Innogration (Suzhou) Co., Ltd.

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Innogration (Suzhou) Co., Ltd.

CCharacteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR 30 dbc. Output 0.01% CCDF OPAR 7 db

PTFB213004F. High Power RF LDMOS Field Effect Transistor 300 W, MHz. Description. Features. RF Characteristics

PTFB211503FL. Thermally-Enhanced High Power RF LDMOS FET 150 W, MHz. Description. Features. RF Characteristics

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

Efficiency (%) g261701fa-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Drain Efficiency (%) b092707fh-gr1a. Characteristic Symbol Min Typ Max Unit

Efficiency (%) c241002fc-gr1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

not recommended for new design

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

not recommended for new design Efficiency (%) Characteristic Symbol Min Typ Max Unit Intermodulation Distortion IMD dbc

Efficiency (%) c261402fc_gr1. Adjacent Channel Power Ratio ACPR dbc All published data at T CASE = 25 C unless otherwise indicated

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR 7 7.

Efficiency (%) gtra364002fc_g1. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Characteristic Symbol Min Typ Max Unit. Intermodulation Distortion IMD 35 dbc All published data at T CASE = 25 C unless otherwise indicated

Efficiency (%) ptra082808nf_g1. Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR

60 W, DC MHz, 50 V, GaN HEMT for LTE and Pulse Radar Applications. = 25 C) of Demonstration Amplifier

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

PTFC270051M. High Power RF LDMOS Field Effect Transistor 5 W, 28 V, MHz. Description. Features. RF Characteristics, 2170 MHz

ra097008nb-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc. Output 0.01% CCDF OPAR

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjancent Channel Power Ratio ACPR dbc

PTFB193404F. Thermally-Enhanced High Power RF LDMOS FET 340 W, 30 V, MHz. Description. Features. RF Characteristics

GTVA123501FA. Thermally-Enhanced High Power RF GaN on SiC HEMT 350 W, 50 V, MHz. Description. Features. RF Characteristics

IMD Shoulder (dbc) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

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BLF6G10LS-135R. 1. Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features

BLF6G10LS Product profile. Power LDMOS transistor. 1.1 General description. 1.2 Features

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Preliminary GTVA126001EC/FC

Efficiency (%) c201202fc-v2-gr1a. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Features. ficiency (%) Eff. Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

Drain Efficiency (%) 1300 MHz 1400 MHz 15. Characteristic Symbol Min Typ Max Unit

Drain Efficiency (%) 10 a120501ea_g1-1. Characteristic Symbol Min Typ Max Unit. Return Loss IRL 10 7 db

maintaining high gain and efficiency. Parameter 5.5 GHz 6.0 GHz 6.5 GHz Units Small Signal Gain db = 28 dbm

Drain Efficiency (%) c262157sh-gr1. Characteristic Symbol Min Typ Max Unit. Gain Gps db. Adjacent Channel Power Ratio ACPR 31.

which offers high efficiency, high gain and wide bandwidth capabilities. The CGHV27030S GaN

PRELIMINARY. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

CGH40120P. 120 W, RF Power GaN HEMT FEATURES APPLICATIONS

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045P & CG2H40045F

= 25 C) of Demonstration Amplifier. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units. 43 dbm

Efficiency (%) 1215 MHz 15. Characteristic Symbol Min Typ Max Unit

CGH55030F2 / CGH55030P2

transistor is available in a flange and pill package. Package Types: & PN s: CGH40045F & CGH40045P

Gain: 960 MHz Gain: 1030 MHz Gain: 1090 MHz Gain: 1150 MHz Gain: 1215 MHz Eff: 960 MHz Eff: 1030 MHz Eff: 1090 MHz Eff: 1150 MHz Eff: 1215 MHz

maintaining high gain and efficiency. Package Type: 3x4 DFN PN: CGHV1F025S Parameter 8.9 GHz 9.2 GHz 9.4 GHz 9.6 GHz Units = 37 dbm W

Efficiency (%) Characteristic Symbol Min Typ Max Unit. Adjacent Channel Power Ratio ACPR dbc

CG2H W, DC - 6 GHz, RF Power GaN HEMT APPLICATIONS FEATURES

transistor is available in a flange and pill package. Package Types: & PN s: CG2H40045F & CG2H40045P

RF Power GaN Transistor

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

BLF7G22L-200; BLF7G22LS-200

CGH35060F1 / CGH35060P1

CGH40006P. 6 W, RF Power GaN HEMT APPLICATIONS FEATURES

Parameter 5.2 GHz 5.5 GHz 5.9 GHz Units. Small Signal Gain db. Output Power W. Efficiency

RF LDMOS Wideband Integrated Power Amplifier MHVIC2115R2. Freescale Semiconductor, I. The Wideband IC Line SEMICONDUCTOR TECHNICAL DATA

RF Power GaN Transistor

= 25 C) Parameter 20 MHz 0.5 GHz 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units Gain

CMPA801B W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

= 25 C) Note: Measured at -30 dbc, 1.6 MHz from carrier, in the CGHV96050F1-AMP (838176) under OQPSK modulation, 1.6 Msps, PN23, Alpha Filter = 0.

