Please contact T E L : +82-32-623-6320~ 4 E-MAIL : sales@kortherm.co.kr jshuh@kortherm.co.kr
1. LASER SAMPLE TEST - To serve companies and individuals who need sample tests before buying new laser micromachining systems, KORTherm Science provides laser testing with a wide range of lasers. For quotations, following rules will be applied in the contract Minimum working time in a contract : 10 hours (based on 5 years of experience worker) Testing is performed by the drawing that customer provides. Labor Charges 1) UV,GREEN,IR LASER : $150/hour *10hours = $1,500 2) CO2 LASER : $200/hour * 10hours = $2,000 Minimum 4 hours required for Laser Settings: alignment and parameter. Labor charge varied by the difficulty of testing Additional tools and parts not included and to be quoted seperately. Test result not guaranteed once agreed
1-1. Process of LASER SAMPLE TEST 1 Technical request from customer (Feasibility and test details to be specified : Laser type, thickness, materials) 2 Quotation 3 Test request form to be filled out and samples to be sent by customer 7 Payment in advance KORTHERM 4 LASER Test done 5 Test report to share through email (Microscope image and analysis included) 6 Test Sample to return to the customer (by Express) CUSTOMER
1-2. What are Parameters for laser processing? 1. Pass 2. Scanning Speed 3. Pulse Energy 4. Pulse Width 5. Repetition Rate Depending on the sample status and processing, KOS optimizes Laser procssing parameters to find out the best processing conditions. 4
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2. SAMPLE TEST Cutting Hole Drilling ITO / FTO Patterning Scribing Marking Film Cutting (Polymer) Transparent materials such as Glass, Quartz, Sapphire, Fused Silica(CaF 2, MgF 2 ) ITO/PI, ITO/PET, ZnO/PI, ZnO/PET Carbon, Graphene
3. SAMPLE TEST TOOL
3. SAMPLE TEST TOOL-1 µ-lab Microscope/Scanner NIR radiation : 1064 nm Precisely small beam control Compact size design Easy to use with a software Up to 20W average output power More than 20kW peak power Works in true CW or pulsed regime Applications - Marking - Engraving - Soldering - Micromachining - Cutting - Micro hole drilling - Scribing - Sintering - Welding -Thin film patterning - Edge isolation of solar cell
3. SAMPLE TEST TOOL-2 µ-fab Micromachining System Single Nd:YAG Laser 1064/532/355nm wavelength Scribing speed: 300-2000mm/s Scribing width < 60um Vacuum chuck system Assist gas and Suction system Auto alignment and inspection system Applications - Marking - Engraving - Soldering - Micromachining - Cutting - Micro hole drilling - Scribing - Sintering - Welding - Thin film patterning - Edge isolation of solar cell
4. SAMPLE TEST TOOL-3 Light from CO 2 lasers is absorbed strongly by most nonmetallic materials. This makes CO 2 lasers a natural choice for cutting a wide variety of organic and plastic materials. CO 2 lasers can cut materials of varying thickness-for example. from 0.05mm for ceramic to 30mm for wood. ABS,PET Cotton Polyethylene Acrylic Epoxy Resins Polyimide(Kapton T Alumina Leather Polyurethane Aluminum Nitride Maple PVC Birch Mylar TM Quartz Borosilicate Glass Nylon Rosewood Cardboard Paper Rubber Ceramic Plywood Silicon Corian TM PMMA Teflon TM M )
