements and other changes to its reference designs. Buyers are authorized to use TI reference designs with the TI component(s) identified in each particular reference design and to modify the reference design in the development of their end products. HOWEVER, NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY THIRD PARTY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT, IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI REFERENCE DESIGNS ARE PROVIDED "AS IS". TI MAKES NO WARRANTIES OR REPRESENTATIONS WITH REGARD TO THE REFERENCE DESIGNS OR USE OF THE REFERENCE DESIGNS, EXPRESS, IMPLIED OR STATUTORY, INCLUDING ACCURACY OR COMPLETENESS. TI DISCLAIMS ANY WARRANTY OF TITLE AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, QUIET ENJOYMENT, QUIET POSSESSION, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS WITH REGARD TO TI REFERENCE DESIGNS OR USE THEREOF. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY BUYERS AGAINST ANY THIRD PARTY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON A COMBINATION OF COMPONENTS PROVIDED IN A TI REFERENCE DESIGN. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, SPECIAL, INCIDENTAL, CONSEQUENTIAL OR INDIRECT DAMAGES, HOWEVER CAUSED, ON ANY THEORY OF LIABILITY AND WHETHER OR NOT TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES, ARISING IN ANY WAY OUT OF TI REFERENCE DESIGNS OR BUYER S USE OF TI REFERENCE DESIGNS. TI reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products are sold subject to TI s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI s terms and conditions of sale of semiconductor products. Testing and other quality control techniques for TI components are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers products and applications, Buyers should provide adequate design and operating safeguards. Reproduction of significant portions of TI information in TI data books, data sheets or reference designs is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards that anticipate dangerous failures, monitor failures and their consequences, lessen the likelihood of dangerous failures and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in Buyer s safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed an agreement specifically governing such use. Only those TI components that TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components that have not been so designated is solely at Buyer's risk, and Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright 2015, Texas Instruments Incorporated