CGH55030F1 / CGH55030P1

= 25 C) Parameter 1.0 GHz 2.0 GHz 3.0 GHz 4.0 GHz 5.0 GHz 6.0 GHz Units. Gain db. 32 dbm W

CGH55015F2 / CGH55015P2

= 25 C), 50 V. Parameter 800 MHz 850 MHz 900 MHz 950 MHz 1000 MHz Units. Small Signal Gain db

= 25 C) Note: Measured in CGHV96100F2-TB (838179) under 100 µs pulse width, 10% duty, Pin 42.0 dbm (16 W) Applications. Marine Radar.

= 25 C), 50 V. Parameter 0.96 GHz 1.1 GHz 1.25 GHz 1.4 GHz Units. Saturated Output Power W

= 25 C) Parameter 2.5 GHz 4.0 GHz 6.0 GHz Units Gain db W Power P OUT. = 43 dbm

RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs

CMPA F. 25 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Applications. Features

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz. Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.7 GHz Units

LDMOS RF Power Transistor HTN7G21P160H. 1. Features. 2. Applications. 3. Items for Ordering. Package:H2110S-6L. Pin Connections

15 W, 28V, GaN HEMT for Linear Communications ranging from VHF to 3 GHz = 25 C) Parameter 2.3 GHz 2.4 GHz 2.5 GHz 2.6 GHz 2.

RF Power LDMOS Transistor N--Channel Enhancement--Mode Lateral MOSFET

Watts W/ C Storage Temperature Range Tstg 65 to +200 C Operating Junction Temperature TJ 200 C. Test Conditions

10 W LDMOS power transistor for base station applications at frequencies from HF to 2200 MHz

CPH6354. Power MOSFET 60V, 100mΩ, 4A, Single P-Channel. Features. Specifications

CGHV1J070D. 70 W, 18.0 GHz, GaN HEMT Die

Watts W/ C Storage Temperature Range Tstg 65 to +150 C Operating Junction Temperature TJ 200 C

CMPA F. 30 W, GHz, GaN MMIC, Power Amplifier. Typical Performance Over GHz (T C. Features. Applications

= 25 C) Parameter 0.5 GHz 1.0 GHz 2.5 GHz 4.0 GHz 6.0 GHz Units. Gain db. 23 dbm W

= 25 C), 50 V. Parameter 500 MHz 1.0 GHz 1.5 GHz 2.0 GHz 2.5 GHz Units. Small Signal Gain db

RF Power LDMOS Transistors N--Channel Enhancement--Mode Lateral MOSFETs

PRELIMINARY. Cree s CGHV59070 is an internally matched gallium nitride (GaN) high electron mobility transistor

well as multi-octave bandwidth amplifiers up to 4 GHz. The transistor is available in a 2-lead flange and = 25 C), 50 V

RF Power GaN Transistor

Transcription:

3400-3600MHz, 75W, 28V RF LDMOS FETs Description The ITCH36075B2 is a 75-watt, internally-matched LDMOS FETs, designed for cellular application with frequencies from 3400 to 3600MHz. It can biased at class AB or Class C for linear or pulse application as well ITCH36075B2 ITCH36075B2E Typical Performance of Demo (On Innogration fixture with device soldered): V DD =28 Volts, I DQ=600 ma, Pulse Width=20 us, Duty cycle=10%. Frequency Gp@P 1dB (db) P 1dB (dbm) D@P 1 (%) P 3dB (dbm) D@P 3 (%) 3400 MHz 12.8 48.5 46.3 49.3 46.7 3500 MHz 12.7 48.8 44.7 49.6 45.8 3600 MHz 12.7 48.2 42.8 49.3 45.5 Typical Single-Carrier W-CDMA Performance (On Test Fixture with device soldered): V DD=28Volts, I DQ = 600 ma, WCDMA signal: 3GPP test model 1; 1 to 64 DPCH; Channel Bandwidth=3.84MHz, PAR =10.5 db at 0.01 % probability on CCDF. P OUT(dBm) ACPR 5M (dbc) 3400MHz 3500MHz 3600MHz 33-50.4-50.2-52.0 34-48.4-48.1-50.2 35-46.3-46.4-48.2 36-44.6-44.8-46.0 37-42.5-42.7-44.0 38-40.5-41.2-41.6 39-38.3-39.0-39.5 40-36.0-36.8-36.8 Features High Efficiency and Linear Gain Operations Integrated ESD Protection Internally Matched for Ease of Use Excellent thermal stability, low HCI drift Large Positive and Negative Gate/Source Voltage Range for Improved Class C Operation Pb-free, RoHS-compliant Table 1. Maximum Ratings Rating Symbol Value Unit Drain--Source Voltage VDSS 65 Vdc Gate--Source Voltage VGS -10 to +10 Vdc Operating Voltage VDD +32 Vdc Storage Temperature Range Tstg -65 to +150 C Case Operating Temperature TC +150 C Operating Junction Temperature TJ +225 C 1 / 6