5. APPLICATIONS Photovoltaic Applications Thin Film Scribing P1, P2, P3 Edge Deletion P4 Photovoltaic Applications c-si Edge Isolation Doping / Diffusion Data-Matrix marking Metal Wrap Through Selective Emitter Semiconductor Dicing Via drilling Thin film ablation Microelectronic PCB cutting, drilling Depanelling Ceramic Cutting Engraving / cavity Drilling Polymer / Polyimide Cutting Drilling Texturing Metal Deep engraving / 3D Drilling Texturing Films Cutting Ablation Carbon - Graphene Cutting Drilling
6. LASER SPECIFICATION ND-YAG (DPSS) LASER - 355nm / 532nm / 1064nm CO2 LASER - 10.6μm / 9.35μm / 9.4μm FIBER LASER - 1080nm EXCIMER LASER - 193nm / 248nm
7. Laibray Polymer (1) Cutting of polymer Wavelength: 1064nm Pulse energy: Rep rate: 40kHz Proceeding speed : 300mm/s Hole Drilling (on the PI film) Scribing of IMI film on Glass Pulse energy: Rep rate: 30kHz Proceeding speed : 500mm/s Film Release FTO Patterning (FTO on glass) Wavelength: 1060nm FTO Patterning (on the PI film) Wavelength: 1080nm PET Film Cutting Wavelength: 10.6 μm PET Easy Cut ITO Patterning (on the PET film)
7. Library Polymer (2) PET Film Cutting PET Film Cutting FTO Release (FTO on glass) Polyimide Film Release Polyimide Film Cutting ITO Scribing (Including Ag) ABS Hole Drilling Thickness: 2.8mm Polaroid Film Patterning ITO Scribing (Ag Including)
7. Library Polymer (3) Acrylic Resin Patterning Wavelength: 10.6 μm Thickness: 5mm PI Film Drilling ITO Patterning Wavelength: 1,080nm (PICO Laser) PMMA Cutting Wavelength: 10.6 μm Ag Film Punching (Ag & Polymer Film) Wavelength: 10.6 μm PI Film Drilling FTO Scribing Polymer Deposition Thin-film Patterning ITO Scribing Wavelength: 1,080nm
7. Library Wafer (Ceramic) (1) Scribing of Ceramic Wavelength: 1080nm Solar cell Wafer Edge isolation Wavelength : 532nm Solar Cell Wafer Doping Wafer Doping Wavelength : 532nm Ceramic Film Patterning LED CELL Si Wafer Drilling Wavelength : 532nm Si Wafer Align Key Marking Ceramic Hole Wavelength: 10.6 μm
7. Library Wafer (Si/Ceramic) (2) Drilling of Si-Wafer Wavelength: 1064nm Pulse energy: Rep rate: 10kHz Proceeding speed : 20mm/s Si Wafer Round Cutting Thickness: 520 μm Edge Isolation of Si Solarcell Wavelength: 1064nm Pulse energy: Rep rate: 500kHz Proceeding speed : 2m/s Si Wafer Pattern Cutting Removal of TCO on CIGS + Mo+Glass Wavelength: 1064nm Pulse energy: Rep rate: 500kHz Proceeding speed : 2m/s Removal of CIGS on Mo+Glass Wavelength: 1064nm Pulse energy: Rep rate: 500kHz Proceeding speed : 2m/s Silicone Sheet Hole Drilling AIN Wafer Hole Drilling Si Wafer Pattern Cutting
7. Library Wafer (Si/Ceramic) (3) Patterned Si-Wafer Cutting (Membrane Pattern) Si Wafer Full Cutting ARC Ablation (Anti-Reflective Coating) LGBC Scribing (Laser Grooved Buried Contracts) Green Sheet Scribing (Unfired Ceramic Sheet) Si Wafer Cutting Fired Ceramic Sheet (Via Hole) Si Wafer Patterning Si Wafer Scribing (Scanner Type)
7. Library Wafer (Si/Ceramic) (4) Ceramic Cutting (Ni Oxide + YSZ) Wavelength: 1064nm Ceramic Cutting (Ni Oxide + YSZ) Wavelength: 1064nm Si Wafer Round Cutting Si Wafer Hatching Patterning Si Wafer Full Cutting (Cross-Section) Thickness: 0.3mm Si Wafer Cutting (Membrane Pattern)
