Automotive N-channel 60 V, 0.9 mω max., 300 A STripFET F7 Power MOSFET in a TO-LL package. Features. Description G1DTABS

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Transcription:

Automotive N-channel 60 V, 0.9 mω max., 300 A STripFET F7 Power MOSFET in a TO-LL package Datasheet - preliminary data Prerelease product(s) TAB 1 TAB 8 8 1 TO-LL Figure 1: Internal schematic diagram D (TAB) G (1) Features Order code VDS RDS(on) max. ID 60 V 0.9 mω 300 A Designed for automotive applications Among the lowest RDS(on) on the market Excellent FoM (figure of merit) Low Crss/Ciss ratio for EMI immunity High avalanche ruggedness Wettable flank package Applications Switching applications Description This N-channel Power MOSFET utilizes STripFET F7 technology with an enhanced trench gate structure that results in very low onstate resistance, while also reducing internal capacitance and gate charge for faster and more efficient switching. S (2,3,4,5,6,7,8) G1DTABS2345678 Table 1: Device summary Order code Marking Package Packaging 572N6F7AG TO-LL Tape and reel December 2017 DocID031339 Rev 1 1/11 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.st.com

Contents Contents 1 Electrical ratings... 3 2 Electrical characteristics... 4 3 Test circuits... 5 4 Package information... 6 4.1 TO-LL package information... 7 5 Revision history... 10 2/11 DocID031339 Rev 1

Electrical ratings 1 Electrical ratings Table 2: Absolute maximum ratings Symbol Parameter Value Unit VDS Drain-source voltage 60 V VGS Gate-source voltage ±20 V ID (1) Drain current (continuous) at TC = 25 C 300 A ID (1) Drain current (continuous) at TC = 100 C 300 A IDM (2) Drain current (pulsed) 1200 A PTOT Total dissipation at TC = 25 C 441 W TJ Tstg Operating junction temperature range -55 to 175 C Storage temperature range Notes: (1) Limited by package. (2) Pulse width limited by safe operating area Prerelease product(s) Table 3: Thermal data Symbol Parameter Value Unit Rthj-c Thermal resistance junction-case 0.34 C/W DocID031339 Rev 1 3/11

Electrical characteristics 2 Electrical characteristics (TC= 25 C unless otherwise specified) Table 4: On/off states Symbol Parameter Test conditions Min. Typ. Max. Unit V(BR)DSS IDSS Drain-source breakdown voltage Zero gate voltage drain current VGS = 0 V, ID = 1 ma 60 V VGS = 0 V, VDS = 60 V 1 µa VGS = 0 V, VDS = 60 V, Tj = 125 C (1) 100 µa IGSS Gate-body leakage current VDS = 0 V, VGS = ±20 V ±100 na VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µa 2 4 V RDS(on) Static drain-source on-resistance VGS = 10 V, ID = 150 A 0.9 mω Prerelease product(s) Notes: (1) Defined by design, not subject to production test. Table 5: Dynamic Symbol Parameter Test conditions Min. Typ. Max. Unit Ciss Input capacitance - 17500 - pf Coss Output capacitance VDS= 25 V, f = 1 MHz, - 8600 - pf VGS = 0 V Reverse transfer Crss - 770 - pf capacitance Qg Total gate charge VDD = 30 V, ID = 300 A, - 270 - nc Qgs Gate-source charge VGS = 0 to 10 V (see Figure 3: "Test circuit for gate charge - TBD - nc Qgd Gate-drain charge behavior") - TBD - nc 4/11 DocID031339 Rev 1

Test circuits 3 Test circuits Figure 2: Test circuit for resistive load switching times Figure 3: Test circuit for gate charge behavior Prerelease product(s) Figure 4: Test circuit for inductive load switching and diode recovery times Figure 6: Unclamped inductive waveform Figure 5: Unclamped inductive load test circuit Figure 7: Switching time waveform DocID031339 Rev 1 5/11

Package information 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 6/11 DocID031339 Rev 1

4.1 TO-LL package information Figure 8: TO-LL package outline Package information DM00276569_1_ LV DocID031339 Rev 1 7/11

Package information Table 6: TO-LL package mechanical data mm Dim. Min. Typ. Max. A 2.20 2.30 2.40 A1 0.40 0.48 0.60 b 0.80 c 0.46 c1 0.15 C 10.28 10.38 10.48 C2 2.35 2.45 2.55 C3 0.71 D 9.80 9.90 10.00 D2 3.30 3.50 3.70 D3 9.30 9.40 9.50 D4 8.20 8.40 8.6 D5 9.50 9.70 9.90 D6 7.40 D7 2.20 e 1.20 E 11.48 11.68 11.88 E1 4.96 E2 5.54 E3 5.14 E4 0.90 E5 0.72 E6 6.41 6.61 6.81 E7 0.50 0.70 0.90 K 1.70 1.90 2.10 L 1.05 1.20 1.35 L1 0.25 0.35 0.45 L2 0.40 0.60 0.80 θ 11 8/11 DocID031339 Rev 1

Figure 9: TO-LL recommended footprint (dimensions are in mm) Package information DM00276569_1_ LV DocID031339 Rev 1 9/11

Revision history 5 Revision history Table 7: Document revision history Date Revision Changes 06-Dec-2017 1 First release 10/11 DocID031339 Rev 1

IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ( ST ) reserve the right to make changes, corrections, enhancements, modifications, and improvements to ST products and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement. Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products. No license, express or implied, to any intellectual property right is granted by ST herein. Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product. ST and the ST logo are trademarks of ST. All other product or service names are the property of their respective owners. Prerelease product(s) Information in this document supersedes and replaces information previously supplied in any prior versions of this document. 2017 STMicroelectronics All rights reserved DocID031339 Rev 1 11/11