Table 2. Thermal Characteristics Characteristic Symbol Value Unit Thermal Resistance, Junction to Case T C= 85 C, T J=200 C, DC test Table 3. ESD Protection Characteristics Test Methodology R JC 0.35 C/W Class Human Body Model (per JESD22--A114) Class 2 Table 4. Electrical Characteristics (TA = 25 unless otherwise noted) Characteristic Symbol Min Typ Max Unit DC Characteristics Zero Gate Voltage Drain Leakage Current (V DS = 65V, V GS = 0 V) Zero Gate Voltage Drain Leakage Current (V DS = 28 V, V GS = 0 V) Gate--Source Leakage Current (V GS = 10 V, V DS = 0 V) Gate Threshold Voltage (V DS = 28V, I D = 300 A) Gate Quiescent Voltage (V DD = 28 V, I D = 600 ma, Measured in Functional Test) IDSS 100 A IDSS 1 A IGSS 1 A VGS(th) 1.75 V VGS(Q) 2.5 3.0 3.5 V Functional Tests (In Innogration Test Fixture, 50 ohm system) V DD = 28 Vdc, I DQ = 600 ma, f =3500 MHz, Pulsed CW Signal Measurements. Pulse width: 20uS,duty cycle: 10% Power Gain Gp 12.7 db 1 db Compression Point P 1dB 48.8 W Drain Efficiency@P1dB D 44.7 % Input Return Loss IRL -10 db Load Mismatch (In Innogration Test Fixture, 50 ohm system): V DD = 28 Vdc, I DQ = 380 ma, f = 3500 MHz VSWR 10:1 at 10W WCDMA Output Power No Device Degradation 2 / 6

Reference Circuit of Test Fixture Assembly Diagram TYPICAL CHARACTERISTICS Figure 1. Single Carrier WCDMA ACPR at 5 MHz as function of average output power 3 / 6

Package Outline Flanged ceramic package; 2 mounting holes; 2 leads(1 DRAIN 2 GATE 3 SOURCE) UNIT A b c D D₁ E E₁ F H L p Q q U₁ U₂ W₁ W₂ mm 4.72 3.43 12.83 12.57 0.15 0.08 20.02 19.61 19.96 19.66 9.50 9.30 9.53 9.25 1.14 0.89 19.94 18.92 5.33 4.32 3.38 3.12 1.70 1.45 27.94 34.16 33.91 9.91 9.65 0.25 0.51 inches 0.186 0.135 0.505 0.495 0.006 0.003 0.788 0.772 0.786 0.774 0.374 0.366 0.375 0.364 0.045 0.035 0.785 0.745 0.210 0.170 0.133 0.123 0.067 0.057 1.100 1.345 1.335 0.390 0.380 0.01 0.02 OUTLINE VERSION REFERENCE IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE PKG-B2E 03/12/2013 4 / 6

Earless flanged ceramic package; 2 leads(1 DRAIN 2 GATE 3 SOURCE) UNIT A b c D D₁ E E₁ F H L Q U₁ U₂ W₂ mm 4.72 3.43 12.83 12.57 0.15 0.08 20.02 19.61 19.96 19.66 9.50 9.30 9.53 9.25 1.14 0.89 19.94 18.92 5.33 4.32 1.70 1.45 20.70 20.45 9.91 9.65 0.25 inches 0.186 0.135 0.505 0.495 0.006 0.003 0.788 0.772 0.786 0.774 0.374 0.366 0.375 0.364 0.045 0.035 0.785 0.745 0.210 0.170 0.067 0.057 0.815 0.805 0.390 0.380 0.010 OUTLINE VERSION REFERENCE IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE PKG-B2 03/12/2013 5 / 6

Revision history Innogration (Suzhou) Co., Ltd. Table 5. Document revision history Date Revision Datasheet Status 2018/10/12 Rev 1.0 Preliminary Datasheet Creation Disclaimers Specifications are subject to change without notice. Innogration believes the information contained within this data sheet to be accurate and reliable. However, no responsibility is assumed by Innogration for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Innogration. Innogration makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Typical parameters are the average values expected by Innogration in large quantities and are provided for information purposes only. These values can and do vary in different applications and actual performance can vary over time. All operating parameters should be validated by customer s technical experts for each application. Innogration products are not designed, intended or authorized for use as components in applications intended for surgical implant into the body or to support or sustain life, in applications in which the failure of the Innogration product could result in personal injury or death or in applications for planning, construction, maintenance or direct operation of a nuclear facility. For any concerns or questions related to terms or conditions, pls check with Innogration and authorized distributors Copyright by Innogration (Suzhou) Co.,Ltd. 6 / 6