7. Library Metal/Ferrite (1) Via Hole Metal on PET Wavelength: 10.6μm SUS Thin Film Hole Drilling Ferrite Compound Cutting (Cross-Section) Thickness: 150μm Metal Hole Drilling Cu Thin Film Drilling Scribing of ZnO on glass Mo Scribing (Solar Cell Thin Film) Removing of ZnO on Glass Pulse energy: Rep rate: 30kHz Proceeding speed : 200mm/s
7. Library Metal (2) Tungsten-Carbide Hole Drilling (Via Hole) Tungsten-Carbide & Nickel Complex Hole Drilling (Via Hole) Mg Surface Patterning Wafer Doping Wavelength : 532nm Tantalum (Ta) Hole Drilling Cu Wafer Cutting Gold Thin Film Patterning (Inner Transparent & Flexible PDMA Film) Aluminium Oxide Wafer Hole Drilling Mo (Molybdenum) Thin Film Hole Drilling
7. Library Metal (3) SUS Scribing Invar Steel (Fe-NI) Scribing SUS420J2 Scribing Cathode/Anode Electrode Cutting (Copper & Aluminium) Thickness: 25μm Pure Mg Cutting (Magnesium) Ag Coated GdBCO on STS Cutting (Cross-Section) Aluminium Through Line Patterning Metal Oxide Film Ablation Si Wafer Metal Layer Ablation
7. Library Metal (4) Au Pad Full Scribing Copper Foil Hole Drilling Back Electrode Film Ablation (ZnO on the Glass) Ag Nano Wire Thin-film Scribing Wavelength: 1064nm Cu Hole Drilling Thickness: 0.1mm SUS Hole Drilling Thickness: 0.1mm Alumina Tube Hole Drilling Wavelength: 10.6μm Metal Film Patterning SUS304 Hole Drilling
7. Library Carbon/Glass/Diamond/Quartz. (1) Graphite Patterning Scribing of Glass Pulse energy: Rep rate: 30kHz Proceeding speed : 200mm/s Hole Drilling on the Aluminium Wavelength : 355nm Artificial Diamond Patterning Glass Patterning Quartz Patterning Graphene Cutting Carbon Disk Hole Drilling (100% Carbon) Quartz Hole Patterning (Via Hole)
7. Library Transparent materials. (2) Quartz Micro-Hole Drilling (Cross-Section) Sapphire Micro-Hole Drilling Thickness: 420μm Soda-Lime Glass Hole Scribing (Via Hole) Wavelength : 355nm Epoxy Resin Patterning Wavelength: 10.6μm Superconductor GdBCO Thin Film Scribing (Cross-Section) Superconductor GdBCO Thin Film Hole Drilling (Through Hole) Quartz Scribing Wavelength: 10.6μm Flexible Gorilla Glass Cutting Slide Glass Cutting
7. Library Transparent materials. (3) Sapphire Wafer Cutting (Cross-Section) Gold/Pt/CVD Diamond Pattern Scribing (Using Edge Alignment) Glass Full Cutting Thickness: 0.5T PMN-PT Patterning (Piezoelectric Element) Glass Microwire Cutting Quartz Thin Film Cutting Sapphire Wafer Scribing OLED Light Hole Drilling Thickness: 0.88mm Glass Channel Patterning (Lab-on-a-chip)
7. Library Transparent materials. (4) Quartz Wafer Hole Drilling Wavelength: 10.6μm Thickness: 500μm Quartz Wafer Round Cutting Wavelength: 10.6μm Thickness: 680μm Transparent Electrode Scribing Thickness: 0.71mm Glass Full Cutting
after the F-πShaper Input laser beam I Output beam I 1/e² 6mm p 6mm In Case of F-πShaper required, additional costs worth of 10 hours will be charged.
Thank you! KORTherm Science Co., Ltd. www.kortherm.co.kr T E L : +82-32-623-6320~ 4 E-MAIL : sales@kortherm.co.kr jshuh@kortherm.co.kr C-1203B, Woorim Lion s Valley 425, Cheoncheon-dong Bupyeong-gu, Incheon, South Korea