MBRM11LT1G, NRVBM11LT1G, NRVBM11LT3G Surface Mount Schottky Power Rectifier Power Surface Mount Package The Schottky employs the Schottky Barrier principle with a barrier metal and epitaxial construction that produces optimal forward voltage drop reverse current tradeoff. The advanced packaging techniques provide for a highly efficient micro miniature, space saving surface mount Rectifier. With its unique heatsink design, the has the same thermal performance as the SMA while being 5% smaller in footprint area, and delivering one of the lowest height profiles, 1.1 mm in the industry. Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards. Typical applications are AC DC and DC DC converters, reverse battery protection, and ORing of multiple supply voltages and any other application where performance and size are critical. Features Ultra Low V F 1st in Marketplace with a 1 V R Schottky Rectifier Low Profile Maximum Height of 1.1 mm Small Footprint Footprint Area of 8.45 mm 2 Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink ESD Ratings: Human Body Model > 4 V (Class 3) Machine Model > 4 V (Class C) AEC Q11 Qualified and PPAP Capable NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements All Packages are Pb Free* Mechanical Characteristics: is JEDEC Registered as D 216AA Case: Molded Epoxy Epoxy Meets UL 94 V @.125 in Weight: 62 mg (Approximately) Lead and Mounting Surface Temperature for Soldering Purposes: 26 C Maximum for 1 Seconds SCHOTTKY BARRIER RECTIFIER 1. AMPERES, 1 VOLTS ORDERING INFORMATION Device Package Shipping MBRM11LT1G MBRM11LT3G CATHODE CASE 457 PLASTIC ANODE MARKING DIAGRAM M 1L1 NRVBM11LT1G NRVBM11LT3G M 1 2 1L1 = Date Code = Device Code = Pb Free Package 3, / 3, / 12, / 12, / For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD811/D. *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 212 January, 212 Rev. 2 1 Publication Order Number: MBRM11L/D
MBRM11LT1G, NRVBM11LT1G, NRVBM11LT3G MAXIMUM RATINGS Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Rating Symbol Value Unit V RRM V RWM V R 1 V Average Rectified Forward Current (T L = 115 C, R JL = 35 C/W) Non Repetitive Peak Surge Current (Non Repetitive peak surge current, halfwave, single phase, 6 Hz) I O 1. I FSM 5 A A Storage Temperature T stg 55 to 125 C Operating Junction Temperature T J 55 to 125 C Voltage Rate of Change (Rated V R, T J = 25 C) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. dv/dt 1, V/ s THERMAL CHARACTERISTICS Thermal Resistance, Junction to Lead (Anode) (Note 1) Thermal Resistance, Junction to Tab (Cathode) (Note 1) Thermal Resistance, Junction to Ambient (Note 1) Characteristic Symbol Value Unit 1. Mounted with minimum recommended pad size, PC Board FR4, See Figures 8 and 9. R tjl R tjtab R tja 35 23 277 C/W ELECTRICAL CHARACTERISTICS Characteristic Symbol Value Unit Maximum Instantaneous Forward Voltage (Note 2) V F T J = 25 C T J = 1 C V (I F =.1 A) (I F = 1. A) (I F = 2. A).28.365.415.175.275.325 Maximum Instantaneous Reverse Current (Note 2) I R T J = 25 C T J = 1 C ma (V R = 5. V) (V R = 1 V) 2. Pulse Test: Pulse Width 25 s, Duty Cycle 2%..2.5 3 6 I F, INSTANTANEOUS FORWARD CURRENT (AMPS) 1 1 C 25 C 55 C 1.1.1.2.3.4.5.6.7 V F, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) I F, INSTANTANEOUS FORWARD CURRENT (AMPS) 1 1 C 1.1 25 C 55 C.1.2.3.4.5.6.7 V F, INSTANTANEOUS FORWARD VOLTAGE (VOLTS) Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage 2
MBRM11LT1G, NRVBM11LT1G, NRVBM11LT3G I R, INSTANTANEOUS REVERSE VOLTAGE (VOLTS) 1E 1 1E 2 1E 3 1E 4 1E 5 1E 6 1 C 25 C 1 2 3 4 5 6 7 8 9 1 I R, INSTANTANEOUS REVERSE VOLTAGE (VOLTS) 1E+ 1E 1 1E 2 1E 3 1E 4 1E 5 1 C 25 C 1 2 3 4 5 6 7 8 9 1 Figure 3. Typical Reverse Current Figure 4. Maximum Reverse Current I F, AVERAGE FORWARD CURRENT (AMPS) 1.8 1.6 1.4 1.2 1..8.6.4.2 2 dc SQUARE WAVE 4 6 8 1 12 14 T L, LEAD TEMPERATURE ( C) Figure 5. Current Derating Junction to Lead C, CAPACITANCE (pf) 5 45 4 35 3 25 2 15 1 T J = 25 C f = 1 MHz.5 1 2 3 4 5 6 7 8 9 1.2.4.6.8 1. 1.2 1.4 1.6 1.8 I O, AVERAGE FORWARD CURRENT (AMPS) Figure 6. Typical Capacitance P FO, AVERAGE POWER DISSIPATION (WATTS).45.4.35.3.25.2.15.1 SQUARE WAVE dc Figure 7. Forward Power Dissipation 3
MBRM11LT1G, NRVBM11LT1G, NRVBM11LT3G (T), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1. 5% 2%.1 1% 5.% 2.%.1 1.%.1.1 Rtjl(t) = Rtjl*r(t).1.1.1.1 1. 1 1 R T, TIME (s) Figure 8. Thermal Response Junction to Lead R (T), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1. 5% 2%.1 1% 5.%.1 2.% Rtjl(t) = Rtjl*r(t).1 1.%.1.1.1.1.1 1. 1 1 1, T, TIME (s) Figure 9. Thermal Response Junction to Ambient 4
MBRM11LT1G, NRVBM11LT1G, NRVBM11LT3G PACKAGE DIMENSIONS CASE 457 4 ISSUE E A S C J F.8 (.3) M T B S C S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED.15 (.6) PER SIDE. K R B J H T L PIN 1 PIN 2 D.8 (.3) M T B S C S MILLIMETERS INCHES DIM MIN MAX MIN MAX A 1.75 2.5.69.81 B 1.75 2.18.69.86 C.85 1.15.33.45 D.4.69.16.27 F.7 1..28.39 H -.5 +.1 -.2 +.4 J.1.25.4.1 K 3.6 3.9.142.154 L.5.8.2.31 R 1.2 1.5.47.59 S.5 REF.19 REF STYLE 1: PIN 1. CATHODE 2. ANODE SOLDERING FOOTPRINT*.635.25 2.67.15.762.3 2.54.1 1.27.5 SCALE 1:1 mm inches *For additional information on our Pb Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. is a registered trademark of and used under a license from Microsemi Corporation. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Typical parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including Typicals must be validated for each customer application by customer s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 8217 USA Phone: 33 675 2175 or 8 344 386 Toll Free USA/Canada Fax: 33 675 2176 or 8 344 3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 8 282 9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 79 291 Japan Customer Focus Center Phone: 81 3 5817 15 5 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MBRM11L/D